Woven label chip composite label
By using stitching strips and glue bonding in the woven label composite label, the problem of falling or damage of the woven label chip label is solved, and the effect of reducing the number of sewing needles and improving identification reliability is achieved.
Patent Information
- Application Number
- CN202422364421.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-09-26
AI Technical Summary
Existing woven label chip labels are prone to falling or damaged when fixed, resulting in unrecognition of clothes. The existing sewing method can damage the labels and clothes.
A composite label of woven label chip is designed. By setting seam strips at both ends of the woven label and fixing only seam strips when sewing, combining glue bonding of woven labels and film chips to reduce the number of sewing needles. Polyester woven labels and film RFID chips are used, and the seam strips are set into sharp corners for easy fixing and identification.
It realizes reducing the number of sewing needles when fixing the woven label chip label, reducing the risk of damage, ensuring the integrity of the label and clothes, and improving identification reliability.
Smart Images

Figure CN223078705U_ABST
Abstract
Description
Technical Field
[0001] An embodiment of the present utility model relates to a label in the field of intelligent clothing identification, and particularly to a woven label chip composite label. Background Art
[0002] In existing woven label chip labels, the woven label mainly provides main identifications such as LOGO, and the chip is used to record the manufacturing process of its entire life cycle. Before selling to consumers, the woven label chip label needs to be recycled and reused. When the existing woven label chip label is fixed to clothing, generally, the methods of pasting or sewing are adopted. When using the pasting method, the woven label chip label often falls off, resulting in the clothing being unable to be identified. If the entire woven label chip label is sewn, when removing the label, the clothing or the woven label chip label is often damaged. Summary of the Utility Model
[0003] An object of the embodiment of the present utility model is to provide a woven label chip composite label that can be sewn but can reduce the number of sewing stitches.
[0004] To achieve the above object, the embodiment of the present utility model designs a woven label chip composite label, including:
[0005] A woven label, the woven label is arranged on one side of the woven label chip composite label;
[0006] A thin film chip, the thin film chip is placed below the woven label; both ends of the woven label are bent to fix the thin film chip;
[0007] A stitch-bonded strip, the stitch-bonded strip is arranged at both ends of the woven label; when sewing, only the stitch-bonded strip is sewn and fixed.
[0008] Further, in the woven label chip composite label of the present utility model, after both ends of the woven label and the thin film chip are bonded by glue, they are fixedly connected to one end of the stitch-bonded strip.
[0009] Further, in the woven label chip composite label of the present utility model, the other end of the stitch-bonded strip is set to be pointed.
[0010] Further, in the woven label chip composite label of the present utility model, after both ends of the woven label are bent, they extend downward to form fixed ends for fixing.
[0011] Further, in the woven label chip composite label of the present utility model, the material of the woven label is polyester.
[0012] Further, in the woven label chip composite label of the present utility model, the thin film chip is a thin film RFID chip.
[0013] Furthermore, in the woven label chip composite label of the present utility model, the thickness of the woven label is 2 mm - 5 mm.
[0014] Furthermore, in the woven label chip composite label of the present utility model, the thickness of the thin film chip is 1 mm - 1.5 mm.
[0015] Furthermore, in the woven label chip composite label of the present utility model, the length of the stitch-bonded strip is 15 mm - 20 mm; the width is 5 mm - 6 mm.
[0016] Furthermore, in the woven label chip composite label of the present utility model, the center line of the stitch-bonded strip coincides with the center lines at both ends of the woven label and the thin film chip.
[0017] Compared with the prior art, in the woven label chip composite label of the present utility model, a woven label is provided on one side; a thin film chip is placed below the woven label; both ends of the woven label are bent to fix the thin film chip; stitch-bonded strips are provided at both ends of the woven label; during sewing, only the stitch-bonded strips are sewn and fixed. When fixing the woven label chip composite label, only the stitch-bonded strips are sewn, thereby reducing the number of sewing needles. It can achieve both sewing and reducing the number of sewing needles, reducing the risk of being damaged. This solves the technical problem that when fixing the existing woven label chip label to clothing, generally, methods such as pasting or sewing are used. When using the pasting method, the woven label chip label often falls off, resulting in the clothing being unidentifiable. If the entire woven label chip label is sewn, when removing the label, the clothing or the woven label chip label is often damaged. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic structural diagram in the front view direction of the present utility model;
[0019] Figure 2 is Figure 1 the schematic structural diagram in the top view direction of
[0020] Figure 3 is Figure 1 the schematic structural diagram in the left view direction of DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] To make the objectives, technical solutions, and advantages of the present utility model clearer, the following will elaborate on the various embodiments of the present utility model in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in the various embodiments of the present utility model, many technical details are presented for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the various claims of the present application can still be implemented.
[0022] The embodiments of the present utility model relate to a woven label chip composite label, asFigure 1 , Figure 2 , Figure 3 as shown in the figure, it includes:
[0023] A woven label 1 is provided on one side of the woven label chip composite label in this embodiment; the function of the woven label 1 is to provide main identifiers such as a LOGO.
[0024] A thin film chip 2 is placed below the woven label 1; both ends of the woven label 1 are bent to fix the thin film chip 2; the thin film chip 2 is used to record the manufacturing process of its entire life cycle.
[0025] Stitch-bonded strips 3 are provided at both ends of the woven label 1; during sewing, only the stitch-bonded strips 3 are sewn and fixed. The stitch-bonded strips 3 are used to fix the woven label chip composite label in this embodiment on the clothing. Since only the stitch-bonded strips 3 are fixed, the number of sewing needles can be reduced, so that sewing can be achieved while reducing the number of sewing needles and the risk of being damaged. This solves the technical problem that when fixing the existing woven label chip label to the clothing, generally pasting or sewing methods are used. When using the pasting method, the woven label chip label often falls off, resulting in the clothing being unrecognizable. If the entire woven label chip label is sewn, the clothing or the woven label chip label is often damaged when removing the label.
[0026] To achieve the above technical effects, in the woven label chip composite label of this embodiment, as Figure 1 , Figure 2 , Figure 3 shown, after both ends of the woven label 1 and the thin film chip 2 are bonded with glue, they are fixedly connected to one end of the stitch-bonded strip 3. Such a structure can fix the woven label 1 and the thin film chip 2 and then fix them to the stitch-bonded strip 3.
[0027] To achieve the above technical effects, in the woven label chip composite label of this embodiment, as Figure 1 , Figure 2 , Figure 3 shown, the other end of the stitch-bonded strip 3 is set to be a pointed shape. The pointed shape is beneficial for grasping and recognition.
[0028] To achieve the above technical effects, in the woven label chip composite label of this embodiment, as Figure 1 , Figure 2 , Figure 3 shown, after both ends of the woven label 1 are bent and extended downward, they are set to be fixed ends 4 for fixing. The bent ends of the woven label 1 at both ends can be placed under the thin film chip 2 and are used to protect the circuit board of the thin film chip 2 after being fixed.
[0029] To achieve the above technical effects, in the woven label chip composite label of this embodiment, as Figure 1 , Figure 2 , Figure 3As shown, the material of the woven label 1 is polyester. It is mainly resistant to washing and the material is firm.
[0030] To achieve the above technical effects, in this embodiment, the woven label chip composite label, as Figure 1 , Figure 2 , Figure 3 shown, the thin film chip 2 is a thin film RFID chip. The thin film RFID chip can be repeatedly read and written and reused, thus reducing the usage cost.
[0031] To achieve the above technical effects, in this embodiment, the woven label chip composite label, as Figure 1 , Figure 2 , Figure 3 shown, the thickness of the woven label 1 is 2 mm - 5 mm. The thickness of the woven label 1 can adapt to protect the strength of the underlying thin film chip 2 when used on clothes.
[0032] To achieve the above technical effects, in this embodiment, the woven label chip composite label, as Figure 1 , Figure 2 , Figure 3 shown, the thickness of the thin film chip 2 is 1 mm - 1.5 mm. The thickness of the thin film chip 2 can maintain flexibility, so that the service life of the thin film chip 2 is extended.
[0033] To achieve the above technical effects, in this embodiment, the woven label chip composite label, as Figure 1 , Figure 2 , Figure 3 shown, the length of the stitching strip 3 is 15 mm - 20 mm; the width is 5 mm - 6 mm. The length and width of the stitching strip 3 can sew the woven label chip composite label in this embodiment well during sewing, ensure a certain strength, and at the same time, can be easily removed. It can reduce the number of sewing stitches and the risk of being damaged during removal.
[0034] To achieve the above technical effects, in this embodiment, the woven label chip composite label, as Figure 1 , Figure 2 , Figure 3 shown, the center line of the stitching strip 3 coincides with the center lines at both ends of the woven label 1 and the thin film chip 2. This can ensure that the center position of the woven label chip composite label in this embodiment does not deviate from the center position during the sewing process.
[0035] Those of ordinary skill in the art can understand that the above embodiments are specific embodiments for implementing the present invention, and in actual applications, various changes can be made in form and details without departing from the spirit and scope of the present invention.
Claims
1. A woven label chip composite label, characterized in that, Including: A woven label, the woven label is provided on one side of the composite label of the woven label chip; A thin film chip, the thin film chip is placed below the woven label; both ends of the woven label are bent to fix the thin film chip; A stitch-bonded strip, the stitch-bonded strip is provided at both ends of the woven label; during sewing, only the stitch-bonded strip is sewn and fixed.
2. The woven label chip composite label according to claim 1, characterized in that After both ends of the woven label and the thin film chip are bonded with glue, they are fixedly connected to one end of the stitch-bonded strip.
3. The woven label chip composite label according to claim 2, wherein, The other end of the stitch-bonded strip is set to be pointed.
4. The woven label chip composite label according to claim 2, wherein After both ends of the woven label are bent, they extend downward to form fixed ends for fixing.
5. The woven label chip composite label according to claim 3, characterized in that, The material of the woven label is polyester.
6. The woven label chip composite label according to claim 1, characterized in that The thin film chip is a thin film RFID chip.
7. The woven label chip composite label according to claim 5, characterized in that, The thickness of the woven label is 2 mm - 5 mm.
8. The woven label chip composite label according to claim 6, characterized in that, The thickness of the thin film chip is 1 mm - 1.5 mm.
9. The woven label chip composite label according to claim 3, wherein The length of the stitch-bonded strip is 15 mm - 20 mm; the width is 5 mm - 6 mm.
10. The woven label chip composite label according to claim 9, characterized in that, The center line of the stitch-bonded strip coincides with the center lines of both ends of the woven label and the thin film chip.