Silicon wafer high-speed rotation rejecting device

Abstract

The utility model relates to a high-speed rotary rejecting device for silicon wafers. A supporting seat of the removing line is connected to a base plate, a stepping motor of a driving assembly is arranged on the supporting seat, a rotating plate is rotatably connected to the supporting seat, a transmission component is arranged on the rotating plate, and the stepping motor drives the transmission component; a servo motor of the lower swing assembly is arranged on a supporting base, the output end of the servo motor is connected to one end of a crank connecting rod, and the other end of the crank connecting rod is rotationally connected to a rotating plate. A machine shell of the material removing assembly is arranged on the supporting base, and a nozzle is connected into the machine shell and points to the transmission component. According to the utility model, airflow sprayed by the nozzle is blown to the silicon wafer to form downward pressure, so that the silicon wafer is attached to the flat belt, fragments can simultaneously swing downwards along with the lower swing component during lower swing material removing and downward pressing, and the next silicon wafer can be attached to the flat belt by the downward pressure formed by blowing when the silicon wafer swings upwards after material removing is finished, so that the problem that the silicon wafer jumps upwards during upward swinging is solved; and the device is suitable for a high-speed silicon wafer sorting machine.

Description

Technical Field

[0001] The utility model belongs to the field of silicon wafer sorting equipment, and particularly relates to a high-speed rotating silicon wafer rejecting device. Background Art

[0002] As an important raw material for solar cells, silicon wafers are widely used in the production and manufacturing of products such as solar cells and circuit boards. During the production process of silicon wafers, as a terminal device for quality control, a silicon wafer sorter detects and sorts the quality grades of silicon wafers in terms of size, chipping, silicon loss, dirt, hidden cracks, holes, resistivity, etc., to ensure the quality of products such as solar cells and circuit boards manufactured from silicon wafers.

[0003] A silicon wafer sorter generally consists of three parts: feeding, detection, and discharging and sorting. During the production process of silicon wafers, silicon wafers are prone to breakage and other phenomena due to the impact. Therefore, before the silicon wafers enter the detection and sorting process, the fragments need to be removed first.

[0004] In response to the above-mentioned risk of phenomena, in early technologies, a fragment rejection device was added to the conveying streamline, and the broken materials were removed into the broken material box by the swinging down of the swing arm. When the silicon wafers enter the detection station through the conveying streamline, first, the detection camera in the detection mechanism detects elements such as the appearance and edges of the silicon wafers. The rejection conveying belt on the fragment rejection mechanism and the conveying belt of the conveying streamline form a set of conveying lines. When a complete silicon wafer flows through the fragment rejection mechanism, the silicon wafer directly passes through. When a fragment is detected, the swinging mechanism that composes the conveying belt of the rejection structure will perform a reciprocating swinging motion between the conveying line and the broken material box to remove the fragment into the broken material box and achieve the fragment rejection action. However, due to structural problems, when applied to a high-speed silicon wafer sorter, due to the increase in production capacity, the speed of the conveying streamline will be significantly increased. When reciprocating and swinging to reject materials, there will be a problem that the fragments cannot follow the swing arm mechanism to reject materials downward in time, resulting in a blockage problem. When swinging upward, the silicon wafers may also jump due to the inertia of the upward swing, and there will be factors of secondary damage to the silicon wafers, affecting the production quality of the silicon wafers.

[0005] In response to the above problems, there is also a device that adsorbs and transports silicon wafers by the vacuum generated by the overhead conveyor belt group. When the silicon wafers are transported to the end of the overhead conveyor belt, they naturally fall due to gravity, and the silicon wafers fall onto the receiving conveyor belt group and continue to be transported to the subsequent detection station. This device uses the overhead conveyor belt group to replace the swing arm rejection mechanism, which can solve the problem of silicon wafer jumping during swinging, but there is also a phenomenon that only the upper silicon wafer is adsorbed when there are overlapping silicon wafers, and there is a problem of missed adsorption; at the same time, continuously adsorbing silicon wafers will increase the gas consumption of the equipment, and continuous air supply is required to provide a stable adsorption effect. Summary of the Utility Model

[0006] To solve the above technical problems, the present utility model provides a high-speed rotating wafer picking device. By blowing the air flow ejected from the nozzle towards the wafer to form a downward pressure, the wafer is attached to the flat belt. When performing the downward swing picking operation, during the downward pressure application, the fragments can swing downward simultaneously with the downward swing component, and the picking operation can be completed within the required time. When swinging upward after the picking operation is completed, the downward pressure formed by the blowing can make the next wafer closely attached to the flat belt, effectively solving the problem that the wafer jumps upward during the upward swing, and it can be applied to a high-speed wafer sorting machine.

[0007] To achieve the above object, the technical solution adopted by the present utility model is as follows:

[0008] A high-speed rotating wafer picking device includes a feeding conveyor line, a detection line, a rejection line, a receiving conveyor line, and a substrate. The feeding conveyor line, the detection line, the rejection line, and the receiving conveyor line are sequentially arranged on the substrate from left to right. The wafers sequentially pass through the feeding conveyor line, the detection line, the rejection line, and the receiving conveyor line. The rejection line includes a support seat, a driving component, a downward swing component, and a picking component. The support seat is connected to the substrate. The driving component includes a stepping motor, a rotating plate, and a transmission member. The stepping motor is arranged on the support seat. The rotating plate is rotatably connected to the support seat. The transmission member is arranged on the rotating plate. The stepping motor drives the transmission member. The downward swing component includes a servo motor and a crank connecting rod. The servo motor is arranged on the support seat. The output end of the servo motor is connected to one end of the crank connecting rod. The other end of the crank connecting rod is rotatably connected to the rotating plate. The picking component includes a housing and a nozzle. The housing is arranged on the support seat. The nozzle is connected inside the housing and points to the transmission member.

[0009] The transmission member includes a transmission wheel, a flat belt, a first idler wheel, and a second idler wheel. The transmission wheel and the first idler wheel are rotatably connected to the rotating plate. The flat belt is sleeved between the transmission wheel and the first idler wheel. The upper end surface of the flat belt is flush with the feeding conveyor line and the receiving conveyor line respectively. The stepping motor drives the transmission wheel to drive the flat belt to rotate. The second idler wheel is rotatably connected to the rotating plate. The second idler wheel is arranged between the transmission wheel and the first idler wheel. The second idler wheel abuts against the inner side surface of the flat belt. The driving component further includes a cleaning member. The cleaning member includes a mounting seat and a brush wheel. The mounting seat is connected to the support seat. The brush wheel is rotatably connected to the mounting seat. The brush wheel abuts against the outer side surface of the flat belt. There are two groups of transmission members. The flat belts of the two groups of transmission members are parallel to each other and do not contact each other. An induction head is arranged between the two groups of flat belts. The induction head faces upward and points to the nozzle. The upper end surface of the induction head is lower than the upper end surfaces of the two groups of flat belts.

[0010] The high-speed rotating wafer rejection device with this structure uses the substrate to play the most basic supporting role. The wafers pass through the incoming material conveying line, inspection line, rejection line, and receiving material conveying line on the substrate in sequence. The incoming material conveying line and the receiving material conveying line are common belt conveying mechanisms, on which the wafers can be stably conveyed. The wafers are inspected by an inspection camera for factors such as the appearance and edges of the wafers to check whether the wafers are intact without breakage or there is breakage. When the wafers are sent by the incoming material conveying line into the rejection line, according to the inspection results, if the wafers are intact without breakage, the rejection line is kept horizontal so that the wafers are sent into the receiving material conveying line and enter the next process. When there is breakage in the wafers, the rejection line is tilted to let the fragments on the wafers fall off. After the falling is completed, the rejection line is lifted to send the cleaned wafers into the receiving material conveying line and enter the next process.

[0011] In order to achieve the above processes, first, the problem of how to tilt the rejection line needs to be solved. Therefore, the rotating plate is rotatably connected to the support base, and the crank-link is driven by a servo motor on the support base to rotate. The other end of the crank-link is rotatably connected to the rotating plate. When the servo motor drives the rotation, it will drive the crank-link to pull the rotating plate and turn the rotating plate downward. Therefore, when the servo motor drives the crank-link to reciprocate, the rotating plate can reciprocally swing between the horizontal state and the inclined state. In order to enable the wafers to translate across the rotating plate, a transmission member is set. The transmission wheel, the first idler wheel, and the second idler wheel are all rotatably connected to the rotating plate. The flat belt is sleeved between the transmission wheel and the first idler wheel. Therefore, when the stepping motor on the support plate drives the transmission wheel to rotate, it can drive the flat belt to transmit, driving the wafers placed on it. In order to stably transmit the wafers, two sets of transmission members are set, and the two flat belts are arranged in parallel. The wafers are transmitted on the two flat belts, with sufficient support on both the left and right. In order to prevent the middle span of the flat belt from being too long and being depressed by the wafers, a second idler wheel is added between the driven wheel and the first idler wheel to support the wafers above the flat belt. Therefore, the problems of the rotation and transmission of the rejection line are solved.

[0012] Since the wafer sorter used by this device is a high-speed wafer sorter, during the rapid transmission of wafers, after identifying the fragments on the wafer and entering the rejection line, it is necessary to immediately determine whether it is necessary to lower the rotating plate to remove the fragments. After the removal is completed, the rotating plate needs to be immediately lifted to resume the transmission of the wafers. The whole process needs to be completed in a short time. Therefore, it is necessary to have a detection device for detecting the wafers entering the rejection line and a device for quickly removing the fragments. Therefore, an induction head is set between the two groups of flat belts. The induction head is located in the middle part of the flat belt. When the induction head senses that the wafer passes by, it immediately performs actions based on the detection results obtained through the detection line. The distance from the induction head to the first idler pulley is the time allowed for material rejection. Therefore, a nozzle is set on the transmission member. The nozzle is vertically pointed at the wafers transmitted on the two groups of flat belts. The nozzle continuously blows downward air flow to form a continuous downward pressure. When a complete wafer flows through the material rejection component, the air flow blown by the nozzle can keep the wafer continuously on the two groups of flat belts. When it is detected that there are fragments when the wafer flows through the material rejection component, the rotating plate is driven to rotate by the servo motor, the rotating plate is lowered, and the fragments are blown out below the receiving conveyor by the inclined air flow blown onto the wafer by the nozzle. The operation of fragment rejection can be completed in a very short time. Then, the rotating plate is immediately lifted, and the wafers that have been cleaned are sent to the receiving conveyor. At the same time, the air flow of the nozzle can also keep the next transmitted wafer tightly attached to the flat belt, avoiding the wafer jumping upward during the lifting process of the rotating plate and preventing secondary damage to the wafer during the transmission process. The provided cleaning component presses the brush wheel against the outer side surface at the lower end of the flat belt. Therefore, when the rotating plate is lowered, the flat belt contacts the brush wheel, and the brush wheel rotates following the flat belt, which can clean the dirt on the flat belt and the fragments attached to the flat belt.

[0013] Further, the casing is a sheet metal part that is enclosed on four sides, runs through from front to back, and has a rejection cavity inside. The nozzle is detachably connected to the upper end surface of the rejection cavity. The support seat, drive assembly, and lower swing assembly are all arranged inside the casing; the material rejection component further includes a scrap box, and the scrap box is arranged on the substrate at the lower end between the material rejection component and the receiving conveyor.

[0014] Compared with the prior art, the advantages of the present utility model are as follows: The material rejection is safer. The downward pressure formed by blowing air makes the wafer tightly attached to the flat belt, eliminating the problem of the wafer jumping up when the rotating plate is lifted, thus avoiding the harm of secondary damage to the wafer; The efficiency is higher. When the rotating plate is lowered, due to the downward pressure of the blowing air, the fragments can follow the rotating plate and be lowered at the same time, reducing the lag during fragment rejection. It is also possible to achieve material rejection by increasing the lowering speed of the rotating plate, thereby increasing the production capacity speed; The material rejection is more comprehensive. Compared with the material rejection device that adsorbs and rejects materials, it can effectively solve the problem of missed suction when there are overlapping wafers. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0016] Figure 1 3D view of the hidden housing of the present invention;

[0017] Figure 2 3D view of the material removal component of the present invention;

[0018] Figure 3 3D view of the material removal line of the hidden housing of the present invention;

[0019] Figure 4 Left view of the material removal line of the hidden housing of the present invention.

[0020] Wherein: 1, incoming material conveying line; 2, detection line; 3, rejection line; 31, support base; 32, driving member; 321, stepping motor; 322, rotating plate; 323, transmission member; 3231, transmission wheel; 3232, flat belt; 3233, first idler wheel; 3234, second idler wheel; 324, cleaning member; 3241, mounting seat; 3242, brush wheel; 325, induction head; 33, lower swing member; 331, servo motor; 332, crank and connecting rod; 34, material removal component; 341, housing; 342, nozzle; 343, scrap box; 4, receiving material conveying line; 5, substrate; 6, silicon wafer. Detailed implementation manners

[0021] To make the objectives, technical solutions and advantages of the present invention clearer, the following will clearly and completely describe the technical solutions of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present invention.

[0022] The following will describe the detailed implementation manners of the present invention in conjunction with the drawings:

[0023] Such as Figures 1-4As shown in the figure, a high-speed rotating silicon wafer rejection device includes a feeding conveyor line 1, a detection line 2, a rejection line 3, a receiving conveyor line 4 and a substrate 5. The feeding conveyor line 1, the detection line 2, the rejection line 3 and the receiving conveyor line 4 are sequentially arranged on the substrate 5 from left to right. The silicon wafers 6 sequentially pass through the feeding conveyor line 1, the detection line 2, the rejection line 3 and the receiving conveyor line 4. The rejection line 3 includes a support base 31, a driving assembly, a lower swing assembly and a rejection component 34. The support base 31 is connected to the substrate 5. The driving assembly includes a stepping motor 321, a rotating plate 322 and a transmission member 323. The stepping motor 321 is arranged on the support base 31. The rotating plate 322 is rotatably connected to the support base 31. The transmission member 323 is arranged on the rotating plate 322. The stepping motor 321 drives the transmission member 323. The lower swing assembly includes a servo motor 331 and a crank connecting rod 332. The servo motor 331 is arranged on the support base 31. The output end of the servo motor 331 is connected to one end of the crank connecting rod 332. The other end of the crank connecting rod 332 is rotatably connected to the rotating plate 322. The rejection component 34 includes a housing 341 and a nozzle 342. The housing 341 is arranged on the support base 31. The nozzle 342 is connected inside the housing 341 and points to the transmission member 323.

[0024] The transmission member 323 includes a transmission wheel 3231, a flat belt 3232, a first idler wheel 3233 and a second idler wheel 3234. The transmission wheel 3231 and the first idler wheel 3233 are rotatably connected to the rotating plate 322. The flat belt 3232 is sleeved between the transmission wheel 3231 and the first idler wheel 3233. The upper end surface of the flat belt 3232 is flush with the feeding conveyor line 1 and the receiving conveyor line 4 respectively. The stepping motor 321 drives the transmission wheel 3231 to drive the flat belt 3232 to transmit. The second idler wheel 3234 is rotatably connected to the rotating plate 322. The second idler wheel 3234 is arranged between the transmission wheel 3231 and the first idler wheel 3233. The second idler wheel 3234 abuts against the inner side surface of the flat belt 3232. The driving assembly further includes a cleaning member 324. The cleaning member 324 includes a mounting seat 3241 and a brush wheel 3242. The mounting seat 3241 is connected to the support base 31. The brush wheel 3242 is rotatably connected to the mounting seat 3241. The brush wheel 3242 abuts against the outer side surface of the flat belt 3232. There are two groups of the transmission members 323. The flat belts 3232 of the two groups of the transmission members 323 are parallel to each other and do not contact each other. An induction head 325 is arranged between the two groups of the flat belts 3232. The induction head 325 faces upward and points to the nozzle 342. The upper end surface of the induction head 325 is lower than the upper end surfaces of the two groups of the flat belts 3232.

[0025] Further, the casing 341 is a sheet metal part that is surrounded on four sides, penetrated front and back, and has a rejection cavity inside. The nozzle 342 is detachably connected to the upper end surface of the rejection cavity. The support base 31, the drive assembly, and the lower swing assembly are all arranged inside the casing 341. The material rejection assembly further includes a shredding box 343, and the shredding box 343 is arranged on the substrate 5 at the lower end between the material rejection assembly and the receiving conveyor line 4.

[0026] Description of the working mode of the present utility model:

[0027] For the high-speed rotating wafer material rejection device with this structure, the substrate 5 plays the most basic supporting role. The wafers 6 sequentially pass through the incoming material conveyor line 1, the detection line 2, the rejection line 3, and the receiving conveyor line 4 on the substrate 5. The incoming material conveyor line 1 and the receiving conveyor line 4 are common belt conveyor mechanisms, and the wafers 6 can be stably conveyed thereon. The detection camera detects factors such as the appearance and edges of the wafers 6 to check whether the wafers 6 are intact without breakage or there is breakage. When the wafers 6 are sent by the incoming material conveyor line 1 to the rejection line 3, according to the detection result, if the wafers 6 are intact without breakage, the rejection line 3 is kept horizontal so that the wafers 6 are sent to the receiving conveyor line 4 and enter the next process. When there is breakage in the wafers 6, the rejection line 3 is tilted to let the fragments on the wafers 6 fall off. After the falling is completed, the rejection line 3 is lifted to send the cleaned wafers 6 to the receiving conveyor line 4 and enter the next process.

[0028] In order to implement the above processes, first, the problem of how the rejection line 3 inclines needs to be solved. Therefore, the rotating plate 322 is rotatably connected to the support base 31, and the servo motor 331 on the support base 31 drives the crank connecting rod 332 to rotate. The other end of the crank connecting rod 332 is rotatably connected to the rotating plate 322. When the servo motor 331 drives the rotation, it will drive the crank connecting rod 332 to pull the rotating plate 322 and rotate the rotating plate 322 downward. Therefore, when the servo motor 331 drives the crank connecting rod 332 to reciprocate, the rotating plate 322 can reciprocally swing between the horizontal state and the inclined state. In order to enable the silicon wafer 6 to translate over the rotating plate 322, a transmission member 323 is provided. The transmission wheel 3231, the first idler wheel 3233, and the second idler wheel 3234 are all rotatably connected to the rotating plate 322. The flat belt 3232 is sleeved between the transmission wheel 3231 and the first idler wheel 3233. Therefore, when the stepping motor 321 on the support plate drives the transmission wheel 3231 to rotate, it can drive the flat belt 3232 to transmit and drive the silicon wafer 6 placed thereon. In order to stably transmit the silicon wafer 6, two sets of transmission members 323 are provided, and the two flat belts 3232 are arranged in parallel. The silicon wafer 6 is transmitted on the two flat belts 3232 and has sufficient support on both the left and the right. In order to prevent the middle span of the flat belt 3232 from being too long and being depressed by the silicon wafer 6, a second idler wheel 3234 is added between the driven wheel and the first idler wheel 3233 to support the silicon wafer 6 on the flat belt 3232. Therefore, the problems of the rotation and transmission of the rejection line 3 are solved.

[0029] Because the silicon wafer 6 sorting machine used by the device is a high-speed silicon wafer 6 sorting machine, during the rapid transmission of the silicon wafer 6, after identifying the fragments on the silicon wafer 6, it is necessary to immediately determine whether it is necessary to swing down the rotating plate 322 to remove the fragments. After the removal is completed, the rotating plate 322 is immediately raised to restore the transmission of the silicon wafer 6. The whole process must be completed in a short time. Therefore, it is necessary to have a detection device for detecting the silicon wafer 6 entering the rejection line 3 and a device for quickly removing the fragments. Therefore, an induction head 325 is set between the two sets of flat belts 3232. The induction head 325 is used to detect the silicon wafer 6 entering the rejection line 3. The sensor head 325 is located in the middle of the flat belt 3232. When the sensor head 325 senses the silicon wafer 6 passing by, it immediately executes the action through the detection result obtained by the detection line 2. The distance between the sensor head 325 and the first idler wheel 3233 is the time allowed for the material removal. Therefore, a nozzle 342 is set on the transmission component 323. The nozzle 342 is vertically pointed to the silicon wafer 6 driven on the two groups of flat belts 3232. The nozzle 342 continuously blows air downward to form a continuous downward pressure. When the complete silicon wafer 6 flows through the material removal component 34, the nozzle 342 The blown airflow can keep the silicon wafer 6 on the two sets of flat belts 3232 continuously. When it is detected that there are fragments in the silicon wafer 6 flowing through the material removal component 34, the servo motor 331 drives the rotating plate 322 to rotate, the rotating plate 322 is lowered, and the inclined airflow blown to the silicon wafer 6 by the nozzle 342 is used to blow the fragments to the bottom of the material receiving conveyor line 4. The debris removal operation can be completed in a very short time, and then the rotating plate 322 is immediately lifted up to send the cleaned silicon wafer 6 into the material receiving conveyor line 4. At the same time, the airflow from the nozzle 342 can also blow the rear A silicon wafer 6 being conveyed is kept close to the flat belt 3232 to prevent the silicon wafer 6 from jumping upward when the rotating plate 322 is lifted, and to prevent secondary damage to the silicon wafer 6 during the conveying process. A cleaning component 324 is provided to abut the brush wheel 3242 against the outer surface of the lower end of the flat belt 3232. Therefore, when the rotating plate 322 is lowered, the flat belt 3232 contacts the brush wheel 3242, and the brush wheel 3242 rotates with the flat belt 3232, so as to clean the dirt and debris attached to the flat belt 3232.

[0030] In order to ensure that the gas blown downward by the nozzle 342 will not be affected by the external environment, a casing 341 is added which is surrounded on all sides, penetrated from front to back and provided with a rejecting chamber inside, so as to keep the blowing space of the nozzle 342 always in the rejecting chamber, and the crushed material box 343 is arranged on the substrate 5 at the lower end of the rejecting component and the material receiving conveyor line 4. When the fragments on the silicon wafer 6 are blown down, the crushed material box 343 can receive the fallen fragments to avoid the fragments flying around and causing the trouble of cleaning.

[0031] The beneficial effects of the present utility model are as follows: The material removal is safer. The downward pressure formed by blowing air makes the silicon wafer 6 closely adhere to the flat belt 3232, eliminating the problem that the silicon wafer 6 jumps up when the rotating plate 322 swings upward, thereby avoiding the harm of secondary damage to the silicon wafer 6; The efficiency is higher. When swinging downward, the debris can swing downward simultaneously with the rotating plate 322 due to the downward pressure of the blowing air, reducing the lag during debris removal. The material removal can also be achieved by increasing the downward swing speed of the rotating plate 322, thereby increasing the production speed; The material removal is more comprehensive. Compared with the material removal device that adsorbs and removes materials, it can effectively solve the problem of missed suction when there are overlapping wafers.

[0032] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; Although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: They can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; And these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present utility model.

Claims

1. A high-speed rotating wafer rejection device, comprising a feeding conveyor line, a detection line, a rejection line, a receiving conveyor line and a substrate. The feeding conveyor line, the detection line, the rejection line and the receiving conveyor line are sequentially arranged on the substrate from left to right. The wafers sequentially pass through the feeding conveyor line, the detection line, the rejection line and the receiving conveyor line, and are characterized in that: The rejection line includes a support base, a drive assembly, a lower swing assembly, and a material rejection assembly. The support base is connected to the substrate. The drive assembly includes a stepper motor, a rotating plate, and a transmission member. The stepper motor is disposed on the support base. The rotating plate is rotatably connected to the support base. The transmission member is disposed on the rotating plate. The stepper motor drives the transmission member. The lower swing assembly includes a servo motor and a crank connecting rod. The servo motor is disposed on the support base. The output end of the servo motor is connected to one end of the crank connecting rod. The other end of the crank connecting rod is rotatably connected to the rotating plate. The material rejection assembly includes a housing and a nozzle. The housing is disposed on the support base. The nozzle is connected inside the housing and points to the transmission member.

2. The silicon wafer high-speed rotating material removal device according to claim 1, wherein: The transmission member includes a transmission wheel, a flat belt, and a first idler pulley. The transmission wheel and the first idler pulley are rotatably connected to the rotating plate. The flat belt is sleeved between the transmission wheel and the first idler pulley. The upper end surface of the flat belt is flush with the incoming material conveying line and the receiving material conveying line respectively. The stepper motor drives the transmission wheel to drive the flat belt to transmit.

3. The silicon wafer high-speed rotating material removing device according to claim 2, wherein: The transmission member further includes a second idler pulley. The second idler pulley is rotatably connected to the rotating plate. The second idler pulley is disposed between the transmission wheel and the first idler pulley. The second idler pulley abuts against the inner side surface of the flat belt.

4. The silicon wafer high-speed rotating blanking device according to claim 3, wherein: The drive assembly further includes a cleaning member. The cleaning member includes a mounting seat and a brush wheel. The mounting seat is connected to the support base. The brush wheel is rotatably connected to the mounting seat. The brush wheel abuts against the outer side surface of the flat belt.

5. The silicon wafer high-speed rotating material removal device according to claim 4, characterized in that: There are two sets of the transmission members. The flat belts of the two sets of the transmission members are parallel to each other and do not contact each other. An induction head is provided between the two flat belts. The induction head points upward to the nozzle. The upper end surface of the induction head is lower than the upper end surfaces of the two flat belts.

6. The high-speed rotating wafer blanking device according to claim 1, characterized in that: The housing is a sheet metal part surrounded by four sides, penetrating through the front and back, and having a rejection cavity inside. The nozzle is detachably connected to the upper end surface of the rejection cavity. The support base, the drive assembly, and the lower swing assembly are all disposed inside the housing.

7. The silicon wafer high-speed rotating material removal device according to claim 6, characterized in that: The material rejection assembly further includes a shredding box. The shredding box is disposed on the substrate at the lower end between the material rejection assembly and the receiving material conveying line.

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