Heat dissipation assembly and electronic equipment
By using isolated gas and liquid channels in the VC heat dissipation structure and setting capillary structures in the liquid channels, the problem of gas and liquid interfering in the same channel is solved, and more efficient heat transfer and heat dissipation performance is achieved.
Patent Information
- Application Number
- CN202422011084.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In the existing VC heat dissipation structure, gas and liquid are transmitted in the same channel, resulting in mutual interference and affecting the heat transfer effect.
Separators are used to isolate the gas channel and the liquid channel, and a capillary structure is set in the evaporation chamber, condensation chamber and liquid channel. The gas and liquid flow independently. The capillary structure is only arranged in the liquid channel, and the gas channel is not set in the capillary structure.
It improves the gas-liquid circulation efficiency, ensures the independent flow of gas and liquid, and improves the heat transfer efficiency and heat dissipation performance.
Smart Images
Figure CN223080345U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, and particularly relates to a heat dissipation component and an electronic device. Background Art
[0002] With the application of 5G communication, high-power charging, the improvement of screen resolution and the increase of game load in electronic devices such as mobile phones, the heat dissipation demand of electronic devices is increasing, and the level of heat dissipation capacity has become one of the important evaluation criteria for electronic devices.
[0003] In the related art, an electronic device adopts a VC (Vapor Chamber) heat dissipation structure. However, in this heat dissipation structure, gas and liquid are transmitted in the same channel, which causes mutual interference and affects the heat transfer effect. Summary of the Utility Model
[0004] The utility model provides a heat dissipation component and an electronic device, which can solve the problem that gas and liquid are transmitted in the same channel in the VC heat dissipation structure, resulting in mutual interference and affecting the heat transfer effect.
[0005] The technical solution is as follows:
[0006] On the one hand, a heat dissipation component is provided, and the heat dissipation component includes: a heat transfer body;
[0007] A sealed chamber is arranged inside the heat transfer body, and a coolant is provided in the sealed chamber;
[0008] The sealed chamber includes an evaporation chamber and a condensation chamber. A gas channel and a liquid channel are arranged between the evaporation chamber and the condensation chamber, and a partition rib is arranged between the gas channel and the liquid channel;
[0009] The heat dissipation component further includes a capillary structure, and the capillary structure is arranged in at least one of the evaporation chamber, the condensation chamber and the liquid channel, and at least part of the gas channel is not provided with the capillary structure.
[0010] In some embodiments, the evaporation chamber and the condensation chamber are respectively located at two ends of the sealed chamber along the length direction;
[0011] The gas channel and the liquid channel extend along the length direction and are arranged side by side along the width direction of the sealed chamber;
[0012] Wherein, the dimension of the sealed chamber along the length direction is greater than the dimension along the width direction.
[0013] In some embodiments, the capillary structure includes a first part, a second part, and a third part. The first part is located in the evaporation chamber, the second part is located in the condensation chamber, the third part is located in the liquid channel, and the first part, the second part, and the third part are connected to each other.
[0014] In some embodiments, the heat dissipation assembly further includes a support structure, and the support structure is located in at least one of the evaporation chamber, the condensation chamber, the gas channel, and the liquid channel.
[0015] In some embodiments, the support structure includes a plurality of support columns arranged at intervals in an array, and the support columns extend along the thickness direction of the heat transfer body to provide internal support for the heat transfer body.
[0016] In some embodiments, the gas channel is located between two adjacent support columns, and the number of gas channels is at least two.
[0017] In some embodiments, both the evaporation chamber and the condensation chamber are provided with the support structure and the capillary structure. The support structure and the capillary structure are arranged in layers along the thickness direction of the heat transfer body, and the capillary structure is close to the surface of the heat transfer body close to the heat source or the cold source.
[0018] In some embodiments, the heat dissipation assembly further includes a heat dissipation sheet, and the heat dissipation sheet is attached to at least one surface of the heat transfer body.
[0019] In some embodiments, the heat dissipation sheet covers the condensation chamber; the heat dissipation sheet is a graphite sheet or a graphene sheet.
[0020] In some embodiments, the heat dissipation assembly is applied to an electronic device, and the heat dissipation sheet is connected to the middle frame structure of the electronic device.
[0021] On the other hand, an electronic device is provided, and the electronic device adopts the heat dissipation assembly of the present utility model.
[0022] The beneficial effects brought by the technical solution provided by the present utility model at least include:
[0023] The heat dissipation component of the present utility model has a sealed chamber provided inside the heat transfer body. The gas passage and the liquid passage between the evaporation chamber and the condensation chamber inside the sealed chamber are isolated from each other by partition ribs. The coolant absorbs heat and evaporates into a gas state in the evaporation chamber, and the gas flows along the gas passage to the condensation chamber. The coolant releases heat and condenses into a liquid state in the condensation chamber, and the liquid flows back to the evaporation chamber along the liquid passage. The gas and the liquid flow independently and will not conflict with each other, having better gas-liquid circulation efficiency, which is beneficial to improving the heat transfer efficiency and enhancing the heat dissipation performance of the heat dissipation component. In addition, the capillary structure is only arranged in the evaporation chamber, the condensation chamber and the liquid passage, which is beneficial to improving the flow efficiency of the liquid in the corresponding area. The capillary structure is not arranged in the gas passage, so the liquid will not flow back into the gas passage, and only gas flows in the gas passage, ensuring the flow efficiency of the gas. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0025] Figure 1 is a schematic structural diagram of a VC structure provided by the prior art;
[0026] Figure 2 is a schematic structural diagram of the heat transfer body provided by the embodiment of the present utility model;
[0027] Figure 3 is Figure 2 a structural cross-sectional view taken at A-A in
[0028] Figure 4 is Figure 2 a structural cross-sectional view taken at B-B in
[0029] Figure 5 is a schematic structural diagram of the capillary structure provided by the embodiment of the present utility model;
[0030] Figure 6 is a schematic structural diagram of the heat dissipation component provided by the embodiment of the present utility model;
[0031] Figure 7 is a side view of the structure of the heat dissipation component provided by the embodiment of the present utility model.
[0032] Figure 1 The reference numerals in
[0033] respectively represent:
[0034] Figures 2 to 7 a, evaporation end; b, condensation end; c, gas; d, liquid;
[0034] Figures 2 to 7The reference numerals in the figures are respectively represented as follows:
[0035] 10. Heat transfer body;
[0036] 1. Sealing chamber;
[0037] 101. Evaporation chamber; 102. Condensation chamber; 103. Gas channel; 104. Liquid channel; 105. Partition rib;
[0038] 20. Capillary structure;
[0039] 201. First part; 202. Second part; 203. Third part;
[0040] 30. Support structure;
[0041] 301. Support column;
[0042] 40. Heat dissipation fin;
[0043] 001. Heat source. Detailed implementation mode
[0044] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements. The implementation modes described in the following exemplary embodiments do not represent all implementation modes consistent with the present invention. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.
[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the Figure 1 orientation or positional relationship shown, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0046] It should be understood that in the present utility model, "electrically connected" can be understood as physical contact and electrical conduction between components; it can also be understood as a connection form in a circuit structure where different components are connected through physical conductors such as copper foils or wires of a Printed Circuit Board (PCB) that can transmit electrical signals. "Communication connection" can refer to the transmission of electrical signals, including wireless communication connections and wired communication connections. Wireless communication connections do not require a physical medium and do not belong to the connection relationship that defines the product structure. "Connected" and "linked" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A is connected to B or A is linked to B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and it is difficult to separate A and B.
[0047] In the VC structure provided by the related art, as shown in Figure 1 Coolant absorbs heat and vaporizes at the evaporation end a, releases heat and liquefies at the condensation end b. Gas c flows from the evaporation end a to the condensation end b, and liquid d flows from the condensation end b to the evaporation end a. However, gas c and liquid d flow in the same channel, and their flow paths overlap. Gas c and liquid d will collide and interfere with each other, and the flow efficiency of both gas c and liquid d is affected, resulting in poor heat transfer performance of the VC structure.
[0048] Therefore, the present utility model provides a heat dissipation component. The gas channel and the liquid channel are isolated from each other by partition ribs. The gas and the liquid flow independently and do not conflict with each other, having better gas-liquid circulation efficiency, which is beneficial to improving the heat transfer efficiency and enhancing the heat dissipation performance of the heat dissipation component.
[0049] Unless otherwise defined, all technical terms used in the embodiments of the present utility model have the same meaning as commonly understood by those of ordinary skill in the art.
[0050] To make the objectives, technical solutions, and advantages of the present utility model clearer, the embodiments of the present utility model will be further described in detail below with reference to the accompanying drawings.
[0051] On the one hand, as shown in Figure 2 、 Figure 3 and Figure 4 , this embodiment provides a heat dissipation component, and the heat dissipation component includes: a heat transfer body 10.
[0052] A sealed chamber 1 is provided inside the heat transfer body 10, and a coolant is provided inside the sealed chamber 1; the sealed chamber 1 includes an evaporation chamber 101 and a condensation chamber 102. A gas channel 103 and a liquid channel 104 are provided between the evaporation chamber 101 and the condensation chamber 102, and a partition rib 105 is provided between the gas channel 103 and the liquid channel 104.
[0053] The heat dissipation component further includes a capillary structure 20, which is disposed in at least one of the evaporation chamber 101, the condensation chamber 102, and the liquid channel 104. At least a partial region of the gas channel 103 is not provided with the capillary structure 20, which can ensure that there is no flow obstruction in the gas channel 103, and the flow efficiency of the gas in the gas channel 103 is relatively high.
[0054] For the heat dissipation component of the present utility model, a sealed chamber 1 is provided in the heat transfer body 10. The gas channel 103 and the liquid channel 104 between the evaporation chamber 101 and the condensation chamber 102 in the sealed chamber 1 are isolated from each other by the partition ribs 105. The coolant absorbs heat and evaporates into a gas state in the evaporation chamber 101, and the gas flows along the gas channel 103 to the condensation chamber 102. The coolant releases heat and condenses into a liquid state in the condensation chamber 102, and the liquid flows back to the evaporation chamber 101 along the liquid channel 104. The gas and the liquid flow independently and do not conflict with each other, having better gas-liquid circulation efficiency, being beneficial to improving the heat transfer efficiency, and improving the heat dissipation performance of the heat dissipation component.
[0055] In addition, the capillary structure 20 is arranged in the evaporation chamber 101, the condensation chamber 102, and the liquid channel 104, which is beneficial to improving the flow efficiency of the liquid in the corresponding regions. The capillary structure 20 is not arranged in the gas channel 103, so that the liquid will not flow back into the gas channel 103. Only gas flows in the gas channel 103, and the flow efficiency of the gas is guaranteed.
[0056] In some possible implementation manners, the capillary structure 20 may be a copper mesh structure or a copper powder sintered structure. The capillary structure 20 is used for the coolant to flow under capillary action, that is, from the condensation chamber 102 to the evaporation chamber 101 through the liquid channel 104.
[0057] In this embodiment, both the liquid channel 104 and the gas channel 103 are located in the sealed chamber 1 surrounded by the outer wall of the heat transfer body 10. The space between the evaporation chamber 101 and the condensation chamber 102 in the sealed chamber 1 is divided into two parts by the partition ribs 105, that is, the liquid channel 104 and the gas channel 103. In fact, the liquid channel 104 and the gas channel 103 are channel-shaped spaces surrounded by the outer wall of the heat transfer body 10 and the partition ribs 105.
[0058] Combined Figure 2 As shown, in some embodiments, the evaporation chamber 101 and the condensation chamber 102 are respectively located at two ends of the sealed chamber 1 along the length direction; the gas channel 103 and the liquid channel 104 extend along the length direction and are arranged side by side along the width direction of the sealed chamber 1; wherein, the dimension of the sealed chamber 1 along the length direction is greater than the dimension along the width direction.
[0059] With the above arrangement, the gas channel 103 and the liquid channel 104 are arranged side by side in the longitudinal direction. The flow paths of the gas and the liquid are parallel and spaced apart, and flow linearly respectively, with less flow resistance and better flow characteristics.
[0060] Combined with Figure 5 As shown, in some embodiments, the capillary structure 20 includes a first part 201, a second part 202, and a third part 203. The first part 201 is located in the evaporation chamber 101, the second part 202 is located in the condensation chamber 102, the third part 203 is located in the liquid channel 104, and the first part 201, the second part 202, and the third part 203 are connected.
[0061] With the above arrangement, the capillary structure 20 in the condensation chamber 102, the liquid channel 104, and the evaporation chamber 101 are connected in sequence. After the coolant condenses into a liquid in the condensation chamber 102, it can directly enter the first part 201 along the second part 202 and the third part 203, and then absorb heat and evaporate again to realize the rapid circulation flow of the coolant.
[0062] In some possible implementation manners, the shapes of the first part 201, the second part 202, and the third part 203 respectively correspond to the shapes of the evaporation chamber 101, the condensation chamber 102, and the liquid channel 104.
[0063] Combined with Figure 2 and Figure 3 As shown, in some embodiments, the heat dissipation assembly further includes a support structure 30, and the support structure 30 is located in at least one of the evaporation chamber 101, the condensation chamber 102, the gas channel 103, and the liquid channel 104.
[0064] Considering that the heat transfer body 10 is a hollow structure, in order to improve the structural strength of the heat transfer body 10, the support structure 30 is arranged in the sealed chamber 1 to provide internal support for the heat transfer body 10, preventing the heat transfer body 10 from being compressed and causing deformation of the sealed cavity, and further causing leakage of the sealed cavity, or blockage of the gas channel 103 and the liquid channel 104, etc., which will affect the heat dissipation effect of the heat dissipation assembly.
[0065] Combined with Figure 3 As shown, in some embodiments, the support structure 30 includes a plurality of support columns 301 arranged at intervals in an array, and the support columns 301 extend along the thickness direction of the heat transfer body 10 for providing internal support for the heat transfer body 10.
[0066] Through the above steps, a plurality of support columns 301 arranged at intervals in an array are used as the support structure 30, which can provide good internal support for the heat transfer body 10 and also occupy as little space in the sealed cavity as possible, so that the sealed cavity has more space to accommodate more coolant, thereby facilitating the improvement of the working ability of the heat dissipation component.
[0067] As shown in Figure 4 In some embodiments, the gas channels 103 are located between two adjacent support columns 301, and the number of gas channels 103 is at least two. Thus, there are a plurality of gas channels 103 in the heat dissipation component of this embodiment, which can ensure better flow efficiency of the gas.
[0068] As shown in Figure 4 and Figure 5 In some embodiments, both the evaporation cavity 101 and the condensation cavity 102 are provided with the support structure 30 and the capillary structure 20. The support structure 30 and the capillary structure 20 are arranged in layers along the thickness direction of the heat transfer body 10, and the capillary structure 20 is close to the surface of the heat transfer body 10 close to the heat source 001 or the cold source.
[0069] In this embodiment, there are both gas and liquid in the evaporation cavity 101 and the condensation cavity 102. Therefore, the support structure 30 and the capillary structure 20 are arranged in the evaporation cavity 101 and the condensation cavity 102 at the same time. The support structure 30 is used to support and form a gas flow space, and this gas flow space is communicated with the gas channels 103 to facilitate the entry and exit of gas. The capillary structure 20 is used to form a liquid flow space, and the capillary structure 20 in the capillary structure 20 is connected to the liquid channels 104, so that the liquid can also enter and exit.
[0070] In addition, the capillary structure 20 is arranged close to the heat source 001 or the cold source. The heat source 001 provides heat, which can evaporate and gasify the liquid in the capillary structure 20. The cold source absorbs heat, which can reduce the temperature at the capillary structure 20. When the temperature is lower than the condensation temperature of the coolant, the gas condenses into liquid and flows along the capillary structure 20.
[0071] As shown in Figure 6 and Figure 7 In some embodiments, the heat dissipation component further includes a heat dissipation fin 40, and the heat dissipation fin 40 is attached to at least one surface of the heat transfer body 10. Among them, the heat dissipation fin 40 has a high thermal conductivity and a large heat transfer efficiency.
[0072] To improve the heat exchange efficiency between the heat transfer body 10 and the outside, a heat dissipation fin 40 is attached to at least one surface of the heat transfer body 10. At the corresponding position of the evaporation chamber 101, the heat dissipation fin 40 can quickly transfer the heat of the heat source 001 to the heat transfer body 10. At the corresponding position of the condensation chamber 102, the heat dissipation fin 40 can quickly transfer the heat of the heat transfer body 10 to the cold source.
[0073] In some possible implementation manners, the heat dissipation fin 40 is attached to at least one surface of the heat transfer body 10 along the thickness direction, and the positions of the heat source 001 and the cold source also correspond to the surfaces of the heat transfer body 10 along the thickness direction.
[0074] In other possible implementation manners, the area of the heat dissipation fin 40 is larger than the surface area of the heat transfer body 10, so as to have a larger effective heat exchange area.
[0075] Combined Figure 6 and Figure 7 As shown, in some embodiments, the heat dissipation fin 40 covers the condensation chamber 102; the heat dissipation fin 40 is a graphite sheet or a graphene sheet.
[0076] Through the above arrangement, the heat dissipation fin 40 only covers the condensation chamber 102, quickly transfers the heat of the condensation chamber 102, accelerates the process of condensing the gas in the condensation chamber 102 into a liquid, and further increases the temperature difference between the evaporation chamber 101 and the condensation chamber 102, promoting the flow efficiency of the gas-liquid from the evaporation chamber 101 to the condensation chamber 102.
[0077] Using the graphite sheet and the graphene sheet as the heat dissipation fin 40 has better heat transfer efficiency.
[0078] In some embodiments, the heat dissipation component is applied to an electronic device, and the heat dissipation fin 40 is connected to the middle frame structure of the electronic device. By connecting the heat dissipation fin 40 to the middle frame structure of the electronic device, the heat in the electronic device can be quickly guided to the middle frame structure of the electronic device, improving the heat dissipation capacity of the electronic device.
[0079] On the other hand, this embodiment provides an electronic device, and the electronic device adopts the heat dissipation component of the present utility model.
[0080] The electronic device of this embodiment adopts the heat dissipation component of the present utility model and has all the beneficial technical effects of all the embodiments herein.
[0081] The electronic device in the embodiment of the present utility model may be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart watch, a smart helmet, a smart glasses, etc. The electronic device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing devices connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network or an electronic device in a future evolved Public Land Mobile Network (PLMN), etc. The embodiment of the present utility model does not limit this.
[0082] In some cases, the electronic device may perform multiple functions (for example, playing music, displaying videos, storing pictures, and receiving and sending phone calls). If needed, the electronic device may be a device such as a cellular phone, a media player, other handheld devices, a wristwatch device, a pendant device, a headset device or other compact and portable devices.
[0083] It should be noted that in the present utility model, unless otherwise clearly specified and defined, the first feature being “on” or “under” the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being “above”, “over” and “on top of” the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being “under”, “beneath” and “underneath” the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.
[0084] In the description of this specification, the description with reference to the terms “certain embodiments”, “one embodiment”, “some embodiments”, “schematic embodiments”, “examples”, “specific examples”, or “some examples” means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present utility model.
[0085] The above are only the embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A heat dissipation component, characterized in that, The heat dissipation component includes: a heat transfer body (10); A sealed chamber (1) is provided inside the heat transfer body (10), and a coolant is provided in the sealed chamber (1); The sealed chamber (1) includes an evaporation chamber (101) and a condensation chamber (102). A gas channel (103) and a liquid channel (104) are provided between the evaporation chamber (101) and the condensation chamber (102), and a partition rib (105) is provided between the gas channel (103) and the liquid channel (104); The heat dissipation component further includes a capillary structure (20). The capillary structure (20) is disposed in at least one of the evaporation chamber (101), the condensation chamber (102), and the liquid channel (104), and at least a partial region of the gas channel (103) is not provided with the capillary structure (20).
2. The heat dissipation component according to claim 1, wherein The evaporation chamber (101) and the condensation chamber (102) are respectively located at two ends of the sealed chamber (1) along the length direction; The gas channel (103) and the liquid channel (104) extend along the length direction and are arranged side by side along the width direction of the sealed chamber (1); Wherein, the dimension of the sealed chamber (1) along the length direction is greater than the dimension along the width direction.
3. The heat dissipation component according to claim 1, characterized in that, The capillary structure (20) includes a first part (201), a second part (202), and a third part (203). The first part (201) is located in the evaporation chamber (101), the second part (202) is located in the condensation chamber (102), the third part (203) is located in the liquid channel (104), and the first part (201), the second part (202), and the third part (203) are connected.
4. The heat dissipation component according to claim 1, wherein The heat dissipation component further includes a support structure (30). The support structure (30) is located in at least one of the evaporation chamber (101), the condensation chamber (102), the gas channel (103), and the liquid channel (104).
5. The heat dissipation component according to claim 4, wherein The support structure (30) includes a plurality of support columns (301) arranged at intervals in an array. The support columns (301) extend along the thickness direction of the heat transfer body (10) and are used to provide internal support for the heat transfer body (10).
6. The heat dissipation component according to claim 5, characterized in that The gas channel (103) is located between two adjacent support columns (301), and the number of the gas channels (103) is at least two.
7. The heat dissipation component according to claim 4, wherein Both the evaporation chamber (101) and the condensation chamber (102) are provided with the support structure (30) and the capillary structure (20). The support structure (30) and the capillary structure (20) are arranged in a stacked manner along the thickness direction of the heat transfer body (10), and the capillary structure (20) is close to the surface of the heat transfer body (10) close to the heat source (001) or the cold source.
8. The heat dissipation component according to any one of claims 1 to 7, characterized in that, The heat dissipation component further includes a heat dissipation fin (40). The heat dissipation fin (40) is attached to at least one surface of the heat transfer body (10).
9. The heat dissipation component according to claim 8, wherein The heat dissipation fin (40) covers the condensation chamber (102); the heat dissipation fin (40) is a graphite sheet or a graphene sheet.
10. The heat dissipation component according to claim 9, wherein, The heat dissipation component is applied to an electronic device, and the heat equalizing fin (40) is connected to the middle frame structure of the electronic device.
11. An electronic device, characterized in that, The electronic device adopts the heat dissipation component described in any one of claims 1 to 10.