Solar cell containing copper metal electrode and solar cell module

Abstract

The utility model discloses a copper-containing metal electrode solar cell and a solar cell module, and belongs to the technical field of solar cells, the copper-containing metal electrode solar cell comprises a silicon wafer, a first semiconductor layer, a second semiconductor layer, a conductive film layer, a copper-containing metal fine gate electrode and protective ink; a second semiconductor opening region is formed between the adjacent first semiconductor layers; an isolation groove is formed in the conductive film layer corresponding to the edge area of the second semiconductor opening area; the conductive film layer corresponding to each first semiconductor layer and each second semiconductor layer is provided with a copper-containing metal fine gate electrode; and the protective ink covers the copper-containing metal fine gate electrode, and / or the protective ink covers the isolation groove. According to the utility model, the long-term reliability of the module is improved, the technical requirements on packaging materials are reduced, the product cost is effectively reduced, and the application scene of packaging the copper-containing metal electrode solar cell into the module is expanded.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cells, and particularly relates to a copper-containing metal electrode solar cell and a solar cell module. Background Art

[0002] The silver paste for photovoltaic use is mainly used for making the grid lines of photovoltaic cells and affects the photoelectric conversion efficiency. The quality and conductivity of the silver paste directly affect the performance and quality of the cell wafers. With the development of the photovoltaic industry, in 2023, the proportion of silver used in photovoltaic applications in the total global silver demand exceeded 16%, and silver for photovoltaic use has become the largest disturbance item in the global silver demand side. In 2024, the demand for electronic-grade silver powder in the photovoltaic industry is expected to approach 7,000 tons. Against the background of high silver prices, photovoltaic enterprises are accelerating the cost reduction of silver paste. Currently, the cost of silver paste accounts for more than 30% of the non-silicon material cost of photovoltaic cells.

[0003] To reduce the usage amount of silver, silver-coated copper pastes or even pure copper pastes have received extensive attention. Silver-coated copper pastes generally consist of conductive fillers and organic polymers. The conductive fillers are generally silver-coated copper powders or specially treated copper powders, which mainly play the role of conducting electrons and determine the conductivity of the grid lines. The organic polymers mainly consist of various composite resins, solvents, curing agents, and other additives. Resins such as epoxy resins and polyurethanes, after curing, serve as the molecular structure framework, connecting left and right and determining physical properties such as the bonding strength. Solvents and additives mainly regulate the viscosity and leveling property of the paste and determine the printability of the paste. The curing agent mainly cures the collective bonding phase. Each raw material component is made into a uniform paste through high-speed stirring and three-roll grinding.

[0004] However, copper elements are very sensitive to water vapor, acids, or alkalis. Water vapor will oxidize the copper in the silver-coated copper paste or copper paste to produce copper oxide, thereby reducing the conductivity of the grid lines. Copper ions are also prone to diffuse and penetrate on the cell wafers, forming deep-level recombination centers, thereby destroying the passivation effect and affecting the cell performance. Moreover, the solar cell module needs to be used outdoors for a long time (generally required for 30 years), so there is a great risk in the outdoor reliability of the copper-containing metal electrode.

[0005] Currently, in order to reduce the influence of acids, alkalis, and water vapor on the silver-coated copper paste or copper paste cells, both the front and back sides of the module are encapsulated with glass that has a low water vapor transmission rate and a relatively large weight, and it is impossible to use polymers with a relatively high water vapor transmission rate and a relatively light weight for encapsulation. Moreover, a layer of waterproof glue (such as butyl glue, silica gel, etc.) needs to be added around the glass. At the same time, the encapsulation film of the module needs to select a film made of materials as neutral as possible, thus increasing the encapsulation cost and difficulty of the module.

[0006] Furthermore, even if the above measures are taken for the silver-coated copper paste or copper paste cells in the prior art, their performance in the DH reliability test of solar cells is still not good enough, and the long-term reliability of the module is insufficient.

[0007] It should be noted that this part of the content of the present utility model only provides the background technology related to the present utility model, and does not necessarily constitute the prior art or the well-known technology. Summary of the Utility Model

[0008] The present utility model provides a copper-containing metal electrode solar cell and a solar cell module, which at least solve the problems that in the prior art, during the long-term use after the battery is made into a module, water vapor, acid and alkali react with copper, copper is oxidized and migrates and diffuses, and the long-term reliability of the module is insufficient.

[0009] To achieve the above object, in a first aspect, the present utility model provides a copper-containing metal electrode solar cell, including a silicon wafer, a first semiconductor layer, a second semiconductor layer, a conductive film layer, a copper-containing metal fine grid electrode and a protective ink; the silicon wafer has a back surface and a front surface; the first semiconductor layer and the second semiconductor layer are alternately arranged on the back surface of the silicon wafer, and a second semiconductor opening area is formed between adjacent first semiconductor layers; the conductive film layer is laid on the first semiconductor layer and the second semiconductor layer, and an isolation groove is formed in the conductive film layer corresponding to the edge area of the second semiconductor opening area; a copper-containing metal fine grid electrode is arranged on the conductive film layer corresponding to each of the first semiconductor layer and the second semiconductor layer; the protective ink covers the copper-containing metal fine grid electrode, and / or the protective ink covers the isolation groove.

[0010] Preferably, the thickness of the protective ink is 10 - 100 μm, and the width of the protective ink is not less than 60 μm; when the protective ink covers the copper-containing metal fine grid electrode, the thickness of the protective ink is more than 5 μm greater than the thickness of the copper-containing metal fine grid electrode, and the width of the protective ink is more than 10 μm greater than the width of the copper-containing metal fine grid electrode.

[0011] Preferably, the width of the isolation groove is 0.03 - 0.2 mm; when the protective ink covers the isolation groove, the width ratio of the protective ink to the isolation groove is (1 - 4):1.

[0012] Preferably, the copper-containing metal electrode solar cell further includes a first insulating ink and a second insulating ink; the first insulating ink is arranged on the conductive film layer corresponding to the first semiconductor layer and is spaced along the length direction of the first semiconductor layer, and covers the copper-containing metal fine grid electrode; the second insulating ink is arranged on the conductive film layer corresponding to the second semiconductor layer and is spaced along the length direction of the second semiconductor layer, and covers the copper-containing metal fine grid electrode; wherein, the first insulating ink and the second insulating ink are arranged in a staggered and alternating manner along the length direction of the first semiconductor layer and the second semiconductor layer.

[0013] Preferably, the copper-containing metal electrode solar cell further includes fine grid connection lines, and fine grid connection lines are respectively disposed on a plurality of first insulating inks spaced along the length direction of the first semiconductor layer and a plurality of second insulating inks spaced along the length direction of the second semiconductor layer, and the fine grid connection lines are perpendicular to the copper-containing metal fine grid electrodes.

[0014] Preferably, protective inks are disposed on regions with a width W1 on both sides of the fine grid connection lines.

[0015] Preferably, protective inks are not disposed on regions with a width W1 on both sides of the fine grid connection lines.

[0016] Preferably, the width W1 on both sides of the fine grid connection lines is 0.1 - 4 mm.

[0017] Preferably, the length of the copper-containing metal fine grid electrode without protective ink accounts for less than 10% of the entire length of the copper-containing metal fine grid electrode.

[0018] Preferably, the length of the isolation groove without protective ink accounts for less than 10% of the entire length of the isolation groove.

[0019] Preferably, the first semiconductor layer includes a tunneling oxide layer and a doped polycrystalline layer, and the second semiconductor layer includes an amorphous passivation layer and a doped amorphous layer.

[0020] Preferably, the copper-containing metal electrode solar cell further includes a front passivation layer and an antireflection layer, and the front passivation layer and the antireflection layer are sequentially disposed on the front side of the silicon wafer.

[0021] On the other hand, the present invention also provides a copper-containing metal electrode solar cell module, including a plurality of copper-containing metal electrode solar cells, and the plurality of copper-containing metal electrode solar cells are connected by solder ribbons to form a battery string; the copper-containing metal electrode solar cell module further includes a backplane, a back adhesive film, a front adhesive film, and a front plate; wherein, the backplane, the back adhesive film, the battery string, the front adhesive film, and the front plate are sequentially laminated and laminated to form a copper-containing metal electrode solar cell module.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. The present invention protects the copper-containing metal fine grid electrodes by covering them with protective inks, preventing water vapor, acids and alkalis from reacting with copper during long-term use after the battery is made into a module, thereby avoiding the migration and diffusion of copper ions, further improving the long-term reliability of the module, reducing the technical requirements for packaging materials, effectively reducing product costs, and expanding the application scenarios of copper-containing metal electrode solar cells packaged into modules.

[0024] 2. The present utility model also protects the isolation groove with a protective ink, preventing the insulation groove from being directly exposed, which can reduce the environmental impact on the battery cell, such as humidity, dust, chemical substances, etc., thereby extending its service life.

[0025] 3. The protective ink provided by the present utility model also has an anti-reflection effect, effectively improving the efficiency (double-sided rate) of the photovoltaic panel in receiving and converting light energy from the front and back, significantly reducing the reflection loss on the surface of the battery cell, and enabling more light energy to be absorbed and converted into electrical energy by the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a cross-sectional schematic diagram of a copper-containing metal electrode solar cell provided in Embodiment 1 of the present utility model;

[0028] Figure 2 It is a plan schematic diagram of a copper-containing metal electrode solar cell provided in Embodiment 1 of the present utility model;

[0029] Figure 3 It is a plan schematic diagram of forming a first insulating ink, a second insulating ink, and a fine grid connection line on a copper-containing metal electrode solar cell provided in Embodiment 1 of the present utility model;

[0030] Figure 4 It is a cross-sectional schematic diagram of forming a protective ink on a copper-containing metal electrode solar cell provided in Embodiment 1 of the present utility model;

[0031] Figure 5 It is a plan schematic diagram of forming a protective ink on a copper-containing metal electrode solar cell provided in Embodiment 1 of the present utility model;

[0032] Figure 6 It is a plan schematic diagram of connecting multiple copper-containing metal electrode solar cells with solder strips to form a battery string provided in Embodiment 1 of the present utility model;

[0033] Figure 7 It is a structural schematic diagram of a copper-containing metal electrode solar cell module provided in Embodiment 1 of the present utility model;

[0034] Figure 8 It is a cross-sectional schematic diagram of forming a protective ink on a copper-containing metal electrode solar cell provided in Embodiment 2 of the present utility model;

[0035] Figure 9 Cross-sectional schematic diagram of the protective ink formed on the copper-containing metal electrode solar cell provided in Embodiment 3 of the present utility model;

[0036] Figure 10 Planar schematic diagram of the protective ink formed on the copper-containing metal electrode solar cell provided in Embodiment 8 of the present utility model;

[0037] Figure 11 Planar schematic diagram of the first insulating ink, the second insulating ink and the protective ink formed on the copper-containing metal electrode solar cell provided in Embodiment 11 of the present utility model;

[0038] Figure 12 Structural schematic diagram of the copper-containing metal electrode solar cell module provided in Comparative Example 1 of the present utility model;

[0039] Figure 13 Planar microscope image of the copper-containing metal electrode solar cell provided in Comparative Example 1 of the present utility model;

[0040] Figure 14 Planar microscope image of the copper-containing metal electrode solar cell provided in Embodiment 2 of the present utility model;

[0041] Figure 15 EL test image of the copper-containing metal electrode solar cell module DH1000 before testing provided in Embodiment 2 of the present utility model;

[0042] Figure 16 EL test image of the copper-containing metal electrode solar cell module DH1000 after testing provided in Embodiment 2 of the present utility model;

[0043] Figure 17 EL test image of the copper-containing metal electrode solar cell module DH1000 before testing provided in Comparative Example 1 of the present utility model;

[0044] Figure 18 EL test image of the copper-containing metal electrode solar cell module DH1000 after testing provided in Comparative Example 1 of the present utility model;

[0045] Figure 19 Cross-sectional schematic diagram of the protective ink formed on the copper-containing metal electrode solar cell provided in Embodiment 14 of the present utility model.

[0046] Explanation of reference numerals:

[0047] 1. Silicon wafer; 2. Tunneling oxide layer; 3. Doped polycrystalline layer; 4. Amorphous passivation layer; 5. Doped amorphous layer; 6. Front passivation layer; 7. Anti-reflection layer; 8. Conductive film layer; 9. Copper-containing metal fine gate electrode; 10. Protective ink; 11. First insulating ink; 12. Second insulating ink; 13. Fine gate connection line;

[0048] 100. Solar cell containing copper metal electrode; 200. Solder strip; 300. Back plate; 400. Back adhesive film; 500. Front adhesive film; 600. Front plate; 700. Waterproof adhesive. DETAILED DESCRIPTION

[0049] In the present invention, unless otherwise stated, directional words such as "up, down, left, right" are generally understood in combination with the directions shown in the drawings and actual applications.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0051] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] The endpoints and any values of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of each range, the endpoint values of each range and the individual point values, and the individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article. Among them, the terms "optional" and "optional" all mean that they may be included or not included (or may be present or not).

[0053] In a first aspect, the present utility model provides a copper-containing metal electrode solar cell, comprising a silicon wafer, a first semiconductor layer, a second semiconductor layer, a conductive film layer, a copper-containing metal fine grid electrode, and a protective ink; the silicon wafer has a back surface and a front surface; the first semiconductor layer and the second semiconductor layer are alternately arranged on the back surface of the silicon wafer, and a second semiconductor opening region is formed between adjacent first semiconductor layers; the conductive film layer is laid on the first semiconductor layer and the second semiconductor layer, and an isolation groove is formed in the conductive film layer corresponding to the edge region of the second semiconductor opening region; a copper-containing metal fine grid electrode is arranged on the conductive film layer corresponding to each first semiconductor layer and the second semiconductor layer; the protective ink covers the copper-containing metal fine grid electrode, and / or the protective ink covers the isolation groove.

[0054] It can be understood that the protective ink of the present utility model can cover only the copper-containing metal fine grid electrode, or only the isolation groove, or cover both the copper-containing metal fine grid electrode and the isolation groove at the same time. On the premise of pursuing the protection effect, the protective ink preferably covers both the copper-containing metal fine grid electrode and the isolation groove at the same time.

[0055] It can be understood that although the present utility model takes a hybrid passivated back contact battery as an example, the technical solution of the present utility model has no limitation on the type of solar cells, and can be a double-sided grid line battery or a back contact battery. The double-sided grid line battery can be a HJT (heterojunction battery), Topcon (tunnel oxide passivated contact battery), Perc (passivated emitter and rear contact battery), etc. The back contact battery can be a TBC battery (tunnel oxide passivated back contact battery), HBC battery (heterojunction back contact battery), etc. The protective ink of the present utility model can be arranged on the fine grid and / or isolation groove on the back surface of the back contact battery, or can be arranged on the fine grid on the front and / or back surface of the double-sided grid line battery.

[0056] It can be understood that the conductive film layer is a transparent conductive film or a composite film layer composed of a transparent conductive film and a metal conductive film. The transparent conductive film is indium oxide doped with zinc, tin, tungsten, titanium or silicon, or can also be zinc oxide doped with aluminum, boron or gallium, etc. The metal conductive film is at least one of metal aluminum, metal copper, metal silver, nickel alloy, and titanium alloy.

[0057] It can be understood that the metal fine grid is formed by curing silver-coated copper paste or copper paste.

[0058] The refractive index of the protective ink is 1.4 - 2.2, preferably 1.55 - 2.0. By making the refractive index of the protective ink between the encapsulation material and the silicon-based semiconductor material, the present utility model can gradually transition the refractive index of light in the multi-layer structure, can significantly reduce the surface reflection loss of the battery cell, and more light energy is absorbed by the battery and converted into electrical energy, effectively improving the efficiency (double-sided rate) of the photovoltaic panel to receive and convert light energy from the front and back sides.

[0059] The average light transmittance of the protective ink at a wavelength of 300 - 1100 nm is ≥ 80%, and preferably, the average light transmittance at a wavelength of 300 - 1100 nm is ≥ 85%. Traditional silicon-based batteries mainly absorb the 300 - 1100 nm band (visible light and near-infrared). The high light transmittance of the protective ink of the present utility model ensures that light can penetrate the protective layer and enter the battery interior, avoiding a decrease in the photoelectric conversion efficiency caused by absorption or scattering of the protective layer.

[0060] Preferably, the thickness of the protective ink is 10 - 100 μm, and the width of the protective ink is not less than 60 μm. The present utility model reasonably controls the thickness and width of the protective ink, so that the total volume of the protective ink (the amount of ink per unit area) is limited within a reasonable range, which not only ensures that the protective ink has sufficient physical barrier ability to effectively block the penetration of water vapor, oxygen, and acid-base substances, but also avoids excessive ink increasing the material cost.

[0061] When the protective ink covers the copper-containing metal fine grid electrode, the thickness of the protective ink is more than 5 μm greater than the thickness of the copper-containing metal fine grid electrode, and the width of the protective ink is more than 10 μm greater than the width of the copper-containing metal fine grid electrode. This application ensures that the protective ink completely covers the electrode edge area, avoiding copper oxidation caused by water vapor intrusion from the edge. When the protective ink covers the copper-containing metal fine grid electrode, the cross-sectional shape of the protective ink can be semi-circular, semi-elliptical, trapezoidal, etc.

[0062] Preferably, the width of the isolation groove is 0.03 - 0.2 mm; when the protective ink covers the isolation groove, the width ratio of the protective ink to the isolation groove is (1 - 4):1. The present utility model controls the width of the isolation groove to ensure the electrical isolation effect between the first semiconductor layer and the second semiconductor layer. At the same time, when the protective ink covers the isolation groove, the width ratio of the protective ink to the isolation groove is controlled so that the protective ink fully fills the groove body, preventing the accumulation of residual pollutants or moisture in the groove.

[0063] It can be understood that the present utility model does not limit the width of the protective ink. In the extreme case of pursuing the protection effect, the part of the conductive film layer except for the position of the fine grid connection line can be covered with the protective ink.

[0064] Preferably, the protective ink can adopt the resin ink commonly used in the prior art, and the present utility model has no special limitation on it.

[0065] Preferably, the copper-containing metal electrode solar cell further includes a first insulating ink and a second insulating ink; the first insulating ink is disposed on the conductive film layer corresponding to the first semiconductor layer and is spaced along the length direction of the first semiconductor layer, and covers the copper-containing metal fine grid electrode; the second insulating ink is disposed on the conductive film layer corresponding to the second semiconductor layer and is spaced along the length direction of the second semiconductor layer, and covers the copper-containing metal fine grid electrode; wherein, the first insulating ink and the second insulating ink are alternately arranged in a staggered manner along the length directions of the first semiconductor layer and the second semiconductor layer.

[0066] It can be understood that both the first insulating ink and the second insulating ink are resin inks, preferably acrylic resin.

[0067] Preferably, the copper-containing metal electrode solar cell further includes fine grid connection lines, and fine grid connection lines are respectively disposed on a plurality of first insulating inks spaced along the length direction of the first semiconductor layer and a plurality of second insulating inks spaced along the length direction of the second semiconductor layer, and the fine grid connection lines are perpendicular to the copper-containing metal fine grid electrodes; the fine grid connection lines are formed by curing silver-coated copper paste or copper paste.

[0068] Preferably, a protective ink is disposed or not disposed in the region with a width W1 on both sides of the fine grid connection line.

[0069] Preferably, the width W1 on both sides of the fine grid connection line is 0.1 - 4 mm.

[0070] It can be understood that when no protective ink is disposed in the region with a width W1 on both sides of the fine grid connection line (i.e., the protective ink gives way to the fine grid connection line), it is more convenient to fabricate connection solder tapes between multiple copper-containing metal electrode solar cells in a module. When a protective ink is disposed in the region with a width W1 on both sides of the fine grid connection line (i.e., the protective ink does not give way to the fine grid connection line), although the protection effect is better, when connecting the solder tape, the solder tape and the fine grid connection line may have a poor contact situation.

[0071] Preferably, the length of the copper-containing metal fine grid electrode without the protective ink accounts for less than 10% of the entire length of the copper-containing metal fine grid electrode. The length of the isolation groove without the protective ink accounts for less than 10% of the entire length of the isolation groove. The above settings can ensure the protection effect of the protective ink.

[0072] Preferably, the first semiconductor layer includes a tunneling oxide layer and a doped polycrystalline layer, and the second semiconductor layer includes an amorphous passivation layer and a doped amorphous layer. The thicknesses of the tunneling oxide layer or amorphous passivation layer, doped polycrystalline layer, and doped amorphous layer of the present invention, as well as the corresponding doping concentrations, can respectively refer to the ranges of the prior art and can all be used in the present invention. Exemplarily, the thickness of the tunneling oxide layer is 1-2 nm, and the thickness of the amorphous passivation layer is 3-10 nm; the thickness of the doped amorphous layer is 7-15 nm, and the effective doping concentration is 5e18 cm -3 -1e20 cm -3 , the thickness of the doped polycrystalline layer is 30-250 nm, and the effective doping concentration is greater than 9e19 cm -3 .

[0073] Preferably, the copper-containing metal electrode solar cell further includes a front passivation layer and an antireflection layer, and the front passivation layer and the antireflection layer are sequentially disposed on the front side of the silicon wafer. The types and thicknesses of the front passivation layer, antireflection layer, and mask layer of the present invention can respectively refer to the prior art and can all be used in the present invention. Exemplarily, the front passivation layer is at least one of amorphous silicon, microcrystalline silicon, silicon oxide, and polycrystalline silicon, and the antireflection layer is a silicon dielectric layer, and the silicon dielectric layer is at least one of silicon nitride, silicon oxide, silicon oxynitride, and intrinsic amorphous silicon.

[0074] On the other hand, the present invention also provides a method for manufacturing a copper-containing metal electrode solar cell, and the manufacturing method includes the following steps:

[0075] S101. Form an alternately arranged first semiconductor layer and second semiconductor layer on the back side of the silicon wafer, and form a second semiconductor opening region between adjacent first semiconductor layers;

[0076] S102. Form a conductive film layer on the first semiconductor layer and the second semiconductor layer;

[0077] S103. Perform an etching opening on the conductive film layer corresponding to the edge region of the second semiconductor opening region to form an isolation groove;

[0078] S104. Form a copper-containing metal fine grid electrode on the conductive film layer corresponding to each first semiconductor layer and second semiconductor layer;

[0079] S105. Cover a protective ink on the copper-containing metal fine grid electrode, and / or cover a protective ink on the isolation groove.

[0080] Preferably, S101 further includes: forming a front passivation layer and an antireflection layer on the front side of the silicon wafer.

[0081] Preferably, between S104 and S105, it further includes:

[0082] S106. Dislocationally and alternately arrange a first insulating ink and a second insulating ink on the corresponding conductive film layer along the length directions of the first semiconductor layer and the second semiconductor layer; and respectively arrange fine grid connection lines on a plurality of first insulating inks arranged at intervals along the length direction of the first semiconductor layer and a plurality of second insulating inks arranged at intervals along the length direction of the second semiconductor layer.

[0083] It can be understood that the first insulating ink, the second insulating ink, the protective ink, and the fine grid connection lines can be formed by printing or spraying processes.

[0084] Preferably, S105 further includes dislocationally and alternately arranging a first insulating ink and a second insulating ink on the corresponding conductive film layer along the length directions of the first semiconductor layer and the second semiconductor layer; the first insulating ink, the second insulating ink, and the protective ink are formed synchronously; and then respectively arrange fine grid connection lines on a plurality of first insulating inks arranged at intervals along the length direction of the first semiconductor layer and a plurality of second insulating inks arranged at intervals along the length direction of the second semiconductor layer.

[0085] It can be understood that when the first insulating ink, the second insulating ink, and the protective ink are formed simultaneously, the production efficiency is higher.

[0086] On the other hand, the present utility model also provides a copper-containing metal electrode solar cell module, including a plurality of copper-containing metal electrode solar cells, and the plurality of copper-containing metal electrode solar cells are connected by solder tapes to form a battery string; the copper-containing metal electrode solar cell module further includes a backplane, a back adhesive film, a front adhesive film, and a front plate; wherein, the backplane, the back adhesive film, the battery string, the front adhesive film, and the front plate are laminated and laminated in sequence to form the copper-containing metal electrode solar cell module.

[0087] Preferably, the backplane and the front plate are each independently a glass or a polymer plate.

[0088] It can be understood that when the backplane is a polymer plate, it can be polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), polyethylene terephthalate (PET), etc.; when the front plate is a polymer plate, it can be ETFE (ethylene-tetrafluoroethylene copolymer), fluorocarbon resin, PVF (polyvinyl fluoride), and PVDF (polyvinylidene fluoride), etc.

[0089] On the other hand, the present utility model also provides a preparation method for a copper-containing metal electrode solar cell module, and the preparation method includes the following steps:

[0090] S201. Provide a plurality of copper-containing metal electrode solar cells;

[0091] S202. Connect the plurality of copper-containing metal electrode solar cells with solder tapes to form a battery string;

[0092] S203. Lay a back adhesive film, the battery string formed in S202, a front adhesive film, and a front plate on the backplane surface in sequence;

[0093] S204. Laminate the backplane, back adhesive film, battery string, front adhesive film, and front plate laid in S203 to form a copper metal electrode-containing solar cell module.

[0094] The following details the embodiments of the present invention. They are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0095] Embodiment 1

[0096] A preparation method of a copper metal electrode-containing solar cell, the preparation method includes the following steps:

[0097] S101. As shown in, a first semiconductor layer and a second semiconductor layer are alternately arranged on the back surface of the silicon wafer 1, a second semiconductor opening area is formed between adjacent first semiconductor layers, and a front passivation layer 6 and an antireflection layer 7 are formed on the front surface of the silicon wafer 1; Figure 1 As shown in, the first semiconductor layer includes a tunneling oxide layer 2 and a doped polycrystalline layer 3, and the second semiconductor layer includes an amorphous passivation layer 4 and a doped amorphous layer 5;

[0098] As shown in Figure 1 As shown in, a conductive film layer 8 is formed on the first semiconductor layer and the second semiconductor layer;

[0099] S102. As shown in Figure 1 As shown in, an etching opening is made on the conductive film layer 8 corresponding to the edge area of the second semiconductor opening area to form an isolation groove;

[0100] S103. As shown in Figure 1 As shown in, the width of the isolation groove is 60 μm;

[0101] The width of the isolation groove is 60 μm;

[0102] S104. As shown in Figure 1 and Figure 2 As shown in, a copper metal fine grid electrode 9 is formed on the conductive film layer 8 corresponding to each first semiconductor layer and second semiconductor layer;

[0103] S106. As shown in Figure 3 As shown in, the first insulating ink 11 and the second insulating ink 12 are alternately arranged in a staggered manner on the conductive film layer 8 corresponding to the length directions of the first semiconductor layer and the second semiconductor layer; fine grid connection lines 13 are respectively arranged on a plurality of first insulating inks 11 spaced along the length direction of the first semiconductor layer and a plurality of second insulating inks 12 spaced along the length direction of the second semiconductor layer;

[0104] S105. As shown in Figure 4 andFigure 5 As shown, a protective ink 10 is coated on the copper-containing metal fine grid electrode 9 to obtain the copper-containing metal electrode solar cell 100;

[0105] The refractive index of the protective ink 10 is 1.55 - 2.0, and the average light transmittance at a wavelength of 300 - 1100 nm is 90%;

[0106] The thickness of the protective ink 10 is 50 μm, and the width is 200 μm;

[0107] The protective ink 10 is not provided in the area with a width W1 on both sides of the fine grid connection line 13 (i.e., the protective ink 10 gives way to the fine grid connection line 13), and the width W1 on both sides of the fine grid connection line 13 is 2 mm.

[0108] A preparation method for manufacturing the obtained copper-containing metal electrode solar cell into a copper-containing metal electrode solar cell module, the preparation method includes the following steps:

[0109] S201, as Figure 6 shown, provide a plurality of the above-mentioned copper-containing metal electrode solar cells 100;

[0110] S202, as Figure 6 shown, use a solder strip 200 to connect a plurality of copper-containing metal electrode solar cells 100 to form a battery string;

[0111] S203, as Figure 7 shown, sequentially lay a back adhesive film 400, the battery string formed in S202, a front adhesive film 500, and a front plate 600 on the surface of the back plate 300;

[0112] S204, as Figure 7 shown, laminate the back plate 300, the back adhesive film 400, the battery string, the front adhesive film 500, and the front plate 600 laid in S203 to form a copper-containing metal electrode solar cell module;

[0113] Both the front plate 600 and the back plate 300 are made of glass.

[0114] Example 2

[0115] Refer to the method of Example 1, the difference is that, as Figure 8 shown, in S105, a protective ink 10 is coated on the isolation groove, and the protective ink 10 is not coated on the copper-containing metal fine grid electrode 9.

[0116] Example 3

[0117] Refer to the method of Example 1, the difference is that, as Figure 9 shown, in S105, a protective ink 10 is coated on both the isolation groove and the copper-containing metal fine grid electrode 9 at the same time.

[0118] Example 4

[0119] It was carried out according to the method of Reference Example 1, except that the thickness of the protective ink 10 was 10 μm.

[0120] Example 5

[0121] It was carried out according to the method of Reference Example 1, except that the thickness of the protective ink 10 was 100 μm.

[0122] Example 6

[0123] It was carried out according to the method of Reference Example 1, except that the width of the protective ink 10 was 60 μm.

[0124] Example 7

[0125] It was carried out according to the method of Reference Example 1, except that the width of the protective ink 10 was 300 μm.

[0126] Example 8

[0127] It was carried out according to the method of Reference Example 1, except that, as Figure 10 shown, the protective ink 10 was provided in the regions with the width W1 on both sides of the fine grid connection line 13 (i.e., the protective ink 10 did not give way to the fine grid connection line 13).

[0128] Example 9

[0129] It was carried out according to the method of Reference Example 1, except that the width W1 on both sides of the fine grid connection line 13 was 0.1 mm.

[0130] Example 10

[0131] It was carried out according to the method of Reference Example 1, except that the width W1 on both sides of the fine grid connection line 13 was 4 mm.

[0132] Example 11

[0133] It was carried out according to the method of Reference Example 1, except that, as Figure 11 shown, S106 was not carried out, and the first insulating ink, the second insulating ink and the protective ink were formed synchronously in S105.

[0134] Example 12

[0135] It was carried out according to the method of Reference Example 1, except that the backplane 300 in S203 was a polymer plate.

[0136] Example 13

[0137] The method of Example 1 was followed, except that in S203, both the front plate 600 and the back plate 300 were polymer plates.

[0138] Example 14

[0139] The method of Example 2 was followed, except that, as Figure 19 shown, there was a second semiconductor opening region between adjacent first semiconductor layers. At both ends of the second semiconductor layer located in the second semiconductor opening region, they extended a preset distance towards the surfaces of the adjacent first semiconductor layers and overlapped with them to form overlapping regions. There was a first semiconductor opening region on the first semiconductor layer. A conductive film layer was laid on the first semiconductor layer and the second semiconductor layer, and isolation grooves were provided at the positions of each overlapping region of the conductive film layer.

[0140] Comparative Example 1

[0141] As Figure 12 shown, a method for preparing a copper-containing metal electrode solar cell module included the following steps:

[0142] S101. Provide a plurality of copper-containing metal electrode solar cells 100 (different from Example 1 in that no protective ink 10 was provided on the copper-containing metal electrode solar cells 100 in Comparative Example 1);

[0143] S102. Connect a plurality of copper-containing metal electrode solar cells 100 with a solder tape 200 to form a battery string;

[0144] S103. Sequentially lay a back adhesive film 400, the battery string formed in S102, a front adhesive film 500, and a front plate 600 on the surface of the back plate 300; there was also a waterproof adhesive 700 around between the back plate 300 and the front plate 600, and the waterproof adhesive 700 could be butyl rubber or silicone rubber;

[0145] S104. Laminate the stack laid in S103 to form a copper-containing metal electrode solar cell module;

[0146] Both the front plate 600 and the back plate 300 were made of glass.

[0147] Test Example

[0148] The batteries and battery modules obtained from the above examples and comparative examples were subjected to performance tests, and the results are shown in Table 1. The test method for DH1000 attenuation was to conduct a reliability test in an environment with a constant temperature of 85 °C and a relative humidity of 85% for a duration of 1000 hours, and compare the difference ratio between the actual power output and the theoretical power output of the battery module.

[0149] Table 1

[0150]

[0151] From the above results, it can be seen that, compared with the comparative example, adopting the embodiment scheme of the present utility model, covering the protection ink on the electrode and the isolation groove will not significantly affect the battery performance, but can greatly improve the attenuation of the battery module in the DH1000 reliability test.

[0152] Furthermore, according to Embodiments 1-14, it can be seen that adopting the preferred technical scheme of the present utility model is more conducive to improving the battery performance and reliability.

[0153] Furthermore, as Figure 13 and Figure 14 shown, under microscopic observation, in Embodiment 2, the isolation groove is covered with a protection ink with a width of 200 μm.

[0154] As Figure 15 and Figure 16 shown, there is no obvious change in the EL test image of the battery module in Embodiment 2 before and after the DH1000 reliability test, and the reliability is excellent.

[0155] As Figure 17 and Figure 18 shown, obvious penetration and blackening phenomena appear at the edge in the EL test image of the battery module in Comparative Example 1 after the DH1000 reliability test, and the reliability is insufficient.

[0156] The preferred embodiments of the present utility model have been described in detail above. However, the present utility model is not limited thereto. Within the scope of the technical concept of the present utility model, various simple modifications can be made to the technical scheme of the present utility model, including any other suitable combination of each technical feature. These simple modifications and combinations should also be regarded as the content disclosed by the present utility model and fall within the protection scope of the present utility model.

Claims

1. A copper-containing metal electrode solar cell, characterized in that, Comprising: A silicon wafer having a back surface and a front surface; A first semiconductor layer and a second semiconductor layer, which are alternately arranged on the back surface of the silicon wafer, and a second semiconductor opening region is formed between adjacent first semiconductor layers; A conductive film layer laid on the first semiconductor layer and the second semiconductor layer, and an isolation groove is formed in the conductive film layer corresponding to the edge region of the second semiconductor opening region; A copper-containing metal fine grid electrode, and a copper-containing metal fine grid electrode is provided on the conductive film layer corresponding to each of the first semiconductor layer and the second semiconductor layer; A protective ink, which covers the copper-containing metal fine grid electrode, and / or the protective ink covers the isolation groove.

2. The copper-containing metal electrode solar cell according to claim 1, characterized in that, The thickness of the protective ink is 10-100 μm, and the width of the protective ink is not less than 60 μm; When the protective ink covers the copper-containing metal fine grid electrode, the thickness of the protective ink is more than 5 μm greater than the thickness of the copper-containing metal fine grid electrode, and the width of the protective ink is more than 10 μm greater than the width of the copper-containing metal fine grid electrode.

3. The copper-containing metal electrode solar cell according to claim 2, wherein The width of the isolation groove is 0.03-0.2 mm; When the protective ink covers the isolation groove, the width ratio of the protective ink to the isolation groove is (1-4):

1.

4. The copper-containing metal electrode solar cell according to claim 1, wherein The copper-containing metal electrode solar cell further comprises: A first insulating ink, which is arranged on the conductive film layer corresponding to the first semiconductor layer at intervals along the length direction of the first semiconductor layer, and covers the copper-containing metal fine grid electrode; A second insulating ink, which is arranged on the conductive film layer corresponding to the second semiconductor layer at intervals along the length direction of the second semiconductor layer, and covers the copper-containing metal fine grid electrode; Wherein, the first insulating ink and the second insulating ink are arranged alternately in a staggered manner along the length directions of the first semiconductor layer and the second semiconductor layer.

5. The copper-containing metal electrode solar cell according to claim 4, wherein The copper-containing metal electrode solar cell further comprises: Fine grid connection lines, and the fine grid connection lines are respectively arranged on a plurality of first insulating inks arranged at intervals along the length direction of the first semiconductor layer and a plurality of second insulating inks arranged at intervals along the length direction of the second semiconductor layer, and the fine grid connection lines are perpendicular to the copper-containing metal fine grid electrodes.

6. The copper-containing metal electrode solar cell according to claim 5, wherein The protective ink is provided in the region with a width W1 on both sides of the fine grid connection line.

7. The copper-containing metal electrode solar cell according to claim 5, characterized in that, The protective ink is not provided in the region with a width W1 on both sides of the fine grid connection line.

8. The copper-containing metal electrode solar cell according to claim 6 or 7, wherein The width W1 on both sides of the fine grid connection line is 0.1-4 mm.

9. The copper-containing metal electrode solar cell according to claim 7, characterized in that, The length of the copper-containing metal fine grid electrode without the protective ink accounts for within 10% of the total length of the copper-containing metal fine grid electrode; And / or The length of the isolation groove without the protective ink accounts for within 10% of the total length of the isolation groove.

10. The copper-containing metal electrode solar cell according to claim 1, characterized in that, The first semiconductor layer includes a tunneling oxide layer and a doped polycrystalline layer, and the second semiconductor layer includes an amorphous passivation layer and a doped amorphous layer; And / or The copper-containing metal electrode solar cell further comprises: A front passivation layer and an antireflection layer, the front passivation layer and the antireflection layer are sequentially disposed on the front side of the silicon wafer.

11. A copper-containing metal electrode solar cell module, characterized in that, Comprising a plurality of copper-containing metal electrode solar cells according to any one of claims 1 to 10, and a plurality of the copper-containing metal electrode solar cells are connected by solder tapes to form a battery string; The copper-containing metal electrode solar cell module further includes a back plate, a back adhesive film, a front adhesive film, and a front plate; Wherein, the back plate, the back adhesive film, the battery string, the front adhesive film, and the front plate are sequentially laminated to form the copper-containing metal electrode solar cell module.

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