Optical module

Abstract

According to the optical module provided by the invention, the digital signal processing chip is connected with the driving chip, so that the digital signal processing chip regenerates and shapes an electric signal sent by an upper computer, signal attenuation between a switching chip of the upper computer and a port of the upper computer is compensated, and optical eye diagrams output by optical modules of different ports are consistent. And the digital signal processing chip is not connected with the transimpedance amplification chip, so that the loss of the optical module can be effectively reduced. The circuit board is provided with a second bonding pad and a third bonding pad, and the bonding pad of the transimpedance amplification chip is connected with the second bonding pad or the third bonding pad. And the first signal line for realizing the connection between the second bonding pad and the golden finger is not connected with the digital signal processing chip. And a second signal line for realizing the connection between the third bonding pad and the golden finger is connected with the digital signal processing chip. According to the invention, the digital signal processing chip is connected with the driving chip and is not connected with the transimpedance amplification chip, thereby reducing the power consumption of the optical module, and guaranteeing the consistency of optical eye diagrams outputted by the optical modules of different ports.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber communication technologies, and particularly to an optical module. Background Art

[0002] High-speed optical modules with a transmission rate of 50 Gbps or higher have relatively high requirements for signals. Therefore, high-speed optical modules are equipped with a DSP. The DSP has a large power consumption, resulting in a large power consumption of the optical module, which poses a huge challenge to the increasing traffic capacity and computer room power consumption. To reduce the power consumption of the optical module, the DSP is no longer provided inside the optical module.

[0003] Since the host computer has multiple ports and the insertion loss between each port and the switching chip is different, and there is no DSP inside the optical module, it is impossible to regenerate and shape the electrical signals transmitted from the host computer, resulting in a large difference in the optical eye diagrams output by the optical modules of different ports. Summary of the Utility Model

[0004] The present disclosure provides an optical module, which enables the optical eye diagrams output by the optical modules of different ports to be Figure 1 consistent.

[0005] In some embodiments, an optical module is provided, including:

[0006] A circuit board having a gold finger formed at one end;

[0007] A digital signal processing chip disposed on the surface of the circuit board and connected to the gold finger;

[0008] A driver chip connected to the digital signal processing chip;

[0009] A transimpedance amplifier chip having a first pad;

[0010] Wherein, on the surface of the circuit board, there are formed:

[0011] A second pad connected to the gold finger through a first signal line; the first signal line is not connected to the digital signal processing chip;

[0012] A third pad connected to the gold finger through a second signal line; the second signal line is connected to the digital signal processing chip;

[0013] The first pad is wire-bonded to the second pad or the third pad; when the first pad is wire-bonded to the second pad, the transimpedance amplifier chip is not connected to the digital signal processing chip but directly connected to the gold finger; when the first pad is wire-bonded to the third pad, the transimpedance amplifier chip is connected to the digital signal processing chip.

[0014] The above technical solution has the following beneficial effects: The digital signal processing chip is connected to the drive chip to facilitate the digital signal processing chip to regenerate and shape the electrical signal sent by the host computer, so as to compensate for the signal attenuation between the switching chip of the host computer and the port of the host computer, so that the optical eyes output by the optical modules of different ports Figure 1 are consistent. The digital signal processing chip is not connected to the transimpedance amplifier chip, which can effectively reduce the loss of the optical module. The pad of the transimpedance amplifier chip is wire-bonded to the second pad, so that the transimpedance amplifier chip is not connected to the digital signal processing chip, making the optical module an LRO type optical module. The pad of the transimpedance amplifier chip is wire-bonded to the third pad, so that the transimpedance amplifier chip is connected to the digital signal processing chip, making the optical module a DSP type optical module. By selecting the pad connected to the pad of the transimpedance amplifier chip, the requirements of the DSP type optical module and the LRO type optical module can be met.

[0015] Some embodiments provide an optical module, including:

[0016] The transimpedance amplifier chip is not connected to the digital signal processing chip, and the optical module is inserted into a port of the host computer that is relatively close to the switching chip in the host computer;

[0017] The transimpedance amplifier chip is connected to the digital signal processing chip, and the optical module is inserted into a port of the host computer that is relatively far from the switching chip.

[0018] The above technical solution has the following beneficial effects: Different types of optical modules are inserted into ports of the host computer at different distances from the switching chip, which can reduce the power consumption of the host computer.

[0019] Some embodiments provide an optical module, including:

[0020] The distance between the second pad and the first pad is less than the distance between the third pad and the first pad.

[0021] The above technical solution has the following beneficial effects: The first wire-bonding length between the first pad and the second pad is less than the second wire-bonding length between the first pad and the third pad, so as to improve the signal integrity of the LRO type optical module.

[0022] Some embodiments provide an optical module, including:

[0023] The second pad and the third pad are flush with the first pad respectively.

[0024] The above technical solution has the following beneficial effects: The wire-bonding length between the first pad and the second pad or the third pad can be reduced, and the signal integrity of the optical module can be improved.

[0025] Some embodiments provide an optical module, including:

[0026] The first signal line is located inside the circuit board. One end of the first signal line is connected to the gold finger through a via, and the other end of the first signal line is connected to the second pad through a via.

[0027] The above technical solution has the following beneficial effects: Both ends of the first signal line are respectively connected to the gold finger and the second pad through vias, so that the first signal line is not connected to the digital signal processing chip.

[0028] In some embodiments, an optical module is provided, including:

[0029] The second signal line is located on the surface of the circuit board. The second signal line includes a first sub-signal line and a second sub-signal line. One end of the first sub-signal line is connected to the gold finger, the other end of the first sub-signal line and one end of the second sub-signal line are both connected to the digital signal processing chip, and the other end of the second sub-signal line is connected to the third pad.

[0030] The above technical solution has the following beneficial effects: The second signal line is connected to the digital signal processing chip.

[0031] In some embodiments, an optical module is provided, including:

[0032] A light source for emitting light that does not carry data;

[0033] An optical chip is optically connected to the light source to receive the light that does not carry data emitted by the light source; the optical chip is connected to the drive chip to receive the drive signal provided by the drive chip, and the optical chip modulates the light that does not carry data into an optical signal under the action of the drive signal.

[0034] The above technical solution has the following beneficial effects: The optical chip is connected to the drive chip, so that the optical chip realizes optical modulation under the action of the drive signal.

[0035] In some embodiments, an optical module is provided, including:

[0036] A laser chip is connected to the drive chip to receive the drive signal provided by the drive chip; the laser chip emits an optical signal under the action of the drive signal.

[0037] The above technical solution has the following beneficial effects: The laser chip is connected to the drive chip, so that the laser chip realizes the emission of an optical signal under the action of the drive signal. Description of the Drawings

[0038] To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 Partial structure diagram of an optical communication system provided according to some embodiments;

[0040] Figure 2 Partial structure diagram of a host computer provided according to some embodiments;

[0041] Figure 3 Structure diagram of an optical module provided according to some embodiments;

[0042] Figure 4 Exploded view of an optical module provided according to some embodiments;

[0043] Figure 5 Internal structure schematic diagram of an optical module provided according to some embodiments;

[0044] Figure 6 Internal structure diagram of another optical module provided according to some embodiments;

[0045] Figure 7 Internal structure schematic diagram of another optical module provided according to some embodiments;

[0046] Figure 8 Partial view of the internal structure of an optical module provided according to some embodiments;

[0047] Figure 9 Partial view of the internal structure of an optical module from another perspective provided according to some embodiments;

[0048] Figure 10 Usage status diagram of a TIA provided according to some embodiments;

[0049] Figure 11 Usage status diagram of another TIA provided according to some embodiments;

[0050] Figure 12 Internal structure schematic diagram of another optical module provided according to some embodiments;

[0051] Figure 13 Internal structure schematic diagram of yet another optical module provided according to some embodiments;

[0052] Figure 14Schematic diagram of the internal structure of yet another optical module provided according to some embodiments. Detailed implementation manners

[0053] The following will clearly and detailedly describe some embodiments of the present disclosure with reference to the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure fall within the scope of protection of the present disclosure.

[0054] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" cannot be construed as indicating or implying relative importance or an upper limit on quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the term "suitable for" or "configured to" implies open and inclusive language, which does not exclude a device suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "identical", "consistent", "flush", etc. do not limit to absolute mathematical theory relationships, but also include an acceptable error range in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0055] In optical communication technologies, in order to establish information transmission between information processing devices, it is necessary to load information onto light and utilize the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When the optical signal is transmitted in an information transmission device, the loss of optical power can be reduced, so that high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing devices can recognize and process are electrical signals. Information processing devices generally include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablet computers, televisions, etc., and information transmission devices generally include optical fibers and optical waveguides, etc.

[0056] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or optical signal output pin of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or electrical signal output pin of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or optical signal output pin of the optical module can be called an optical port, and the electrical signal input end or electrical signal output pin of the optical module can be called an electrical port.

[0057] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0058] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0059] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0060] The host computer 100 includes a substantially rectangular housing and an optical module connection hole 102 disposed on the housing. The optical module connection hole 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0061] The host computer 100 further includes an external electrical connection hole, which can access an electrical signal network. For example, the external electrical connection hole includes a Universal Serial Bus (USB) connection hole or a network cable connection hole 104, and the network cable connection hole 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal into the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. In the above conversion process of optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0062] In addition to including an optical network terminal, the host computer 100 further includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0063] Figure 2 It is a partial structural diagram of a host computer provided according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2As shown in the figure, the host computer 100 further includes a PCB circuit board 105 disposed inside the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the radiator 107 has raised structures such as fins for increasing the heat dissipation area.

[0064] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing a two-way electrical signal connection between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, thereby establishing a two-way optical signal connection between the optical module 200 and the optical fiber 101.

[0065] Figure 3 FIG. is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. is an exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4 shown, the optical module 200 includes a housing (shell), a circuit board 300 disposed inside the housing, and an optical transceiver component.

[0066] The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202 to form the above-mentioned housing having two openings 204 and 205; the outer contour of the housing generally presents a rectangular body.

[0067] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower housing 202 to form the above-mentioned housing.

[0068] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to realize the upper housing 201 covering the lower housing 202.

[0069] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may not be consistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 the right end), and the opening 205 is also located at the end of the optical module 200 ( Figure 3 the left end). Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the electrical connector of the host computer 100; the opening 205 is an optical port and is configured to access an external optical fiber 101 so that the optical fiber 101 is connected to the optical transceiver component in the optical module 200.

[0070] Adopting the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the optical transceiver component, etc. into the above housing, and the upper housing 201 and the lower housing 202 can package and protect the above devices. In addition, when assembling the circuit board 300, the optical transceiver component, etc., it is convenient for the deployment of the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is beneficial to the automated implementation of production.

[0071] In some embodiments, the upper housing 201 and the lower housing 202 are made of a metal material, which is beneficial to achieving electromagnetic shielding and heat dissipation.

[0072] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0073] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes a latching component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the latching component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the latching component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the latching component and the host computer to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0074] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components can include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips can include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0075] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connectors in the cage 106 of the host computer 100.

[0076] The circuit board 300 also includes a gold finger formed on its end surface, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is electrically connected to the electrical connector in the cage 106. The gold finger can be provided only on the surface of one side of the circuit board 300 (for example, Figure 4 the upper surface shown), or can be provided on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions with a large demand for the number of pins. The gold finger is configured to establish an electrical connection with the host computer to achieve functions such as power supply, grounding, inter-integrated circuit (I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board as a supplement to the rigid circuit board.

[0077] In some embodiments, the optical transceiver component can include a light source 910 and an optical chip 920. The optical chip 920 can be optically connected to the light source 910. The light source 910 can emit light that does not carry data, and the optical chip 920 can modulate the light emitted by the light source 910 that does not carry data into an optical signal.

[0078] The optical chip 920 can be a silicon optical chip or a lithium niobate chip, etc.

[0079] In some embodiments, the optical chip 920 may be provided with a beam splitter. One end of the beam splitter may be optically connected to the light source 910 to split a path of light that does not carry data emitted by the light source 910 into at least one path of light that does not carry data, so that the optical chip 920 can modulate at least one path of light that does not carry data into an optical signal.

[0080] In some embodiments, the optical chip 920 may be provided with at least one modulation region. The at least one modulation region may be connected to the beam splitter to receive the light that does not carry data after being split by the beam splitter. The at least one modulation region may modulate at least one path of light that does not carry data into at least one path of optical signal under the action of a driving signal. Exemplarily, one modulation region modulates one path of light that does not carry data into one path of optical signal under the action of one path of driving signal.

[0081] In some embodiments, the optical transceiver component may include a photodetector. The photodetector may receive the optical signal transmitted by the optical fiber and convert the optical signal into a current signal.

[0082] The photodetector may be disposed on the surface of the circuit board 300 or may be integrated on the optical chip 920.

[0083] In some embodiments, the number of photodetectors is at least one, so that the optical transceiver component can receive at least one path of optical signal. Exemplarily, the number of photodetectors is four.

[0084] In some embodiments, a TIA 303 may be disposed on the surface of the circuit board 300. The TIA 303 may be connected to the photodetector to convert the current signal of the photodetector into a voltage signal. Of course, in some embodiments, the TIA 303 may also be disposed on the surface of the optical chip 920.

[0085] In some embodiments, a driving chip 302 may be disposed on the surface of the circuit board 300. The driving chip 302 may be connected to the optical chip 920 to provide a driving signal to the optical chip 920, so that the optical chip 920 modulates the light that does not carry data emitted by the light source 910 into an optical signal under the action of the driving signal.

[0086] In some embodiments, at least one path of driving circuit is integrated inside the driving chip 302, and one path of driving circuit is connected to one modulation region of the optical chip 920, so that the driving chip 302 can provide at least one path of driving signal to the optical chip 920. Exemplarily, four paths of driving circuits are integrated inside the driving chip 302, and the driving chip 302 provides four paths of driving signals to the optical chip 920.

[0087] In some embodiments, a DSP 301 may be provided on the surface of the circuit board 300. The DSP has a digital clock recovery function and a dispersion compensation function (removing factors such as noise and non-linear interference), and can counteract and compensate for distortion, reducing the impact of distortion on the system bit error rate. The DSP 301 may be connected to the gold finger to receive the electrical signal transmitted by the host computer. The DSP 301 may be connected to the driver chip 302 to transmit the shaped electrical signal of the gold finger to the driver chip 302. The DSP 301 may be connected to the TIA 303 to process the voltage signal transmitted by the TIA 303 and then transmit it to the gold finger. Of course, in the embodiments of the present disclosure, the DSP 301 may not be provided on the surface of the circuit board 300.

[0088] An optical module with a DSP 301 provided inside, where the DSP 301 can be connected to the first driver chip 302 or the first TIA 303, may be referred to as a DSP-type optical module.

[0089] Since the power consumption of the DSP is relatively large, resulting in a relatively large power consumption of the optical module, it poses a huge challenge to the increasing traffic capacity and the power consumption of the computer room. To reduce the power consumption of the optical module, in some embodiments, the DSP is no longer provided inside the optical module, and the gold finger is directly connected to the driver chip, and the gold finger is directly connected to the TIA (supplementing the transmission path of the radio frequency signal). An optical module without a DSP provided inside may be referred to as a Linear-drive Pluggable Optics (LPO)-type optical module.

[0090] For an LPO-type optical module, the driver chip is a linear driver chip, which integrates a continuous time linear equalization (CTLE) function and an equalizer (EQ) function, and can compensate the electrical signal transmitted by the host computer to a certain extent. For an LPO-type optical module, the TIA integrates an Automatic Gain Control (AGC) function and an EQ function, and can compensate the electrical signal to be transmitted to the host computer to a certain extent.

[0091] However, since the host computer has multiple ports and the insertion loss between each port and the switching chip is different, and there is no DSP inside the optical module, the electrical signal cannot be regenerated and shaped, resulting in a large difference in the optical eye diagrams output by the optical modules of different ports, affecting the interconnection and interoperability of the optical modules.

[0092] To solve this problem, in some embodiments, a DSP is disposed inside the optical module, but the DSP is only connected to the driver chip and not connected to the TIA. The DSP can regenerate and shape the electrical signal sent by the host computer to compensate for the signal attenuation between the switching chip of the host computer and the port of the host computer, so that the optical eyes output by the optical modules of different ports are Figure 1 consistent, thereby ensuring the interoperability of the optical modules. In addition, since the DSP is not connected to the TIA, the power consumption of the optical module can be effectively reduced. Therefore, the optical module provided by the embodiments of the present disclosure can ensure that the optical eyes output by the optical modules of different ports are Figure 1 consistent on the premise of reducing the power consumption of the optical module. An optical module with a DSP disposed inside but the DSP only connected to the driver chip and not connected to the TIA can be referred to as a Linear-drive Receiving Optics (LRO) type optical module.

[0093] Figure 5 FIG. is a schematic diagram of the internal structure of an optical module according to some embodiments. As Figure 5 shown, in some embodiments, the optical module may include a DSP301. One end of the DSP301 can be connected to the gold finger, and the other end of the DSP301 can be connected to the driver chip 302. The driver chip 302 can be connected to the optical chip 920. The photodetector can be connected to one end of the TIA303, and the other ends of the TIA303 are all directly connected to the gold finger.

[0094] Figure 6 FIG. is another internal structure diagram of an optical module according to some embodiments. Figure 7 FIG. is another schematic diagram of the internal structure of an optical module according to some embodiments. As Figure 6 and Figure 7 shown, in some embodiments, the optical module may include a DSP301. One end of the DSP301 can be connected to the gold finger, and the other end of the DSP301 can be connected to the driver chip 302. The driver chip 302 can be connected to the laser chip 410. The optical receiving chip 510 can be connected to one end of the TIA303, and the other ends of the TIA303 are all directly connected to the gold finger. In this optical module, the TIA303 can be disposed on the surface of the circuit board or may not be disposed on the surface of the circuit board.

[0095] Figure 8 FIG. is a partial view of the internal structure of an optical module according to some embodiments. Figure 9 FIG. is a partial view of the internal structure of an optical module according to some embodiments from another perspective. As Figure 4 、 Figure 8 and Figure 9As shown, in some embodiments, a DSP 301 is disposed on the surface of the circuit board 300. The DSP 301 can be connected to the gold finger 314 to obtain the electrical signals on the gold finger 314 and transmit the electrical signals to the gold finger 314.

[0096] In some embodiments, a first pad 331 can be formed on the TIA 303.

[0097] In some embodiments, a second pad 305 can be disposed on the surface of the circuit board 300. The second pad 305 and the gold finger 314 can be connected through a first signal line 316. The first signal line 316 is not connected to the DSP 301.

[0098] The first signal line 316 can be located on the surface of the circuit board 300 or inside the circuit board 300. When the first signal line 316 is located inside the circuit board 300, the length of the first signal line 316 can be shortened, improving the integrity of the electrical signal.

[0099] The second pad 305 and the first pad 331 can be connected so that the TIA 303 is not connected to the DSP 301 but directly connected to the gold finger 314, making the optical module an LRO type optical module.

[0100] In some embodiments, a third pad 304 can be disposed on the surface of the circuit board 300. The third pad 304 and the gold finger 314 can be connected through a second signal line 318. The second signal line 318 is connected to the DSP 301.

[0101] The second signal line 318 can be located on the surface of the circuit board 300 or inside the circuit board 300. When the second signal line 318 is located on the surface of the circuit board 300, the length of the second signal line 318 can be shortened, improving the integrity of the electrical signal.

[0102] The second signal line 318 can include a first sub-signal line. The first end of the first sub-signal line can be connected to the gold finger 314. The second end of the second sub-signal line can be connected to one end of the DSP 301.

[0103] The second signal line 318 can include a second sub-signal line. The first end of the second sub-signal line can be connected to the other end of the DSP 301. The second end of the second sub-signal line can be connected to the third pad 304.

[0104] The third pad 304 and the first pad 331 can be connected so that the TIA 303 is connected to the DSP 301, making the optical module a DSP type optical module.

[0105] Under the condition that other structures are the same, the power consumption of the LRO type optical module is smaller than that of the DSP type optical module. The loss of the port closer to the switching chip in the host computer is smaller than that of the port farther from the switching chip in the host computer. Therefore, the LRO type optical module can be inserted into the port closer to the switching chip in the host computer, and the DSP type optical module can be inserted into the port farther from the switching chip in the host computer. By way of example, the port with a distance less than or equal to the first preset distance between the host computer and the switching chip of the host computer is the first port, and the port with a distance greater than the first preset distance between the host computer and the switching chip of the host computer is the second port. The LRO type optical module can be inserted into the first port of the host computer, and the DSP type optical module can be inserted into the second port of the host computer.

[0106] Inserting different types of optical modules into ports with different distances from the switching chip in the host computer can reduce the power consumption of the host computer.

[0107] The second pad 305 and the third pad 304 can be arranged at the edge of the circuit board 300 or in the middle of the circuit board 300.

[0108] In some embodiments, the circuit board 300 may include a first surface layer 311 and a second surface layer 313. The first surface layer 311 may be the upper surface layer of the circuit board 300, and the second surface layer 313 may be the lower surface layer of the circuit board 300. The first surface layer 311 may be provided with a gold finger 314 and a TIA 303. The TIA may be provided with a first pad 331.

[0109] In some embodiments, the second pad 305 and the third pad 304 may be arranged on the first surface layer 311, and the first pad 331 may be wire-bonded to the second pad 305 or the third pad 304 so that the optical module can be selected to be an LRO type optical module or a DSP type optical module.

[0110] In some embodiments, the second pad 305 and the third pad 304 are flush with the first pad 331 respectively to reduce the wire-bonding distance between the second pad 305 and the third pad 304 and the first pad 331, thereby improving the integrity of the electrical signal.

[0111] In some embodiments, the second pad 305 is closer to the first pad 331 than the third pad 304, such that the length of the first wire bond 307 between the second pad 305 and the first pad 331 is less than the length of the second wire bond 306 between the third pad 304 and the first pad 331. In the case where the second pad 305 is closer to the first pad 331 than the third pad 304, the second pad 305 being closer to the first pad 331 can effectively reduce the length of the first wire bond 307 between the second pad 305 and the first pad 331, so as to improve the signal integrity of the LRO type optical module, and can also avoid the situation where the second pad 305 crosses the second signal line 318.

[0112] In some embodiments, the circuit board 300 may include an intermediate layer 312. The intermediate layer 312 may be located between the first surface layer 311 and the second surface layer 313. The upper surface of the intermediate layer 312 may be connected to the first surface layer 311 through a dielectric. The lower surface of the intermediate layer 312 may be connected to the second surface layer 313 through a dielectric. The first signal line 316 may be disposed on the intermediate layer 312.

[0113] In some embodiments, the first end of the first signal line 316 and the gold finger 314 may be connected through a first via 315. The second end of the first signal line 316 and the second pad 305 may be connected through a second via 317, so that the first signal line 316 on the intermediate layer 312 can be connected to the gold finger 314 and the second pad 305 on the first surface layer 311.

[0114] Figure 10 A usage state diagram of a TIA provided according to some embodiments. As Figure 10 shown, the first pad 331 and the second pad 305 are wire-bonded through the first wire bond 307, so that the optical module can be an LRO type optical module.

[0115] Figure 11 Another usage state diagram of a TIA provided according to some embodiments. As Figure 11 shown, the first pad 331 and the third pad 304 are wire-bonded through the second wire bond 306, so that the optical module can be a DSP type optical module.

[0116] The above is the case where the DSP 301 is provided in the optical module and the driving chip 302 is connected to the DSP 301. In this case, the first pad 331 can be connected to the second pad 305 or the third pad 304, so that the TIA 303 can be directly connected to the gold finger or connected to the gold finger through the DSP 301.

[0117] For the case where the DSP 301 is provided in the optical module, but the driver chip 302 is not connected to the DSP 301 and is directly connected to the gold finger 314, the connection relationship between the first pad 331 and the second pad 305 or the third pad 304 is also applicable.

[0118] For the case where the DSP 301 is not provided in the optical module and the driver chip 302 is directly connected to the gold finger 314, the connection relationship between the first pad 331 and the second pad 305 or the third pad 304 is no longer applicable.

[0119] To solve the problem that the optical eye diagrams output by optical modules of different ports vary greatly, in some embodiments, in an optical module where the driver chip is directly connected to the gold finger, the driver chip is connected to the MCU. The MCU can be used to adjust the gain voltage of the driver chip according to a preset voltage and the output voltage of the driver chip so that the output voltage is equal to the preset voltage. The MCU is used to adjust the gain voltage of the driver chip according to the output voltage and the preset voltage so that the output voltage is equal to the preset voltage, thereby stabilizing the level amplitude of the output signals of the optical modules of different ports within a preset range, and thus making the optical eyes Figure 1 consistent.

[0120] Figure 12 Another internal structure schematic diagram of an optical module provided according to some embodiments. As Figure 12 shown, in some embodiments, the driver chip can be connected to the gold finger to obtain an input signal sent by the host computer. The driver chip can be connected to a laser chip or an optical chip to provide an output signal to the laser chip or the optical chip, thereby enabling the laser chip to emit an optical signal or the optical chip to modulate the light without data into an optical signal.

[0121] In some embodiments, the driver chip can include an input pin. The input pin can be connected to the gold finger to obtain an input signal transmitted by the host computer.

[0122] In some embodiments, the driver chip can include a first output pin. The first output pin can output an output signal. The output signal can be a drive signal.

[0123] In some embodiments, the driver chip can include a second output pin. The second output pin can be connected to the laser chip or the optical chip so that the laser chip emits an optical signal under the action of the drive signal or the optical chip modulates the light without data into an optical signal under the action of the drive signal.

[0124] In some embodiments, the drive chip may include a control pin. The control pin may receive a gain voltage, enabling the drive chip to adjust the level amplitude of the output signal according to the gain voltage. The level amplitude of the output signal can be calculated to obtain the output voltage. Therefore, the level amplitude of the output signal can be considered as the output voltage.

[0125] The gain voltage, also known as voltage gain, refers to the proportional relationship between the input signal and the output signal in a circuit. The magnitude of the gain voltage directly determines the amplification degree of the output signal relative to the input signal. When the input signal is processed by an operational amplifier, its output voltage will be amplified or reduced accordingly according to the set gain voltage, thereby affecting the output voltage of the output signal of the drive chip.

[0126] As Figure 12 shown, in some embodiments, the optical module may include an MCU. The MCU may be connected to the drive chip to monitor the output voltage of the drive chip and adjust the gain voltage output to the drive chip according to the output voltage, thereby adjusting the output voltage of the drive chip.

[0127] In some embodiments, the MCU may include an input pin. The input pin of the MCU may be connected to the first output pin of the drive chip to monitor the output voltage of the first output pin of the drive chip. Exemplarily, the input pin of the MCU may be an ADC pin. The ADC pin of the MCU is connected to the first output pin of the drive chip, enabling the MCU and the drive chip to be connected through an ADC / DAC serial port.

[0128] The ADC pin of the MCU is equipped with a detector, which can measure the output voltage of the drive chip and convert the analog signal into a digital signal for the MCU to process and analyze.

[0129] In some embodiments, the MCU may include an output pin. The output pin of the MCU may be connected to the control pin of the drive chip to output the gain voltage to the drive chip. Exemplarily, the output pin of the MCU may be a DAC pin. The DAC pin of the MCU is connected to the control pin of the drive chip, enabling the MCU and the drive chip to be connected through an ADC / DAC serial port.

[0130] In some embodiments, the MCU may include registers. A preset voltage may be stored in the registers. The MCU may be used to compare the acquired output voltage with the preset voltage in the registers and adjust the gain voltage output to the drive chip according to the comparison result between the output voltage and the preset voltage. When the output voltage is less than the preset voltage in the registers, the gain voltage is increased until the output voltage is equal to the preset voltage; when the output voltage is greater than the preset voltage in the registers, the gain voltage is decreased until the output voltage is equal to the preset voltage; when the output voltage is equal to the preset voltage in the registers, the gain voltage remains unchanged.

[0131] In some embodiments, an initial gain voltage may be stored in the registers. The initial gain voltage is the gain voltage required by the drive chips of most optical modules. The MCU is used to first transmit the initial gain voltage to the drive chip and determine whether the output voltage of the drive chip is equal to the preset voltage under the initial gain voltage; when the output voltage is less than the preset voltage, the gain voltage is stepped up based on the initial gain voltage until the output voltage is equal to the preset voltage; when the output voltage is greater than the preset voltage, the gain voltage is stepped down based on the initial gain voltage until the output voltage is equal to the preset voltage; when the output voltage is equal to the preset voltage, the initial gain voltage remains unchanged.

[0132] In some embodiments, a gain voltage threshold may be stored in the registers. The gain voltage threshold is the upper limit of the gain voltage that the MCU can output. When the gain voltage is greater than or equal to the gain voltage threshold and the output voltage is less than the preset voltage, it indicates that no electrical signal is input to the optical module. Therefore, the MCU reports a Loss of Signal Alarm (LOS) signal to the host computer. When the gain voltage is less than the gain voltage threshold and the output voltage is not equal to the preset voltage, the gain voltage is continuously adjusted according to the output voltage and the preset voltage to make the output voltage reach the preset voltage.

[0133] Figure 13 The following is a schematic diagram of the internal structure of another optical module provided according to some embodiments. As Figure 13 shown, in some embodiments, the drive chip may be connected to the gold finger to obtain the input signal sent by the host computer. The drive chip may be connected to the laser chip or the optical chip to provide an output signal to the laser chip or the optical chip, so that the laser chip emits an optical signal or the optical chip modulates the optical signal without data into an optical signal.

[0134] In some embodiments, the drive chip may include an input pin. The input pin may be connected to the gold finger to obtain the input signal transmitted by the host computer.

[0135] In some embodiments, the drive chip may include a first output pin. The first output pin may output an output signal. The output signal may be a drive signal.

[0136] In some embodiments, the driving chip may include a second output pin. The second output pin may be connected to a laser chip or an optical chip, so that the laser chip emits an optical signal under the action of a driving signal, or the optical chip modulates the light without carrying data into an optical signal under the action of the driving signal.

[0137] In some embodiments, the driving chip may include a control pin. The control pin may receive a gain voltage, so that the driving chip can adjust the level amplitude of the output signal, that is, the output voltage, according to the gain voltage.

[0138] As Figure 13 shown, in some embodiments, an operational amplifier may be included inside the optical module. The operational amplifier may be connected to the driving chip to obtain the output voltage of the driving chip and compare the output voltage with a reference voltage to output a comparison result.

[0139] In some embodiments, the operational amplifier may include a non-inverting input pin, and the non-inverting input pin of the operational amplifier may be connected to the first output pin of the driving chip to obtain the output voltage of the driving chip.

[0140] In some embodiments, the operational amplifier may include an inverting input pin, and the inverting input pin of the operational amplifier may be connected to a preset voltage. The preset voltage may be provided by a power supply chip or by an MCU, that is, the inverting input pin of the operational amplifier may be connected to the power supply chip or to the MCU.

[0141] In some embodiments, the operational amplifier may include an output pin, and the output pin of the operational amplifier may output the comparison result of the output voltage and the preset voltage. When the output voltage is greater than the preset voltage, the output pin of the operational amplifier outputs a number greater than zero; when the output voltage is less than the preset voltage, the output pin of the operational amplifier outputs a number less than zero; when the level of the output signal is equal to the preset voltage, the output pin of the operational amplifier outputs zero.

[0142] As Figure 13 shown, in some embodiments, an MCU may be included inside the optical module. The MCU may be connected to the output pin of the operational amplifier to obtain the comparison result of the operational amplifier. The MCU may be used to adjust the gain voltage according to the comparison result of the operational amplifier. When the comparison result of the operational amplifier is a number greater than zero, the MCU reduces the gain voltage; when the comparison result of the operational amplifier is a number less than zero, the MCU increases the gain voltage; when the comparison result of the operational amplifier is zero, the MCU keeps the gain voltage unchanged. The MCU may be connected to the control pin of the driving chip to output the gain voltage to the driving chip.

[0143] In some embodiments, the MCU may include input pins. The input pins of the MCU may be connected to the output pins of the operational amplifier to obtain the comparison result of the operational amplifier.

[0144] In some embodiments, the MCU may include output pins. The output pins of the MCU may be connected to the control pins of the driver chip to output a gain voltage to the driver chip. For example, the output pin of the MCU may be a DAC pin.

[0145] In some embodiments, the MCU may include a register, and an initial gain voltage may be stored in the register. The initial gain voltage is the gain voltage required by the driver chips of most optical modules. The MCU first transmits the initial gain voltage to the driver chip and reads the comparison result of the operational amplifier at the initial gain voltage. When the comparison result of the operational amplifier is at a low level, the gain voltage is stepped up on the basis of the initial gain voltage until the output voltage is equal to the preset voltage; when the comparison result of the operational amplifier is at a high level, the gain voltage is stepped down on the basis of the initial gain voltage until the output voltage is equal to the preset voltage; when the comparison result of the operational amplifier is at a zero level, the initial gain voltage remains unchanged.

[0146] In some embodiments, a gain voltage threshold may be stored in the register. The gain voltage threshold is the upper limit of the gain voltage that the MCU can output. When the gain voltage is greater than or equal to the gain voltage threshold and the output voltage is less than the preset voltage, it indicates that no electrical signal is input to the optical module. Therefore, the MCU reports the LOS signal to the host computer. When the gain voltage is less than the gain voltage threshold and the output voltage is equal to the preset voltage, the gain voltage is continuously adjusted according to the output voltage and the preset voltage so that the output voltage reaches the preset voltage.

[0147] Figure 14 The following is a schematic diagram of the internal structure of another optical module provided according to some embodiments. As Figure 14 shown, in some embodiments, the driver chip may include input pins. The input pins may be connected to the gold fingers to obtain the input signal transmitted by the host computer.

[0148] In some embodiments, the driver chip may include output pins. The output pins may be connected to the laser chip or the optical chip to provide a driving signal to the laser chip or the optical chip, so that the laser chip emits an optical signal under the action of the driving signal or the optical chip modulates the optical signal without carrying data into an optical signal under the action of the driving signal.

[0149] In some embodiments, the driving chip may include input and output pins. The driving chip can monitor the level amplitude of the output signal by itself, that is, the output voltage, and store the output voltage and the gain voltage. The gain voltage may include an original gain voltage and a first gain voltage. The original gain voltage is the gain voltage corresponding to the output voltage, and the first gain voltage is the gain voltage adjusted according to the output voltage and a preset voltage.

[0150] In some embodiments, the driving chip may include a first register. The output voltage may be stored in the first register.

[0151] In some embodiments, the gain voltage may be stored in the first register, and the gain voltage may correspond to the output voltage.

[0152] As Figure 14 shown, in some embodiments, the interior of the optical module may include an MCU. The MCU may be connected to the driving chip to read the output voltage of the driving chip and the original gain voltage corresponding to the output voltage.

[0153] In some embodiments, the MCU may include input and output pins. The input and output pins of the MCU may be connected to the input and output pins of the driving chip to facilitate the MCU to read the output voltage and the gain voltage. Exemplarily, the input and output pins of the MCU may be I2C pins. The I2C pins of the MCU are connected to the input and output pins of the driving chip so that the MCU and the driving chip are connected through the I2C communication protocol via the I2C serial interface.

[0154] The I2C communication protocol uses two wires for communication. One is the serial data line for transmitting data, and the other is the serial clock line for transmitting synchronous clock pulses.

[0155] In some embodiments, the MCU may include a second register, and the preset voltage may be stored in the second register. The MCU may adjust the gain voltage in the first register according to the output voltage and the preset voltage so that the output voltage is equal to the preset voltage. When the output voltage is less than the preset voltage, the MCU may increase the gain voltage in the first register until the output voltage is equal to the preset voltage; when the output voltage is greater than the preset voltage, the MCU may decrease the gain voltage in the first register until the output voltage is equal to the preset voltage; when the output voltage is equal to the preset voltage, the MCU may maintain the gain voltage in the first register.

[0156] In some embodiments, the MCU may directly modify the gain voltage in the first register to adjust the gain voltage in the first register. Exemplarily, the MCU may write the first gain voltage into the first register to replace the original gain voltage in the first register, so as to realize the adjustment of the gain voltage in the first register, where the first gain voltage is the gain voltage adjusted by the MCU according to the comparison result.

[0157] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that, Comprising: A circuit board with a gold finger formed at one end; A digital signal processing chip disposed on the surface of the circuit board and connected to the gold finger; A driver chip connected to the digital signal processing chip; A transimpedance amplifier chip having a first pad; Wherein, on the surface of the circuit board are formed: A second pad connected to the gold finger through a first signal line; the first signal line is not connected to the digital signal processing chip; A third pad connected to the gold finger through a second signal line; the second signal line is connected to the digital signal processing chip; The first pad is wire-bonded to the second pad or the third pad; when the first pad is wire-bonded to the second pad, the transimpedance amplifier chip is not connected to the digital signal processing chip but directly connected to the gold finger; when the first pad is wire-bonded to the third pad, the transimpedance amplifier chip is connected to the digital signal processing chip.

2. The optical module according to claim 1, wherein The transimpedance amplifier chip is not connected to the digital signal processing chip, and the optical module is inserted into a port in the host computer that is closer to the switching chip in the host computer; The transimpedance amplifier chip is connected to the digital signal processing chip, and the optical module is inserted into a port in the host computer that is farther from the switching chip.

3. The optical module according to claim 1, characterized in that, The distance between the second pad and the first pad is less than the distance between the third pad and the first pad.

4. The optical module according to claim 1, wherein The second pad and the third pad are respectively flush with the first pad.

5. The optical module according to claim 1, wherein The first signal line is located inside the circuit board, one end of the first signal line is connected to the gold finger through a via, and the other end of the first signal line is connected to the second pad through a via.

6. The optical module according to claim 1, characterized in that, The second signal line is located on the surface of the circuit board, the second signal line includes a first sub-signal line and a second sub-signal line, one end of the first sub-signal line is connected to the gold finger, the other end of the first sub-signal line and one end of the second sub-signal line are both connected to the digital signal processing chip, and the other end of the second sub-signal line is connected to the third pad.

7. The optical module according to claim 1, characterized in that, Further comprising: A light source for emitting light without carrying data; An optical chip optically connected to the light source to receive the light without carrying data emitted by the light source; The optical chip is connected to the driver chip to receive the drive signal provided by the driver chip, and the optical chip modulates the light without carrying data into an optical signal under the action of the drive signal.

8. The optical module according to claim 1, wherein Further comprising: A laser chip connected to the driver chip to receive the drive signal provided by the driver chip; The laser chip emits an optical signal under the action of the drive signal.

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