Optical module

Abstract

The utility model discloses an optical module, which comprises a first shell, a second shell, a circuit board, an electronic element, a photoelectric element and a radiator, wherein the first shell and the second shell are connected and fixed together, and a cavity for accommodating the circuit board, the electronic element and the photoelectric element is formed between the first shell and the second shell; the heat radiator is fixed on the first shell, a first convex block is formed on the heat radiator, the first shell is provided with an opening, the first convex block penetrates through the opening to be accommodated in the cavity, and at least part of the electronic element and the photoelectric element are in heat conduction connection with the first convex block. According to the optical module provided by the invention, heat generated by the electronic element and the photoelectric element is directly transmitted to the heat dissipation structure through the first bump for heat dissipation, so that an interface between the heat dissipation device and the heating element is reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to an optical module. Background Art

[0002] With the continuous iteration and upgrading of optical communication technologies, the rate of optical communication products has been continuously improved, and high speed will bring problems of power consumption and heat dissipation. In addition to solving the heat dissipation problem through the core materials of the chip, the structural components can also solve the heat dissipation problem.

[0003] In common technologies, traditional optical modules rely on metal housings to conduct the heat of the internal chips to the system radiator for heat dissipation through the system radiator. Limited by the manufacturing process and usage scenarios, the housing is generally die-cast zinc alloy with poor thermal conductivity; it is difficult to prepare a complex housing using high thermal conductivity aluminum alloy; similarly, other high thermal conductivity materials are not only difficult to prepare, but also have too high a density, which will cause the weight of the entire product to exceed the standard. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an optical module to solve the technical problem of poor heat dissipation performance of the radiator of common optical modules.

[0005] To achieve the above purpose, the utility model provides an optical module, including a first housing, a second housing, a circuit board, electronic components, optoelectronic components, and a radiator;

[0006] Wherein, the first housing and the second housing are fixedly connected together, and a cavity for accommodating the circuit board, electronic components, and optoelectronic components is formed between the first housing and the second housing;

[0007] The radiator is fixed on the first housing, a first convex block is formed on the radiator, an opening is formed on the first housing, the first convex block passes through the opening and is accommodated in the cavity, and at least some of the electronic components and optoelectronic components are thermally connected to the first convex block.

[0008] Further, the radiator includes a bearing structure and a heat dissipation structure arranged on the bearing structure. The bearing structure has opposite first and second surfaces. The heat dissipation structure is arranged on the first surface, the first convex block is located on the second surface and protrudes from the second surface, and the second surface is attached and connected to the first housing.

[0009] Further, the bearing structure includes a convex ring screw hole; the first housing also has a fixing hole and a bolt. The fixing hole corresponds to the convex ring screw hole, and the bolt passes through the fixing hole and is connected to the convex ring screw hole to fixedly connect the bearing structure to the first housing.

[0010] Further, the outer edge of the convex-ring screw hole protrudes from the second surface, and the inner hole of the convex-ring screw hole is a blind hole.

[0011] Further, the first housing includes opposite third and fourth surfaces, the third surface is attached to the second surface, and the fourth surface faces the second housing;

[0012] The fixing hole on the first housing is a stepped hole, and the convex-ring screw hole is at least partially disposed in the fixing hole. The bolt is connected to the inner hole of the convex-ring screw hole to closely attach the third surface to the second surface.

[0013] Further, the first housing has a thickness direction along the direction connecting the third and fourth surfaces; a first groove adapted to the bearing structure is formed on the third surface of the first housing; in the thickness direction, the bottom of the first groove is lower than the second surface; an electromagnetic shielding medium or a sealing medium is provided between the first groove and the bearing structure to achieve a sealed connection between the radiator and the first housing through the electromagnetic shielding medium or the sealing medium.

[0014] Further, a second groove surrounding the opening is formed on the fourth surface; in the thickness direction, the bottom of the second groove is lower than the fourth surface;

[0015] An electromagnetic shielding medium or a sealing medium is provided between the second groove and the first protrusion to achieve a sealed connection between the radiator and the first housing through the electromagnetic shielding medium or the sealing medium.

[0016] Further, the first housing has a length direction consistent with the longitudinal direction of the first housing and a width direction perpendicular to the length direction;

[0017] The heat dissipation structure includes a plurality of heat dissipation fins and a cover plate. The heat dissipation fins are located on one side surface of the cover plate and extend on the cover plate along the length direction; in the width direction, the plurality of heat dissipation fins are arranged at intervals, and adjacent two heat dissipation fins and the cover plate form a heat dissipation channel.

[0018] Further, the first housing has a length direction consistent with the longitudinal direction of the first housing;

[0019] The first protrusion is disposed near the center position of the third surface;

[0020] In the length direction, the convex-ring screw holes are located on both sides of the first protrusion.

[0021] Further, there are a plurality of first protrusions, and the plurality of first protrusions are arranged at intervals along the length direction.

[0022] Further, at least one second bump protruding from the first bump is formed on the first bump, and at least some of the electronic components and optoelectronic components are thermally connected to the second bump.

[0023] Further, the optical module further includes a heat dissipation block for thermally connecting with at least some of the electronic components and optoelectronic components;

[0024] An abutting structure is further provided on the first bump, and the abutting structure is used for abutting against the heat dissipation block.

[0025] Further, the abutting structure is a groove with an inclined surface, the inclined surface abuts against the heat dissipation block, and an adhesive medium is filled between the inclined surface and the heat dissipation block.

[0026] Through one or more of the above embodiments in the present utility model, at least the following technical effects can be achieved: In the optical module provided in the present application, at least some of the electronic components and optoelectronic components are thermally connected through the first bump on the heat sink. The first bump passes through the opening and is received in the cavity, and the heat is directly transferred to the heat dissipation structure through the first bump, without the need to transfer the heat to the heat dissipation structure through the first housing, thereby reducing the interface between the heat sink and the heat generating components and improving the heat dissipation effect. Description of the Drawings

[0027] The following will make the technical solutions and other beneficial effects of the present application obvious by describing the specific embodiments of the present application in detail with reference to the drawings.

[0028] Figure 1 It is a schematic structural diagram of an optical module provided by an embodiment of the present application;

[0029] Figure 2 is Figure 1 an exploded view of;

[0030] Figure 3 It is one of the three-dimensional structural diagrams of a heat sink provided by an embodiment of the present application;

[0031] Figure 4 It is the second three-dimensional structural diagram of a heat sink provided by an embodiment of the present application;

[0032] Figure 5 It is a schematic structural diagram of a heat sink provided by an embodiment of the present application;

[0033] Figure 6 It is a schematic structural diagram of the first housing as viewed from the third surface provided by an embodiment of the present application;

[0034] Figure 7Schematic diagram of the first housing provided by the embodiment of the present application as viewed from the fourth surface and schematic diagram of the heat sink as viewed from the second surface.

[0035] The identification of the components in the attached drawings is as follows:

[0036] 10. First housing; 20. Second housing; 30. Heat sink; 40. Circuit board; 50. Optoelectronic element; 60. Electronic component; 101. Third surface; 102. Fourth surface; 103. Opening; 104. First groove; 105. Second groove; 106. Fixing hole; 107. Bolt; 300. Bearing structure; 301. First surface; 302. Second surface; 303. First bump; 304. Second bump; 305. Bump ring screw hole; 306. Abutting structure; 307. Heat dissipation structure; 3071. Heat dissipation fin; 3072. Cover plate. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0038] Next, a optical module provided by the present application will be described in conjunction with the accompanying drawings.

[0039] See Figures 1 to 7 As shown, the embodiment of the present application provides a optical module. The optical module includes a first housing 10, a second housing 20, a heat sink 30, and a circuit board 40, an optoelectronic element 50, and an electronic component 60 disposed in the cavity formed by the first housing 10 and the second housing 20.

[0040] Specifically, when the first housing 10 and the second housing 20 are fixedly connected together, a cavity will be formed inside, and this cavity can be used to place the circuit board 40, the optoelectronic element 50, the electronic component 60, etc.

[0041] The heat sink 30 is fixed on the first housing 10 from outside the cavity. A first bump 303 is formed on the heat sink 30, and an opening 103 is provided on the first housing 10. The first bump 303 passes through the opening 103 and is received in the cavity. At least some of the electronic component 60 and the optoelectronic element 50 are thermally connected to the first bump 303. In other embodiments, the heat sink 30 can also be fixed on the first housing 10 from inside the cavity.

[0042] The distance between the first housing 10 and the circuit board 40, the optoelectronic element 50, and the electronic element 60 is smaller than the distance between the second housing 20 and the circuit board 40, the optoelectronic element 50, and the electronic element 60, so as to facilitate the thermal connection between the optoelectronic element 50 or the electronic element 60 and the first housing 10. For the convenience of description, hereinafter, the optoelectronic element 50 or the electronic element 60 thermally connected to the first housing 10 is collectively referred to as the heating element. Since the first housing 10 and the heat sink 30 are fixed together, the first housing 10 is a more primary heat dissipation surface compared to the second housing 20. The heat generated by the heating element is conducted from the inside to the outside through the heat sink 30 fixed to the first housing 10 and thus dissipated.

[0043] For the convenience of description, it is defined that the first housing 10 has a length direction X consistent with the longitudinal direction of the first housing 10, a width direction Y perpendicular to the length direction, and a thickness direction Z along the connecting line direction of the third surface 101 and the fourth surface 102. The heat sink 30 includes a bearing structure 300 and a heat dissipation structure 307 provided on the bearing structure 300. The bearing structure 300 has opposite first surface 301 and second surface 302. The heat dissipation structure 307 is disposed on the first surface 301. The first bump 303 is located on the second surface 302 and protrudes from the second surface 302, and the second surface 302 is in fitting connection with the first housing 10. In this embodiment, the first bump 303 on the second surface 302 passes through the opening 103 to directly conduct the heat generated by the heating element to the heat dissipation structure 307 on the first surface 301. The heat generated by the heating element does not need to be transferred through the first housing 10, thereby reducing the interface between the heat sink 30 and the heating element and improving the heat dissipation effect. A heat-conducting paste or a heat pad can be provided between the heating element and the first bump 303 to absorb tolerances and enhance heat dissipation.

[0044] The first bump 303 can be a structure capable of covering the areas where all the heating elements are located. The positive projection of the first bump 303 in the thickness direction Z can be close to the center position of the third surface 101, so that at least some of the heating elements can be thermally connected to one first bump 303. Also, due to the limited internal space of the cavity, multiple first bumps 303 can be provided corresponding to the positions where the heating elements are distributed. For example, the electronic component 60 and the optoelectronic component 50 are thermally connected to the same first bump 303, or the electronic component 60 and the optoelectronic component 50 are each thermally connected to one first bump 303. In this embodiment, two first bumps 303 are provided on the second surface 302 according to the positions of the heating elements in the cavity. In other embodiments of the present application, when multiple first bumps 303 are provided, the multiple first bumps 303 are arranged at intervals along the length direction X. At the same time, the openings 103 corresponding to the first bumps 303 are also arranged at intervals along the length direction X. It should be noted that the projection of the first bump 303 in the thickness direction Z can coincide with the area where the heating elements are located, which can be partial coincidence or complete coincidence.

[0045] The heat dissipation structure 307 includes a plurality of heat dissipation fins 3071 and a cover plate 3072. The heat dissipation fins 3071 are located on one side surface of the cover plate 3072 and extend on the cover plate 3072 along the length direction X. And the plurality of heat dissipation fins 3071 are arranged at intervals in the width direction Y. A heat dissipation channel is jointly formed between two adjacent heat dissipation fins 3071 and the cover plate 3072. The optical module dissipates the heat conducted out by the first bump 303 through the heat dissipation structure 307. The heat dissipation structure 307 and the carrier structure 300 can be integrally formed, or can be separately manufactured and then assembled together. In this embodiment, the heat dissipation structure 307 is in the form of a combination of the heat dissipation fins 3071 and the cover plate 3072. In other embodiments, the heat dissipation structure 307 can also be only a longitudinally long heat dissipation fin 3071 or heat dissipation columns, heat dissipation plates, etc. formed on the carrier structure 300. It should be noted that the heat dissipation structure 307 can also be removed, and only the carrier structure 300 is used for heat dissipation.

[0046] In some embodiments of the present application, there is also a raised-ring screw hole 305 on the second surface 302. The outer edge of the raised-ring screw hole 305 protrudes from the second surface 302, but the inner hole of the raised-ring screw hole 305 does not penetrate to the first surface 301, that is, the inner hole of the raised-ring screw hole 305 is a blind hole. Such a setting can enable the part between the first surface 301 and the second surface 302 of the bearing structure 300 to form screw holes for fixing without being made particularly thick, and can achieve good fitting between the bearing structure 300 and the first housing 10, reducing or even eliminating the gap between the two. Correspondingly, a fixing hole 106 is provided on the first housing 10 and has a bolt 107. In the thickness direction Z, the central positions of the fixing hole 106 and the raised-ring screw hole 305 coincide. The fixing hole 106 is a stepped hole. The raised-ring screw hole 305 is at least partially disposed in the fixing hole 106.

[0047] Further, the bolt 107 passes through the fixing hole 106 and is threadedly connected to the inner hole of the raised-ring screw hole 305. The first housing 10 and the radiator 30 are fixedly connected through the bolt 107, the fixing hole 106, and the raised-ring screw hole 305. In addition, the raised-ring screw hole 305 can also be thermally connected to the heating element, further improving the heat dissipation effect. The raised-ring screw hole 305 can be directly attached to the heating element through a heat dissipation pad, thereby ensuring good heat dissipation. Multiple sets of the bolt 107, the fixing hole 106, and the raised-ring screw hole 305 can be provided, which can further improve the sealing performance and fixing effect while also improving the heat dissipation effect. In the length direction X, multiple raised-ring screw holes 305 are located on both sides of the first protrusion 303, and multiple fixing holes 106 are located on both sides of the opening 103.

[0048] In some embodiments of the present application, the first housing 10 includes opposite third surface 101 and fourth surface 102. The third surface 101 is attached to the second surface 302, and the fourth surface 102 faces the second housing 20 (in other embodiments, when the radiator 30 is fixed to the first housing 10 from the cavity, the fourth surface and the first surface are attached, and the positions of the raised-ring screw hole and the fixing hole are adjusted accordingly). A first groove 104 adapted to the edge of the bearing structure 300 is provided on the third surface 101, and the first groove 104 surrounds the opening 103 and the fixing hole 106. The first groove 104 is an annular groove. In the thickness direction, the bottom of the first groove 104 is slightly lower than the third surface 101, and the position of the orthographic projection of the edge of the bearing structure 300 corresponds to the bottom position of the first groove 104. The side wall of the first groove 104 is formed by the side wall of the first housing 10. An electromagnetic shielding medium or a sealing medium is provided between the first groove 104 and the bearing structure 300 to achieve the sealed connection between the radiator 30 and the first housing 10 through the electromagnetic shielding medium or the sealing medium.

[0049] On the fourth surface 102, there is a second groove 105 surrounding the opening 103. The second groove 105 is a stepped surface. In the thickness direction, the bottom of the second groove 105 is slightly lower than the fourth surface 102. The side wall of the second groove 105 is composed of the side wall of the first housing 10 and the side wall of the first bump 303. An electromagnetic shielding medium or a sealing medium is provided between the second groove 105 and the first bump 303 to achieve the sealed connection between the heat sink 30 and the first housing 10 through the electromagnetic shielding medium or the sealing medium.

[0050] In the optical module provided by the embodiment of the present application, the first groove 104 and the second groove 105 are used to accommodate an electromagnetic shielding medium or a sealing medium to achieve double sealing between the heat sink 30 and the first housing 10 through the electromagnetic shielding medium or the sealing medium, avoiding problems such as poor sealing caused by assembly errors. In addition, the electromagnetic shielding medium can not only achieve sealing but also provide electromagnetic shielding for the optical module.

[0051] Specifically, the size and position of the first groove 104 are adapted to the size and position of the carrier structure 300. By coating an electromagnetic shielding medium or a sealing medium in the first groove 104, the sealed connection between the third surface 101 and the second surface 302 is achieved. The second groove 105 is provided at the edge of the opening 103, and sealing is achieved by coating an electromagnetic shielding medium or a sealing medium in the second groove 105.

[0052] In some other embodiments of the present application, along the thickness direction Z, at least one second bump 304 is further formed on the first bump 303. At least some of the electronic components 60 and the optoelectronic components 50 are thermally connected to the second bump 304. The distance between the second bump 304 and the heat-generating component is smaller than the distance between the first bump 303 and the heat-generating component, further improving the heat dissipation effect.

[0053] In some embodiments of the present application, the material of the heat sink 30 is one of aluminum alloy or copper alloy. The material of the first housing 10 is one of zinc alloy, copper alloy, and aluminum alloy. The material of the heat sink 30 and the material of the first housing 10 can be the same or different, and the present application does not make any limitations in this regard.

[0054] In order to avoid the overweight problem of the optical module, the material of the first housing 10 can be zinc alloy with a relatively low thermal conductivity, and the material of the heat sink 30 can be magnesium aluminum alloy with a relatively high thermal conductivity, or others.

[0055] In some other embodiments of the present application, a heat dissipation block is further provided between the heat sink 30 and the heat generating element. Correspondingly, a contact structure 306 is further provided on the first bump 303 of the heat sink 30. The contact structure 306 is thermally connected to the heat dissipation block, so that the heat dissipation block is thermally connected to the heat generating element. The heat dissipation block is detachably arranged with respect to the heat sink 30, which increases the design flexibility.

[0056] The heat dissipation block can be made of a material with a higher thermal conductivity, and its size, quantity, and position are determined according to the size, quantity, and position of the optoelectronic components. Heat dissipation is achieved jointly by the heat dissipation block and the heat sink 30.

[0057] The contact structure 306 can be a groove or a protrusion. The contact structure 306 is a groove with an inclined surface, and the groove wall is composed of a plurality of inclined surfaces that form a certain angle with the second surface 302. When the contact structure 306 is connected to the heat dissipation block, an adhesive medium is filled between the inclined surface and the heat dissipation block, and the adhesive medium fixes the two together. The adhesive medium can be a structural adhesive or a sealant. The heat dissipation block is fixed through the contact structure 306 to avoid displacement and loosening of the heat dissipation block during application, and to improve the stability of the thermal connection between the heat dissipation block and the heat generating element.

[0058] In addition, the contact structure 306 can also be a trapezoidal or triangular protrusion with an inclined surface. The inclined surface faces the heat dissipation block and abuts against the heat dissipation block, and the heat dissipation block is fixedly abutted by filling an adhesive medium between the inclined surface and the heat dissipation block.

[0059] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0060] The above has introduced in detail an optical module provided by the embodiments of the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that, It includes a first housing, a second housing, a circuit board, electronic components, optoelectronic components and a heat sink; Wherein, the first housing and the second housing are fixedly connected together, and a cavity for accommodating the circuit board, electronic components and optoelectronic components is formed between the first housing and the second housing; The heat sink is fixed on the first housing, a first bump is formed on the heat sink, an opening is formed on the first housing, the first bump passes through the opening and is accommodated in the cavity, and at least part of the electronic components and optoelectronic components are thermally connected to the first bump.

2. The optical module according to claim 1, wherein The heat sink includes a carrier structure and a heat dissipation structure provided on the carrier structure. The carrier structure has opposite first and second surfaces. The heat dissipation structure is provided on the first surface. The first bump is located on the second surface and protrudes from the second surface, and the second surface is attached to and connected with the first housing.

3. The optical module according to claim 2, wherein, The carrier structure includes a convex ring screw hole; the first housing also has a fixing hole and a bolt. The fixing hole corresponds to the convex ring screw hole, and the bolt passes through the fixing hole and is connected with the convex ring screw hole so that the carrier structure is fixedly connected with the first housing.

4. The optical module according to claim 3, wherein The outer edge of the convex ring screw hole protrudes from the second surface, and the inner hole of the convex ring screw hole is a blind hole.

5. The optical module according to claim 4, wherein The first housing includes opposite third and fourth surfaces. The third surface is attached to the second surface, and the fourth surface faces the second housing; The fixing hole on the first housing is a stepped hole, at least part of the convex ring screw hole is arranged in the fixing hole, and the bolt is connected with the inner hole of the convex ring screw hole to make the third surface fit tightly with the second surface.

6. The optical module according to claim 5, characterized in that, The first housing has a thickness direction along the direction connecting the third surface and the fourth surface; a first groove adapted to the carrier structure is formed on the third surface of the first housing; in the thickness direction, the bottom of the first groove is lower than the second surface; an electromagnetic shielding medium or a sealing medium is provided between the first groove and the carrier structure to realize the sealed connection between the heat sink and the first housing through the electromagnetic shielding medium or the sealing medium.

7. The optical module according to claim 5 or 6, characterized in that, A second groove surrounding the opening is formed on the fourth surface; in the thickness direction, the bottom of the second groove is lower than the fourth surface; An electromagnetic shielding medium or a sealing medium is provided between the second groove and the first bump to realize the sealed connection between the heat sink and the first housing through the electromagnetic shielding medium or the sealing medium.

8. The optical module according to claim 2, wherein The first housing has a length direction consistent with the longitudinal direction of the first housing and a width direction perpendicular to the length direction; The heat dissipation structure includes a plurality of heat dissipation fins and a cover plate. The heat dissipation fins are located on one side surface of the cover plate and extend on the cover plate along the length direction; in the width direction, the plurality of heat dissipation fins are arranged at intervals, and adjacent two heat dissipation fins and the cover plate form a heat dissipation channel.

9. The optical module according to claim 5, wherein The first housing has a length direction consistent with the longitudinal direction of the first housing; The first bump is arranged near the center position of the third surface; In the length direction, the convex ring screw holes are located on both sides of the first convex block.

10. The optical module according to claim 9, characterized in that, There are multiple first convex blocks, and the multiple first convex blocks are arranged at intervals along the length direction.

11. The optical module according to claim 1, characterized in that, At least one second convex block protruding from the first convex block is further formed on the first convex block, and at least some of the electronic components and optoelectronic components are thermally connected to the second convex block.

12. The optical module according to claim 1, characterized in that, The optical module further includes a heat dissipation block, and the heat dissipation block is used for thermally connecting with at least some of the electronic components and optoelectronic components; A butt-joint structure is further provided on the first convex block, and the butt-joint structure is used for butting against the heat dissipation block.

13. The optical module according to claim 12, wherein The butt-joint structure is a groove with an inclined surface, the inclined surface abuts against the heat dissipation block, and an adhesive medium is filled between the inclined surface and the heat dissipation block.

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