Interface card heat dissipation assembly and server

Abstract

The utility model discloses an interface card heat dissipation assembly and a server. The interface card heat dissipation assembly comprises an auxiliary card which is arranged above an interface card needing heat dissipation in a covering mode; the fan assembly is arranged above the auxiliary card, the axis of the fan assembly is longitudinally arranged, and the fan assembly is electrically connected with the auxiliary card and used for cooling the auxiliary card; the support assembly is arranged on the outer side of the fan assembly, the fan assembly is installed on the support assembly, the support assembly is provided with a switching part, and the switching part is electrically connected with the auxiliary card and used for being in butt joint fit with an interface in a main board. The problem that the heat dissipation effect of a high-power-consumption IO card is poor in the prior art is solved, independent efficient heat dissipation of the interface card is achieved, the heat dissipation effect of the interface card is improved, the cost is low, and the income is high.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to an interface card heat dissipation component and a server. Background Art

[0002] At present, the power consumption of electronic components in servers, including IO cards (i.e. input and output interface cards), is getting higher and higher, resulting in worse heat dissipation. There are two factors: first, the heat generated by the IO cards themselves increases, resulting in worse heat dissipation; second, the increased power consumption of other components causes the air inlet temperature to deteriorate, resulting in worse heat dissipation.

[0003] There are currently three main methods for cooling high-power IO cards:

[0004] 1. Increase the system fan speed to optimize the IO card boundary conditions and reduce the air inlet temperature and air speed. However, this method may increase the system power consumption to several hundred watts just to dissipate the power of the network card with a power consumption of tens of watts. The cost is too high and the benefit ratio is too low.

[0005] 2. Set up a separate air duct for the IO card to guide the cold zone airflow to the front of the IO card and increase the air inlet speed. However, this type of air duct is difficult to arrange due to factors such as cables and IO card positions, and the effect is not good. At the same time, different configurations for different projects may not be universally adaptable, which has great limitations.

[0006] 3. The IO card is placed in front to directly reduce the air inlet temperature. However, this architecture needs to be planned at the very beginning and cannot meet the requirements of the rear IO card, so its applicability is relatively limited.

[0007] In summary, the existing high-power IO card heat dissipation methods cannot effectively solve the problem of poor heat dissipation of high-power IO cards. Utility Model Content

[0008] The present application provides an interface card heat dissipation component and a server to at least solve the problem of poor heat dissipation effect of high-power IO cards in the related art.

[0009] The present application provides an interface card heat dissipation assembly, including: an auxiliary card, wherein an auxiliary card cover is arranged above the interface card that needs heat dissipation; a fan assembly, wherein the fan assembly is arranged above the auxiliary card, the axis of the fan assembly is arranged longitudinally, the fan assembly is electrically connected to the auxiliary card and is used to dissipate heat for the auxiliary card; a bracket assembly, wherein the bracket assembly is arranged on the outside of the fan assembly, the fan assembly is mounted on the bracket assembly, the bracket assembly has a transfer portion, the transfer portion is electrically connected to the auxiliary card, and is used to dock and cooperate with an interface on a mainboard.

[0010] The present application also provides a server, including a chassis, an interface card and the above-mentioned interface card heat dissipation component, the interface card is arranged in the chassis, and the interface card heat dissipation component is stacked on top of the interface card.

[0011] Through the present application, an auxiliary card, a fan assembly and other components are directly arranged above the interface card to form an independent heat dissipation assembly, so that the heat dissipation assembly can independently draw air and dissipate heat for the interface card, thereby improving the heat dissipation effect of the interface card. At the same time, the heat dissipation assembly adopts the method of setting an auxiliary card. On the one hand, the auxiliary card is arranged on the top of the interface card so that the heat of the interface card can be transferred to the auxiliary card. The fan assembly dissipates heat for the auxiliary card to achieve heat dissipation for the interface card. On the other hand, the auxiliary card also plays a role in circuit conduction. The auxiliary card is electrically connected to the socket on the mainboard through the adapter of the bracket assembly. At the same time, the auxiliary card is also electrically connected to the fan assembly, so that the fan assembly can be electrically connected to the mainboard through the auxiliary card to achieve the effect of powering the fan assembly. The above-mentioned setting method can independently and efficiently dissipate heat for the interface card, thereby improving the heat dissipation effect of the interface card, and the cost is low and the benefit is relatively high. At the same time, there is no need to arrange additional components such as cables. The heat dissipation assembly can be adjusted according to the position of the interface card. It can be used for different interface cards and has high adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 A schematic diagram of the structure of the interface card heat dissipation assembly provided in an embodiment of the present application;

[0014] Figure 2 for Figure 1 A schematic diagram of the structure of the auxiliary card and fan assembly in FIG.

[0015] Figure 3 for Figure 2 A cross-sectional view of

[0016] Figure 4 A schematic diagram of the structure of a server provided in an embodiment of the present application;

[0017] Figure 5 for Figure 4 Enlarged view of point P in the middle.

[0018] The above drawings include the following reference numerals:

[0019] 10. Auxiliary card; 20. Fan assembly; 21. Air guide cover; 22. Fan; 30. Bracket assembly; 31. Adapter; 32. Bracket; 40. Baffle; 50. Chassis. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] In order to solve the problem of poor heat dissipation effect of high-power IO cards in the related art, the present application provides an interface card heat dissipation component and a server.

[0024] like Figures 1 to 3 An interface card heat dissipation assembly shown includes an auxiliary card 10, a fan assembly 20 and a bracket assembly 30. The auxiliary card 10 is covered above the interface card that needs heat dissipation; the fan assembly 20 is arranged above the auxiliary card 10, and the axis of the fan assembly 20 is arranged longitudinally. The fan assembly 20 is electrically connected to the auxiliary card 10 and is used to dissipate heat for the auxiliary card 10; the bracket assembly 30 is arranged on the outside of the fan assembly 20, and the fan assembly 20 is installed on the bracket assembly 30. The bracket assembly 30 has a transfer portion 31, which is electrically connected to the auxiliary card 10 and is used to dock with the interface on the mainboard.

[0025] In this embodiment, an independent heat dissipation assembly is formed by directly arranging the auxiliary card 10, the fan assembly 20 and other components above the interface card, so that the heat dissipation assembly can independently draw air and dissipate heat for the interface card, thereby improving the heat dissipation effect of the interface card. At the same time, the heat dissipation assembly adopts the method of arranging the auxiliary card 10. On the one hand, the auxiliary card 10 is arranged on the top of the interface card, so that the heat of the interface card can be transferred to the auxiliary card 10, and the fan assembly 20 dissipates heat for the interface card by dissipating the heat for the auxiliary card 10. On the other hand, the auxiliary card 10 also plays the role of circuit conduction. The auxiliary card 10 is electrically connected to the socket on the mainboard through the adapter 31 of the bracket assembly 30, and the auxiliary card 10 is also electrically connected to the fan assembly 20, so that the fan assembly 20 can be electrically connected to the mainboard through the auxiliary card 10 to achieve the effect of supplying power to the fan assembly 20. The above-mentioned arrangement method can independently and efficiently dissipate heat for the interface card, thereby improving the heat dissipation effect of the interface card, and the cost is low and the benefit is relatively high. At the same time, there is no need to arrange additional components such as cables, and the position of the heat dissipation assembly can be adjusted according to the position of the interface card. It can be used for different interface cards and has high adaptability.

[0026] The auxiliary card 10 of this embodiment may also be a component such as an IO card (input-output interface card), a PCIe card (Peripheral Component Interconnect Express, a high-speed serial bus standard interface card), etc., as long as it can be electrically connected to the fan assembly 20 .

[0027] In addition to powering the fan assembly 20, the auxiliary card 10 of this embodiment can also control the fan assembly 20. It can control parameters such as the rotation speed of the fan assembly 20, so as to adjust parameters such as the rotation speed of the fan assembly 20 according to different types of interface cards, heat generation, etc., realize automatic regulation, and achieve a dynamic balance of temperature-rotation speed, making the heat dissipation capacity of the fan assembly 20 match the actual situation, which can not only ensure good heat dissipation effect, but also reduce noise and energy consumption.

[0028] As Figure 1 and Figure 2 shown, in this embodiment, the fan assembly 20 includes a flow guide cover 21 and a fan 22. Among them, the flow guide cover 21 is in the shape of a cover body, and the flow guide cover 21 is arranged above the auxiliary card 10, thus forming a space for air flow. The upper surface of the flow guide cover 21 has air vents that penetrate through the upper, lower, inner and outer sides. Since the auxiliary card 10 is arranged below the flow guide cover 21, the air vents are located on the side of the flow guide cover 21 away from the auxiliary card 10. The setting of the air vents is mainly to realize the entry and discharge of air flow. Therefore, in this embodiment, the fan 22 is arranged inside the flow guide cover 21, and the fan 22 is arranged at the air vents. The rotation axis of the fan 22 is arranged longitudinally, so that when the fan 22 rotates, it can suck air flow into the flow guide cover 21 and act on the auxiliary card 10, thereby realizing the heat dissipation effect on the auxiliary card 10, and further realizing the heat dissipation effect on the interface card. Since the fan 22 is the main electrical component, the fan 22 is electrically connected to the auxiliary card 10, so as to realize the effect of the auxiliary card 10 powering and controlling the fan 22. Of course, the specific structural form of the fan assembly 20 is not limited to the above manner in this embodiment, and other forms of fan assemblies 20 can also be adopted. For example, the fan assembly 20 adopts a form with only the fan 22 arranged, and the fan 22 can be directly installed above the auxiliary card 10.

[0029] As Figure 3 shown, in this embodiment, since the auxiliary card 10 is arranged at the bottom of the flow guide cover 21, in order to improve the heat dissipation effect of the air flow on the auxiliary card 10, the bottom of the flow guide cover 21 in this embodiment is arranged in an open form, so that the bottom of the flow guide cover 21 forms an open side facing the opening. The auxiliary card 10 is arranged at the open side and together with the flow guide cover 21 forms a receiving cavity for accommodating the fan 22. In this way, the top surface and the surrounding side surfaces of the receiving cavity are formed by the flow guide cover 21, and the bottom surface is formed by the auxiliary card 10. In this way, after the air flow enters the flow guide cover 21 from the air vents, it can act on the auxiliary card 10, which helps to improve the heat dissipation effect.

[0030] Optionally, the fan 22 can be set at the exact center position of the air deflector 21 as needed, or it can be laterally offset by a certain distance. At this time, the air deflector 21 has opposite first and second sides, and the distance between the axis of the fan 22 and the first side is greater than the distance between the axis of the fan 22 and the second side, so that the fan 22 is offset relative to the center of the air deflector 21. In this case, the top surface of the air deflector 21 can have an inclined section extending downward, and the inclined section is directly above the first side. In this way, the inclined section can assist in guiding the air flow, so that the air flow on the first side, which is farther from the fan 22, can act on the auxiliary card 10 under the guidance of the inclined section, thereby helping to improve the heat dissipation effect. At the same time, the setting of the inclined section can also be used to achieve the avoidance and cooperation with the bracket assembly 30 and other components in the chassis 50, etc., which helps the installation and setting of the fan assembly 20 and reduces the installation difficulty.

[0031] As Figure 2 and Figure 3 shown, in this embodiment, the interface card heat dissipation assembly further includes a baffle 40 for electromagnetic shielding, and the baffle 40 is disposed on the outer side surface of the fan assembly 20 and is connected to the fan assembly 20. The setting of the baffle 40 can prevent the electromagnetic signals of components such as the fan 22 from interfering with the components in the chassis 50, thereby reducing the influence of the heat dissipation assembly on the normal operation of the components. The material of the baffle 40 can be selected as a material that can shield electromagnetic signals, such as using conductive foam and other components.

[0032] The baffle 40 of this embodiment is set to be long strip-shaped, and its length direction is consistent with the length direction of the side where the fan assembly 20 is located, and their shapes are roughly the same, so that the baffle 40 can achieve a good electromagnetic shielding effect.

[0033] Preferably, in this embodiment, the projection of the fan assembly 20 on the surface of the baffle 40 is located within the range of the baffle 40. In this way, the baffle 40 can play a comprehensive shielding role for the fan assembly 20, so that most of the electromagnetic signals of the fan assembly 20 can be blocked by the baffle 40, thereby ensuring the overall working reliability of the server. Of course, the size of the baffle 40 can be set as needed, or the baffle 40 can be disposed on the four side surfaces of the air deflector 21, or the baffle 40 is not fully disposed, but only disposed at some key positions, so as to reduce the amount and cost of the baffle 40.

[0034] As Figure 1As shown, in this embodiment, the bracket assembly 30 includes a bracket 32, which is the main part of the bracket assembly 30. The bracket 32 ​​is connected to the fan assembly 20, so that the bracket 32 ​​plays the role of installing and fixing the fan assembly 20, so that the fan assembly 20 can be installed and fixed in the chassis 50 through the bracket 32. Considering that the air duct 21 is provided with an air outlet for air flow, the bracket 32 ​​of this embodiment avoids the air outlet at the top of the fan assembly 20, so that the bracket 32 ​​can not only play the role of connecting the fan assembly 20, but also will not affect the normal heat dissipation of the fan assembly 20. At the same time, in addition to installing and fixing the fan assembly 20, the bracket 32 ​​is also used to cooperate with the adapter 31, that is, the adapter 31 is connected to the bracket 32, and the adapter 31 is also installed and fixed on the bracket 32, so that the adapter 31 can form an integral component with the bracket 32, and can be installed as a whole during installation, which is convenient and quick.

[0035] The bracket 32 ​​of this embodiment is in a semi-enclosed form, which is arranged at the circumferential side of the fan assembly 20 and extends along the circumferential side of the fan assembly 20, so that the bracket 32 ​​can avoid the top surface of the air guide cover 21, thereby facilitating the avoidance between the air outlet and not affecting the contact and heat transfer between the auxiliary card 10 and the interface card below. The air guide cover 21 of this embodiment is arranged as a relatively flat block structure, or more precisely, a flat rectangular parallelepiped structure, and the bracket 32 ​​is arranged as a horizontal L-shaped structure, and the fan assembly 20 is installed on the inner side of the L-shaped structure, so that the bracket 32 ​​covers the two circumferential sides of the fan assembly 20, wherein the baffle 40 can also be within the covering range of the bracket 32, so that the baffle 40 can play a certain protective role. In addition to adopting the above-mentioned setting method of this embodiment, the specific shape of the bracket 32 ​​can also be adjusted as needed. For example, it can be set into a 匚-shaped structure, and the fan assembly 20 is set on the inner side of the 匚-shaped structure, so that the bracket 32 ​​at this time covers the three circumferential sides of the fan assembly 20. Of course, the bracket 32 ​​can also adopt a U-shaped structure, etc.

[0036] like Figure 4 and Figure 5As shown, this embodiment also provides a server, including a chassis 50, an interface card and the above-mentioned interface card heat dissipation component. The interface card can be an IO card, etc., which is arranged in the chassis 50, and the interface card heat dissipation component is stacked and arranged above the interface card, so as to achieve heat dissipation of the interface card. The position of the interface card in the chassis 50 can be set as needed, and can be set at the front end and the rear end of the chassis 50, forming a front-end or rear-end form. No matter what form the interface card is in, the interface card heat dissipation component of this embodiment can follow the position of the interface card to adjust the installation position, so that the interface card heat dissipation component is always arranged above the interface card, achieving effective heat dissipation of the single component of the interface card, and maximizing the heat dissipation of the local hot spot at a specific position, avoiding affecting the system fan. After comparison and actual measurement, the overall benefit of the interface card heat dissipation component of this embodiment reaches the expected. After adding and installing, the fan of the whole machine is reduced to 10% of the original power consumption, and the noise of the whole machine is reduced by 14.9dBA, with significant benefits.

[0037] It should be noted that, the multiple in the above embodiments refers to at least two.

[0038] The interface card heat dissipation assembly of this embodiment includes an auxiliary card 10, a fan assembly 20 and a bracket assembly 30. The auxiliary card 10 is covered above the interface card that needs heat dissipation; the fan assembly 20 is arranged above the auxiliary card 10, and the axis of the fan assembly 20 is arranged longitudinally. The fan assembly 20 is electrically connected to the auxiliary card 10 and is used to dissipate heat for the auxiliary card 10; the bracket assembly 30 is arranged on the outside of the fan assembly 20, and the fan assembly 20 is installed on the bracket assembly 30. The bracket assembly 30 has a transfer part 31, which is electrically connected to the auxiliary card 10 and is used to dock with the interface on the mainboard. In this embodiment, an independent heat dissipation assembly is formed by directly arranging the auxiliary card 10, the fan assembly 20 and other components above the interface card, so that the heat dissipation assembly can independently draw air and dissipate heat for the interface card, thereby improving the heat dissipation effect of the interface card. At the same time, the heat dissipation component adopts the method of setting an auxiliary card 10. On the one hand, the auxiliary card 10 is arranged on the top of the interface card so that the heat of the interface card can be transferred to the auxiliary card 10. The fan component 20 dissipates heat for the interface card by dissipating heat for the auxiliary card 10. On the other hand, the auxiliary card 10 also plays a role in circuit conduction. The auxiliary card 10 is electrically connected to the socket on the mainboard through the adapter 31 of the bracket component 30. At the same time, the auxiliary card 10 is also electrically connected to the fan component 20, so that the fan component 20 can be electrically connected to the mainboard through the auxiliary card 10 to achieve the effect of supplying power to the fan component 20. The above-mentioned setting method can perform efficient heat dissipation on the interface card separately, thereby improving the heat dissipation effect of the interface card, and the cost is low and the benefit is relatively high. At the same time, there is no need to arrange additional components such as cables, and the position of the heat dissipation component can be adjusted according to the position of the interface card. It can be used for different interface cards and has high adaptability.

[0039] The above has introduced in detail an interface card heat dissipation component and a server provided by the present application. Specific examples are used in this text to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. An interface card heat dissipation component, characterized in that, include: An auxiliary card (10), the auxiliary card (10) being arranged above the interface card that needs heat dissipation; a fan assembly (20), the fan assembly (20) being arranged above the auxiliary card (10), the axis of the fan assembly (20) being arranged longitudinally, the fan assembly (20) being electrically connected to the auxiliary card (10) and being used to dissipate heat from the auxiliary card (10); A bracket assembly (30), the bracket assembly (30) being arranged on the outside of the fan assembly (20), the fan assembly (20) being mounted on the bracket assembly (30), the bracket assembly (30) comprising a transfer portion (31), the transfer portion (31) being electrically connected to the auxiliary card (10) and being used for docking with an interface on a mainboard.

2. The interface card heat dissipation component according to claim 1, wherein The fan assembly (20) comprises: An air guide cover (21), the air guide cover (21) being arranged above the auxiliary card (10), and the upper surface of the air guide cover (21) having an air outlet away from the auxiliary card (10); A fan (22), the fan (22) being arranged in the air guide cover (21), and the rotation axis of the fan (22) being arranged longitudinally, the fan (22) being arranged at the air outlet, and the fan (22) being electrically connected to the auxiliary card (10).

3. The interface card heat dissipation component according to claim 2, wherein The bottom of the air guide cover (21) is an open side provided with an opening, and the auxiliary card (10) is provided at the open side and together with the air guide cover (21) forms an accommodation cavity for accommodating the fan (22).

4. The interface card heat dissipation component according to claim 2, characterized in that The air guide cover (21) has a first side and a second side opposite to each other, the distance between the axis of the fan (22) and the first side is greater than the distance between the axis of the fan (22) and the second side, and the top surface of the air guide cover (21) has an inclined section extending downward, and the inclined section is located directly above the first side.

5. The interface card heat dissipation component according to claim 2, wherein The interface card heat dissipation assembly further comprises a baffle (40) for electromagnetic shielding, wherein the baffle (40) is arranged at an external side surface of the fan assembly (20) and is connected to the fan assembly (20).

6. The interface card heat dissipation component according to claim 5, characterized in that A projection of the fan assembly (20) on the surface of the baffle (40) is located within the range of the baffle (40).

7. The interface card heat dissipation component according to claim 1, characterized in that The support assembly (30) comprises a support (32), the support (32) being connected to the fan assembly (20), and the support (32) avoiding the air outlet at the top of the fan assembly (20), and the adapter (31) being connected to the support (32).

8. The interface card heat dissipation component according to claim 7, characterized in that, The bracket (32) is located at a circumferential side surface of the fan assembly (20) and extends along the circumferential side surface of the fan assembly (20); the bracket (32) covers at least two circumferential side surfaces of the fan assembly (20).

9. The interface card heat dissipation assembly according to claim 1, characterized in that: The fan assembly (20) comprises a shroud (21) and a fan (22); the bottom of the shroud (21) is an open side provided with an opening; the auxiliary card (10) is provided at the open side and together with the open side forms a receiving cavity; the fan (22) is provided in the receiving cavity, and the rotation axis of the fan (22) is provided longitudinally; the shroud (21) has an air outlet penetrating inside and outside above, and the fan (22) is provided at the air outlet; The interface card heat dissipation assembly further comprises a baffle (40) for electromagnetic shielding, wherein the baffle (40) is arranged on an outer side surface of the air guide cover (21) and is connected to the air guide cover (21); The bracket assembly (30) comprises a bracket (32), the bracket (32) being connected to the fan assembly (20), and the bracket (32) avoiding the air outlet at the top of the fan assembly (20), the adapter (31) being connected to the bracket (32), and the baffle (40) being inserted into the bracket (32) and capable of being connected and matched with the bracket (32).

10. A server, characterized in that, The invention comprises a chassis (50), an interface card and the interface card heat dissipation assembly according to any one of claims 1 to 9, wherein the interface card is arranged in the chassis (50), and the interface card heat dissipation assembly is arranged on top of the interface card.

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