Automatic piece discharging device suitable for porcelain plates

Abstract

The utility model relates to an automatic wafer unloading device suitable for porcelain dishes, which comprises a transmission track, a wafer unloading mechanism, a wafer unloading mechanism and a wafer unloading mechanism, and is characterized in that a transmission surface for transmitting wafers one by one from top to bottom is formed on the transmission track; the positioning unit comprises a positioning platform and a first driving part, the porcelain plate is flatly placed on the positioning platform, and the first driving part is used for driving the positioning platform and driving the wafers to be sequentially aligned with the feeding end of the transmission track; a wafer receiving groove connected with the discharging end of the transmission track is formed in the receiving unit; and a blade unit. According to the utility model, on one hand, on the basis of the state that the wafers are adhered to the porcelain plate, lossless stripping and unloading of the wafers are carried out through cooperation of the positioning platform, the scraper knife and the transmission track, so that the wafers are effectively prevented from deviating, accurate butt joint of the wafers and the transmission track is ensured, and the unloading success rate is greatly improved; on the other hand, the structure is simple and reliable, and implementation cost is low.

Description

Technical Field

[0001] The utility model belongs to the field of wafer unloading devices, and particularly relates to an automatic wafer unloading device suitable for ceramic plates. Background Art

[0002] A wafer is a silicon wafer used in the production of semiconductor chips and integrated circuits. Since its shape is circular, it is also called a wafer. By fabricating various circuit structures on the surface of the wafer, it can be made into an electronic component with specific electrical functions. In the production and processing process of wafers, process steps such as slicing, grinding, polishing, and cleaning are usually required. Currently, in processes such as grinding and polishing, a ceramic plate is used as the carrier or substrate for the wafer, that is, the wafer is attached to the surface of the ceramic plate for processing operations. The ceramic plate has a very high surface flatness and can serve as a reference plane for the grinding and polishing of the wafer.

[0003] In the prior art, after attaching the wafer to the surface of the ceramic plate and performing the grinding and polishing processes, the ceramic plate needs to be cleaned to remove residues, impurities, etc. on the surfaces of the ceramic plate and the wafer. After the cleaning process is completed, the wafer needs to be removed from the ceramic plate, that is, the wafer unloading process is carried out. Among them, after the ceramic plate with wafers is cleaned, the existing wafer unloading device generally heats the ceramic plate to make the wafer peel off from the ceramic plate (heating melts the wax oil that plays an adhesive role between the wafer and the ceramic plate), and then the wafer is removed and collected by a material receiving mechanism.

[0004] However, in the actual production process, since the wafer and the ceramic plate are in a peeled state after heating, there is a probability that the wafer slips relative to the ceramic plate when the ceramic plate is tilted or moved. Especially when multiple wafers are attached to the ceramic plate, it is necessary to control the rotation of the ceramic plate to dock each wafer with the material receiving mechanism in sequence. Under the influence of centrifugal force, it is very difficult to ensure the precise docking of the wafer with the material receiving structure, resulting in the problem that the wafer cannot be normally received. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved automatic wafer unloading device suitable for ceramic plates.

[0006] To solve the above technical problem, the utility model adopts the following technical solutions:

[0007] An automatic wafer unloading device suitable for a ceramic plate, one side of the ceramic plate forms an attaching surface and adheres with multiple wafers, and an adhesive layer is provided between the attaching surface and each wafer.

[0008] The wafer unloading device includes:

[0009] A transmission track, which forms a transmission surface for transmitting wafers one by one from top to bottom.

[0010] A positioning unit, which includes a positioning platform and a first driving component. The ceramic disc is placed flat on the positioning platform, and the first driving component is used to drive the positioning platform and drive each wafer to be aligned with the feeding end of the transmission track in sequence;

[0011] A material receiving unit, which forms a wafer receiving groove connected to the discharging end of the transmission track,

[0012] The wafer unloading device further includes a wafer shoveling unit. The wafer shoveling unit includes a shovel blade movably arranged above the positioning platform and a first power component used to drive the shovel blade to reciprocate in a direction close to or away from the feeding end of the transmission track. The shovel blade has a blade head that can be inserted between the ceramic disc and the wafer, and a shovel blade surface is formed on the blade head. As the shovel blade moves closer to the feeding end, the blade head synchronously destroys the adhesive layer, and the corresponding wafer gradually detaches from the bonding surface and enters the shovel blade surface. When the shovel blade surface is docked with the transmission surface, the wafer falls from the shovel blade surface onto the transmission surface and is transmitted towards the receiving groove.

[0013] According to a specific implementation and preferred aspect of the present invention, the shovel blade includes a blade holder and a blade body fixedly connected to one end of the blade holder. The other end of the blade body extends obliquely downward towards the feeding end to form a blade head, and a shovel blade surface is formed on the upper surface of the blade head. Here, the structure is simple, facilitating assembly and implementation.

[0014] Preferably, the lower surface of the blade head intersects with the shovel blade surface from the side close to the feeding end, and the formed angle is 13° - 17°. Under this layout, the blade head enters between the ceramic disc and the wafer and has the best effect of destroying the adhesive layer, which is beneficial to the detachment of the wafer.

[0015] Preferably, when unloading the wafer, the lower surface of the blade head is arranged in contact with the bonding surface. Here, the bonding surface forms an auxiliary support for the blade head to enhance the anti-deformation ability of the blade head and extend its service life.

[0016] According to another specific implementation and preferred aspect of the present invention, a step portion protruding upward is further formed on the side of the shovel blade surface away from the feeding end. When the wafer enters the shovel blade surface, the wafer abuts against the step portion from the edge; and / or, in the orthographic projection on the horizontal plane, when unloading the wafer, the center lines of the wafer and the blade head are arranged to coincide. Here, the displacement of the wafer on the shovel blade surface is restricted by the step portion, facilitating the wafer to quickly fall onto the transmission track for material receiving.

[0017] According to another specific implementation and preferred aspect of the present invention, the first power component is used to drive the shovel blade to reciprocate along the extending direction of the transmission surface; the wafer shoveling unit further includes a second power component used to drive the shovel blade to reciprocate along a direction perpendicular to the bonding surface and / or the transmission surface.

[0018] Preferably, the positioning platform includes a platform body capable of vacuum-absorbing the ceramic disc, and a plurality of clamping blocks circumferentially and spaced apart around the platform body, wherein the plurality of clamping blocks can approach or move away from each other to clamp or release the ceramic disc; the first driving component is used to drive the platform body to rotate around its own central axis.

[0019] According to another specific implementation and preferred aspect of the present invention, the positioning platform has a horizontal state and an inclined state. When the positioning platform is in the inclined state, the bonding surface is arranged parallel to the transmission surface; the positioning unit further includes a second driving component for driving the positioning platform to switch between the horizontal state and the inclined state. Here, when the positioning platform is in the horizontal state, it is convenient for the manipulator to accurately place the ceramic disc on the positioning platform; when the positioning platform is in the inclined state, it is beneficial to peel off the wafer and enter the transmission track, reducing the probability of wafer bump damage.

[0020] Preferably, the second driving component includes a base, a flipping seat arranged above the base, and a driving member, wherein one side of the flipping seat is rotatably connected to the base through a pivot, and the other side is rotatably connected to the output shaft of the driving member; the positioning platform is fixedly arranged on the flipping seat; and / or, the positioning unit further includes a third driving component for driving the positioning platform to move up and down.

[0021] In addition, the material receiving unit includes a lifting frame and a material box arranged on the lifting frame. A plurality of material receiving grooves are formed on the material box and are distributed up and down. The lifting frame drives the material box and drives the plurality of material receiving grooves to be sequentially docked with the discharge end; there are a plurality of material boxes and they are distributed at intervals up and down. Here, the orderly receiving of multiple wafers is realized; at the same time, multiple material boxes can be continuously replaced to meet the requirements of batch and efficient production.

[0022] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art:

[0023] Since the chip and the porcelain plate are in a peeling state after being heated, there is a probability that the chip will slip relative to the porcelain plate when the porcelain plate is tilted or moved. In particular, when there are multiple chips on the porcelain plate, it is necessary to control the rotation of the porcelain plate to dock each chip with the receiving mechanism in turn. Under the influence of centrifugal force, it is difficult to ensure that the chip and the receiving structure are accurately docked, resulting in the problem that the chip cannot be received normally. The present application comprehensively designs the structure of an automatic chip unloading device suitable for porcelain plates, ingeniously solving the shortcomings and defects of the prior art. After adopting the chip unloading device, the porcelain plate is placed flat and fixed on the positioning platform, the positioning platform is driven by the first driving component to drive each chip on the porcelain plate to align with the feed end of the transmission track in turn, and then Then, the blade head of the scraper is inserted between the porcelain plate and the corresponding chip, and when the scraper moves close to the feed end of the transmission track, the blade head destroys the adhesive layer to drive the corresponding chip to leave the patch surface and enter the scraper surface. Finally, when the scraper surface is connected with the transmission surface, the chip falls from the scraper surface to the transmission surface and is transmitted in the direction of the receiving trough to complete the chip unloading process. Therefore, compared with the prior art, the utility model, on the one hand, is based on the state that the chip remains adhered to the porcelain plate, and the cooperation of the positioning platform, the scraper and the transmission track is used to implement non-destructive peeling and chip unloading, which effectively avoids the deviation of the chip, ensures that each chip is accurately docked with the transmission track, and greatly improves the success rate of chip unloading. On the other hand, the structure is simple and reliable, and the implementation cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a three-dimensional front view schematic diagram of an automatic unloading device suitable for porcelain plates in this embodiment;

[0025] Figure 2 for Figure 1 A schematic diagram of the main view;

[0026] Figure 3 for Figure 2 An enlarged schematic diagram of the structure of the middle blade body;

[0027] Where: 1, transmission track; m2, transmission surface;

[0028] 2. Positioning unit; 20. Positioning platform; 200. Platform body; 201. Clamping block; 21. First driving component; 22. Second driving component; 220. Base; 221. Turning seat; 222. Driving member; 23. Third driving component;

[0029] 3. Material receiving unit; 30. Lifting frame; 31. Material box; 310. Material receiving trough;

[0030] 4, scraper blade unit; 40, scraper blade; 400, tool holder; 401, tool body; t, tool head; m3, scraper blade surface; b, step portion; 41, first power component; 42, second power component;

[0031] P1, porcelain plate; m1, bonding surface; P2, wafer. Specific Embodiments

[0032] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present application.

[0034] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0035] In the present application, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0036] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0037] As Figures 1 to 3 shown, an automatic wafer unloading device applicable to a ceramic disc in this embodiment includes a transfer track 1, a positioning unit 2, a material receiving unit 3, and a wafer shoveling unit 4.

[0038] Specifically, one side of the ceramic disc P1 in this embodiment forms an adhesive surface m1 and adheres multiple wafers P2, wherein the multiple wafers P2 are distributed at intervals around the center of the ceramic disc P1, and an adhesive layer is provided between the adhesive surface m1 and each wafer P2.

[0039] In this example, the transfer track 1 extends obliquely up and down, wherein the upper end of the transfer track 1 is the feeding end and the lower end is the discharging end, and the transfer track 1 forms a transfer surface m2 for sequentially transferring the wafers P2 from top to bottom. In some specific embodiments, when the wafer enters the transfer surface m2, the wafer freely slides down along the transfer track 1 under its own weight.

[0040] In this example, the positioning unit 2 includes a positioning platform 20, a first driving component 21 and a second driving component 22 respectively connected to the positioning platform 20, wherein the ceramic disc P1 is placed flat and fixed on the positioning platform 20, and the positioning platform 20 has a horizontal state and an inclined state; the first driving component 21 is used to drive the positioning platform 20 and drive each wafer P2 to be aligned with the feeding end of the transfer track 1 in sequence; the second driving component 22 is used to drive the positioning platform 20 to switch between the horizontal state and the inclined state, and when the positioning platform 20 is in the inclined state, the adhesive surface m1 is arranged parallel to the transfer surface m2.

[0041] In some specific embodiments, the positioning platform 20 includes a platform body 200 capable of vacuum - adsorbing the ceramic disc P1, and a plurality of clamping blocks 201 circumferentially and spaced apart around the platform body 200. Among them, the plurality of clamping blocks 201 can move closer to or away from each other to clamp or release the ceramic disc P1, and the contact surfaces of each clamping block 201 are tangent to the corresponding positions on the edge of the ceramic disc P1. At the same time, among the plurality of clamping blocks 201, a part is fixedly arranged relative to the platform body 200, and the other part is arranged to reciprocate in the radial direction of the ceramic disc P1; the first driving member 21 uses a conventional motor and is used to drive the platform body 200 to rotate around its own central axis direction; the second driving member 22 includes a base 220, a flipping seat 221 arranged above the base 220, and a driving member 222. One side of the flipping seat 221 is rotatably connected to the base 220 through a pivot, and the other side is rotatably connected to the output shaft of the driving member 222. The positioning platform 20 is fixedly arranged on the flipping seat 221. Under the telescopic movement of the telescopic rod of the driving member 222 in the vertical direction, the flipping seat 221 drives the positioning platform 20 to tilt towards the transfer track 1 or return to the horizontal state.

[0042] To facilitate the feeding and discharging of the positioning platform, the positioning unit 2 further includes a third driving member 23. In this embodiment, the third driving member 23 uses a conventional lifting cylinder, and the telescopic end of the lifting cylinder is provided with a vacuum - adsorption hole. During feeding, the telescopic end of the lifting cylinder extends out and adsorbs and fixes the ceramic disc, and then the telescopic end of the lifting cylinder retracts to place and fix the ceramic disc on the platform body 200.

[0043] In this example, the material - receiving unit 3 includes a lifting frame 30 and a material box 31 arranged on the lifting frame 30. Among them, a plurality of material - receiving slots 310 for receiving wafers are formed on the material box 31 and are distributed vertically. The lifting frame drives the material box 31 and drives the plurality of material - receiving slots 310 to be sequentially aligned with the discharging end of the transfer track 1; there are a plurality of material boxes 31 and they are spaced apart vertically.

[0044] In this example, the wafer - shoveling unit 4 includes a shovel 40 movably arranged above the positioning platform 20, a first power member 41 for driving the shovel 40 to reciprocate in a direction close to or away from the feeding end of the transfer track 1, and a second power member 42 for driving the shovel 40 to reciprocate in a direction perpendicular to the bonding surface and / or the transfer surface. The shovel 40 has a tool head t that can be inserted between the ceramic disc P1 and the wafer P2, and a shovel surface m3 is formed on the tool head t. As the shovel 40 moves closer to the feeding end, the tool head t simultaneously breaks the bonding layer, and the corresponding wafer detaches from the bonding surface m1 and enters the shovel surface m3. When the shovel surface m3 is aligned with the transfer surface m2, the wafer falls from the shovel surface m3 onto the transfer surface m2 and is transferred towards the material - receiving slot 310.

[0045] In some specific embodiments, the scraper 40 includes a tool holder 400, a tool body 401 fixedly connected to the tool holder 400 at one end, wherein the other end of the tool body 401 extends obliquely downward toward the feeding end of the transmission track 1 and forms a tool head t, and a scraper surface m3 is formed on the upper surface of the tool head t; the lower surface of the tool head t intersects with the scraper surface m3 from the side close to the feeding end, and the angle formed is 13° to 17°; when the slice is removed, the lower surface of the tool head t is arranged in contact with the patch surface m1; the side of the scraper surface m3 away from the feeding end of the transmission track 1 is also formed with an upward The raised step portion b, when the chip enters the scraper surface m3, the chip rests on the step portion b from the edge; in the orthographic projection on the horizontal plane, when the chip is unloaded, the center lines of the chip and the cutter head t aligned with the feed end of the transmission track 1 are arranged to coincide; the first power component 41 is used to drive the scraper 40 to reciprocate along the extension direction of the transmission surface m1, wherein the first power component 41 adopts a conventional rodless cylinder, the second power component 42 is connected to the first power component 41, and adopts a conventional linear cylinder, and the tool holder 400 is fixedly connected to the telescopic rod of the linear cylinder.

[0046] In summary, after adopting the chip unloading device, the porcelain plate is placed flat and fixed on the positioning platform, the positioning platform is driven by the first driving component and drives each chip on the porcelain plate to be aligned with the feed end of the transmission track in turn, and then the blade head of the scraper is inserted between the porcelain plate and the corresponding chip, and when the scraper moves close to the feed end of the transmission track, the blade head destroys the adhesive layer to drive the corresponding chip to leave the patch surface and enter the scraper surface, and finally when the scraper surface is connected with the transmission surface, the chip falls from the scraper surface on the transmission surface and is transmitted in the direction of the receiving trough to complete the chip unloading process; therefore, compared with the prior art, the utility model, on the one hand, is based on the state that the chip remains adhered to the porcelain plate, and the cooperation of the positioning platform, the scraper and the transmission track is used to implement non-destructive peeling and chip unloading of the chip, which effectively avoids the deviation of the chip, ensures that each chip is accurately connected with the transmission track, and greatly improves On the other hand, the structure is simple and reliable, and the implementation cost is low; on the third hand, by limiting the angle between the upper and lower surfaces of the cutter head, the cutter head enters between the porcelain plate and the chip and forms the best damage effect on the bonding layer, which is conducive to the chip falling off; on the fourth hand, the chip surface is used to form an auxiliary support for the cutter head to enhance the deformation resistance of the cutter head and extend its service life; on the fifth hand, the step portion is used to limit the displacement of the chip on the scraper surface, so that the chip can quickly fall onto the transmission track for collection; on the sixth hand, when the positioning platform is in a horizontal state, it is convenient for the robot to accurately place the porcelain plate on the positioning platform; when the positioning platform is in an inclined state, it is conducive to the peeling of the chip and entering the transmission track, reducing the probability of chip collision and damage; on the seventh hand, multiple chips can be collected in an orderly manner; at the same time, multiple material boxes can be replaced continuously to meet the needs of batch and efficient production.

[0047] The above has made a detailed description of the present utility model, aiming to enable those skilled in this field of technology to understand the content of the present utility model and implement it. However, it should not be used to limit the protection scope of the present utility model. Any equivalent changes or modifications made according to the spirit and essence of the present utility model should be covered within the protection scope of the present utility model.

Claims

1. An automatic wafer unloading device applicable to a ceramic plate, with an adhesive surface formed on one side of the ceramic plate and multiple wafers adhered thereto. A bonding layer is provided between the adhesive surface and each wafer. The wafer unloading device includes: A transfer track having a transfer surface for sequentially transferring the wafers from top to bottom one by one. A positioning unit including a positioning platform and a first driving component. The ceramic plate is placed flat on the positioning platform, and the first driving component is used to drive the positioning platform and drive each wafer to be aligned with the feeding end of the transfer track in sequence. A collecting unit having a wafer collecting groove connected to the discharging end of the transfer track. It is characterized in that the wafer unloading device further includes a wafer shoveling unit. The wafer shoveling unit includes a shovel blade movably arranged above the positioning platform and a first power component for driving the shovel blade to reciprocate in a direction close to or away from the feeding end of the transfer track. The shovel blade has a blade head capable of being inserted between the ceramic plate and the wafer, and a shovel blade surface is formed on the blade head. As the shovel blade moves closer to the feeding end, the blade head synchronously destroys the bonding layer, and the corresponding wafer gradually detaches from the adhesive surface and enters the shovel blade surface. When the shovel blade surface is docked with the transfer surface, the wafer falls from the shovel blade surface onto the transfer surface and is transferred towards the collecting groove.

2. The automatic sheet unloading device applicable to porcelain plates according to claim 1, characterized in that, The shovel blade includes a blade holder and a blade body fixedly connected to one end of the blade holder. The other end of the blade body extends obliquely downward towards the feeding end to form the blade head, and the shovel blade surface is formed on the upper surface of the blade head.

3. The automatic sheet discharging device applicable to porcelain plates according to claim 2, wherein The lower surface of the blade head intersects with the shovel blade surface on the side close to the feeding end, and the formed angle is 13° - 17°.

4. The automatic sheet unloading device applicable to porcelain plates according to claim 3, characterized in that, During wafer unloading, the lower surface of the blade head is arranged in contact with the adhesive surface.

5. The automatic sheet discharging device applicable to porcelain plates according to claim 2, wherein On the side of the shovel blade surface far from the feeding end, there is also a step portion protruding upward. When the wafer enters the shovel blade surface, the wafer abuts against the step portion from the edge; and / or, in the orthographic projection on the horizontal plane, during wafer unloading, the center lines of the wafer and the blade head are arranged to coincide.

6. The automatic sheet discharging device applicable to porcelain plates according to claim 1, wherein The first power component is used to drive the shovel blade to reciprocate along the extending direction of the transfer surface; the wafer shoveling unit further includes a second power component for driving the shovel blade to reciprocate along a direction perpendicular to the adhesive surface and / or the transfer surface.

7. The automatic sheet unloading device applicable to porcelain plates according to claim 1, characterized in that, The positioning platform includes a platform body capable of vacuum adsorbing the ceramic plate and a plurality of clamping blocks circumferentially spaced around the platform body. The plurality of clamping blocks can move towards or away from each other to clamp or release the ceramic plate; the first driving component is used to drive the platform body to rotate around its own center line direction.

8. The automatic sheet unloading device applicable to porcelain plates according to claim 1, characterized in that, The positioning platform has a horizontal state and an inclined state. During wafer unloading, the positioning platform is in the inclined state, and the adhesive surface is arranged parallel to the transfer surface; the positioning unit further includes a second driving component for driving the positioning platform to switch between the horizontal state and the inclined state.

9. The automatic sheet unloading device applicable to porcelain plates according to claim 8, characterized in that, The second driving component includes a base, a flipping seat disposed above the base, and a driving member, wherein one side of the flipping seat is rotatably connected to the base through a pivot, and the other side is rotatably connected to the output shaft of the driving member; the positioning platform is fixedly arranged on the flipping seat.

10. The automatic sheet unloading device applicable to porcelain plates according to claim 1, characterized in that, The material receiving unit includes a lifting frame and a material box arranged on the lifting frame, wherein a plurality of the material receiving grooves are formed on the material box and are distributed up and down, and the lifting frame drives the material box and drives the plurality of material receiving grooves to be sequentially docked with the discharging end; there are a plurality of the material boxes and they are distributed at intervals up and down.

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