Wafer cutting feeding device

Abstract

The utility model discloses a wafer cutting feeding device, which belongs to the technical field of wafer cutting and mainly comprises a pushing assembly and a buffering structure, the pushing assembly comprises a support, a cam, a pushing frame and a pulley, the support is fixedly arranged between a sliding block and an air cylinder, the cam is rotatably connected with the support, the pushing frame is movably arranged at the bottom of the support, and the pulley is connected with the cam. The pulley is rotationally arranged above the pushing frame and is in sliding connection with the cam; the buffering structure is arranged below the pushing frame, the buffering structure comprises a buffering cushion and a limiting rod, the limiting rod is fixedly arranged on the upper wall face of the buffering cushion, the limiting rod is movably connected with the pushing frame, and the pushing frame is elastically connected with the buffering cushion. According to the utility model, the force for pushing the wafer is ensured while the suction force of the sucker is removed through the buffer structure, so that the wafer cannot be damaged, and the wafer cutting device can be matched with the pushing assembly to assist the cutting processing of the wafer; meanwhile, the rotating motor is externally arranged and is convenient to replace.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting, in particular to a wafer cutting feeding device. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon rod. After the silicon crystal rod is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.

[0003] The prior art CN215988690U discloses a wafer cutting feeding device, including a driving motor. One side of the driving motor is provided with a guide rail. The outer surface of the guide rail is sleeved with a slider. The bottom end of the slider is provided with a cylinder. The bottom end of the cylinder is provided with a mounting post. The bottom end of the mounting post is provided with a suction cup. The top end of the suction cup is fixedly connected with a suction cup connecting sleeve. The bottom end of the mounting post extends into the inside of the suction cup connecting sleeve. The suction cup connecting sleeve is snap-fitted and sleeved on the outer surface of the mounting post; through the designed push plate, moving sleeve, fixed housing, fixed motor, lead screw, and threaded sleeve, it is convenient for the wafer adsorbed on the suction cup to be separated.

[0004] When the existing device is in use, the fixed motor arranged inside the fixed housing drives the threaded connection of the lead screw and the threaded sleeve, so that the push plate pushes the wafer to fall off. However, in this way, when in use, the fixed motor is inside the fixed housing. Once the fixed motor is damaged, it is not easy to replace, which causes the lead screw unable to rotate. This not only easily leads to the situation that the push plate cannot help push the wafer to fall off, but also hinders the suction cup from sucking the wafer; in addition, since the push plate of the existing technology does not consider the buffering driving force during use, when the push plate needs to touch the wafer, the suction force of the suction cup and the thrust of the push plate act on the wafer at the same time, which easily causes damage to the wafer and further affects the cutting and processing of the wafer.

[0005] In view of this, the present utility model is specifically proposed. Content of the Utility Model

[0006] The purpose of the present utility model is to solve at least one of the technical problems existing in the above-mentioned prior art, and provides a wafer cutting feeding device.

[0007] The purpose of the present utility model is achieved through the following technical solutions:

[0008] Provide a wafer cutting feeding device, including:

[0009] A driving guide rail, the driving guide rail includes a driving motor and a guide rail, and the guide rail is connected to the output end of the driving motor;

[0010] A slider, the slider is slidably arranged inside the driving guide rail;

[0011] A cylinder, which is fixedly arranged on the bottom wall surface of the slider;

[0012] A suction cup, an installation column is fixedly arranged above the suction cup, and the installation column is fixedly arranged on the bottom wall surface of the cylinder;

[0013] A pushing component, the pushing component includes a bracket, a cam, a pushing frame and a pulley. The bracket is fixedly arranged between the slider and the cylinder. The cam is rotatably connected to the bracket. The pushing frame is movably arranged at the bottom of the bracket. The pulley is rotatably arranged above the pushing frame, and the pulley is slidably connected to the cam;

[0014] A buffer structure, the buffer structure is arranged below the pushing frame. The buffer structure includes a buffer pad and a limiting rod. The limiting rod is fixedly arranged on the upper wall surface of the buffer pad. The limiting rod is movably connected to the pushing frame, and the pushing frame is elastically connected to the buffer pad.

[0015] As a preferred embodiment of the present invention, the bracket is composed of a square plate and four columns located at the four corners of the bottom of the square plate. A plurality of sliding columns are fixedly arranged at the four corners of the top of the pushing frame. A sliding hole is opened in the column, and the sliding column slides in the sliding hole.

[0016] As a preferred embodiment of the present invention, one side of the bracket is fixedly connected with a support column. There are a plurality of support columns. One side of the pushing frame is fixedly connected to one of the support columns. A tension spring is arranged between the two support columns, and the bracket is elastically connected to the pushing frame through the tension spring.

[0017] As a preferred embodiment of the present invention, a through hole is opened in the square plate of the bracket. Two cams are rotatably installed on the bracket. The two cams are fixedly connected by a rotating shaft and the two cams penetrate through the square plate up and down. One side of the bracket is fixedly installed with a rotating motor through a triangular bracket. The rotating motor is located on the adjacent side where the bracket is connected to the support column. The output end of the rotating motor is connected to one end of the rotating shaft.

[0018] As a preferred embodiment of the present invention, two fixed seats are fixedly connected above the pushing frame. The pulley is rotatably connected in the fixed seat, and the pulley is located directly below the cam.

[0019] As a preferred embodiment of the present invention, the buffer pad is clamped at the bottom of the pushing frame. Buffer grooves are opened on both sides of the bottom of the pushing frame. The buffer pad is movably arranged in the corresponding buffer groove. A buffer spring is arranged between the pushing frame and the buffer pad. The buffer spring is nested on the limiting rod, and the pushing frame is elastically connected to the buffer pad through the buffer spring.

[0020] As a preferred embodiment of the present utility model, the limiting rod is composed of a short column and a limiting piece. Perforations are provided in the buffer grooves. The short column movably penetrates the pushing frame through the perforations. The limiting piece is located directly above the perforation, and the pushing frame limits the short column through the limiting piece.

[0021] It should be further noted that the technical features corresponding to the above options can be combined or replaced with each other without conflict to form a new technical solution.

[0022] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] (1) The pushing component of the present utility model uses the shape of the cam to push the pulley, controls the pushing direction through the sliding holes and sliding columns between the bracket and the pushing frame, and then uses the tension spring to pull between the pushing frame and the bracket. At the same time, the two cams controlled by the rotating shaft can not only push the pushing frame simultaneously but also quickly retract the pushing frame. This not only facilitates the separation of the wafer from the suction cup but also does not prevent the suction cup from sucking again. At the same time, a buffer structure is arranged below the pushing component. By setting the buffer pad, buffer spring and limiting rod, the buffer pad and the pushing frame are limited by the limiting rod to ensure that the buffer pad does not slip during buffering. Then, the buffer is carried out by using the material of the buffer pad and the elastic force of the buffer spring. While removing the suction force of the suction cup, it also ensures the force for pushing the wafer, not only will not cause damage to the wafer, but also cooperate with the pushing component to assist in the cutting and processing of the wafer.

[0024] (2) In one example, a rotating motor is fixedly installed on one side of the bracket of the present utility model through a triangular bracket. The rotating motor is located on the adjacent side where the bracket is connected to the support column. By externally setting the rotating motor, the rotating motor can be replaced at any time, which is convenient for replacement when the rotating motor fails and ensures the normal operation of the pushing component. Description of the Drawings

[0025] Figure 1 It is an overall schematic diagram of a wafer cutting feeding device shown in an embodiment of the present utility model;

[0026] Figure 2 It is a front view schematic diagram of the wafer cutting feeding device shown in an embodiment of the present utility model;

[0027] Figure 3 It is a schematic diagram of the pushing component shown in an embodiment of the present utility model;

[0028] Figure 4 It is a bottom view schematic diagram of the bracket shown in an embodiment of the present utility model;

[0029] Figure 5 It is a schematic diagram of the buffer structure shown in an embodiment of the present utility model.

[0030] In the figure: 10, driving guide rail; 11, slider; 12, cylinder; 13, suction cup; 14, bracket; 15, rotating motor; 16, cam; 17, pushing frame; 18, tension spring; 19, fixed seat; 20, pulley; 21, support pillar; 22, sliding column; 23, sliding hole; 24, buffer pad; 25, limiting rod; 26, buffer spring. Detailed implementation manners

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0034] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] In an exemplary embodiment, a wafer cutting feeding device is provided, as Figure 1 , Figure 2 , Figure 3 and Figure 5As shown in the figure, it includes a driving guide rail 10, the driving guide rail 10 includes a driving motor and a guide rail, and the guide rail is connected to the output end of the driving motor; a slider 11, the slider 11 is slidably arranged in the driving guide rail 10; a cylinder 12, the cylinder 12 is fixedly arranged on the bottom wall surface of the slider 11; a suction cup 13, an installation column is fixedly arranged above the suction cup 13, and the installation column is fixedly arranged on the bottom wall surface of the cylinder 12; a pushing assembly, the pushing assembly includes a bracket 14, a cam 16, a pushing frame 17 and a pulley 20, the bracket 14 is fixedly arranged between the slider 11 and the cylinder 12, the cam 16 is rotatably connected to the bracket 14, the pushing frame 17 is movably arranged at the bottom of the bracket 14, the pulley 20 is rotatably arranged above the pushing frame 17, and the pulley 20 is slidably connected to the cam 16; a buffer structure, the buffer structure is arranged below the pushing frame 17, and the buffer structure includes a buffer pad 24 and a limiting rod 25, the limiting rod 25 is fixedly arranged on the upper wall surface of the buffer pad 24, the limiting rod 25 is movably connected to the pushing frame 17, and the pushing frame 17 is elastically connected to the buffer pad 24.

[0036] Specifically, a bracket 14 is fixedly installed on the bottom wall surface of the slider 11, and the bottom surface of the bracket 14 is fixedly installed with a cylinder 12 through bolts and a fixing frame. It should be particularly noted here that the operating mode between the driving motor, the guide rail and the slider 11 in the driving guide rail 10 and the connection mode between the cylinder 12 and the suction cup 13 have been disclosed in detail in an existing wafer cutting feeding device (CN215988690U), and will not be elaborated here; by setting the pushing assembly in this device, the pulley 20 is pushed by the shape of the cam 16, and the pushing direction is controlled by the connection mode between the bracket 14 and the pushing frame 17. The rotation of the cam 16 can not only push out the pushing frame 17 but also quickly retract the pushing frame 17, which not only facilitates the separation of the wafer from the suction cup 13 but also does not prevent the suction cup 13 from sucking again; by setting the buffer pad 24 and the limiting rod 25 in the buffer structure, the buffer pad 24 and the pushing frame 17 are limited by the limiting rod 25 to ensure that the buffer pad 24 does not slip during buffering, and then the suction force of the suction cup 13 is removed by the material of the buffer pad 24, and at the same time, the force for pushing the wafer is ensured, which will not only cause damage to the wafer but also cooperate with the pushing assembly to assist in the cutting and processing of the wafer.

[0037] Furthermore, as shown in Figure 2 、 Figure 3 and Figure 4 the figure, the bracket 14 is composed of a square plate and four columns located at the four corners of the bottom of the square plate. Multiple sliding columns 22 are fixedly arranged at the four corners of the top of the pushing frame 17, sliding holes 23 are opened in the columns, and the sliding columns 22 slide in the sliding holes 23; as shown in Figure 2 、 Figure 3 and Figure 5As shown, one side of the bracket 14 is fixedly connected with a support column 21. There are multiple support columns 21. One side of the push frame 17 is fixedly connected with one of the support columns 21. A tension spring 18 is arranged between two support columns 21. The bracket 14 is elastically connected to the push frame 17 through the tension spring 18; As Figure 3 and Figure 4 shown, through holes are formed in the square plate of the bracket 14. Two cams 16 are rotatably installed on the bracket 14. The two cams 16 are fixedly connected by a rotating shaft and the two cams 16 penetrate through the square plate up and down. One side of the bracket 14 is fixedly installed with a rotating motor 15 through a triangular bracket. The rotating motor 15 is located on the adjacent side where the bracket 14 is connected to the support column 21. The output end of the rotating motor 15 is connected to one end of the rotating shaft; As Figure 2 and Figure 3 shown, two fixed seats 19 are fixedly connected above the push frame 17. Pulleys 20 are rotatably connected in the fixed seats 19. The pulleys 20 are located directly below the cams 16.

[0038] Specifically, the shape of the square plate of the bracket 14 is approximately similar to the shape of the Chinese character 'Ri'. When using this component, the rotating motor 15 drives the rotation of the rotating shaft, and the two cams 16 on the curved surface of the rotating shaft rotate together with the rotating shaft. At this time, after the top of the cam 16 touches the pulley 20, the pulley 20 rotates in the fixed seat 19. The pulley 20 uses the force of rotation to buffer the force of the collision between the cam 16 and itself. At this time, due to the shape of the cam 16, the push frame 17 is pushed under the combined action of the pulley 20 and the cam 16. At this time, the four sliding columns 22 above the push frame 17 will move down in the corresponding sliding holes 23. During the downward movement, the tension spring 18 will be pulled. When the push frame 17 pushes out the wafer, the tension spring 18 will drive the rebound of the push frame 17, so that the four sliding columns 22 move up along their respective corresponding sliding holes 23. At this time, the push frame 17 completes the recycling.

[0039] As Figure 2 and Figure 5 shown, a buffer pad 24 is clamped at the bottom of the push frame 17. Buffer grooves are formed on both sides of the bottom of the push frame 17. The buffer pad 24 is movably arranged in the corresponding buffer grooves. A buffer spring 26 is arranged between the push frame 17 and the buffer pad 24. The buffer spring 26 is nested on the limit rod 25. The push frame 17 is elastically connected to the buffer pad 24 through the buffer spring 26; As Figure 2 and Figure 5 shown, the limit rod 25 is composed of a short column and a limit piece. Perforations are formed in the buffer grooves. The short column penetrates through the push frame 17 through the perforations. The limit piece is located directly above the perforation. The push frame 17 limits the short column through the limit piece.

[0040] Specifically, the material of the buffer pad 24 is a flexible material made of rubber. When the pushing frame 17 is pushed out, the buffer pad 24 will first come into contact with the surface of the wafer. At this time, the suction force between the suction cup 13 and the wafer will force the buffer pad 24 to retract in the buffer groove. At this time, the limit rod 25 will move upward in the through hole. At this time, the buffer spring 26 will be jointly squeezed between the buffer pad 24 and the bottom buffer groove of the pushing frame 17. In this process, since the material of the buffer pad 24 is a rubber material that is easy to rebound, with the joint cooperation of the buffer pad 24 and the buffer spring 26, the elastic force will cancel out the suction force of the suction cup 13. At the same time, the rubber buffer pad 24 forms a protection measure when contacting the surface of the wafer, so as to achieve the effect of protecting the wafer.

[0041] The above specific implementation manners are detailed descriptions of the present invention. It cannot be determined that the specific implementation manners of the present invention are only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions and substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. A wafer cutting feeding device, characterized in that, Comprising: A driving guide rail (10), the driving guide rail (10) includes a driving motor and a guide rail, and the guide rail is connected to the output end of the driving motor; A slider (11), the slider (11) is slidably arranged in the driving guide rail (10); A cylinder (12), the cylinder (12) is fixedly arranged on the bottom wall surface of the slider (11); A suction cup (13), an installation column is fixedly arranged above the suction cup (13), and the installation column is fixedly arranged on the bottom wall surface of the cylinder (12); A pushing component, the pushing component includes a bracket (14), a cam (16), a pushing frame (17) and a pulley (20), the bracket (14) is fixedly arranged between the slider (11) and the cylinder (12), the cam (16) is rotatably connected to the bracket (14), the pushing frame (17) is movably arranged at the bottom of the bracket (14), the pulley (20) is rotatably arranged above the pushing frame (17), and the pulley (20) is slidably connected to the cam (16); A buffer structure, the buffer structure is arranged below the pushing frame (17), the buffer structure includes a buffer pad (24) and a limiting rod (25), the limiting rod (25) is fixedly arranged on the upper wall surface of the buffer pad (24), the limiting rod (25) is movably connected to the pushing frame (17), and the pushing frame (17) is elastically connected to the buffer pad (24).

2. The wafer cutting and feeding device according to claim 1, wherein, The bracket (14) is composed of a square plate and four columns located at the four corners of the bottom of the square plate. Multiple sliding columns (22) are fixedly arranged at the four corners of the top of the pushing frame (17). A sliding hole (23) is opened in the column, and the sliding column (22) slides in the sliding hole (23).

3. The wafer cutting and feeding device according to claim 1, characterized in that, One side of the bracket (14) is fixedly connected with a support column (21), there are multiple support columns (21), one side of the pushing frame (17) is fixedly connected to one of the support columns (21), and a tension spring (18) is arranged between the two support columns (21). The bracket (14) is elastically connected to the pushing frame (17) through the tension spring (18).

4. A wafer cutting feeding device according to claim 2, characterized in that, A through hole is opened in the square plate of the bracket (14). Two cams (16) are rotatably installed on the bracket (14). The two cams (16) are fixedly connected by a rotating shaft and the two cams (16) penetrate through the square plate up and down. A rotating motor (15) is fixedly installed on one side of the bracket (14) through a triangular bracket. The rotating motor (15) is located on the adjacent side where the bracket (14) is connected to the support column (21), and the output end of the rotating motor (15) is connected to one end of the rotating shaft.

5. A wafer cutting feeding device according to claim 1, wherein, Two fixed seats (19) are fixedly connected above the pushing frame (17). The pulley (20) is rotatably connected in the fixed seat (19), and the pulley (20) is located directly below the cam (16).

6. The wafer cutting feeding device according to claim 1, characterized in that, The bottom of the pushing frame (17) is clamped with a buffer pad (24). Buffer grooves are formed on both sides of the bottom of the pushing frame (17). The buffer pad (24) is movably arranged in the corresponding buffer groove. A buffer spring (26) is arranged between the pushing frame (17) and the buffer pad (24). The buffer spring (26) is nested on a limiting rod (25). The pushing frame (17) is elastically connected to the buffer pad (24) through the buffer spring (26).

7. A wafer cutting feeding device according to claim 6, characterized in that, The limiting rod (25) is composed of a short column and a limiting piece. Through holes are formed in the buffer grooves. The short column movably penetrates through the pushing frame (17) through the through holes. The limiting piece is located directly above the through hole. The pushing frame (17) limits the short column through the limiting piece.

8. A wafer cutting feeding device according to claim 2, wherein The square plate is in the shape of a Chinese character 'Ri'.

9. The wafer cutting feeding device according to claim 1, characterized in that The bottom surface of the bracket (14) is fixedly installed with a cylinder (12) through bolts and a fixing frame.

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