Atomic layer deposition coating equipment

Abstract

The utility model discloses atomic layer deposition coating equipment which comprises a loading cavity, a special gas panel, a reaction cavity, a cooling water system, a tail gas exhaust pipeline, a substrate loading disc, a lifting device, an ozone generator, a conveying assembly, a substrate, a vacuum gate valve and a rack, and the loading cavity, the cooling water system, the tail gas exhaust pipeline, the lifting device and the ozone generator are all installed on the rack. The conveying assembly is arranged in the loading cavity, the substrate is connected with the conveying assembly, the reaction cavity corresponds to the loading cavity, the substrate moves towards the reaction cavity through the conveying assembly, the vacuum gate valve is installed between the loading cavity and the reaction cavity, the substrate carrying disc is installed at the top of the lifting device, and the lifting device is used for adjusting the height of the substrate carrying disc. According to the invention, the control of the thickness and components of the thin film is more accurate, and the photoelectric conversion efficiency of the cell is also improved.

Description

Technical Field

[0001] The utility model relates to a coating device, in particular to an atomic layer deposition coating device. Background Technique

[0002] With the increasing global demand for renewable energy, solar cells, as a clean and renewable energy source, are being applied more and more widely. Among them, perovskite solar cells have received extensive attention due to their high efficiency and low cost. However, the performance of perovskite solar cells is affected by various factors, such as the quality and thickness of the thin film.

[0003] Atomic layer deposition (ALD) is a chemical vapor thin film deposition method based on ordered and surface self-saturating reactions. After nearly decades of development, atomic layer deposition technology has become one of the most advanced thin film deposition technologies and has an irreplaceable position in the field of advanced semiconductor chip manufacturing. The biggest advantage of atomic layer deposition technology is that it can deposit substances layer by layer in the form of a single atomic film on the surface of the substrate. When the precursors reach the surface of the deposition substrate, they will chemically adsorb on the surface of the substrate. Between precursor pulses, an inert gas is required to purge the reaction chamber to remove the excess precursors that have not adsorbed on the surface of the substrate, so as to ensure that the chemical reaction only occurs on the surface of the substrate. Therefore, the thickness and composition of the thin film can be precisely controlled.

[0004] In the existing technology, the coating of perovskite solar cells is mainly achieved by chemical vapor deposition (CVD) and solution processing. These methods can effectively form perovskite thin films on the substrate, but for large-sized perovskite solar cells, these methods may lead to poor uniformity and quality of the thin film, thus affecting the performance of the battery. The existing coating technologies are difficult to ensure the uniformity and quality of the thin film for large-sized perovskite solar cells, which may lead to inconsistent battery performance and affect the overall efficiency of the battery. At the same time, the existing coating technologies often require high temperature and pressure, which not only increases the complexity and cost of the process, but also may affect the stability of perovskite materials. Finally, the existing coating technologies have insufficient control accuracy for the thickness and composition of the thin film, which may affect the photoelectric conversion efficiency of the battery. A solution is proposed for the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide an atomic layer deposition coating device to solve the problems raised in the above background technique.

[0006] The above technical purpose of the utility model is achieved through the following technical solutions:

[0007] An atomic layer deposition coating device includes a loading chamber, a special gas panel, a reaction chamber, a cooling water system, an exhaust gas discharge pipe, a substrate carrier, a lifting device, an ozone generator, a conveying component, a substrate, a vacuum gate valve, and a frame. The loading chamber, the cooling water system, the exhaust gas discharge pipe, and the lifting device are all installed on the frame. The conveying component is arranged in the loading chamber. The substrate is connected to the conveying component. The reaction chamber corresponds to the loading chamber. The substrate moves towards the reaction chamber through the conveying component. The vacuum gate valve is installed between the loading chamber and the reaction chamber. The substrate carrier is installed on the top of the lifting device. The lifting device is used to adjust the height of the substrate carrier. The substrate carrier corresponds to the reaction chamber.

[0008] Preferably, the conveying component includes a motor reducer, a coupling, a magnetic fluid, a mounting column, a first guide rod, a rack, and a gear. The loading chamber is provided with a loading cavity body. A loading chamber door is installed on the side wall of the loading chamber. A clamping pliers is installed on the loading chamber door. A sensor is installed outside the loading chamber and corresponds to the loading chamber door. The mounting column is installed on the outer wall of the loading chamber. The motor reducer is installed on the mounting column. The coupling is installed on the output shaft of the motor reducer. One section of the magnetic fluid is installed in cooperation with the coupling. The other end of the magnetic fluid penetrates the loading chamber and is fixed to the gear. The first guide rod is installed inside the loading chamber. The rack is slidably arranged on the first guide rod. The gear meshes with the rack. One end of the rack is installed with a substrate material rack. The substrate is installed on the substrate material rack.

[0009] Preferably, the lifting device includes an electric cylinder, a floating joint, a second guide rod, a cylinder, a second sealing bellows, a process cavity, a needle plate, a spray plate, a special gas inlet, a heating carrier plate, a through wire tube, a needle plate connecting rod, a first sealing bellows, a cylinder mounting plate, and a guide rod connecting plate. The electric cylinder is installed on the frame. The floating joint is installed on the electric cylinder. The floating joint connects the cylinder mounting plate and the guide rod connecting plate. The two second guide rods are respectively installed at both ends of the guide rod connecting plate. One end of each of the two second guide rods penetrates the cylinder mounting plate and is connected to the process cavity. The cylinder is installed on the cylinder mounting plate. A mounting seat is installed on the piston rod of the cylinder. One end of the mounting seat penetrates the process cavity and is installed with the needle plate connecting rod. The needle plate is installed and fixed through the needle plate connecting rod. The second sealing bellows are respectively installed between the bottom of the process cavity and the cylinder. The spray plate is installed on the inner top wall of the reaction chamber. The special gas inlet is arranged at the top of the reaction chamber. The heating carrier plate is arranged in the reaction chamber. One end of the through wire tube is connected to the heating carrier plate. The other end of the through wire tube penetrates the process cavity and is installed with the heating carrier plate. The first sealing bellows are installed outside the through wire tube. Both ends of the first sealing bellows are respectively connected to the process cavity and the cylinder mounting plate.

[0010] Preferably, the heating carrier plate includes an outer ring heating wire, an inner ring heating wire, and positioning screws. The outer ring heating wire is installed on the outer ring of the heating carrier plate, the inner ring heating wire is installed on the inner ring of the heating carrier plate, and the positioning screws are used for the installation of the heating carrier plate.

[0011] Preferably, a spray plate heater is also installed in the inner wall of the reaction chamber. One end of the spray plate heater is matched with the top of the spray plate, and a heater is also installed in the side wall of the reaction chamber.

[0012] Preferably, a pair of sensors is also installed in the loading cavity, and the pair of sensors corresponds to the initial position of the rack.

[0013] Beneficial effects:

[0014] 1) Provide an atomic layer deposition coating device to achieve film uniformity and quality control on large-sized perovskite solar cells, and improve the performance consistency of the cells;

[0015] 2) Precisely control the temperature of the substrate during the coating process, improve the heat uniformity of the coating substrate, and reduce the impact on the stability of the perovskite material;

[0016] 3) Precisely control the temperature of the process gas during the coating process, improve the control accuracy of the film thickness and composition, and is beneficial to improving the photoelectric conversion efficiency of the cell. Description of the drawings

[0017] Figure 1 It is a schematic structural diagram of the embodiment;

[0018] Figure 2 It is a partial structural schematic diagram of this embodiment;

[0019] Figure 3 It is a structural schematic diagram of the conveying component of this embodiment;

[0020] Figure 4 It is a structural schematic diagram of the lifting device of this embodiment;

[0021] Figure 5 It is a schematic diagram of the heating wire arrangement of the heating carrier plate of this embodiment.

[0022] Reference numerals: 1, loading chamber; 101, motor reducer; 102, coupling; 103, magnetic fluid; 104, mounting column; 105, loading cavity body; 106, loading chamber door; 107, clamping pliers; 108, sensor; 109, first guide rod; 110, substrate material rack; 111, opposed sensor; 112, rack; 113, gear; 2, special gas panel; 3, reaction chamber; 4, cooling water system; 5, tail gas discharge pipe; 6, substrate carrier; 7, lifting device; 8, ozone generator; 9, conveying assembly; 10, substrate; 11, vacuum gate valve; 12, frame; 301, electric cylinder; 302, floating joint; 303, second guide rod; 304, cylinder; 305, second sealing bellows; 306, process cavity; 307, needle plate; 308, spray plate; 309, special gas inlet; 310, heater; 311, heating carrier; 312, wire conduit; 313, needle plate connecting rod; 314, first sealing bellows; 315, cylinder mounting plate; 316, guide rod connecting plate; 317, spray plate heater; 318, outer ring heating wire; 319, inner ring heating wire; 320, positioning screw. Detailed implementation manners

[0023] Refer to Figure 1 and Figure 2 , an atomic layer deposition coating device, comprising a loading chamber 1, a special gas panel 2, a reaction chamber 3, a cooling water system 4, a tail gas discharge pipe 5, a substrate carrier 6, a lifting device 7, an ozone generator 8, a conveying assembly 9, a substrate 10, a vacuum gate valve 11, and a frame 12, characterized in that the loading chamber 1, the cooling water system 4, the tail gas discharge pipe 5, the lifting device 7, and the ozone generator 8 are all installed on the frame 12, the special gas panel 2 is used to provide precursors and gases required for the process, the cooling water system 4 is used to protect components from high-temperature damage, the tail gas discharge pipe 5 is used to connect the tail gas processor and the mechanical vacuum pump, and the ozone generator 8 is used to output ozone to the special gas panel 2.

[0024] The conveying component 9 is arranged in the loading chamber 1. The substrate 10 is connected to the conveying component 9. Through the conveying component 9, the substrate can be conveyed and moved. The reaction chamber 3 corresponds to the loading chamber 1. The substrate 10 is moved towards the reaction chamber 3 through the conveying component 9. The loading chamber 1 is used for loading and transporting the substrate 10. When loading the substrate 10, the loading chamber 1 communicates with the atmosphere. After the substrate 10 is pushed into the loading chamber 1, the inside of the loading chamber 1 is evacuated. The vacuum gate valve 11 is installed between the loading chamber 1 and the reaction chamber 3. The vacuum gate valve 11 controls the connection and blockage between the loading chamber 1 and the reaction chamber 3. After reaching a certain vacuum degree, the vacuum gate valve 11 is opened. The substrate 10 is transported to the reaction chamber 3 for coating. After the coating is completed, it is transported to the loading chamber 1. The vacuum gate valve 11 is closed. After the loading chamber 1 breaks the vacuum, the substrate 10 is withdrawn. The substrate carrier 6 is installed on the top of the lifting device 7. The lifting device 7 is used to adjust the height of the substrate carrier 6. The substrate carrier 6 corresponds to the reaction chamber 3. The lifting device 7 is used to adjust the height of the substrate carrier 6 to meet the separation of the substrate 10 and the conveying component 9.

[0025] Working principle: Initial state: The loading chamber 1 and the reaction chamber 3 are in a blocked state. The reaction chamber 3 is maintained in a vacuum state. The vacuum gate valve 11 is in a closed state. The loading chamber 1 is in an atmospheric state.

[0026] Before the process starts, the substrate 10 is placed on the conveying component 9 and is located in the loading chamber 1. The loading chamber door is closed. The inside of the loading chamber 1 is evacuated. When the vacuum degree of the loading chamber 1 reaches equilibrium with the vacuum degree of the reaction chamber 3, the vacuum gate valve 11 is opened. The substrate 10 is transported from the conveying component 9 into the reaction chamber 3. The lifting device 7 is started to separate the substrate 10 from the conveying component 9. The conveying component 9 retracts into the loading chamber 1, and the vacuum gate valve 11 is closed. After the air pressure inside the reaction chamber 3 reaches the process air pressure and the temperature reaches the process temperature, the thin film deposition process starts in the reaction chamber 3.

[0027] See Figure 3 As shown, the conveying component 9 includes a motor reducer 101, a coupling 102, a magnetic fluid 103, a mounting column 104, a first guide rod 109, a rack 112, and a gear 113. The loading chamber 1 is provided with a loading cavity 105. By designing the loading cavity 105, it is used to meet the vacuum environment of the loading chamber. A loading chamber door 106 is installed on the side wall of the loading chamber 1. By designing the loading chamber door 106, the loading chamber door 106 can be opened in the atmospheric environment to place and take the substrate 10. A clamping plier 107 is installed on the loading chamber door 106. The clamping plier 107 is used to clamp the loading chamber door 106 tightly. A sensor 108 is installed outside the loading chamber 1. The sensor 108 corresponds to the loading chamber door 106. By installing the sensor 108, it is used to detect whether the loading chamber door 106 is installed in place.

[0028] The mounting column 104 is installed on the outer wall of the loading cavity 1. The motor reducer 101 is installed on the mounting column 104. The motor reducer 101 includes a motor and a reducer, which is the power source of this device. The coupling 102 is installed on the output shaft of the motor reducer 101. One end of the magnetic fluid 103 is installed and fitted with the coupling 102. The other end of the magnetic fluid 103 penetrates through the loading cavity 1 and is fixed to the gear 113. The gear 113 is rotatably arranged in the loading cavity 1. The magnetic fluid 103 is used to connect the gear 113 and ensure that the inside of the loading cavity body 105 maintains a vacuum when the gear 113 rotates. The first guide rod 109 is installed inside the loading cavity 1. The rack 112 is slidably arranged on the first guide rod 109. The gear 113 meshes with the rack 112. One end of the rack 112 is installed with a substrate rack 110. The substrate 10 is installed on the substrate rack 110. When it is necessary to drive the substrate 10 to move, the motor reducer 101 can be started first. The coupling 102 is driven to rotate by the motor reducer 101. The coupling 102 drives the magnetic fluid 103 and the gear 113 to rotate. The rack 112 is driven to slide through the gear 113. The rack 112 is limited by the first guide rod 109. The substrate rack 110 and the substrate 10 are pushed to move through the rack 112.

[0029] An opposed sensor 111 is also installed inside the loading cavity 1. The opposed sensor 111 corresponds to the initial position of the rack 112. By installing the opposed sensor 111, the zero position of the rack 112 can be detected.

[0030] See Figure 4As shown in the figure, the lifting device 7 includes an electric cylinder 301, a floating joint 302, a second guide rod 303, a cylinder 304, a second sealing bellows 305, a process chamber 306, a needle plate 307, a spray plate 308, a special gas inlet 309, a heating carrier plate 311, a through-wire pipe 312, a needle plate connecting rod 313, a first sealing bellows 314, a cylinder mounting plate 315, and a guide rod connecting plate 316. The electric cylinder 301 is installed on the frame 12, the floating joint 302 is installed on the electric cylinder 301, the floating joint 302 connects the cylinder mounting plate 315 and the guide rod connecting plate 316, and the electric cylinder 301 can drive the floating joint 302 to connect the cylinder mounting plate 315 and the guide rod connecting plate 316 to achieve lifting. The two second guide rods 303 are respectively installed at both ends of the guide rod connecting plate 316. One end of each of the two second guide rods 303 penetrates through the cylinder mounting plate 315 and is connected to the process chamber 306. The cylinder mounting plate 315 is slidably arranged on the second guide rod 303. The second guide rod 303 is installed at the bottom of the process chamber 306 for lifting and guiding. The process chamber 306 is used to provide and maintain a process vacuum environment. The cylinder 304 is installed on the cylinder mounting plate 315. A mounting seat is installed on the piston rod of the cylinder 304. One end of the mounting seat penetrates through the process chamber 306 and is installed with the needle plate connecting rod 313. The needle plate 307 is installed and fixed through the needle plate connecting rod 313. The second sealing bellows 305 is respectively installed between the bottom of the process chamber 306 and the cylinder 304. The second sealing bellows 305 is used to maintain the vacuum state of the reaction chamber 3. The heating carrier plate 311 is arranged in the reaction chamber 3. One end of the through-wire pipe 312 is connected to the heating carrier plate 311. The other end of the through-wire pipe 312 penetrates through the process chamber 306 and is installed with the heating carrier plate 311. The first sealing bellows 314 is installed outside the through-wire pipe 312. Both ends of the first sealing bellows 314 are respectively connected to the process chamber 306 and the cylinder 304 mounting plate. The first sealing bellows 314 is used to maintain the vacuum degree of the process chamber 306. When lifting, the cylinder 304 can be started first, and then the electric cylinder 301 is started, so that the substrate 10 is separated from the conveying assembly 9, the conveying assembly 9 retreats, the vacuum gate valve 11 is closed, the cylinder 304 descends, the substrate 10 descends onto the heating carrier plate 311, and then the process is carried out.

[0031] The spray plate 308 is installed on the inner top wall of the reaction chamber 3. The spray plate 308 is used to spray process gas. The special gas inlet 309 is arranged at the top of the reaction chamber 3. The special gas inlet 309 is used to connect the special gas assembly to the reaction chamber. A spray plate heater 317 is also installed in the inner wall of the reaction chamber 3. One end of the spray plate heater 317 is matched with the top of the spray plate 308. The spray plate heater 310 is used to heat the spray plate 308. A heater 310 is also installed in the side wall of the reaction chamber 3. The heater is used to heat the cavity of the reaction chamber to reach the process temperature.

[0032] See Figure 5As shown, the heating carrier plate 311 includes an outer ring heating wire 318, an inner ring heating wire 319, and positioning screws 320. The outer ring heating wire 318 is installed on the outer ring of the heating carrier plate 311, the inner ring heating wire 319 is installed on the inner ring of the heating carrier plate 311, and the positioning screws 320 are used for the installation of the heating carrier plate 311. The outer ring heating wire 318 and the inner ring heating wire 319 of the heating carrier plate 311 device respectively adjust the heating temperature precisely through their separate temperature control systems.

[0033] There is a lifting mechanism in the reaction chamber 3. During the process, the heating carrier plate 311 is close to the shower head. The distance from the shower head to the surface of the substrate 10 for the process gas is extremely short, and the process gas is quickly discharged from the reaction chamber 3 through the side discharge system. During this process, the distance between the heating carrier plate 311 and the shower head is short and the space is small, which is more conducive to the uniform distribution of the process gas on the surface of the substrate 10; the excess gas is timely discharged by the side discharge system, which is not only conducive to improving the uniformity of the film thickness on the surface of the substrate 10, but also conducive to reducing the thin film deposition of the process gas in the bottom space of the heating carrier plate 311, thereby effectively reducing the generation of particles and other contaminants caused by the accumulation of the thin film on the non-coated surface during the process, improving the yield of the substrate 10, and reducing the requirements for the cleaning and maintenance of the reaction chamber 3.

[0034] The heating carrier plate 311 is provided with a dual-zone heating system, which is conducive to improving the temperature control of the substrate 10. At the same time, the shower plate 308 has a heating device, which can ensure more uniform and accurate temperature control when the process gas passes through the shower plate 308 and sprays onto the surface of the substrate 10. All of these are conducive to improving the uniformity of the coating thickness and the film formation quality.

Claims

1. An atomic layer deposition coating device, comprising a loading chamber (1), a special gas panel (2), a reaction chamber (3), a cooling water system (4), an exhaust gas discharge pipe (5), a substrate carrier (6), a lifting device (7), an ozone generator (8), a conveying assembly (9), a substrate (10), a vacuum gate valve (11), and a frame (12), characterized in that, The loading chamber (1), the cooling water system (4), the exhaust gas discharge pipe (5), the lifting device (7), and the ozone generator (8) are all installed on the frame (12). The conveying assembly (9) is arranged inside the loading chamber (1). The substrate (10) is connected to the conveying assembly (9). The reaction chamber (3) corresponds to the loading chamber (1). The substrate (10) is moved towards the reaction chamber (3) through the conveying assembly (9). The vacuum gate valve (11) is installed between the loading chamber (1) and the reaction chamber (3). The substrate carrier (6) is installed on the top of the lifting device (7). The lifting device (7) is used to adjust the height of the substrate carrier (6). The substrate carrier (6) corresponds to the reaction chamber (3).

2. The atomic layer deposition coating equipment according to claim 1, characterized in that The conveying assembly (9) includes a motor reducer (101), a coupling (102), a magnetic fluid (103), a mounting column (104), a first guide rod (109), a rack (112), and a gear (113). The loading chamber (1) is provided with a loading cavity body (105). A loading chamber door (106) is installed on the side wall of the loading chamber (1). A clamping pliers (107) is installed on the loading chamber door (106). A sensor (108) is installed outside the loading chamber (1). The sensor (108) corresponds to the loading chamber door (106). The mounting column (104) is installed on the outer wall of the loading chamber (1). The motor reducer (101) is installed on the mounting column (104). The coupling (102) is installed on the output shaft of the motor reducer (101). One end of the magnetic fluid (103) is installed and matched with the coupling (102). The other end of the magnetic fluid (103) penetrates through the loading chamber (1) and is fixed to the gear (113). The first guide rod (109) is installed inside the loading chamber (1). The rack (112) is slidably arranged on the first guide rod (109). The gear (113) meshes with the rack (112). One end of the rack (112) is installed with a substrate material rack (110). The substrate (10) is installed on the substrate material rack (110).

3. An atomic layer deposition coating device according to claim 1, characterized in that, The lifting device (7) includes an electric cylinder (301), a floating joint (302), a second guide rod (303), a cylinder (304), a second sealing bellows (305), a process cavity (306), a needle plate (307), a spray plate (308), a special gas inlet (309), a heating carrier plate (311), a through-wire pipe (312), a needle plate connecting rod (313), a first sealing bellows (314), a cylinder mounting plate (315), and a guide rod connecting plate (316). The electric cylinder (301) is installed on the frame (12). The floating joint (302) is installed on the electric cylinder (301). The floating joint (302) connects the cylinder mounting plate (315) and the guide rod connecting plate (316). The two second guide rods (303) are respectively installed at both ends of the guide rod connecting plate (316). One end of each of the two second guide rods (303) penetrates through the cylinder mounting plate (315) and is connected to the process cavity (306). The cylinder (304) is installed on the cylinder mounting plate (315). An installation seat is installed on the piston rod of the cylinder (304). One end of the installation seat penetrates through the process cavity (306) and is installed with the needle plate connecting rod (313). The needle plate (307) is installed and fixed through the needle plate connecting rod (313). The second sealing bellows (305) is respectively installed between the bottom of the process cavity (306) and the cylinder (304). The spray plate (308) is installed on the inner top wall of the reaction chamber (3). The special gas inlet (309) is provided at the top of the reaction chamber (3). The heating carrier plate (311) is provided in the reaction chamber (3). One end of the through-wire pipe (312) is connected to the heating carrier plate (311). The other end of the through-wire pipe (312) penetrates through the process cavity (306) and is installed with the heating carrier plate (311). The first sealing bellows (314) is installed outside the through-wire pipe (312). Both ends of the first sealing bellows (314) are respectively connected to the process cavity (306) and the cylinder (304) mounting plate.

4. An atomic layer deposition coating device according to claim 3, characterized in that, The heating carrier plate (311) includes an outer ring heating wire (318), an inner ring heating wire (319), and positioning screws (320). The outer ring heating wire (318) is installed on the outer ring of the heating carrier plate (311). The inner ring heating wire (319) is installed on the inner ring of the heating carrier plate (311). The positioning screws (320) are used for the installation of the heating carrier plate (311).

5. An atomic layer deposition coating device according to claim 3, characterized in that, A spray plate heater (317) is also installed in the top inner wall of the reaction chamber (3). One end of the spray plate heater (317) is matched with the top of the spray plate (308). A heater (310) is also installed in the side wall of the reaction chamber (3).

6. An atomic layer deposition coating device according to claim 2, characterized in that, An opposed sensor (111) is also installed in the loading chamber (1) body. The opposed sensor (111) corresponds to the initial position of the rack (112).

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