Variable-distance transfer structure for chip production
Through the design of a variable distance load transfer structure, the automatic chip transfer is achieved using vacuum pickups and suction nozzles, solving the problems of traditional manual finishing efficiency and chip damage, and achieving efficient and safe chip finishing.
Patent Information
- Application Number
- CN202422462109.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-10-12
AI Technical Summary
In traditional chip production, manual disassembly TRAY disks are inefficient and labor-intensive, and are prone to damage the chip.
It adopts a variable distance load transfer structure, including a lateral translation module, a control box, a motor, a distance variable and a vacuum pickup. The chip is moved through vacuum adsorption and loosening operations, adapting to chips of different sizes.
It improves chip handling efficiency, avoids chip damage, and achieves an efficient and safe chip finishing process.
Smart Images
Figure CN223087098U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip tray arrangement, and particularly relates to a variable pitch transfer structure for chip production. Background Technique
[0002] A chip tray, i.e., a TRAY tray, refers to an electronic device for storing and transmitting data. A TRAY tray is a semiconductor storage device, usually used for storing small-scale data, such as images, audio, videos, etc. The characteristics of a TRAY tray are small size, light weight, low power consumption, high-speed transmission, and high-density storage. Common TRAY trays include USB TRAY trays, CF TRAY trays, SD TRAY trays, etc. After chip production, it is necessary to use automated equipment to place multiple chips in the chip trays. However, due to production batch limitations, there will be vacant positions in some TRAY trays, i.e., residual TRAY trays (generally distributed in the third layer or the bottom layer of the TRAY tray stack). At this time, it is necessary to combine and arrange the chips in the residual TRAY trays into full TRAY trays and stack the residual TRAY trays on the top layer.
[0003] The traditional arrangement method mainly relies on manual arrangement. By manually picking the chips in the residual TRAY tray and integrating them onto one TRAY to form a full TRAY tray, this arrangement method has low efficiency and high labor intensity on the one hand, and on the other hand, manually moving and arranging the chips is likely to damage the chips. Content of the Utility Model
[0004] In order to solve the technical problems that the traditional arrangement method mainly relies on manual arrangement, by manually picking the chips in the residual TRAY tray and integrating them onto one TRAY to form a full TRAY tray, this arrangement method has low efficiency and high labor intensity on the one hand, and on the other hand, manually moving and arranging the chips is likely to damage the chips, the utility model provides the following technical solutions:
[0005] The utility model relates to a variable pitch transfer structure for chip production, including a horizontal translation module and a control box. A motor is fixedly installed on the control box. The control box is arranged on a second horizontal movement module. A motor is fixedly installed on the control box. A variator is fixedly installed on the control box, and a plurality of vacuum pickers are fixedly installed on the moving end of the variator. A suction nozzle is installed at the suction end of the vacuum picker. A vacuum generator for controlling the vacuum picker is fixedly installed on the control box.
[0006] As a preferred technical solution of the utility model, an installation frame for installing the horizontal translation module is fixedly installed at the bottom of the horizontal translation module.
[0007] As a preferred technical solution of the present utility model, a guiding slide rail is horizontally installed on the horizontal translation module, and a slider is fixedly installed on the back of the control box, and the control box is slidably installed on the guiding slide rail through the slider.
[0008] As a preferred technical solution of the present utility model, a transmission box for driving the pitch change of the vacuum pick-up is installed between the output end of the motor and the pitch changer, and the transmission box is composed of a synchronous pulley and a transmission belt.
[0009] As a preferred technical solution of the present utility model, a plurality of in-place sensors for detecting whether the vacuum pick-up is in place are fixedly installed on the vacuum pick-up.
[0010] As a preferred technical solution of the present utility model, a controller is integrally installed in the control box, the controller is electrically connected to the vacuum generator, and the vacuum generator is communicated with the vacuum pick-up.
[0011] The beneficial effects achieved by the present utility model are as follows:
[0012] The control box is horizontally translated by the horizontal translation module to stack and move the chips. During the moving process, the vacuum generator sucks air, and the vacuum pick-up and the suction nozzle are used to adsorb and release the chips, so as to realize the chip transfer. Compared with manual chip transfer, on the one hand, the efficiency is higher, and on the other hand, the vacuum adsorption method will not damage the chips.
[0013] The pitch of the vacuum pick-up is controlled by the pitch changer to facilitate the transfer of chips of different sizes. Description of the Drawings
[0014] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:
[0015] Figure 1 is a schematic diagram of a perspective view of a variable-pitch transfer structure for chip production according to the present utility model;
[0016] Figure 2 is a schematic diagram of another perspective view of a variable-pitch transfer structure for chip production according to the present utility model.
[0017] In the figure: 1. Horizontal translation module; 101. Mounting frame; 2. Control box; 201. Pitch changer; 202. Vacuum generator; 203. Motor; 204. Transmission box; 205. Vacuum pick-up; 206. Suction nozzle; 207. In-place sensor. Detailed Embodiments
[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0019] Embodiment: As Figure 1-2 shown, a variable pitch transfer structure for chip production includes a horizontal translation module 1 and a control box 2, and is characterized in that: a motor 203 is fixedly installed on the control box 2, the control box 2 is arranged on the second horizontal movement module, a motor 203 is fixedly installed on the control box 2, a variator 201 is fixedly installed on the control box 2, and a plurality of vacuum pickers 205 are fixedly installed on the moving end of the variator 201. A suction nozzle 206 is installed at the suction end of the vacuum picker 205. A vacuum generator 202 for controlling the vacuum picker 205 is fixedly installed on the control box 2. During use, the control box 2 is driven by the horizontal translation module 1 to horizontally move for chip stacking and transfer. During the transfer process, the vacuum generator 202 sucks air, and the vacuum picker 205 and the suction nozzle 206 are used to adsorb and release the chips, so as to realize chip transfer. During the transfer process, the variator 201 controls the spacing of the vacuum pickers 205 to facilitate the transfer of chips of different sizes.
[0020] An installation frame 101 for installing the horizontal translation module 1 is fixedly installed at the bottom of the horizontal translation module 1. During use, the horizontal translation module 1 is fixedly installed through the installation frame 101.
[0021] A guiding slide rail is horizontally installed on the horizontal translation module 1. A slider is fixedly installed on the back of the control box 2, and the control box 2 is slidably installed on the guiding slide rail through the slider. During use, the guiding slide rail guides and limits the movement of the control box 2 to make the movement of the control box 2 more stable.
[0022] A transmission box 204 for driving the variable pitch of the vacuum picker 205 is installed between the output end of the motor 203 and the variator 201. The transmission box 204 is composed of a synchronous pulley and a transmission belt. During use, the transmission box 204 designed with a reduction gear makes the variable pitch of the variator 201 more accurate and can bear a greater load.
[0023] A plurality of in-place sensors 207 for detecting whether the vacuum picker 205 is in place are fixedly installed on the vacuum picker 205. During use, the in-place sensors 207 are used to detect whether the vacuum picker 205 is in place after variable pitch.
[0024] The control box 2 is integrally installed with a controller, which is electrically connected to the vacuum generator 202. The vacuum generator 202 is communicated with the vacuum picker 205. During use, the controller controls the vacuum generator 202 to inhale to form a vacuum, and the chip is adsorbed and released through the vacuum picker 205 and the suction nozzle 206.
[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.
[0026] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "set", "connected", "fixed", "swiveling connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements or the interaction relationship between two elements. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0027] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A variable pitch transfer structure for chip production, comprising a horizontal translation module (1) and a control box (2), characterized in that: A motor (203) is fixedly installed on the control box (2). The control box (2) is arranged on the second transverse movement module. A motor (203) is fixedly installed on the control box (2). A speed variator (201) is fixedly installed on the control box (2), and a plurality of vacuum pickers (205) are fixedly installed on the moving end of the speed variator (201). A suction nozzle (206) is installed at the suction end of the vacuum picker (205). A vacuum generator (202) for controlling the vacuum picker (205) is fixedly installed on the control box (2).
2. The variable pitch transfer structure for chip production according to claim 1, wherein: An installation frame (101) for installing the transverse translation module (1) is fixedly installed at the bottom of the transverse translation module (1).
3. The variable pitch transfer structure for chip production according to claim 1, characterized in that: A guiding slide rail is horizontally installed on the transverse translation module (1). A slider is fixedly installed on the back of the control box (2), and the control box (2) is slidably installed on the guiding slide rail through the slider.
4. A variable pitch transfer structure for chip production according to claim 1, characterized in that: A transmission box (204) for driving the variable distance of the vacuum picker (205) is installed between the output end of the motor (203) and the speed variator (201). The transmission box (204) is composed of a synchronous pulley and a transmission belt.
5. The variable pitch transfer structure for chip production according to claim 4, characterized in that: A plurality of in-place sensors (207) for detecting whether the vacuum picker (205) is in place are fixedly installed on the vacuum picker (205).
6. The variable pitch transfer structure for chip production according to claim 5, characterized in that: A controller is integrally installed in the control box (2). The controller is electrically connected to the vacuum generator (202), and the vacuum generator (202) is communicated with the vacuum picker (205).