Domain controller and movable platform

Abstract

The utility model provides a domain controller and a movable platform, the domain controller comprises a shell, a first circuit board and a second circuit board, the shell comprises a body, a first end cover and a second end cover, the body is provided with a first mounting groove along a first side of a first direction, the first end cover covers the first mounting groove, and the second end cover covers the second mounting groove; a second mounting groove is formed in the second side of the body in the first direction, and the second end cover covers the second mounting groove; the first circuit board is arranged in the first mounting groove, and the first circuit board comprises a first heat dissipation chip; the second circuit board is arranged in the second mounting groove, the first circuit board is in communication connection with the second circuit board, and the second circuit board comprises a second heat dissipation chip; the body further comprises a cooling device, and the first heat dissipation chip and the second heat dissipation chip abut against the cooling device. According to the invention, the layout complexity and cost of the domain controller can be reduced, a good heat dissipation effect is achieved, and it is ensured that the domain controller has a good information processing capability.

Description

Technical Field

[0001] This application relates to circuit assembly technology, and particularly to a domain controller and a movable platform. Background Art

[0002] A domain controller is a key network server for managing and controlling computers, users, and resources within a domain. For example, in the vehicle field, the domain controller is responsible for managing and controlling various functions of the vehicle, including but not limited to powertrain, chassis control, and information processing in the intelligent cockpit. With the development of technology, the requirements for domain controllers are getting higher and higher. For example, L3 / L4 level autonomous driving technology requires two independent domain controllers. When one domain controller fails, the other domain controller can still ensure the normal operation of the system. However, setting two domain controllers will increase the complexity and cost of the layout. Summary of the Utility Model

[0003] In order to overcome the above defects in the related art, the purpose of this application is to provide a domain controller and a movable platform. In this application, two circuit boards are integrated in the same housing at the same time, and the two circuit boards are communicatively connected to reduce the layout complexity and cost of the domain controller; in addition, by setting a cooling device, the domain controller has a better heat dissipation effect.

[0004] On the one hand, this application provides a domain controller, including:

[0005] A housing, the housing includes a body, a first end cover, and a second end cover. A first installation groove is provided on a first side of the body along a first direction, the first end cover covers the first installation groove, a second installation groove is provided on a second side of the body along the first direction, and the second end cover covers the second installation groove;

[0006] A first circuit board, the first circuit board is disposed in the first installation groove, and the first circuit board includes a first heat dissipation chip;

[0007] A second circuit board, the second circuit board is disposed in the second installation groove, and the first circuit board is communicatively connected to the second circuit board. The second circuit board includes a second heat dissipation chip;

[0008] The body further includes a cooling device, and both the first heat dissipation chip and the second heat dissipation chip are in contact with the cooling device.

[0009] In a possible implementation manner, the cooling device includes a water cooling device and a plurality of heat dissipation fins. The water cooling device is disposed in the body, and a plurality of the heat dissipation fins are all disposed in the second installation groove, and a plurality of the heat dissipation fins are all in contact with the water cooling device;

[0010] A first heat dissipation boss is provided in the first installation groove. In a plane perpendicular to the first direction, the projection of the first heat dissipation boss is within the projection range of the plurality of heat dissipation fins. The first heat dissipation chip is abutted against the first heat dissipation boss through a first heat dissipation adhesive layer;

[0011] A second heat dissipation boss is provided in the second installation groove. The second heat dissipation boss is connected to the water cooling device. The second heat dissipation chip is abutted against the second heat dissipation boss through a second heat dissipation adhesive layer.

[0012] In a possible implementation manner, the water cooling device includes a water cooling flow channel formed in the body and a water cooling end cover. The water cooling end cover covers the water cooling flow channel; the body further includes a water inlet pipe and a water outlet pipe communicated with the water cooling flow channel;

[0013] A plurality of flow guiding columns arranged along the first direction are provided in the water cooling flow channel;

[0014] Two opposite first flow guiding plates and two opposite second flow guiding plates are further provided in the water cooling flow channel; the two first flow guiding plates are arranged close to the water inlet pipe, and the gap between the two first flow guiding plates gradually decreases toward the water inlet pipe side; the two second flow guiding plates are arranged close to the water outlet pipe, and the gap between the two second flow guiding plates gradually decreases toward the water outlet pipe side.

[0015] In a possible implementation manner, along the first direction, a plurality of first solder joints are provided on the first side of the first circuit board. The plurality of first solder joints are arranged around the periphery of the first circuit board; a plurality of second solder joints are provided on the second side of the first circuit board. The plurality of second solder joints are arranged around the periphery of the first circuit board;

[0016] The first end cover includes a first cover plate. A first flange is provided on the side of the first cover plate facing the first installation groove. In a plane perpendicular to the first direction, the projection of the first flange coincides with the projection of the plurality of first solder joints, and the first flange abuts against the plurality of first solder joints;

[0017] The first installation groove further includes a second flange. In a plane perpendicular to the first direction, the projection of the second flange coincides with the projection of the plurality of second solder joints, and the second flange abuts against the plurality of second solder joints.

[0018] In a possible implementation, the first end cover further includes a first side wall, the first side wall is disposed around the periphery of the first cover plate, and is located on the side of the first cover plate facing the first mounting groove, a water retaining groove is formed between the first flange and the first side wall; a water retaining flange is further provided on the side of the body facing the first end cover, and the water retaining flange is located in the water retaining groove.

[0019] In a possible implementation, a plurality of first connection posts are further provided on the side of the body facing the first end cover, a first connection hole is provided in each first connection post, a plurality of first through holes are provided on the first end cover, and the plurality of first through holes and the plurality of first connection holes correspond to each other one by one. A first fastener passes through the first through hole and is fixedly connected to the corresponding first connection hole;

[0020] A plurality of first fixing holes are provided on the first circuit board, and a plurality of locking holes are further provided on the second flange. The plurality of first fixing holes and the plurality of locking holes correspond to each other one by one. A second fastener passes through the first fixing hole and is fixedly connected to the corresponding locking hole;

[0021] A plurality of first stress relief grooves are further provided on the first circuit board. The first stress relief grooves are located around the first fixing holes close to the first heat dissipation chip, and the first stress relief grooves are located between the first fixing holes and the first heat dissipation chip.

[0022] In a possible implementation, along the first direction, a plurality of different functional areas are formed on the first side of the second circuit board. A plurality of third solder points are further provided on the first side of the second circuit board, and the plurality of third solder points are located between two adjacent functional areas and around the second circuit board; a plurality of fourth solder points are provided on the second side of the second circuit board, and the plurality of fourth solder points include several first sub-solder points and several groups of second sub-solder points. The several first sub-solder points are located on one side of the second circuit board, and the several groups of second sub-solder points are evenly distributed on the second circuit board;

[0023] The second mounting groove further includes a third flange. In a plane perpendicular to the first direction, the projection of the third flange coincides with the projection of the plurality of third solder points, and the third flange abuts against the plurality of third solder points;

[0024] The second end cover includes a second cover plate. A fourth flange and a plurality of second connection posts are provided on the side of the second cover plate facing the second mounting groove. In a plane perpendicular to the first direction, the projection of the fourth flange coincides with the projection of the several first sub-solder points, and the projections of the plurality of second connection posts coincide with the projections of the several groups of second sub-solder points one by one. The fourth flange abuts against the several first sub-solder points, and the plurality of second connection posts respectively abut against the several groups of second sub-solder points.

[0025] In a possible implementation, the second end cap further includes a second side wall, the second side wall is disposed around the periphery of the second cover plate, and is located on the side of the second cover plate facing the second mounting groove. A plurality of protruding portions are provided on the side of the second side wall facing the second cover plate; a labyrinth groove is further formed between the side wall of the second mounting groove and the third flange. The second side wall is located in the labyrinth groove, and a plurality of the protruding portions abut against the third flange.

[0026] In a possible implementation, a second through hole is provided in the second connection post, a plurality of second connection holes are provided in the second mounting groove, and a plurality of second fixing holes are provided on the second circuit board. The plurality of second through holes, the plurality of second fixing holes and the plurality of second connection holes correspond to each other one by one. The third fastener sequentially passes through the second through hole and the second fixing hole and then is fixedly connected to the corresponding second connection hole;

[0027] A plurality of second stress relief grooves are further provided on the second circuit board. The second stress relief grooves are located around the second fixing holes close to the second heat dissipation chip, and the second stress relief grooves are located between the second fixing holes and the second heat dissipation chip.

[0028] In a possible implementation, the body further includes a connector mounting portion, and the connector mounting portion penetrates through the body along the first direction; a first connector is provided on the first circuit board, a second connector is provided on the second circuit board, the first connector and the second connector are plugged and connected, and both the first connector and the second connector are located in the connector mounting portion;

[0029] The first end cap includes a first abutting portion. In a plane perpendicular to the first direction, the projection of the first abutting portion coincides with the projection of the first connector, and the first abutting portion abuts against the first circuit board;

[0030] The second end cap includes a second abutting portion. In a plane perpendicular to the first direction, the projection of the second abutting portion coincides with the projection of the second connector, and the second abutting portion abuts against the second circuit board.

[0031] In a possible implementation, a plurality of fifth solder joints are further provided on the first circuit board, and the plurality of fifth solder joints are arranged around the first connector; the first end of the connector mounting portion abuts against the plurality of fifth solder joints;

[0032] And / or, a plurality of sixth solder joints are further provided on the second circuit board, and the plurality of sixth solder joints are arranged around the second connector; the second end of the connector mounting portion abuts against the plurality of sixth solder joints.

[0033] In a possible implementation, the first circuit board further includes a first wire outlet, and the second circuit board further includes a second wire outlet. The first wire outlet and the second wire outlet are respectively located on both sides of the housing along the second direction.

[0034] The first end cover is provided with a first water-blocking eaves, and the first water-blocking eaves is used to block the first wire outlet.

[0035] The main body is provided with a second water-blocking eaves, and the second water-blocking eaves is used to block the second wire outlet.

[0036] On the other hand, the present application provides a movable platform, including the domain controller described in any one of the above.

[0037] The present application provides a domain controller and a movable platform. The domain controller includes a housing, a first circuit board, and a second circuit board. The housing includes a main body, a first end cover, and a second end cover. A first installation groove is provided on the first side of the main body along the first direction, and the first end cover is covered on the first installation groove. A second installation groove is provided on the second side of the main body along the first direction, and the second end cover is covered on the second installation groove. The first circuit board is disposed in the first installation groove, and the first circuit board includes a first heat dissipation chip. The second circuit board is disposed in the second installation groove, and the first circuit board is communicatively connected to the second circuit board. The second circuit board includes a second heat dissipation chip. The main body further includes a cooling device, and both the first heat dissipation chip and the second heat dissipation chip are in contact with the cooling device. By integrating the first circuit board and the second circuit board in the housing at the same time, and the first circuit board and the second circuit board are communicatively connected, both can implement the functions of the domain controller, so as to reduce the layout complexity and cost of the domain controller. In addition, by providing a cooling device in the housing and making both the first heat dissipation chip and the second heat dissipation chip in contact with the cooling device, the first heat dissipation chip and the second heat dissipation chip can have a good heat dissipation effect, so as to ensure that the domain controller has a good information processing ability. Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required to be used in the description of the embodiments or related technologies. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 It is a schematic structural diagram of the domain controller provided by an embodiment of the present application from the first perspective;

[0040] Figure 2 It is a schematic structural diagram of the domain controller provided by an embodiment of the present application from the second perspective;

[0041] Figure 3 Top view of the domain controller provided by an embodiment of the present application;

[0042] Figure 4 is Figure 3 A - A cross - sectional view of

[0043] Figure 5 Exploded view of the domain controller provided by an embodiment of the present application;

[0044] Figure 6 Schematic diagram of the main body of the housing in the first perspective provided by an embodiment of the present application;

[0045] Figure 7 is Figure 6 Top view of

[0046] Figure 8 Schematic diagram of the main body of the housing in the second perspective provided by an embodiment of the present application;

[0047] Figure 9 Schematic diagram of the first end cap in the first perspective provided by an embodiment of the present application;

[0048] Figure 10 Schematic diagram of the first end cap in the second perspective provided by an embodiment of the present application;

[0049] Figure 11 Schematic diagram of the first circuit board in the first perspective provided by an embodiment of the present application;

[0050] Figure 12 Schematic diagram of the first circuit board in the second perspective provided by an embodiment of the present application;

[0051] Figure 13 Schematic diagram of the second circuit board in the first perspective provided by an embodiment of the present application;

[0052] Figure 14 Schematic diagram of the second circuit board in the second perspective provided by an embodiment of the present application;

[0053] Figure 15 Schematic diagram of the second end cap provided by an embodiment of the present application;

[0054] Figure 16 is Figure 15 Partial enlarged view of part A in

[0055] Reference numerals:

[0056] 100 - housing;

[0057] 110 - Body; 111 - First mounting groove; 1111 - First heat dissipation boss; 1112 - Second flange; 1113 - Locking hole; 112 - Second mounting groove; 1121 - Second heat dissipation boss; 1122 - Third flange; 1123 - Labyrinth groove; 1124 - Second connection hole; 113 - Water blocking flange; 114 - First connection post; 115 - Connector mounting part; 116 - Second water blocking brim;

[0058] 120 - First end cap; 121 - First cover plate; 122 - First flange; 123 - First side wall; 124 - Water blocking groove; 125 - First through hole; 126 - First abutting part; 127 - First water blocking brim;

[0059] 130 - Second end cap; 131 - Second cover plate; 132 - Fourth flange; 133 - Second connection post; 134 - Second side wall; 1341 - Protrusion; 135 - Second abutting part;

[0060] 140 - Cooling device; 141 - Water cooling device; 1411 - Water cooling flow channel; 1412 - Water cooling end cap; 1413 - Inlet pipe; 1414 - Outlet pipe; 1415 - Guide post; 1416 - First guide plate; 1417 - Second guide plate; 1418 - First shunt post; 1419 - Second shunt post; 142 - Heat dissipation fins;

[0061] 150 - Connection part; 151 - Connection through hole;

[0062] 200 - First circuit board; 210 - First heat dissipation chip; 220 - First solder point; 230 - Second solder point; 240 - First fixing hole; 250 - First stress relief groove; 260 - First connector; 270 - Fifth solder point; 280 - First wire outlet;

[0063] 300 - Second circuit board; 310 - Second heat dissipation chip; 320 - Third solder point; 331 - First sub - solder point; 332 - Second sub - solder point; 340 - Second fixing hole; 350 - Second stress relief groove; 360 - Second connector; 370 - Sixth solder point; 380 - Second wire outlet;

[0064] 410 - First fastener; 420 - Second fastener; 430 - Third fastener;

[0065] X - First direction; Y - Second direction. Detailed implementation manners

[0066] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are some but not all of the embodiments of this application.

[0067] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0068] As described in the background art, L3 / L4 level autonomous driving technology requires two independent domain controllers to be set up. When one domain controller fails, the other domain controller can still ensure the normal operation of the system. However, setting up two domain controllers will increase the complexity and cost of the layout.

[0069] In view of this, the embodiments of the present application aim to provide a domain controller and a movable platform. By integrating the first circuit board and the second circuit board into the housing at the same time, and the first circuit board and the second circuit board are communicatively connected, both can implement the functions of the domain controller, so as to reduce the layout complexity and cost of the domain controller. In addition, by setting a cooling device in the housing and making the first heat dissipation chip and the second heat dissipation chip both abut against the cooling device, the first heat dissipation chip and the second heat dissipation chip can have a good heat dissipation effect, so as to ensure that the domain controller has a good information processing ability.

[0070] The content of the embodiments of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can understand the content of the present application in more detail. It should be noted that in the description of this embodiment, the first direction X and the second direction Y may be, for example, two mutually perpendicular directions in a three-dimensional space. Among them, the first direction X may be, for example, a vertical direction, and the second direction Y may be, for example, a horizontal direction.

[0071] Please refer to Figures 1 - 5 , this embodiment provides a domain controller, including:

[0072] A housing 100, the shape of the housing 100 can be set according to assembly needs, for example, it can be a regular shape such as a prism or a cylinder; or, it can also be an irregular shape. The housing 100 includes a body 110, a first end cover 120 and a second end cover 130. A first installation groove 111 is provided on the first side of the body 110 along the first direction X, and the first end cover 120 covers the first installation groove 111. The first end cover 120 can be fixedly connected to the body 110 by, for example, snap connection or screw connection. A second installation groove 112 is provided on the second side of the body 110 along the first direction X, and the second end cover 130 covers the second installation groove 112. The second end cover 130 can be fixedly connected to the body 110 by, for example, snap connection or screw connection.

[0073] The first circuit board 200 is disposed in the first mounting groove 111. That is to say, the first circuit board 200 is disposed in the space jointly enclosed by the first end cover 120 and the first mounting groove 111. The first circuit board 200 includes a first heat dissipation chip 210. It can be understood that there are also multiple other electronic components provided on the first circuit board 200.

[0074] The second circuit board 300 is disposed in the second mounting groove 112. That is to say, the second circuit board 300 is disposed in the space jointly enclosed by the second end cover 130 and the second mounting groove 112. The first circuit board 200 is communicatively connected to the second circuit board 300, and the communication connection between the two can be realized, for example, through a communication cable. The second circuit board 300 includes a second heat dissipation chip 310. It can be understood that there are also multiple other electronic components provided on the second circuit board 300.

[0075] The body 110 further includes a cooling device 140. Both the first heat dissipation chip 210 and the second heat dissipation chip 310 are in contact with the cooling device 140, so as to use the cooling device 140 to timely dissipate the heat generated when the first heat dissipation chip 210 and the second heat dissipation chip 310 are working, and ensure that the first heat dissipation chip 210 and the second heat dissipation chip 310 have good information processing capabilities. Exemplarily, both the first heat dissipation chip 210 and the second heat dissipation chip 310 can be in contact with the cooling device 140 through a thermal conductive adhesive layer or a thermal conductive pad, etc., so as to better conduct the generated heat into the cooling device 140.

[0076] From the above description, it can be seen that in this embodiment, by integrating the first circuit board 200 and the second circuit board 300 in the housing 100 at the same time, and the first circuit board 200 and the second circuit board 300 are communicatively connected, both can realize the functions of the domain controller. Thus, it is equivalent to integrating two domain controllers in one housing 100 at the same time, reducing the layout complexity and cost of the domain controller. Moreover, when in use, one of the first circuit board 200 and the second circuit board 300 can be used as the main board, and the other can be used as the backup board. When the main board fails, the backup board can take over and continue to realize the functions of the domain controller.

[0077] In addition, by providing the cooling device 140 in the housing 100 and making both the first heat dissipation chip 210 and the second heat dissipation chip 310 in contact with the cooling device 140, it is ensured that the first heat dissipation chip 210 and the second heat dissipation chip 310 have good heat dissipation effects, so as to ensure that the domain controller has good information processing capabilities.

[0078] Please refer to Figures 6 - 8, the cooling device 140 of this embodiment includes a water cooling device 141 and a plurality of heat dissipation fins 142. The water cooling device 141 is arranged inside the body 110, and the plurality of heat dissipation fins 142 are all arranged in the second installation groove 112 and are all in contact with the water cooling device 141, so as to utilize the water cooling device 141 to accelerate the heat dissipation speed of the heat dissipation fins 142 and improve the heat dissipation efficiency.

[0079] A first heat dissipation boss 1111 is provided in the first installation groove 111. In a plane perpendicular to the first direction X, the projection of the first heat dissipation boss 1111 is within the projection range of the plurality of heat dissipation fins 142. The first heat dissipation chip 210 is in contact with the first heat dissipation boss 1111 through the first heat dissipation adhesive layer, realizing indirect contact with the heat dissipation fins 142. That is to say, the first heat dissipation chip 210 of this embodiment transfers the dissipated heat to the plurality of heat dissipation fins 142 through the first heat dissipation adhesive layer and the first heat dissipation boss 1111, thereby dissipating the heat generated by the first heat dissipation chip 210.

[0080] A second heat dissipation boss 1121 is provided in the second installation groove 112. The second heat dissipation boss 1121 is connected to the water cooling device 141. The second heat dissipation chip 310 is in contact with the second heat dissipation boss 1121 through the second heat dissipation adhesive layer, realizing indirect contact with the water cooling device 141. In this embodiment, the second heat dissipation boss 1121 is formed on the outer shell of the water cooling device 141. The second heat dissipation chip 310 transfers the dissipated heat to the water cooling device 141 through the second heat dissipation adhesive layer and the second heat dissipation boss 1121, thereby dissipating the heat generated by the second heat dissipation chip 310.

[0081] Furthermore, the water cooling device 141 of this embodiment includes a water cooling flow channel 1411 and a water cooling end cover 1412 formed inside the body 110. The shape of the water cooling flow channel 1411 can be set as needed, for example, it can be in a "U" shape. The water cooling end cover 1412 covers the water cooling flow channel 1411. Exemplarily, the water cooling flow channel 1411 and the water cooling end cover 1412 can be welded together by friction stir welding, brazing, laser welding, etc. Using the welding method can ensure the integration of the water cooling flow channel 1411 and the water cooling end cover 1412 and prevent the refrigerant in the water cooling flow channel 1411 from leaking. The body 110 further includes a water inlet pipe 1413 and a water outlet pipe 1414 communicating with the water cooling flow channel 1411. The water inlet pipe 1413 and the water outlet pipe 1414 are used to connect to an external water cooling system, so as to realize the circulating flow of the refrigerant.

[0082] A plurality of flow guiding columns 1415 arranged along the first direction X are provided in the water cooling flow channel 1411. The flow guiding columns 1415 can not only increase the heat dissipation area, but also interfere with the flowing refrigerant, form turbulence and break the boundary layer formed between the refrigerant and the inner wall of the water cooling flow channel 1411, improving the heat dissipation performance of the water cooling device 141.

[0083] There are also two opposite first guiding plates 1416 and two opposite second guiding plates 1417 arranged inside the water-cooling channel 1411. The two first guiding plates 1416 are arranged close to the water inlet pipe 1413, and the gap between the two first guiding plates 1416 gradually decreases towards the side of the water inlet pipe 1413. The two second guiding plates 1417 are arranged close to the water outlet pipe 1414, and the gap between the two second guiding plates 1417 gradually decreases towards the side of the water outlet pipe 1414. The two first guiding plates 1416 in this embodiment can evenly separate the flowing-in refrigerant, and the two second guiding plates 1417 can evenly merge the flowing-out refrigerant, preventing the refrigerant from generating eddy currents in the water-cooling channel 1411 and reducing the heat dissipation performance.

[0084] Furthermore, a first flow dividing column 1418 can be arranged between the two first guiding plates 1416. The first flow dividing column 1418 is arranged close to the guiding column 1415. By arranging the first flow dividing column 1418, the flowing-in refrigerant can be better evenly separated, which helps to improve the heat dissipation effect.

[0085] A second flow dividing column 1419 can be arranged between the two second guiding plates 1417. The second flow dividing column 1419 is arranged close to the guiding column 1415. By arranging the second flow dividing column 1419, the flowing-out refrigerant can be better evenly separated, which helps to improve the heat dissipation effect.

[0086] Please continue to refer to Figures 1 - 12 , along the first direction X, on the first side of the first circuit board 200 in this embodiment, there are a plurality of first solder joints 220 arranged around the perimeter of the first circuit board 200. On the second side of the first circuit board 200, there are a plurality of second solder joints 230 arranged around the perimeter of the first circuit board 200. The first solder joints 220 and the second solder joints 230 can be formed by directly opening holes in the corresponding stencils according to the layout requirements and then applying solder paste.

[0087] The first end cap 120 includes a first cover plate 121. On the side of the first cover plate 121 facing the first installation groove 111, there is a first flange 122. In a plane perpendicular to the first direction X, the projection of the first flange 122 coincides with the projection of the plurality of first solder joints 220, and the first flange 122 abuts against the plurality of first solder joints 220. It can be understood that the first end cap 120 is made of a metal material. By abutting the first flange 122 against the plurality of first solder joints 220, under the action of the abutting force of the first flange 122, the plurality of first solder joints 220 can be deformed to evenly abut between the first flange 122 and the first circuit board 200, thereby improving the EMC (Electromagnetic Compatibility) shielding performance.

[0088] The first mounting groove 111 further includes a second flange 1112. In a plane perpendicular to the first direction X, the projection of the second flange 1112 coincides with the projections of the plurality of second solder points 230, and the second flange 1112 abuts against the plurality of second solder points 230. It can be understood that, similar to the function of the above-mentioned first solder points 220, the plurality of second solder points 230 can be evenly abutted between the second flange 1112 and the first circuit board 200 under the action of the abutting force of the second flange 1112, thereby improving the EMC (Electromagnetic Compatibility) shielding performance.

[0089] Further, the first end cap 120 of the present embodiment further includes a first side wall 123. The first side wall 123 is disposed around the periphery of the first cover plate 121 and is located on the side of the first cover plate 121 facing the first mounting groove 111. A water retaining groove 124 is formed between the first flange 122 and the first side wall 123. It can be understood that the water retaining groove 124 is jointly surrounded by the first flange 122, the first side wall 123, and the first cover plate 121. A water retaining flange 113 is further provided on the side of the body 110 facing the first end cap 120. The water retaining flange 113 is located in the water retaining groove 124. By inserting the water retaining flange 113 into the water retaining groove 124, the waterproof performance between the first end cap 120 and the body 110 can be improved, and the influence of external water vapor on the first circuit board 200 can be avoided.

[0090] Exemplarily, a plurality of first connecting columns 114 are further provided on the side of the body 110 facing the first end cap 120. A first connecting hole is provided in the first connecting column 114; a plurality of first through holes 125 are provided on the first end cap 120; the plurality of first through holes 125 and the plurality of first connecting holes correspond one by one, and the first fastener 410 is fixedly connected to the corresponding first connecting hole after passing through the first through hole 125. The first fastener 410 can be, for example, a screw, and the first end cap 120 and the body 110 are locked together by the screw. In this embodiment, the specific numbers of the first through holes 125 and the first connecting columns 114 can be set as needed, for example, both can be 2-6.

[0091] A plurality of first fixing holes 240 are provided on the first circuit board 200, and a plurality of locking holes 1113 are further provided on the second flange 1112; the plurality of first fixing holes 240 and the plurality of locking holes 1113 correspond one by one, and the second fastener 420 is fixedly connected to the corresponding locking hole 1113 after passing through the first fixing hole 240. The second fastener 420 can be, for example, a screw, and the first circuit board 200 and the body 110 are locked together by the screw. In this embodiment, the specific numbers of the first fixing holes 240 and the locking holes 1113 can be set as needed, for example, both can be 2-6.

[0092] When the first circuit board 200 is locked to the main body 110, due to the fact that the stress on the first solder points 220 and the second solder points 230 around the first fixing holes 240 is relatively large, while the stress on the first solder points 220 and the second solder points 230 in other areas is relatively small, the height difference formed between the two may cause a risk of overstress for the first circuit board 200. In order to prevent key electronic components on the first circuit board 200 from being damaged due to excessive stress, in this embodiment, a plurality of first stress relief grooves 250 are further provided on the first circuit board 200. The first stress relief grooves 250 are located around the first fixing holes 240 close to the first heat dissipation chip 210, and the first stress relief grooves 250 are located between the first fixing holes 240 and the first heat dissipation chip 210. By providing the first stress relief grooves 250, the stress around the first fixing holes 240 can be blocked from being transmitted to the area of key electronic components on the first circuit board 200, thereby reducing the risk of damage to key electronic components on the first circuit board 200.

[0093] Please continue to refer to Figures 1 - 8 、 Figures 13 - 16 As shown in, along the first direction X, on the first side of the second circuit board 300 of this embodiment, a plurality of different functional areas are formed. The division of different functional areas can be set according to actual needs. On the first side of the second circuit board 300, a plurality of third solder points 320 are further provided. The plurality of third solder points 320 are located between two adjacent functional areas and around the second circuit board 300. On the second side of the second circuit board 300, a plurality of fourth solder points are provided. The plurality of fourth solder points include several first sub-solder points 331 and several groups of second sub-solder points 332. The several first sub-solder points 331 are located on one side of the second circuit board 300, and the several groups of second sub-solder points 332 are evenly distributed on the second circuit board 300. The second sub-solder points 332 in each group surround a plurality of rings with different diameters. The third solder points 320 and the fourth solder points can be formed by directly opening holes in the corresponding stencils according to the layout requirements and then brushing solder paste.

[0094] The second installation groove 112 further includes a third flange 1122. In a plane perpendicular to the first direction X, the projection of the third flange 1122 coincides with the projection of the plurality of third solder points 320, and the third flange 1122 abuts against the plurality of third solder points 320. It can be understood that by abutting the third flange 1122 against the plurality of third solder points 320, under the action of the abutting force of the third flange 1122, the plurality of third solder points 320 can be evenly abutted between the third flange 1122 and the second circuit board 300, thereby improving the EMC shielding performance; in addition, as Figure 8 shown, the third flange 1122 is provided corresponding to different functional areas on the second circuit board 300, and the second installation groove 112 is divided into a plurality of independent shielding chambers, which can also improve the EMC shielding performance between different functional areas on the second circuit board 300.

[0095] The second end cover 130 includes a second cover plate 131. On the side of the second cover plate 131 facing the second installation groove 112, there are provided a fourth flange 132 and a plurality of second connection columns 133. In a plane perpendicular to the first direction X, the projection of the fourth flange 132 coincides with the projections of several first sub-tin points 331, and the projections of the plurality of second connection columns 133 coincide with the projections of several groups of second sub-tin points 332 one by one. The fourth flange 132 abuts against several first sub-tin points 331, and the plurality of second connection columns 133 respectively abut against several groups of second sub-tin points 332. It can be understood that by abutting the fourth flange 132 against several first sub-tin points 331, under the action of the abutting force of the fourth flange 132, several first sub-tin points 331 can be evenly abutted between the fourth flange 132 and the second circuit board 300; by abutting the second connection columns 133 against the corresponding second sub-tin points 332, under the action of the second connection columns 133, the second sub-tin points 332 can be evenly abutted between the second connection columns 133 and the second circuit board 300; through the above settings, the EMC shielding performance can be improved.

[0096] Furthermore, the second end cover 130 of this embodiment further includes a second side wall 134. The second side wall 134 is disposed around the periphery of the second cover plate 131 and is located on the side of the second cover plate 131 facing the second installation groove 112; on the side of the second side wall 134 facing the second cover plate 131, there are provided a plurality of protrusions 1341. A labyrinth groove 1123 is further formed between the side wall of the second installation groove 112 and the third flange 1122. The second side wall 134 is located in the labyrinth groove 1123, and the plurality of protrusions 1341 abut against the third flange 1122. In this embodiment, by inserting the second side wall 134 into the labyrinth groove 1123 and making the protrusions 1341 on the second side wall 134 abut against the side wall of the labyrinth groove 1123 by means of interference fit, the EMC shielding performance between the second end cover 130 and the body 110 is improved; in addition, this connection structure can also improve the grounding performance of the domain controller.

[0097] In this embodiment, a second through hole is provided in the second connection column 133; a plurality of second connection holes 1124 are provided in the second installation groove 112; a plurality of second fixing holes 340 are provided on the second circuit board 300; the plurality of second through holes, the plurality of second fixing holes 340 and the plurality of second connection holes 1124 correspond to each other one by one, and the third fastener 430 passes through the second through hole and the second fixing hole 340 in sequence and is fixedly connected to the corresponding second connection hole 1124. The third fastener 430 can be, for example, a screw, and the second end cover 130, the second circuit board 300 and the body 110 are locked together by the screw. In this embodiment, the specific number of the second through holes, the second fixing holes 340 and the second connection holes 1124 can be set according to needs, for example, they can all be 3 - 10.

[0098] When the second circuit board 300 is locked to the main body 110, since the stress on the third solder joints 320 and the fourth solder joints around the second fixing holes 340 is relatively large, while the stress on the third solder joints 320 and the fourth solder joints in other areas is relatively small, the height difference formed between the two may cause a risk of overstress on the second circuit board 300. In order to prevent key electronic components on the second circuit board 300 from being damaged due to excessive stress, in this embodiment, several second stress relief grooves 350 are further provided on the second circuit board 300. The second stress relief grooves 350 are located around the second fixing holes 340 close to the second heat dissipation chip 310, and the second stress relief grooves 350 are located between the second fixing holes 340 and the second heat dissipation chip 310. By providing the second stress relief grooves 350, the stress around the second fixing holes 340 can be blocked from being transmitted to the area of key electronic components on the second circuit board 300, thereby reducing the risk of damage to the key electronic components on the second circuit board 300.

[0099] Please continue to refer to Figures 5 - 15 , the main body 110 of this embodiment further includes a connector mounting portion 115, and the connector mounting portion 115 is provided through the main body 110 along the first direction X. A first connector 260 is provided on the first circuit board 200, and a second connector 360 is provided on the second circuit board 300. The first connector 260 and the second connector 360 are plugged and connected, and both the first connector 260 and the second connector 360 are located inside the connector mounting portion 115. In this embodiment, by restricting the first connector 260 and the second connector 360 inside the connector mounting portion 115, signal interference to other electronic components on the first circuit board 200 and the second circuit board 300 can be avoided.

[0100] Furthermore, the first end cover 120 of this embodiment includes a first abutting portion 126. In a plane perpendicular to the first direction X, the projection of the first abutting portion 126 coincides with the projection of the first connector 260, and the first abutting portion 126 abuts against the first circuit board 200, thereby preventing the connection of the first connector 260 from becoming loose and ensuring the communication quality.

[0101] Correspondingly, the second end cover 130 includes a second abutting portion 135. In a plane perpendicular to the first direction X, the projection of the second abutting portion 135 coincides with the projection of the second connector 360, and the second abutting portion 135 abuts against the second circuit board 300, thereby preventing the connection of the second connector 360 from becoming loose and ensuring the communication quality.

[0102] In this embodiment, a plurality of fifth solder joints 270 are further provided on the first circuit board 200, and the plurality of fifth solder joints 270 are arranged around the first connector 260; the first end of the connector mounting portion 115 abuts against the plurality of fifth solder joints 270. It can be understood that by abutting the first end of the connector mounting portion 115 against the plurality of fifth solder joints 270, under the action of the abutting force of the connector mounting portion 115, the plurality of fifth solder joints 270 can be evenly abutted between the connector mounting portion 115 and the first circuit board 200, thereby improving the EMC shielding performance and preventing the communication between the first connector 260 and the second connector 360 from interfering with the electronic components on the first circuit board 200.

[0103] Correspondingly, a plurality of sixth solder joints 370 are further provided on the second circuit board 300, and the plurality of sixth solder joints 370 are arranged around the second connector 360; the second end of the connector mounting portion 115 abuts against the plurality of sixth solder joints 370. It can be understood that by abutting the second end of the connector mounting portion 115 against the plurality of sixth solder joints 370, under the action of the abutting force of the connector mounting portion 115, the plurality of sixth solder joints 370 can be evenly abutted between the connector mounting portion 115 and the second circuit board 300, thereby improving the EMC shielding performance and preventing the communication between the first connector 260 and the second connector 360 from interfering with the electronic components on the second circuit board 300.

[0104] It can be understood that since the first circuit board 200 and the second circuit board 300 are respectively arranged on both sides of the first direction X of the body 110, and corresponding EMC shielding structures are also provided between the connector mounting portion 115 and the first circuit board 200 and the second circuit board 300, it is possible to avoid the interference of the same problem to another circuit board, resulting in the failure of another circuit board, that is, reducing the risk of common cause failure. For example, when water or other liquids invade, the probability of the first circuit board 200 and the second circuit board 300 being unable to work at the same time can be reduced, and the risk of the automatic driving function failure can be reduced.

[0105] Please continue to refer to Figure 1 、 Figure 2 、 Figure 6 and Figure 9 , the first circuit board 200 of this embodiment further includes a first wire outlet 280, and the second circuit board 300 further includes a second wire outlet 380. The first wire outlet 280 and the second wire outlet 380 are respectively located on both sides of the housing 100 along the second direction Y. In this embodiment, the first wire outlet 280 and the second wire outlet 380 are respectively arranged on both sides of the domain controller along the second direction Y, which can avoid the situation where both wire outlets are damaged when the domain controller is subjected to external pressure, dropping, impact, etc., thereby improving the reliability of the domain controller and reducing the risk of the automatic driving function failure.

[0106] In this embodiment, a first water-blocking brim 127 is provided on the first end cap 120. The first water-blocking brim 127 is used to block the first wire outlet 280, thereby improving the waterproof performance at the first wire outlet 280. A second water-blocking brim 116 is provided on the body 110. The second water-blocking brim 116 is used to block the second wire outlet 380, thereby improving the waterproof performance at the second wire outlet 380.

[0107] Please continue to refer to Figure 1 and Figure 2 In this embodiment, the body 110 of this embodiment may further be provided with a plurality of connecting portions 150. The connecting portions 150 are used to connect to a movable platform, thereby fixing the domain controller to the movable platform. The connecting portion 150 may include, for example, a connecting through-hole 151. Fasteners such as screws and bolts can pass through the connecting through-hole 151 and be locked and connected to the movable platform.

[0108] This embodiment also provides a movable platform including the above domain controller.

[0109] Specifically, the movable platform of this embodiment may be, for example, a vehicle, a drone, a robot, etc. The domain controller is disposed inside the movable platform to manage and control various functions of the movable platform by processing data information. Since the above domain controller is adopted, the functions of two domain controllers can be integrated in one housing at the same time, reducing the layout complexity and cost of the domain controller; the domain controller also has a good heat dissipation effect, ensuring that the domain controller has a good information processing ability; in addition, the domain controller can also reduce the potential risk of common cause failure.

[0110] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0111] In the present application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0112] It should be noted that in the description of the present application, the terms "first" and "second" are only used for the convenience of describing different components, and cannot be construed as indicating or implying an order relationship, relative importance, or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features.

[0113] The embodiments or implementation manners in the present application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0114] In the description of the present application, the description with reference to the terms "an implementation manner", "some implementation manners", "illustrative implementation manners", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of the present application. In the present application, the illustrative expressions of the above terms do not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0115] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A domain controller, characterized in that, Comprising: A housing, the housing includes a body, a first end cover and a second end cover. A first mounting groove is provided on a first side of the body along a first direction, the first end cover covers the first mounting groove, a second mounting groove is provided on a second side of the body along the first direction, and the second end cover covers the second mounting groove; A first circuit board, the first circuit board is disposed in the first mounting groove, and the first circuit board includes a first heat dissipation chip; A second circuit board, the second circuit board is disposed in the second mounting groove, and the first circuit board is communicatively connected to the second circuit board. The second circuit board includes a second heat dissipation chip; The body further includes a cooling device, and both the first heat dissipation chip and the second heat dissipation chip are in contact with the cooling device.

2. The domain controller according to claim 1, wherein The cooling device includes a water cooling device and a plurality of heat dissipation fins. The water cooling device is disposed in the body, and a plurality of the heat dissipation fins are all disposed in the second mounting groove, and a plurality of the heat dissipation fins are all in contact with the water cooling device; A first heat dissipation boss is provided in the first mounting groove. In a plane perpendicular to the first direction, the projection of the first heat dissipation boss is within the projection range of a plurality of the heat dissipation fins, and the first heat dissipation chip is in contact with the first heat dissipation boss through a first heat dissipation adhesive layer; A second heat dissipation boss is provided in the second mounting groove, the second heat dissipation boss is connected to the water cooling device, and the second heat dissipation chip is in contact with the second heat dissipation boss through a second heat dissipation adhesive layer.

3. The domain controller according to claim 2, characterized in that, The water cooling device includes a water cooling channel formed in the body and a water cooling end cover, and the water cooling end cover covers the water cooling channel; the body further includes a water inlet pipe and a water outlet pipe communicated with the water cooling channel; A plurality of flow guiding columns are provided in the water cooling channel along the first direction; Two opposite first flow guiding plates and two opposite second flow guiding plates are further provided in the water cooling channel; the two first flow guiding plates are arranged close to the water inlet pipe, and the gap between the two first flow guiding plates gradually decreases toward the water inlet pipe side; the two second flow guiding plates are arranged close to the water outlet pipe, and the gap between the two second flow guiding plates gradually decreases toward the water outlet pipe side.

4. The domain controller according to any one of claims 1-3, characterized in that, Along the first direction, a plurality of first solder joints are provided on a first side of the first circuit board, and the plurality of first solder joints are arranged around the periphery of the first circuit board; a plurality of second solder joints are provided on a second side of the first circuit board, and the plurality of second solder joints are arranged around the periphery of the first circuit board; The first end cover includes a first cover plate. A first flange is provided on a side of the first cover plate facing the first mounting groove. In a plane perpendicular to the first direction, the projection of the first flange coincides with the projection of the plurality of first solder joints, and the first flange is in contact with the plurality of first solder joints; The first mounting groove further includes a second flange. In a plane perpendicular to the first direction, the projection of the second flange coincides with the projection of the plurality of second solder joints, and the second flange is in contact with the plurality of second solder joints.

5. The domain controller according to claim 4, wherein The first end cover further includes a first side wall, which is disposed around the periphery of the first cover plate and is located on the side of the first cover plate facing the first mounting groove. A water retaining groove is formed between the first flange and the first side wall; a water retaining flange is further provided on the side of the body facing the first end cover, and the water retaining flange is located in the water retaining groove.

6. The domain controller according to claim 4, characterized in that A plurality of first connecting posts are further provided on the side of the body facing the first end cover. A first connecting hole is provided in each first connecting post. A plurality of first through holes are provided on the first end cover. The plurality of first through holes and the plurality of first connecting holes correspond to each other one by one. After passing through the first through holes, a first fastener is fixedly connected to the corresponding first connecting hole; A plurality of first fixing holes are provided on the first circuit board. A plurality of locking holes are further provided on the second flange. The plurality of first fixing holes and the plurality of locking holes correspond to each other one by one. After passing through the first fixing holes, a second fastener is fixedly connected to the corresponding locking hole; A plurality of first stress relief grooves are further provided on the first circuit board. The first stress relief grooves are located around the first fixing holes close to the first heat dissipation chip, and the first stress relief grooves are located between the first fixing holes and the first heat dissipation chip.

7. The domain controller according to any one of claims 1-3, characterized in that, Along the first direction, a plurality of different functional areas are formed on the first side of the second circuit board. A plurality of third solder joints are further provided on the first side of the second circuit board. The plurality of third solder joints are located between two adjacent functional areas and around the second circuit board; a plurality of fourth solder joints are provided on the second side of the second circuit board. The plurality of fourth solder joints include several first sub-solder joints and several groups of second sub-solder joints. The several first sub-solder joints are located on one side of the second circuit board, and the several groups of second sub-solder joints are evenly distributed on the second circuit board; The second mounting groove further includes a third flange. In a plane perpendicular to the first direction, the projection of the third flange coincides with the projection of the plurality of third solder joints, and the third flange abuts against the plurality of third solder joints; The second end cover includes a second cover plate. A fourth flange and a plurality of second connecting posts are provided on the side of the second cover plate facing the second mounting groove. In a plane perpendicular to the first direction, the projection of the fourth flange coincides with the projection of the several first sub-solder joints, and the projections of the plurality of second connecting posts coincide with the projections of the several groups of second sub-solder joints one by one. The fourth flange abuts against the several first sub-solder joints, and the plurality of second connecting posts respectively abut against the several groups of second sub-solder joints.

8. The domain controller according to claim 7, characterized in that, The second end cover further includes a second side wall, which is disposed around the periphery of the second cover plate and is located on the side of the second cover plate facing the second mounting groove. A plurality of protruding portions are provided on the side of the second side wall facing the second cover plate; a labyrinth groove is further formed between the side wall of the second mounting groove and the third flange. The second side wall is located in the labyrinth groove, and the plurality of protruding portions abut against the third flange.

9. The domain controller according to claim 7, characterized in that, A second through hole is provided in the second connecting post, a plurality of second connecting holes are provided in the second mounting groove, and a plurality of second fixing holes are provided on the second circuit board. The plurality of second through holes, the plurality of second fixing holes, and the plurality of second connecting holes correspond to each other one by one. A third fastener passes through the second through hole and the second fixing hole in sequence and is fixedly connected to the corresponding second connecting hole; A plurality of second stress relief grooves are further provided on the second circuit board. The second stress relief grooves are located around the second fixing holes close to the second heat dissipation chip, and the second stress relief grooves are located between the second fixing holes and the second heat dissipation chip.

10. The domain controller according to claim 1, characterized in that, The body further includes a connector mounting portion which penetrates through the body along the first direction; a first connector is provided on the first circuit board, a second connector is provided on the second circuit board, the first connector and the second connector are plugged and connected, and both the first connector and the second connector are located in the connector mounting portion; The first end cover includes a first abutting portion. In a plane perpendicular to the first direction, the projection of the first abutting portion coincides with the projection of the first connector, and the first abutting portion abuts against the first circuit board; The second end cover includes a second abutting portion. In a plane perpendicular to the first direction, the projection of the second abutting portion coincides with the projection of the second connector, and the second abutting portion abuts against the second circuit board.

11. The domain controller according to claim 10, wherein A plurality of fifth solder joints are further provided on the first circuit board. The plurality of fifth solder joints are arranged around the first connector; the first end of the connector mounting portion abuts against the plurality of fifth solder joints; And / or, a plurality of sixth solder joints are further provided on the second circuit board. The plurality of sixth solder joints are arranged around the second connector; the second end of the connector mounting portion abuts against the plurality of sixth solder joints.

12. The domain controller according to claim 1, wherein The first circuit board further includes a first wire outlet, and the second circuit board further includes a second wire outlet. The first wire outlet and the second wire outlet are respectively located on both sides of the housing along the second direction; The first end cover is provided with a first water-blocking eaves which is used to block the first wire outlet; The body is provided with a second water-blocking eaves which is used to block the second wire outlet.

13. A mobile platform, characterized in that, Including the domain controller according to any one of claims 1-12.

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