Stress test general tool based on chip on workpiece
By designing a chip stress testing tool for adjustable angles between the horizontal and vertical plates, the problem of inaccurate chip stress measurement in the prior art is solved, and uniform stress detection of different chips is achieved to adapt to accurate measurement under eccentricity.
Patent Information
- Application Number
- CN202421796483.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-29
AI Technical Summary
Existing chip stress testing tools have less versatility when facing chips of different sizes and specifications, making it difficult to accurately measure the stress on the chip, especially in the presence of eccentricity, which is more misjudged.
A general tool for chip stress testing based on workpieces is designed, including base, bracket plate, pressure testing assembly and positioning assembly. Through the adjustable angle between the horizontal and vertical plates, combined with spring screws and pressure sensors, uniform stress measurement of different chips is achieved.
The stress test results of different chips are achieved more accurate, reducing the difference between the actual chip stress value and the calculated value, and adapting to chip stress detection in eccentricity.
Smart Images

Figure CN223077781U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of stress testing tooling, and more specifically, to a general stress testing tooling based on a chip on a workpiece. Background Art
[0002] With the development of the times, various chip size specifications are constantly changing, and the requirements for stress detection of the chips acting on the workpieces are also constantly increasing. The previously common testing methods were all to test the force values of individual springs and then superimpose them. In this way, when there are eccentricities in the outer hole positions of the chips, there is a large difference between the actual stress of the chips and the result calculated by superposition. Since the force value acting on the entire chip cannot be accurately measured, it is easy to misjudge the chips.
[0003] The stress testing fixture and the main board assembly pressure testing system with the publication number of CN108020361A record that when the workpiece is fixed to the main board, the stress of the workpiece and the main board on the stress testing fixture is sensed by a pressure sensor, and the stress of the chip between the main board and the workpiece is more accurately simulated, so as to further adjust the distance and bonding strength between the workpiece and the main board, etc., and reduce or avoid the situation that the downward pressure of the workpiece on the chip is insufficient or excessive. For this testing fixture, although it can realize the stress testing of the chips, its versatility is low, and it is difficult to detect chips with different size specifications. Summary of the Utility Model
[0004] The main purpose of the utility model is to propose a general stress testing tooling based on a chip on a workpiece to solve the technical problems mentioned in the background art.
[0005] To solve the above technical problems, the utility model proposes a general stress testing tooling based on a chip on a workpiece, including:
[0006] A base;
[0007] A support plate, which is slidably arranged on the base in the vertical direction and is used to fix the workpiece;
[0008] A pressure testing component, which is used to detect the chip stress on the workpiece located on the support plate, and further includes:
[0009] A positioning component, which is arranged on the support plate and is used to fix the workpiece;
[0010] Wherein, the positioning component includes:
[0011] Two cross plates, which are arranged on the support plate, and first limiting grooves are formed on the cross plates along their length directions;
[0012] There are two longitudinal plates, which are arranged on the support plate, and the two longitudinal plates and the two transverse plates are arranged in a cross shape to form a "well" shape. There are second limiting grooves opened along the length direction on the longitudinal plates;
[0013] And spring screws, one end of which is arranged on the workpiece, and the other end is embedded into the first limiting groove and the second limiting groove and fixed;
[0014] Wherein, the included angle between the transverse plate and the longitudinal plate is adjustable.
[0015] In the above technical solution, further, there are four groups of spring screws, which are respectively used to fix the four end corners of the workpiece.
[0016] In any of the above technical solutions, further, the pressure test assembly includes:
[0017] A pressure sensor, which is arranged on the base;
[0018] And a height gauge, which is arranged on the base along the vertical direction.
[0019] In any of the above technical solutions, further, the pressure sensor further includes:
[0020] A contact block, which is arranged on the pressure sensor;
[0021] Wherein, the contact block is detachably arranged.
[0022] In any of the above technical solutions, further, there are vertical columns arranged around the base, and guide rods are vertically arranged on each column, and the four sides of the support plate are respectively arranged on each guide rod and slide along the vertical direction;
[0023] Wherein, an adjusting part is further arranged between the support plate and the base for adjusting the position of the support plate on the guide rod.
[0024] In any of the above technical solutions, further, the adjusting part includes:
[0025] A lead screw slider mechanism, which is vertically arranged on the base, and one side of the support plate is connected to the slider on the lead screw slider mechanism.
[0026] In any of the above technical solutions, further, the adjusting part further includes:
[0027] A servo motor, which is connected to the lead screw on the lead screw slider mechanism and is used to drive the lead screw to rotate so as to drive the slider and the support plate to perform linear motion.
[0028] In any of the above technical solutions, further, the workpiece is a radiator.
[0029] Beneficial effects: Compared with the prior art, for chips of different models, especially chips with problems such as eccentricity, in this embodiment, the positions of the horizontal plate and the vertical plate can be adjusted, and then the distribution of the spring screws on the workpiece can be adjusted, so that the stress between the chip and the workpiece can be made more uniform. In this way, even if there is eccentricity in the outer hole position of the chip, it can ensure that the difference between the actual value and the calculated value of the chip stress is small. Brief Description of the Drawings
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0031] Figure 1 is a three-dimensional structural schematic diagram of the present invention;
[0032] Figure 2 is a side view structural schematic diagram of the present invention;
[0033] Figure 3 is a top view structural schematic diagram of the present invention.
[0034] The description of the reference numerals is as follows:
[0035] 10, workpiece; 100, base; 110, column; 120, guide rod; 200, support plate; 300, pressure test assembly; 310, pressure sensor; 320, height gauge; 330, contact block; 400, positioning assembly; 410, horizontal plate; 411, first limit groove; 420, vertical plate; 421, second limit groove; 430, spring screw. Detailed Embodiments
[0036] Next, exemplary embodiments according to the present application will be described in detail with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.
[0037] It should be noted that, as shown in this application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.
[0038] If there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture (as shown in the drawings). If this specific posture changes, then the directional indications will also change accordingly.
[0039] In the present utility model, unless otherwise clearly defined and limited, terms such as "connected" and "fixed" should be understood in a broad sense. For example, "fixed" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.
[0041] Chips of different models have different stresses on the workpiece. This stress refers to the pressure exerted on the chip when the workpiece is installed on the chip. If this pressure is too large, it is likely to cause damage to the chip; if the pressure is too small, the contact force between the chip and the workpiece will be insufficient. Based on this, the stress test of the chip is particularly important. Currently, the test fixtures are relatively single and cannot be adapted to chips of different models. For this reason, this application proposes a general stress test fixture for chips on the workpiece.
[0042] The general tooling for stress testing of chips on a workpiece according to the present application will be described in detail below through the following embodiments.
[0043] Embodiment 1:
[0044] As Figures 1-3 shown, in this embodiment, a general tooling for stress testing of chips on a workpiece includes: a base 100; a support plate 200 slidably disposed on the base 100 in the vertical direction and used to fix the workpiece 10; a pressure testing component 300 for detecting the chip stress on the workpiece 10 located on the support plate 200. Among them, it further includes: a positioning component 400 disposed on the support plate 200 for fixing the workpiece.
[0045] Among them, the positioning component 400 includes: two cross plates 410 disposed on the support plate 200, and a first limiting groove 411 is formed on the cross plate 410 along its length direction; two longitudinal plates 420 disposed on the support plate 200, and the two longitudinal plates 420 and the two cross plates 410 are arranged in a cross shape to form a "well" shape, and a second limiting groove 421 is formed on the longitudinal plate 420 along its length direction; and spring screws 430, one end of which is disposed on the workpiece 10, and the other end is embedded in the first limiting groove 411 and the second limiting groove 421 and fixed.
[0046] Among them, the included angle between the cross plate 410 and the longitudinal plate 420 is adjustable.
[0047] First, fix the workpiece on the cross plate 410 and the longitudinal plate 420 through the spring screws 430, then adjust the position of the support plate 200 so that the pressure testing component 300 can measure the pressure. Immediately, position the workpiece in the horizontal plane direction. For example, insert a test platform at the bottom of the workpiece to limit the downward movement of the workpiece. Subsequently, drive the support plate 200 to move downward, and make the support plate 200 or the cross plate 410 and the longitudinal plate 420 act on the pressure testing component 300, so that the pressure testing component 300 measures the downward pressure. At the same time, since the workpiece is limited, and the lower end of the spring screw 430 on it is on the cross plate 410 and the longitudinal plate 420, when the support plate 200 moves downward, the cross plate 410 and the longitudinal plate 420 move downward synchronously and simultaneously apply a downward pulling force on the spring screw 430, so that the spring on the spring screw 430 is compressed. Through the compression amount of the spring on the spring screw 430 and the pressure amount detected by the pressure testing component 300, the relationship between the stress of the chip and the spring force of the spring screw 430 on the chip can be obtained, and thus provide a reference for the subsequent design and manufacture of the chip.
[0048] For chips of different models, especially chips with problems such as eccentricity, in this embodiment, by adjusting the positions of the cross plate 410 and the longitudinal plate 420, and then adjusting the distribution of the spring screws 430 on the workpiece, the stress between the chip and the workpiece can be made more uniform. In this way, even if there is eccentricity in the outer hole position of the chip, the difference between the actual value and the calculated value of the chip stress can be ensured to be small.
[0049] Specifically, by adjusting the angle between the cross plate 410 and the longitudinal plate 420, the cross position between the first limiting groove 411 on the cross plate 410 and the second limiting groove 421 on the longitudinal plate 420 can be adjusted, and this cross position is the installation position of the spring screw 430 on the workpiece.
[0050] Regarding the fixation of the cross plate 410 and the longitudinal plate 420, they can be fixed on the support plate 200 by bolts. When adjustment is needed, just loosen the bolts, which is very convenient.
[0051] In this embodiment, it should be noted that there are four groups of spring screws 430, which are respectively used to fix the four end corners of the workpiece.
[0052] In this embodiment, the pressure test component 300 includes: a pressure sensor 310, which is arranged at the middle position of the upper end of the base 100; and a height gauge 320, which is arranged on the base 100 along the vertical direction.
[0053] By applying pressure to the pressure sensor 310, the stress of the chip can be measured. When performing stress detection, first, the support plate 200 needs to be moved to an appropriate height so that the pressure sensor 310 is just in the 0 value state. When the support plate 200 is moved downward, the pressure sensor 310 can detect the pressure as the standard.
[0054] The height gauge 320 is used to measure the downward movement amount of the support plate 200, and this downward movement amount is the compression amount of the spring on the spring screw 430.
[0055] Optimally, the pressure sensor 310 further includes: a contact block 330, which is adapted to the chip and is arranged on the pressure sensor 310; wherein, the contact block 330 is detachably arranged.
[0056] By setting the contact block 330, the pressure sensor 310 can be made to receive force evenly.
[0057] It should be noted that in order to enable the support plate 200 to move smoothly up and down on the base 100, for this purpose, there are vertical columns 110 vertically arranged around the base 100, and guide rods 120 are vertically arranged on each column 110. The four sides of the support plate 200 are respectively slidably arranged on each guide rod 120 along the vertical direction;
[0058] Among them, an adjusting part (not shown in the figure) for adjusting the position of the support plate 200 on the guide rod 120 is further provided between the support plate 200 and the base 100. The adjusting part includes: a lead screw slider mechanism, which is vertically arranged on the base 100, and one side of the support plate 200 is connected to the slider on the lead screw slider mechanism.
[0059] First, the guide rod 120 is used to limit the position of the support plate 200, and then the handle on the lead screw slider mechanism is manually rotated to convert the rotational motion of the lead screw into the linear motion of the slider thereon, so as to drive the support plate 200 to move in the vertical direction and adjust the distance between the support plate 200 and the contact block 330 on the pressure sensor 310.
[0060] In the embodiment, it should be noted that the workpiece 10 is a radiator.
[0061] Embodiment Two:
[0062] This embodiment is a further improvement based on Embodiment One.
[0063] In this embodiment, the adjusting part further includes: a servo motor (not shown in the figure), which is connected to the lead screw on the lead screw slider mechanism and is used to drive the lead screw to rotate so as to drive the slider and the support plate 200 to perform linear motion.
[0064] By using a servo motor to control the lead screw slider mechanism to more precisely control the distance between the support plate 200 and the contact block 330 on the pressure sensor 310, it can not only make the test data of the final chip stress more accurate, but also protect the chips on the workpiece.
[0065] The above has described the embodiments of the present disclosure. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technologies in the market, or to enable other ordinary technical personnel in the technical field to understand the embodiments disclosed herein.
Claims
1. General tooling for stress testing of chips on a workpiece, comprising: Base (100); Support plate (200), slidably arranged on the base (100) in the vertical direction and used for fixing the workpiece; Pressure testing assembly (300), used for detecting the chip stress on the workpiece located on the support plate (200), characterized in that it further comprises: Positioning assembly (400), arranged on the support plate (200) and used for fixing the workpiece; Wherein, the positioning assembly (400) comprises: Cross plates (410), having two pieces, arranged on the support plate (200), and first limiting grooves (411) are opened along the length direction of the cross plates (410); Longitudinal plates (420), having two pieces, arranged on the support plate (200), and the two longitudinal plates (420) and the two cross plates (410) are arranged in a "well" shape in a crosswise manner, and second limiting grooves (421) are opened along the length direction of the longitudinal plates (420); And spring screws (430), one end is arranged on the workpiece, and the other end is embedded into the first limiting grooves (411) and the second limiting grooves (421) and fixed; Wherein, the included angle between the cross plates (410) and the longitudinal plates (420) is adjustable.
2. The general tooling for stress testing based on the chip on the workpiece according to claim 1, wherein There are four groups of the spring screws (430), which are respectively used for fixing the four end corners of the workpiece.
3. The general tooling for stress testing based on the chip on the workpiece according to claim 1, characterized in that, The pressure testing assembly (300) comprises: Pressure sensor (310), arranged on the base (100); And height gauge (320), arranged on the base (100) in the vertical direction.
4. The general tooling for stress testing based on the chip on the workpiece according to claim 3, characterized in that The pressure sensor (310) further comprises: Contact block (330), arranged on the pressure sensor (310); Wherein, the contact block (330) is detachably arranged.
5. The general tooling for stress testing based on the chip on the workpiece according to claim 1, characterized in that, There are vertical columns (110) vertically arranged around the base (100), and guide rods (120) are vertically arranged on each of the columns (110), and the four sides of the support plate (200) are respectively slidably arranged on each of the guide rods (120) in the vertical direction; Wherein, an adjusting part is further arranged between the support plate (200) and the base (100) for adjusting the position of the support plate (200) on the guide rods (120).
6. The general tooling for stress testing based on the chip on the workpiece according to claim 5, characterized in that, The adjusting part comprises: Lead screw slider mechanism, vertically arranged on the base (100), and one side of the support plate (200) is connected to the slider on the lead screw slider mechanism.
7. The general tooling for stress testing based on the chip on the workpiece according to claim 6, characterized in that, The adjusting part further comprises: Servo motor, connected to the lead screw on the lead screw slider mechanism, used for driving the lead screw to rotate so as to drive the slider and the support plate (200) to perform linear motion.
8. The general tooling for stress testing based on the chip on the workpiece according to any one of claims 1-7, characterized in that The workpiece is a radiator.
Citation Information
Patent Citations
Stress test jig and mainboard assembling pressure test system
CN108020361A