Traceless conveying device

Abstract

The utility model belongs to the field of silicon wafer conveying, and particularly provides a traceless conveying device which comprises a conveying frame, a driving assembly and at least one conveying assembly. The conveying assembly is rotationally arranged on the conveying frame. The driving assembly is suitable for driving the conveying assembly to convey the silicon wafers; the conveying assembly comprises at least two conveying belts; a plurality of traceless conveying stations are arranged on each conveying belt; each traceless conveying station comprises two traceless bearing tables; the two traceless bearing tables are arranged in a spaced mode and fixedly arranged on the conveying belt. By arranging the traceless bearing table on the conveying belt, the silicon wafer is prevented from being in direct contact with the conveying belt, so that the silicon wafer is prevented from being scratched by the conveying belt, and traceless conveying is achieved.

Description

Technical Field

[0001] The utility model relates to the field of wafer transportation, and particularly relates to a traceless transportation device. Background Art

[0002] Wafers are the basic materials in the semiconductor industry and the solar photovoltaic industry, and are mainly used for manufacturing electronic devices and solar cells.

[0003] Wafers are generally transported by a conveyor belt. The conveyor belt drives the wafers through friction, and belt transmission imprints are likely to appear at the lower end of the wafers, resulting in wafer scratches and contamination.

[0004] At the same time, after long-term operation, the conveyor belt will be worn and damaged. If a relatively large material block gets stuck at the transfer point, the feed chute or the failed idler of the conveyor belt, local excessive wear of the conveyor belt will occur during operation, which may scratch the wafers.

[0005] In the related art, it is necessary to regularly stop the machine to check and maintain the conveyor belt to ensure its good condition and avoid wafer scratches caused by conveyor belt damage. However, on the one hand, the shutdown for maintenance will reduce the production efficiency of the entire production line. On the other hand, it is impossible to avoid the friction between the wafers and the conveyor belt at the source, and wafer scratches will still occur during transportation.

[0006] How to avoid wafer scratches by the conveyor belt during transportation is an urgent problem to be solved at present. Content of the Utility Model

[0007] The purpose of the utility model is to provide a traceless transportation device.

[0008] To solve the above technical problems, the utility model provides a traceless transportation device, including:

[0009] A transportation rack, a driving component, and at least one transportation component;

[0010] The transportation component is rotatably arranged on the transportation rack;

[0011] The driving component is suitable for driving the transportation component to transport wafers;

[0012] The transportation component includes at least two conveyor belts;

[0013] A plurality of traceless transportation stations are arranged on each conveyor belt;

[0014] Each traceless transportation station includes two traceless supporting platforms;

[0015] The two traceless supporting platforms are arranged at intervals and are fixedly arranged on the conveyor belt.

[0016] Further, the traceless support table is provided with an inclined support surface;

[0017] The two support surfaces of the two traceless support tables in each traceless conveying station are arranged oppositely, and are respectively abutted against the two side walls opposite to the silicon wafer, so as to complete the primary positioning of the silicon wafer.

[0018] Further, a guide block is fixedly arranged on the top surface of the traceless support table.

[0019] Further, the adjacent sides of two adjacent traceless conveying stations share the same traceless support table.

[0020] Further, the traceless conveying station further includes at least one support table;

[0021] The support table is fixedly arranged on the conveyor belt and is arranged between the two traceless support tables in the traceless conveying station.

[0022] Further, at least one lifting and positioning component is arranged at the discharging section of the conveying rack;

[0023] The lifting and positioning component is fixedly arranged on the side wall of the conveying rack, and the lifting and positioning component is arranged below the conveyor belt;

[0024] The lifting and positioning component is adapted to lift and position the silicon wafer on the traceless conveying station after the traceless conveying station moves above the lifting and positioning component.

[0025] Further, the lifting and positioning component includes: a lifting cylinder, a lifting plate and at least one set of positioning blocks;

[0026] One set of the positioning blocks includes two positioning blocks;

[0027] The lifting cylinder is fixedly arranged at the side of the conveying rack;

[0028] The lifting plate is arranged below the conveying component and is fixedly connected with the lifting cylinder;

[0029] The lifting cylinder is adapted to drive the lifting plate to rise or fall;

[0030] The two positioning blocks in each set of the positioning blocks are respectively arranged on both sides of the conveying component, and are adapted to abut against the other two opposite side walls of the silicon wafer when the lifting plate rises, so as to complete the secondary positioning of the silicon wafer.

[0031] Further, the lifting and positioning component further includes a detection sensor;

[0032] The detection sensor is fixedly arranged on the lifting plate.

[0033] Further, the traceless conveying device further includes a buffer component;

[0034] The buffer component is arranged in the middle section of the conveying component, and above the conveyor belt, and is adapted to buffer the wafers conveyed on the conveying component.

[0035] Further, the traceless conveying device further includes a loading rack and a picking component;

[0036] The loading rack is fixedly arranged at the feeding port of the conveying rack;

[0037] The picking component is arranged at the side of the feeding end of the conveying rack, and is adapted to pick the wafers on the loading rack and place them on the conveying component for conveying.

[0038] The beneficial effect of the present utility model is that the present utility model provides a traceless conveying device, including: a conveying rack, a driving component and at least one conveying component; the conveying component is rotatably arranged on the conveying rack; the driving component is adapted to drive the conveying component to convey wafers; the conveying component includes at least two conveyor belts; a plurality of traceless conveying stations are arranged on each conveyor belt; each traceless conveying station includes two traceless supporting platforms; the two traceless supporting platforms are arranged at intervals and fixedly arranged on the conveyor belt. By arranging traceless supporting platforms on the conveyor belt, the wafers are prevented from directly contacting the conveyor belt, thereby preventing the conveyor belt from scratching the wafers and realizing traceless conveying. Description of the Drawings

[0039] The present utility model will be further described below with reference to the drawings and embodiments.

[0040] Figure 1 It is a schematic structural diagram of the traceless conveying device provided by the embodiment of the present utility model.

[0041] Figure 2 It is a partial schematic structural diagram of the traceless conveying device provided by the embodiment of the present utility model.

[0042] Figure 3 It is a partial schematic structural diagram of the feeding part of the traceless conveying device provided by the embodiment of the present utility model.

[0043] Figure 4 It is a schematic structural diagram of the positioning block provided by the embodiment of the present utility model.

[0044] In the figure: 100, conveyor frame; 200, drive assembly; 210, drive motor; 220, synchronous pulley; 300, conveyor assembly; 310, conveyor belt; 320, traceless support table; 321, support surface; 322, guide block; 330, support table; 400, lifting and positioning assembly; 410, lifting cylinder; 420, lifting plate; 430, positioning block; 431, guide surface; 440, detection sensor; 500, buffer assembly; 600, loading rack; 700, material taking assembly. Detailed implementation manners

[0045] Now, the present utility model will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present utility model in a schematic manner, so they only show the components related to the present utility model.

[0046] For the embodiment, please refer to Figures 1-4 , at least one embodiment provides a traceless conveying device, including: a conveyor frame 100, a drive assembly 200, and at least one conveyor assembly 300; the conveyor assembly 300 is rotatably arranged on the conveyor frame 100; the drive assembly 200 is adapted to drive the conveyor assembly 300 to convey silicon wafers; the conveyor assembly 300 includes at least two conveyor belts 310; a plurality of traceless conveying stations are arranged on each conveyor belt 310; each traceless conveying station includes two traceless support tables 320; the two traceless support tables 320 are arranged at intervals and fixedly arranged on the conveyor belt 310. By arranging the traceless support tables 320 on the conveyor belt 310, the direct contact between the silicon wafers and the conveyor belt 310 is avoided, thereby preventing the conveyor belt 310 from scratching the silicon wafers and realizing traceless conveying.

[0047] Please refer to Figure 2 , specifically, in some embodiments, the traceless support table 320 is provided with an inclined support surface 321; the two support surfaces 321 of the two traceless support tables 320 in each traceless conveying station are arranged oppositely and respectively abut against the two side walls of the silicon wafer opposite to each other to complete the primary positioning of the silicon wafer. By setting the support surface 321 to be inclined, when the silicon wafer falls into the traceless conveying station, it can slide down along the support surface 321, so as to ensure that the silicon wafer falls into the preset position of the traceless conveying station and complete the primary positioning.

[0048] Please continue to refer to Figure 2 , in at least one embodiment, in order to further ensure that the silicon wafer falls into the traceless conveying station, by fixedly arranging a guide block 322 on the top surface of the traceless support table 320, the falling position of the silicon wafer is guided, reducing the accuracy requirement for placing the silicon wafer.

[0049] Among them, the adjacent sides of two adjacent traceless conveying stations share the same traceless supporting table 320, that is, two adjacent traceless conveying stations include three traceless supporting tables 320.

[0050] Please continue to refer to Figure 2 , in order to avoid bending in the middle of the silicon wafer, in some embodiments, the traceless conveying station further includes at least one supporting table 330; the supporting table 330 is fixedly arranged on the conveyor belt 310 and is arranged between two traceless supporting tables 320 in the traceless conveying station. The middle part of the silicon wafer is supported by the supporting table 330 to avoid bending of the silicon wafer and reduce the damage probability of the silicon wafer.

[0051] Among them, the top surface of the supporting table 330 is a rubber layer, so as to buffer when the silicon wafer falls.

[0052] Please continue to refer to Figure 2 , in order to ensure the accuracy during subsequent material taking, in this embodiment, at least one lifting and positioning component 400 is arranged at the discharging section of the conveying frame 100; the lifting and positioning component 400 is fixedly arranged on the side wall of the conveying frame 100, and the lifting and positioning component 400 is arranged below the conveyor belt 310; the lifting and positioning component 400 is adapted to lift and position the silicon wafer on the traceless conveying station after the traceless conveying station moves above the lifting and positioning component 400.

[0053] Please refer to Figure 2 and Figure 4 , specifically, the lifting and positioning component 400 includes: a lifting cylinder 410, a lifting plate 420 and at least one set of positioning blocks 430; one set of the positioning blocks 430 includes two positioning blocks 430; the lifting cylinder 410 is fixedly arranged on the side of the conveying frame 100; the lifting plate 420 is arranged below the conveying component 300 and is fixedly connected with the lifting cylinder 410; the lifting cylinder 410 is adapted to drive the lifting plate 420 to rise or fall; the two positioning blocks 430 in each set of the positioning blocks 430 are respectively arranged on both sides of the conveying component 300 and are adapted to abut against the other two opposite side walls of the silicon wafer when the lifting plate 420 rises, so as to complete the secondary positioning of the silicon wafer.

[0054] Among them, the positioning block 430 is provided with a first guiding surface 431 to guide the offset silicon wafer.

[0055] It should be noted that in this embodiment, there are two conveying components 300; the two conveying components 300 are synchronously conveyed through the synchronous pulley 220. Among them, the driving motor 210 of the driving component 200 is a stepping motor, and the position of the traceless conveying station in the conveying component 300 is positioned by the stepping motor. Four traceless conveying stations in each conveying component 300 are taken as a group, and four lifting and positioning components 400 are arranged on each side of the discharging section of the conveying frame 100. When taking materials and flowing in the subsequent process, 8 wafers are grabbed and flowed each time.

[0056] In this embodiment, the lifting and positioning component 400 further includes a detection sensor 440; the detection sensor 440 is fixedly arranged on the lifting plate 420. In some embodiments, the detection sensor 440 can be, but is not limited to, an infrared sensor, an optical fiber sensor, an optocoupler sensor, etc.

[0057] Please refer to Figure 3 , in order to ensure that the traceless conveying device does not have an interruption when conveying wafers, in this embodiment, the traceless conveying device further includes a buffer component 500; the buffer component 500 is arranged in the middle section of the conveying component 300, and is arranged above the conveyor belt 310, and is suitable for buffering the wafers conveyed on the conveying component 300.

[0058] Please continue to refer to Figure 3 , in this embodiment, the traceless conveying device 300 further includes a loading rack 600 and a material taking component 700; the loading rack 600 is fixedly arranged at the feeding port of the conveying rack 100; the material taking component 700 is arranged at the side of the feeding end of the conveying rack 100, and is suitable for taking the wafers on the loading rack 600 and placing them on the conveying component 300 for conveying.

[0059] In summary, the present utility model provides a traceless conveying device, including: a conveying rack 100, a driving component 200 and at least one conveying component 300; the conveying component 300 is rotatably arranged on the conveying rack 100; the driving component 200 is suitable for driving the conveying component 300 to convey wafers; the conveying component 300 includes at least two conveyor belts 310; a plurality of traceless conveying stations are arranged on each conveyor belt 310; each traceless conveying station includes two traceless supporting platforms 320; the two traceless supporting platforms 320 are arranged at intervals and are fixedly arranged on the conveyor belt 310. By arranging the traceless supporting platforms 320 on the conveyor belt 310, the wafers are prevented from directly contacting the conveyor belt 310, thereby preventing the conveyor belt 310 from scratching the wafers and realizing traceless conveying.

[0060] In the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0061] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0062] Based on the above inspiration from the ideal embodiments of the present utility model, through the above description, relevant workers can completely make various changes and modifications without departing from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A traceless conveying device, characterized in that, Comprising: A conveying rack, a driving component, and at least one conveying component; The conveying component is rotatably arranged on the conveying rack; The driving component is adapted to drive the conveying component to convey the silicon wafers; The conveying component includes at least two conveyor belts; A plurality of traceless conveying stations are arranged on each conveyor belt; Each traceless conveying station includes two traceless supporting platforms; The two traceless supporting platforms are arranged at intervals and are fixedly arranged on the conveyor belt.

2. The traceless conveying device according to claim 1, wherein The traceless supporting platform is provided with an inclined supporting surface; The two supporting surfaces of the two traceless supporting platforms in each traceless conveying station are arranged oppositely and are respectively abutted against the two opposite side walls of the silicon wafer to complete the primary positioning of the silicon wafer.

3. The traceless conveying device according to claim 2, wherein A guiding block is fixedly arranged on the top surface of the traceless supporting platform.

4. The traceless conveying device according to claim 2, wherein The adjacent sides of adjacent two traceless conveying stations share the same traceless supporting platform.

5. The traceless conveying device according to claim 2, wherein The traceless conveying station further includes at least one supporting platform; The supporting platform is fixedly arranged on the conveyor belt and is arranged between the two traceless supporting platforms in the traceless conveying station.

6. The traceless conveying device according to claim 2, wherein At least one lifting and positioning component is arranged at the discharging section of the conveying rack; The lifting and positioning component is fixedly arranged on the side wall of the conveying rack, and the lifting and positioning component is arranged below the conveyor belt; The lifting and positioning component is adapted to lift and position the silicon wafer on the traceless conveying station after the traceless conveying station moves above the lifting and positioning component.

7. The traceless conveying device according to claim 6, wherein The lifting and positioning component includes: a lifting cylinder, a lifting plate, and at least one set of positioning blocks; One set of the positioning blocks includes two positioning blocks; The lifting cylinder is fixedly arranged at the side of the conveying rack; The lifting plate is arranged below the conveying component and is fixedly connected with the lifting cylinder; The lifting cylinder is adapted to drive the lifting plate to rise or fall; The two positioning blocks in each set of positioning blocks are respectively arranged on both sides of the conveying component and are adapted to abut against the other two opposite side walls of the silicon wafer when the lifting plate rises to complete the secondary positioning of the silicon wafer.

8. The traceless conveying device according to claim 7, wherein The lifting and positioning component further includes a detection sensor; The detection sensor is fixedly arranged on the lifting plate.

9. The traceless conveying device according to claim 1, wherein The traceless conveying device further includes a buffer component; The buffer component is arranged in the middle section of the conveying component and above the conveyor belt, and is adapted to buffer the silicon wafers conveyed on the conveying component.

10. The traceless conveying device according to claim 1, wherein The traceless conveying device further includes a loading rack and a picking component; The loading rack is fixedly arranged at the feeding port of the conveying rack; The material taking component is arranged on the side of the feeding end of the conveying rack, and is adapted to take the silicon wafers on the loading rack and place them on the conveying component for conveying.

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