Vapor chamber with better heat conduction

Abstract

The utility model discloses a vapor chamber with better heat conduction, which comprises an upper vapor chamber, a lower vapor chamber, an upper capillary structure and a lower capillary structure, the upper capillary structure is arranged at the bottom of the inner side of the upper vapor chamber, and the lower capillary structure is arranged at the top of the inner side of the lower vapor chamber. An upper temperature-uniforming plate connecting groove and a lower temperature-uniforming plate connecting groove are formed in the upper temperature-uniforming plate and the lower temperature-uniforming plate respectively, and the supporting column is arranged between the upper temperature-uniforming plate connecting groove and the lower temperature-uniforming plate connecting groove. And the upper capillary structure and the lower capillary structure are respectively provided with an upper capillary structure through hole and a lower capillary structure through hole through which the supporting column can pass. The inner side of the supporting column is provided with a supporting column through hole, the outer side face of the supporting column is provided with a supporting column connecting hole communicated with the supporting column through hole, the supporting column through hole is internally provided with a supporting column capillary structure, and a better heat conduction effect can be achieved by arranging the supporting column capillary structure.

Description

Technical Field

[0001] The utility model relates to the field of heat pipes, and particularly relates to a heat pipe with better heat conduction performance. Background Art

[0002] The existing heat pipes mainly consist of an upper heat dissipation plate, a lower heat dissipation plate, an upper capillary structure arranged inside the upper heat dissipation plate, and a lower capillary structure arranged inside the lower heat dissipation plate. There are also support columns arranged between some of the upper and lower capillary structures for support. In addition to being supported by ordinary hollow metal columns, the support columns can also be supported by sintered capillary structures and support columns with connecting through holes on the side. However, each of these solutions has its own drawbacks. Therefore, this embodiment proposes a heat pipe with better heat conduction performance that uses support columns with capillary structures and side openings inside. Summary of the Utility Model

[0003] The main purpose of the utility model is to provide a heat pipe with better heat conduction performance.

[0004] The utility model proposes a heat pipe with better heat conduction performance, which includes an upper heat dissipation plate, a lower heat dissipation plate, an upper capillary structure, and a lower capillary structure. The upper capillary structure is arranged at the bottom inside the upper heat dissipation plate, and the lower capillary structure is arranged at the top inside the lower heat dissipation plate;

[0005] It further includes support columns. An upper heat dissipation plate connection groove and a lower heat dissipation plate connection groove are respectively arranged on the upper heat dissipation plate and the lower heat dissipation plate. The support columns are arranged between the upper heat dissipation plate connection groove and the lower heat dissipation plate connection groove. Upper capillary structure through holes and lower capillary structure through holes that can allow the support columns to pass through are respectively arranged on the upper capillary structure and the lower capillary structure;

[0006] A support column through hole is arranged inside the support column, a support column connection hole communicated with the support column through hole is arranged on the outer side surface of the support column, and a support column capillary structure is arranged inside the support column through hole. By arranging the support column capillary structure, a better heat conduction effect can be achieved.

[0007] Preferably, the support column connection hole includes a first support column connection hole on the upper side and a second support column connection hole on the lower side. The first support column connection hole is located on the support column below the upper capillary structure, and the second support column connection hole is located on the support column above the upper capillary structure.

[0008] Preferably, the cross-section of the support column capillary structure is triangular.

[0009] Preferably, there are four support column connection holes and they are arranged at equal angles.

[0010] The beneficial effects of the heat pipe with better heat conduction of the present utility model are as follows:

[0011] 1. Compared with directly using a capillary structure as a support column, the support column structure with an outer copper tube and an inner capillary structure has better structural strength, more controllable length during cutting, and is easier to connect with the upper heat spreader and the lower heat spreader.

[0012] 2. Compared with the design with only holes, better heat conduction effect can be achieved by setting a capillary structure. Description of the Drawings

[0013] Figure 1 is a cross-sectional view of the heat pipe with better heat conduction of the present utility model;

[0014] Figure 2 is a cross-sectional view of the support column of the heat pipe with better heat conduction of the present utility model;

[0015] Reference numerals in the figure: 1. Upper heat spreader, 2. Lower heat spreader, 3. Upper capillary structure, 4. Lower capillary structure, 5. Support column, 51. First support column connection hole, 52. Second support column connection hole, 53. Support column through hole, 54. Support column capillary structure.

[0016] The realization, functional features and advantages of the object of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed Embodiment

[0017] It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0018] Referring to Figure 1 and Figure 2 , an embodiment of the heat pipe with better heat conduction of the present utility model is proposed:

[0019] A heat pipe with better heat conduction, including an upper heat spreader 1, a lower heat spreader 2, a support column 5, an upper capillary structure 3 and a lower capillary structure 4.

[0020] The upper capillary structure 3 is arranged at the inner bottom of the upper heat spreader 1, and the lower capillary structure 4 is arranged at the inner top of the lower heat spreader 2. The upper capillary structure 3 and the lower capillary structure 4 are fixedly connected, and upper capillary structure through holes and lower capillary structure through holes through which the support column 5 can pass are respectively arranged on the upper capillary structure 3 and the lower capillary structure 4. A support column through hole 53 is arranged inside the support column 5, and both ends of the support column 5 are respectively connected with the upper heat spreader 1 and the lower heat spreader 2.

[0021] On the outer side of the support column 5, there is a support column connection hole communicated with the support column through hole 52. The support column connection hole includes a first support column connection hole 51 on the upper side and a second support column connection hole 52 on the lower side. Among them, the first support column connection hole 51 is on the side of the support column 5 below the upper capillary structure 3, and the second support column connection hole 52 is on the side of the support column 5 above the upper capillary structure 3.

[0022] A support column capillary structure 54 is arranged in the support column through hole 53. The cross section of the support column capillary structure 54 is triangular. By setting the support column capillary structure 54, a better heat conduction effect can be achieved.

[0023] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made by using the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A vapor chamber with better heat conduction, comprising an upper vapor chamber, a lower vapor chamber, an upper capillary structure and a lower capillary structure. The upper capillary structure is arranged at the bottom inside the upper vapor chamber, and the lower capillary structure is arranged at the top inside the lower vapor chamber; It is characterized in that It further includes support columns. An upper vapor chamber connection groove and a lower vapor chamber connection groove are respectively arranged on the upper vapor chamber and the lower vapor chamber. The support columns are arranged between the upper vapor chamber connection groove and the lower vapor chamber connection groove. Upper capillary structure through holes and lower capillary structure through holes that can allow the support columns to pass through are respectively arranged on the upper capillary structure and the lower capillary structure; A support column through hole is arranged inside the support column, and a support column connection hole communicated with the support column through hole is arranged on the outer side surface of the support column. A support column capillary structure is arranged in the support column through hole. By arranging the support column capillary structure, a better heat conduction effect can be achieved.

2. The heat pipe with better heat conduction according to claim 1, characterized in that The support column connection hole includes a first support column connection hole on the upper side and a second support column connection hole on the lower side. The first support column connection hole is on the support column below the upper capillary structure, and the second support column connection hole is on the support column above the upper capillary structure.

3. The heat pipe with better heat conduction according to claim 1, wherein The cross section of the support column capillary structure is triangular.

4. The heat pipe with better heat conduction according to claim 3, characterized in that, There are four support column connection holes and they are arranged at equal angles.

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