Silicon wafer gluing and drying device

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer gluing and drying device which comprises a drying box and is characterized in that a hot drying cavity is arranged in the drying box, a plurality of supporting blocks are arranged in the hot drying cavity in an array mode, the upper ends of the supporting blocks are slidably connected with trays in a drawable mode, and the distance between the supporting blocks is larger than the height of the trays. A plurality of silicon wafer grooves are concavely formed in the trays in an array manner; and a plurality of trays are arranged. When the silicon wafers are placed, the silicon wafers are placed in the silicon wafer grooves, then the trays slide to the bottoms of the supporting blocks to complete placement of the silicon wafers, the trays can be directly taken out when taken out, the silicon wafers to be dried can be placed on new trays in the drying process, and then the trays to be dried are directly replaced. The time is greatly saved, and the drying efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer glue coating and drying device. Background Art

[0002] The raw material of silicon wafers is silicon element. Silicon element, which accounts for 25.8% of the earth's crust, provides an inexhaustible source for the production of monocrystalline silicon. Since silicon element is one of the most abundant elements in the earth's crust, for products such as solar cells that are destined to enter the large-scale market, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics;

[0003] After retrieval, a Chinese patent with the announcement number CN219607536U discloses a silicon wafer drying furnace.

[0004] In the above technical solution: it includes a drying box, in which a first support block and a second support block for placing a tray to overlap are symmetrically arranged inside; an air duct arranged at the middle position between the first support block and the second support block, the height of which is lower than that of the first support block and the second support block, and a plurality of air outlet holes are arranged in an array along the length of the air duct; an air inlet pipe communicated with the air duct and a fan located at the end of the air inlet pipe; a heating element arranged at any through diameter of the air duct or the air inlet pipe. In this application, through the air outlet holes on the air duct and in cooperation with the setting of the fan, the internal gas can continuously flow through the heating element to form hot air and flow to the placement area of the silicon wafers, thereby improving the utilization of the heat of the heating element. Compared with the existing cabinet-type drying furnace, the overall drying efficiency is improved;

[0005] However, in the above solution, when placing the silicon wafers, they need to be evenly laid in the placement area of the silicon wafers, and the same is true when taking them out, which is very time-consuming. When drying, the inside of the box is in a closed state. Although the hot air passes through the silicon wafers, it is actually in a disordered state, and the convection between the hot air will consume energy with each other, resulting in a low utilization rate of the hot air.

[0006] Therefore, we propose a silicon wafer glue coating and drying device. Utility Model Content

[0007] The utility model mainly solves the technical problems existing in the above-mentioned prior art, and provides a silicon wafer glue coating and drying device.

[0008] In order to achieve the above purpose, the utility model adopts the following technical scheme. A silicon wafer glue coating and drying device includes a drying box, characterized in that: a hot drying cavity is arranged inside the drying box, a number of supporting blocks are arranged in an array inside the hot drying cavity, a tray is slidably connected to the upper end of the supporting blocks in a pullable manner, the distance between the supporting blocks is greater than the height of the tray, a number of silicon wafer grooves are recessed in an array on the tray, and a number of trays are provided.

[0009] Preferably, a hot air blower is provided at the bottom end of the hot air drying chamber, and an air outlet skylight communicating with the hot air drying chamber is fixedly connected to the upper end of the hot air box.

[0010] Preferably, the tray includes a bottom plate, and edge protection shells are fixedly connected to the four peripheries of the upper end of the bottom plate.

[0011] Preferably, a plurality of air outlets are arranged in an array on the inner side of the edge protection shell. The air outlets are communicated with an air duct, and the air duct is arranged in the bottom plate.

[0012] Preferably, a fan is fixedly connected to the lower end of the tray, and the output end of the fan is communicated with the air duct.

[0013] Preferably, a box door is hinged to one side of the drying box.

[0014] The utility model provides a silicon wafer glue coating and drying device. Compared with the prior art, it has the following improvements and advantages:

[0015] In the utility model, the support block is arranged on the support block in a slidable manner. When placing the silicon wafer, the silicon wafer is placed in the silicon wafer groove, and then the tray is slid to the bottom of the support block to complete the placement of the silicon wafer. When taking out, the tray can be directly taken out. During the drying process, the un-dried silicon wafers can be placed on a new tray, and then the dried tray can be directly replaced, which greatly saves time and effectively improves the drying efficiency. Also, by arranging the hot air blower at the bottom, the hot air blows upward, the fan sucks the hot air in and then blows it into the air duct. The hot air passes through the air duct and blows out from the air outlets. The air outlets are arranged on the inner side of the edge protection shell. Therefore, the hot air blows on the silicon wafer to dry the silicon wafer. The hot air on the tray is sucked away by the upper-layer fan after being used, and the cycle continues. After the hot air is utilized layer by layer, it finally discharges from the air outlet skylight, which can efficiently utilize the hot air. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following-described drawings are merely exemplary, and for those of ordinary skill in the art, other implementation drawings can be obtained by extending based on the provided drawings without creative efforts.

[0017] Figure 1 It is a three-dimensional structure diagram of the structure of the present utility model;

[0018] Figure 2 It is a three-dimensional structure diagram of the tray in the present utility model.

[0019] Legend Explanation:

[0020] 10. Drying oven; 11. Hot air drying chamber; 12. Support block; 13. Hot air blower; 14. Air outlet skylight; 15. Box door; 20. Tray; 21. Wafer groove; 22. Bottom plate; 23. Air duct; 24. Air outlet; 25. Edge protection shell; 26. Fan. Detailed implementation mode

[0021] Next, in combination with the accompanying drawings and specific implementation modes, the invention will be further described:

[0022] Embodiment

[0023] Please refer to Figures 1 to 2 The description of the embodiment includes a drying oven 10. There is a hot air drying chamber 11 arranged inside the drying oven 10. The hot air drying chamber 11 is used for drying the glue coating on the wafers. A number of support blocks 12 are arranged in an array inside the hot air drying chamber 11. The function of the support blocks 12 is to support the tray 20. The upper end of the support block 12 is slidably connected to the tray 20 in a pull-out manner. The tray 20 is used for placing wafers. The pull-out method facilitates the replacement of the tray 20. The distance between the support blocks 12 is greater than the height of the tray 20 to ensure that the tray 20 can be placed. A number of wafer grooves 21 are recessed in an array on the tray 20. The wafers are placed in the wafer grooves. There are several trays 20, which facilitates the replacement of the trays 20. A hot air blower 13 is arranged at the bottom end of the hot air drying chamber 11. The hot air blower 13 blows out hot air for drying. An air outlet skylight 14 communicating with the hot air drying chamber 11 is fixedly connected to the upper end of the hot air blower box. The hot air is discharged from the air outlet skylight 14 to form an upward airflow. The tray 20 includes a bottom plate 22. The bottom plate 22 is used for placing wafers. Edge protection shells 25 are fixedly connected to the periphery of the upper end of the bottom plate 22. The edge protection shells 25 enclose the bottom plate 22. A number of air outlets 24 are arranged in an array on the inner side of the edge protection shells 25. The air outlets 24 communicate with the air duct 23. The air duct 23 is opened in the bottom plate 22. The hot air flows from the air duct 23 to the air outlets 24 and finally blows towards the wafer grooves 21. A fan 26 is fixedly connected to the lower end of the tray 20. The output end of the fan 26 communicates with the air duct 23. The fan 26 sucks in the hot air at the lower end and discharges it from the air duct 23. A box door 15 is hinged on one side of the drying oven 10. When the box door 15 is closed, the hot air can be prevented from losing heat.

[0024] In this embodiment, open the box door 15, set the supporting block 12 to be pull-out on the supporting block 12. When placing the silicon wafer, put the silicon wafer into the silicon wafer groove 21, and then slide the tray 20 to the bottom of the supporting block 12 to complete the placement of the silicon wafer. Close the box door 15. When taking out, directly take out the tray 20. During the drying process, the silicon wafers to be dried can be placed on a new tray 20, and then directly replace the tray 20 for drying, which greatly saves time and effectively improves the drying efficiency. Also, by arranging the hot air blower 13 at the bottom, the hot air blows upward, the fan 26 sucks in the hot air and then blows it into the air duct 23. The hot air passes through the air duct 23 and blows out from the air outlet 24. The air outlet 24 is arranged inside the edge protection shell 25. Therefore, the hot air blows on the silicon wafers to dry them. The hot air on the tray 20 is sucked away by the upper layer of fan 26 after being used, and the cycle continues. After the hot air is utilized layer by layer, it finally discharges from the air outlet skylight 14, enabling efficient utilization of the hot air.

Claims

1. A wafer coating and drying device, comprising a drying box (10), characterized in that: A drying box (10) is provided with a hot air drying chamber (11) inside. A number of supporting blocks (12) are arranged in an array inside the hot air drying chamber (11). A tray (20) is slidably connected to the upper ends of the supporting blocks (12) in a pull-out manner. The spacing between the supporting blocks (12) is greater than the height of the tray (20). A number of silicon wafer grooves (21) are recessed in an array on the tray (20). A number of the trays (20) are provided. A hot air blower (13) is arranged at the bottom end of the hot air drying chamber (11). An air outlet skylight (14) communicated with the hot air drying chamber (11) is fixedly connected to the upper end of the drying box (10).

2. The wafer gluing and drying device according to claim 1, characterized in that: The tray (20) includes a bottom plate (22). A guard edge shell (25) is fixedly connected to the periphery of the upper end of the bottom plate (22). A number of air outlets (24) are arranged in an array inside the guard edge shell (25). The air outlets (24) are communicated with an air duct (23). The air duct (23) is opened in the bottom plate (22). A fan (26) is fixedly connected to the lower end of the tray (20). The output end of the fan (26) is communicated with the air duct (23).

3. A wafer gluing and drying device according to claim 1, characterized in that: A box door (15) is hinged to one side of the drying box (10).

Images