IC material pipe automatic discharging appearance inspection equipment

Abstract

The utility model discloses an IC material pipe automatic discharging appearance inspection device which comprises a working plate, a material pushing mechanism for discharging an IC in a material pipe is fixedly installed at the top of the working plate, and a positioning die is fixedly installed at the position, located on one side of the material pushing mechanism, of the top of the working plate through a first supporting column. And a moving mechanism is fixedly installed at the top of the working plate, a material taking mechanism for taking materials is fixedly installed on one side of the moving mechanism, and a detection mechanism for detecting the appearance of the IC is fixedly installed at the position, corresponding to the positioning mold, of the top of the working plate. According to the utility model, the material pipe for containing the ICs is placed in the material pushing mechanism, then the material pushing mechanism can drive the ICs to push the ICs one by one, the arranged moving mechanism can drive the material taking mechanism to move, the pushed ICs are taken to the positioning mold, and the appearance detection is carried out by utilizing the detection mechanism; and when the appearance of the IC is detected to have defects during appearance detection, the IC with the defects can be discharged and taken out through the material taking mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, and particularly relates to an automatic discharging and appearance inspection device for IC tubes. Background Technique

[0002] The automatic discharging and appearance inspection device for IC tubes is a device specially designed to automatically detect the appearance quality of integrated circuit (IC) chips. This device can conduct a detailed appearance inspection on IC chips before they are taken out of the tubes and prepared for the next process, ensuring that only defect-free products can continue to enter the production process.

[0003] Existing ICs have relatively low automation during detection, requiring a large amount of manual material taking and placing processes, resulting in a reduction in the efficiency of appearance inspection. Moreover, when detecting appearance damage during automatic discharging, it is not easy to classify and store them. For this reason, we propose an automatic discharging and appearance inspection device for IC tubes. Content of the Utility Model

[0004] The purpose of the utility model is to provide an automatic discharging and appearance inspection device for IC tubes to solve the problems raised in the background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: an automatic discharging and appearance inspection device for IC tubes, including a working plate. A support frame is fixedly installed at the bottom of the working plate. A pushing mechanism for discharging ICs inside the tube is fixedly installed at the top of the working plate. A positioning mold is fixedly installed at the top of the working plate and on one side of the pushing mechanism through two groups of first support columns. A moving mechanism is fixedly installed at the top of the working plate. A material taking mechanism for taking materials is fixedly installed on one side of the moving mechanism. A detection mechanism for detecting the appearance of ICs is fixedly installed at the top of the working plate corresponding to the position of the positioning mold.

[0006] Further, the pushing mechanism includes a placement rack, a driving cylinder, a connecting plate, and a push rod. A driving cylinder is fixedly installed on one side of the placement rack. The output end of the driving cylinder is fixedly connected to the connecting plate. A push rod is fixedly installed on one side of the connecting plate corresponding to the position of the placement rack.

[0007] Further, the moving mechanism includes a mounting plate, a first electric slide rail, a first electric slider, and a second electric slide rail. The mounting plate is fixedly installed at the top of the working plate through two groups of second support columns. A first electric slide rail arranged along the X-axis direction is fixedly installed on one side of the mounting plate. A first electric slider is slidably connected to the first electric slide rail. A second electric slide rail arranged along the Y-axis direction is fixedly installed on one side of the first electric slider. A second electric slider is slidably connected to the second electric slide rail.

[0008] Further, the material taking mechanism includes a first mounting frame, a driving motor, a connecting elbow, a double-acting cylinder and a clamping jaw. A first mounting frame is fixedly installed on one side of the second electric slider. A driving motor is fixedly installed on the first mounting frame. The output end of the driving motor is fixedly connected to a connecting elbow. The bottom of the connecting elbow is fixedly connected to a double-acting cylinder. The output end of the double-acting cylinder is fixedly connected to a clamping jaw.

[0009] Further, the detection mechanism includes a second mounting frame, an adjusting plate, a rotating shaft, a third mounting frame and an industrial camera. The adjusting plate is fixedly connected to the working plate through the second mounting frame. The third mounting frame is rotatably connected to the adjusting plate through the rotating shaft. An industrial camera is fixedly connected to one side of the third mounting frame. An adjusting groove centered on the rotating shaft is formed in the adjusting plate. A threaded rod is fixedly connected to one side of the third mounting frame corresponding to the adjusting groove. A locking nut that fits the adjusting plate is threadedly connected to the outer surface of the threaded rod.

[0010] Further, buffer pads made of rubber material are provided on one side of the push rod and the inner wall of the clamping jaw.

[0011] Compared with the prior art, the utility model has the following beneficial effects: The material tube for holding ICs of the utility model is placed inside the material pushing mechanism. Subsequently, the material pushing mechanism can drive the ICs for one-by-one material pushing. Then, the provided moving mechanism can drive the material taking mechanism to move, pick up the pushed-out ICs and place them on the positioning mold for appearance detection by the detection mechanism. And when a defect is detected in the appearance of the IC during the appearance detection, the defective IC can be removed by the material taking mechanism. Such a detection device has a high degree of automation and does not require too much manual operation, which improves the appearance detection efficiency to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the first three-dimensional structure of the utility model;

[0013] Figure 2 is a schematic diagram of the second three-dimensional structure of the utility model;

[0014] Figure 3 is a schematic diagram of the first three-dimensional structure of the detection mechanism of the utility model;

[0015] Figure 4 is a schematic diagram of the second three-dimensional structure of the detection mechanism of the utility model.

[0016] In the figure: 1 working plate, 2 support frame, 3 moving mechanism, 4 material taking mechanism, 5 first support column, 6 positioning die, 7 material pushing mechanism, 8 second support column, 9 mounting plate, 10 first electric slide rail, 11 first electric slider, 12 second electric slide rail, 13 second electric slider, 14 first mounting bracket, 15 driving motor, 16 connecting elbow, 17 double-acting cylinder, 18 clamping jaw, 19 detection mechanism, 20 second mounting bracket, 21 adjusting plate, 22 rotating shaft, 23 third mounting bracket, 24 industrial camera, 25 adjusting slot, 26 threaded rod, 27 locking nut, 28 placing rack, 29 driving cylinder, 30 connecting plate, 31 push rod. Specific implementation manner

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] Please refer to Figures 1-4 , the present invention provides a technical solution: an automatic discharging and appearance inspection device for IC tubes, including a working plate 1, a support frame 2 is fixedly installed at the bottom of the working plate 1, a material pushing mechanism 7 for discharging ICs inside the tube is fixedly installed at the top of the working plate 1, a positioning die 6 is fixedly installed on the top of the working plate 1 and on one side of the material pushing mechanism 7 through two groups of first support columns 5, a moving mechanism 3 is fixedly installed on the top of the working plate 1, a material taking mechanism 4 for taking materials is fixedly installed on one side of the moving mechanism 3, and a detection mechanism 19 for detecting the appearance of ICs is fixedly installed on the top of the working plate 1 corresponding to the position of the positioning die 6.

[0019] Among them, the tube for holding ICs is placed inside the material pushing mechanism 7, and then the material pushing mechanism 7 can drive the ICs to be pushed one by one. Subsequently, the set moving mechanism 3 can drive the material taking mechanism 4 to move, take the pushed ICs to the positioning die 6 and use the detection mechanism 19 for appearance detection. And when detecting that there are defects in the appearance of the IC during the appearance detection, the defective ICs can be discharged and taken out through the material taking mechanism 4. Such a detection device has a high degree of automation and does not require too much manual operation, which improves the appearance detection efficiency to a certain extent.

[0020] Please refer to Figure 1 and Figure 2, the pusher mechanism 7 includes a placement rack 28, a driving cylinder 29, a connecting plate 30 and a push rod 31. A driving cylinder 29 is fixedly installed on one side of the placement rack 28. The output end of the driving cylinder 29 is fixedly connected to a connecting plate 30. A push rod 31 is fixedly installed on one side of the connecting plate 30 corresponding to the position of the placement rack 28.

[0021] Among them, place the IC tube inside the placement rack 28, and then start the driving cylinder 29 to operate. The driving cylinder 29 drives the push rod 31 to move along the inside of the tube through the connecting plate 30, so that the ICs placed inside the tube can be pushed out one by one.

[0022] Please refer to Figure 1 and Figure 2 , the moving mechanism 3 includes a mounting plate 9, a first electric slide rail 10, a first electric slider 11 and a second electric slide rail 12. The mounting plate 9 is fixedly installed on the top of the working plate 1 through two groups of second support columns 8. A first electric slide rail 10 arranged along the X-axis direction is fixedly installed on one side of the mounting plate 9. A first electric slider 11 is slidably connected to the first electric slide rail 10. A second electric slide rail 12 arranged along the Y-axis direction is fixedly installed on one side of the first electric slider 11. A second electric slider 13 is slidably connected to the second electric slide rail 12.

[0023] Among them, after the IC is pushed out, the first electric slider 11 and the second electric slider 13 move along the first electric slide rail 10 and the second electric slide rail 12 in the X-axis and Y-axis directions, so that the picking mechanism 4 can be moved to the IC for clamping, and the IC can be clamped and moved to the positioning mold 6 for storage.

[0024] Please refer to Figure 1 and Figure 2 , the picking mechanism 4 includes a first mounting frame 14, a driving motor 15, a connecting elbow 16, a double-axis cylinder 17 and a clamping jaw 18. A first mounting frame 14 is fixedly installed on one side of the second electric slider 13. A driving motor 15 is fixedly installed on the first mounting frame 14. The output end of the driving motor 15 is fixedly connected to a connecting elbow 16. A double-axis cylinder 17 is fixedly connected to the bottom of the connecting elbow 16. The output end of the double-axis cylinder 17 is fixedly connected to a clamping jaw 18.

[0025] Among them, after the picking mechanism 4 moves above the IC, the double-axis cylinder 17 drives the two clamping jaws 18 to contract, so that the IC can be clamped. Then it can be used in cooperation with the moving mechanism 3 to clamp and move the IC to the positioning mold 6. When the detection mechanism 19 detects that there are defects in the appearance of the IC, start the driving motor 15 to operate. The driving motor 15 drives the connecting elbow 16, the double-axis cylinder 17 and the clamping jaw 18 to rotate, which is convenient for classifying and discharging the defective ICs.

[0026] Please refer to Figure 1 、 Figure 3 and Figure 4 The detection mechanism 19 includes a second mounting bracket 20, an adjustment plate 21, a rotating shaft 22, a third mounting bracket 23 and an industrial camera 24. An adjustment plate 21 is fixedly connected to the working plate 1 through the second mounting bracket 20. A third mounting bracket 23 is rotatably connected to the adjustment plate 21 through the rotating shaft 22. An industrial camera 24 is fixedly connected to one side of the third mounting bracket 23. An adjustment slot 25 centered on the rotating shaft 22 is formed in the adjustment plate 21. A threaded rod 26 is fixedly connected to one side of the third mounting bracket 23 corresponding to the adjustment slot 25. A locking nut 27 that fits the adjustment plate 21 is threadedly connected to the outer surface of the threaded rod 26.

[0027] Among them, after the IC moves above the positioning mold 6, the position of the industrial camera 24 is adjusted according to the size of the IC and the appearance position to be detected. First, the locking nut 27 is unscrewed from the threaded rod 26, and then the third mounting bracket 23 and the industrial camera 24 are rotated through the rotating shaft 22. After the angle of the industrial camera 24 is rotated, the threaded rod 26 and the third mounting bracket 23 are positioned by using the locking nut 27, and then the appearance of the IC can be detected by using the industrial camera 24.

[0028] Please refer to Figure 1 and Figure 2 A buffer pad made of rubber material is provided on one side of the push rod 31 and the inner wall of the jaw 18. The setting of the rubber material buffer pad can prevent the IC from being damaged when the push rod 31 and the jaw 18 come into contact with the IC.

[0029] When in use, first, the material tube for holding the IC is placed inside the pushing mechanism 7, and then the pushing mechanism 7 can drive the IC to push the material one by one, and then the movable mechanism 3 can drive the picking mechanism 4 to move, and the pushed IC is taken to the positioning mold 6 for appearance inspection by the detection mechanism 19, and when the appearance inspection detects that the IC has defects, the defective IC can be removed by the picking mechanism 4. Such inspection equipment has a high degree of automation and does not require too much manual operation, which improves the appearance inspection efficiency to a certain extent. The IC material tube is placed inside the placement rack 28, and then the driving cylinder 29 is started to operate. The driving cylinder 29 uses the connecting plate 30 to drive the push rod 31 to move along the inside of the material tube, so that the IC placed in the material tube can be pushed out one by one. After the IC is pushed out, the first electric slider 11 and the second electric slider 13 move along the first adjustment slide rail 10 and the second electric slide rail 12 along the X-axis and Y-axis directions, so that the picking mechanism 4 can be moved onto the IC for Clamp and move the IC to the positioning mold 6 for storage. When the material picking mechanism 4 moves to the top of the IC, the double-axis cylinder 17 drives the two sets of clamps 18 to contract, so that the IC can be clamped, and then it can be used in conjunction with the moving mechanism 3 to clamp and move the IC to the positioning mold 6. When the IC moves to the top of the positioning mold 6, the position of the industrial camera 24 is adjusted according to the size of the IC and the appearance position that needs to be detected. First, the locking nut 27 is unscrewed from the threaded rod 26, and then the third mounting frame 23 and the industrial camera 24 are rotated through the rotating shaft 22. After the angle rotation of the industrial camera 24 is completed, the locking nut 27 is used to position the threaded rod 26 and the third mounting frame 23. Then the industrial camera 24 can be used to detect the appearance of the IC. When the detection mechanism 19 detects that there are defects in the appearance of the IC, the drive motor 15 is started to operate, and the drive motor 15 drives the connecting elbow 16, the double-axis cylinder 17 and the clamps 18 to rotate, so as to facilitate the classification and unloading of defective ICs.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic feeding appearance inspection device for IC tubes, comprising a working plate (1), and a support frame (2) is fixedly installed at the bottom of the working plate (1), characterized in that: A pushing mechanism (7) for discharging the IC inside the material pipe is fixedly installed at the top of the working plate (1). A positioning die (6) is fixedly installed at the top of the working plate (1) and on one side of the pushing mechanism (7) through two groups of first support columns (5). A moving mechanism (3) is fixedly installed at the top of the working plate (1). A material taking mechanism (4) for taking the material is fixedly installed on one side of the moving mechanism (3). A detection mechanism (19) for detecting the appearance of the IC is fixedly installed at the top of the working plate (1) corresponding to the position of the positioning die (6).

2. The automatic discharging appearance inspection device for IC tubes according to claim 1, wherein: The pushing mechanism (7) includes a placement rack (28), a driving cylinder (29), a connecting plate (30), and a push rod (31). A driving cylinder (29) is fixedly installed on one side of the placement rack (28). The output end of the driving cylinder (29) is fixedly connected to the connecting plate (30). A push rod (31) is fixedly installed on one side of the connecting plate (30) corresponding to the position of the placement rack (28).

3. An automatic feeding and appearance inspection device for IC tubes according to claim 2, characterized in that: The moving mechanism (3) includes a mounting plate (9), a first electric slide rail (10), a first electric slide block (11), and a second electric slide rail (12). The mounting plate (9) is fixedly installed at the top of the working plate (1) through two groups of second support columns (8). A first electric slide rail (10) arranged along the X-axis direction is fixedly installed on one side of the mounting plate (9). A first electric slide block (11) is slidably connected to the first electric slide rail (10). A second electric slide rail (12) arranged along the Y-axis direction is fixedly installed on one side of the first electric slide block (11). A second electric slide block (13) is slidably connected to the second electric slide rail (12).

4. An automatic discharging appearance inspection device for IC material tubes according to claim 3, characterized in that: The material taking mechanism (4) includes a first mounting rack (14), a driving motor (15), a connecting elbow (16), a double-axis cylinder (17), and a clamping jaw (18). A first mounting rack (14) is fixedly installed on one side of the second electric slide block (13). A driving motor (15) is fixedly installed on the first mounting rack (14). The output end of the driving motor (15) is fixedly connected to the connecting elbow (16). A double-axis cylinder (17) is fixedly connected to the bottom of the connecting elbow (16). The output end of the double-axis cylinder (17) is fixedly connected to the clamping jaw (18).

5. An automatic feeding appearance inspection device for IC tubes according to claim 4, characterized in that: The detection mechanism (19) includes a second mounting rack (20), an adjustment plate (21), a rotating shaft (22), a third mounting rack (23), and an industrial camera (24). The adjustment plate (21) is fixedly connected to the working plate (1) through the second mounting rack (20). The third mounting rack (23) is rotatably connected to the adjustment plate (21) through the rotating shaft (22). An industrial camera (24) is fixedly connected to one side of the third mounting rack (23). An adjustment slot (25) centered on the rotating shaft (22) is formed on the adjustment plate (21). A threaded rod (26) is fixedly connected to one side of the third mounting rack (23) corresponding to the position of the adjustment slot (25). A locking nut (27) that fits the adjustment plate (21) is threadedly connected to the outer surface of the threaded rod (26).

6. An automatic discharging appearance inspection device for IC material tubes according to claim 5, characterized in that: A buffer pad made of rubber material is provided on one side of the push rod (31) and on the inner wall of the jaw (18).

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