Carrier tape for pre-curing packaging boundary
By setting the barrier layer of UV cured glue on the carrier tape, the packaging problem caused by changes in UV glue fluidity is solved, efficient packaging and cost control are achieved, and the reliability of the smart card module is improved.
Patent Information
- Application Number
- CN202421743136.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The changes in UV fluidity of the carrier tape surface lead to the problem of packaging overflow boundaries or inability to spread. The prior art requires two steps to increase costs and reduce efficiency.
A barrier layer is provided on the carrier tape, and UV cured glue is printed on the packaging boundary using screen printing technology to form a precured boundary to control the flow of UV glue.
Effectively block UV glue overflow, simplify process parameters, improve packaging efficiency, do not increase raw material costs, and enhance the reliability of smart card modules.
Smart Images

Figure CN223060893U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a carrier tape for a pre-cured encapsulation boundary, belonging to the technical field of smart card encapsulation. Background Art
[0002] Currently, the encapsulation surface of the carrier tape used for smart card encapsulation is basically flat except for wire bonding holes. After the connection between the chip and the wire bonding is completed, UV curable glue is dot-coated for encapsulation protection. Since the surface of the carrier tape is made of polymer fiber material, the surface energy fluctuates due to environmental factors, resulting in large fluctuations in the wetting degree (wetting angle) of the encapsulation glue on the surface of the carrier tape. This is manifested as the glue overflowing beyond the encapsulation requirements boundary or the glue not spreading out during UV glue encapsulation, leading to defective products. To solve this problem, some encapsulation manufacturers perform the encapsulation in two steps. First, a high-viscosity UV glue is used to build a dam in the encapsulation boundary area, and then ordinary UV glue is filled in. Although ideal results are achieved, the high-viscosity UV glue and the loss of half of the production efficiency undoubtedly increase the product cost and cannot be widely promoted. Summary of the Invention
[0003] The technical problem to be solved by the utility model is that it is difficult to control the fluidity change of the UV colloid on the surface of the carrier tape, resulting in the overflow of the UV encapsulation beyond the boundary. Even if the process of building a dam and then filling is used, the efficiency is reduced by half, and the cost of the special dam-building glue is relatively high.
[0004] To solve the above problems, the utility model provides a carrier tape for a pre-cured encapsulation boundary, on which a UV curable glue for restricting the flow of the UV glue is provided.
[0005] Preferably, the thickness of the UV curable glue is 30 - 80 μm.
[0006] Preferably, the boundary formed by the UV curable glue is geometric.
[0007] The utility model sets a barrier layer on the carrier tape to prevent the overflow of the UV glue caused by the fluidity change. By using screen printing technology on the carrier tape to print a circle of UV glue at the encapsulation boundary and curing it, it can effectively prevent the overflow of the UV filling glue and at the same time, the dispensing parameters can be relaxed without worrying about the problem of non-spreading.
[0008] The utility model can design and print the pre-cured boundary according to the requirements of the encapsulation boundary to achieve the effect of preventing overflow. Description of the Drawings
[0009] Figure 1 It is a schematic diagram of the carrier tape for a pre-cured encapsulation boundary provided by the utility model;
[0010] Figure 2 、 3Schematic diagram of different shapes formed by the UV curable adhesive;
[0011] Figure 4 Cross-sectional view of the module encapsulated using the present utility model;
[0012] Figure 5 Cross-sectional view of the non-pre-cured module. Detailed implementation mode
[0013] To make the present utility model more obvious and understandable, preferred embodiments are hereby described in detail in conjunction with the accompanying drawings as follows.
[0014] Embodiment
[0015] As shown in the figure, a carrier tape with a pre-cured encapsulation boundary provided by the present utility model is shown. A layer of UV curable adhesive 2 for restricting the flow of the UV adhesive is scraped on the carrier tape 1 with a doctor blade 3.
[0016] The thickness d of the UV curable adhesive 2 is 30 - 80 μm.
[0017] The boundary formed by the UV curable adhesive 2 is geometric, and can be a rectangle, a square, or a quasi-rectangle formed by the combination of an arc and a straight line.
[0018] Above the wire bonding hole of the smart card module after encapsulation with an ordinary carrier tape, the UV boundary is arc-shaped, and it is difficult to control its thickness. Often, the protection of the wire bond 6 is insufficient during the stress experiment, resulting in fracture; while for the module encapsulated using the carrier tape with the above-mentioned pre-cured boundary, the edge has a pre-cured boundary ( Figure 4 as shown), and its thickness can be controlled, playing the role of a fence. Its thickness is also thicker than that of the non-pre-cured module ( Figure 5 as shown), h1 is greater than h0, which provides better protection for the wire bond 6 inside the pad and enhances the reliability of the smart card module. Because it uses ordinary UV adhesive to make the pre-cured boundary, it does not increase the raw material cost, and is consistent with the UV encapsulation adhesive 4 for encapsulating the chip 5, with good compatibility, does not reduce the encapsulation efficiency, but on the contrary, simplifies the UV encapsulation process parameters and improves the UV encapsulation efficiency because the difference in the surface fluidity of the carrier tape is no longer considered.
Claims
1. A carrier tape with a pre-cured encapsulation boundary, characterized in that, The carrier tape (1) is provided with a UV curable adhesive (2) for restricting the flow of the UV adhesive.
2. The carrier tape with a pre-cured encapsulation boundary as described in claim 1, wherein, The thickness (d) of the UV curable adhesive (2) is 30 - 80 μm.
3. The carrier tape with a pre-cured encapsulation boundary as described in claim 1, wherein, The boundary formed by the UV curable adhesive (2) is geometric.