Structure for preventing ACF gold ball from being crushed
By opening a groove on the first binding position of the PIN foot assembly and setting the test point in the groove, the problems of ACF gold ball crushing and short circuit in the liquid crystal display are solved, and the effect of reducing the risk of short circuit is achieved.
Patent Information
- Application Number
- CN202422131783.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-30
AI Technical Summary
During the FPC binding process of the LCD screen, ACF gold balls are easily crushed and gathered on the edge of the glass, resulting in a short circuit risk.
A groove is opened on the first binding position of the PIN foot assembly, and the test point is set in the groove to ensure that there is sufficient distance between the test point and the FPC board after the FPC board is bound to avoid crushing of the gold ball.
It effectively reduces the risk of short-circuiting of ACF gold balls, and by setting test points in the grooves, short-circuit problems caused by the aggregation of gold balls are avoided.
Smart Images
Figure CN223092241U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, in particular to a structure for preventing ACF gold balls from being crushed. Background Art
[0002] At present, circular liquid crystal display screens generally include wearable products, instruments, etc. During the test of liquid crystal glass, test points are made on both sides of the FPC binding position of the liquid crystal glass for glass testing. However, for circular liquid crystals, both sides of the FPC binding position need to be cut off to form a circle, so there is no position to place these test points, and these test points need to be led to the FPC binding position. However, after the FPC is bound, due to the pressing problem, the ACF gold balls may be broken and then gather at the edge of the liquid crystal glass, thus prone to short - circuit risks. Content of the Utility Model
[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a structure for preventing ACF gold balls from being crushed, which can reduce the risk of short - circuit of ACF gold balls.
[0004] The purpose of the utility model is realized through the following technical solutions:
[0005] A first aspect of the present application provides a structure for preventing ACF gold balls from being crushed, including: a glass substrate; a PIN - foot component, the PIN - foot component includes a first binding position and a test point position, a groove is formed on the first binding position, and the test point position is arranged in the groove.
[0006] The depth of the groove is 20μm.
[0007] The end of the test point position is adjacent to the glass substrate.
[0008] The PIN - foot component further includes a second binding position, the second binding position is located on one side of the first binding position, and the second binding position is arranged on the glass substrate.
[0009] The PIN - foot component includes a plurality of the first binding positions, and each of the first binding positions is respectively arranged on the glass substrate at intervals.
[0010] A corresponding groove is formed on each of the first binding positions.
[0011] The PIN - foot component includes a plurality of the test point positions, and each test point position is respectively arranged in each of the grooves in one - to - one correspondence.
[0012] It further includes a chip, and the chip is arranged on the glass substrate.
[0013] The PIN foot component further includes an alignment mark, and the alignment mark is disposed on the glass substrate.
[0014] A display area is defined on the glass substrate.
[0015] Compared with the prior art, the present utility model has at least the following advantages:
[0016] By providing a groove in the first binding position and arranging the test point in the groove, after the FPC board is bound, there is a certain distance between the test point and the FPC board, that is, the FPC board will not crush the ACF gold balls in the test point. Even if the ACF gold balls gather at the edge of the glass substrate, there is no risk of short circuit. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below.
[0018] Figure 1 FIG. is a schematic structural view of a structure for preventing ACF gold balls from being crushed in an embodiment of the present utility model;
[0019] Figure 2 is Figure 1 an enlarged schematic view of the structure for preventing ACF gold balls from being crushed. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] The embodiments of the present application will be described in more detail below with reference to the drawings. Although the embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.
[0022] Unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] Currently, circular liquid crystal displays generally include wearable products, instruments, etc. During the liquid crystal glass test, test points are made on both sides of the FPC binding position of the liquid crystal glass for glass testing. However, for circular liquid crystals, the two sides of the FPC binding position need to be cut off to form a circle, so there is no position to place these test points, and these test points need to be led to the FPC binding position. However, after the FPC is bound, due to the pressing problem, the ACF gold balls may be broken, and then gather at the edge of the liquid crystal glass, which is prone to the risk of short circuit.
[0024] In view of the above problems, an embodiment of the present application provides a structure for preventing ACF gold balls from being crushed, which can reduce the risk of short circuit of ACF gold balls.
[0025] The technical solutions of the embodiments of the present application are described in detail below with reference to the drawings.
[0026] Refer to Figure 1 and Figure 2 , in an embodiment, a structure for preventing ACF gold balls from being crushed includes: a glass substrate 100 and a PIN foot assembly 200. The PIN foot assembly 200 includes a first binding position 210 and a test point position 220. A groove is formed on the first binding position 210, and the test point position 220 is arranged in the groove.
[0027] It should be noted that by forming a groove on the first binding position 210 and arranging the test point position 220 in the groove, after the FPC board is bound, there is a certain distance between the test point position 220 and the FPC board, that is, the FPC board will not crush the ACF gold balls in the test point position 220. Even if the ACF gold balls gather at the edge of the glass substrate 100, there is no risk of short circuit. Among them, the depth of the groove is 20 μm, and the part of the test point position 220 located on the glass substrate 100 is also etched with a groove.
[0028] It should also be noted that the PIN foot component 200 includes a plurality of first binding positions 210, and the first binding positions 210 are respectively arranged on the glass substrate 100 at intervals, and grooves are correspondingly formed on each first binding position 210. The PIN foot component 200 includes a plurality of test points 220, and each test point 220 is respectively arranged in each groove in a one-to-one correspondence. Among them, the first binding positions 210 are located at both ends of the glass substrate 100.
[0029] Refer to Figure 1 , in an embodiment, the end 221 of the test point 220 is arranged adjacent to the glass substrate 100.
[0030] It should be noted that, for the convenience of testing, the end 221 of the test point 220 will be adjacent to the glass substrate 100.
[0031] Refer to Figure 2 , in an embodiment, the PIN foot component 200 further includes a second binding position 230, the second binding position 230 is located on one side of the first binding position 210, and the second binding position 230 is arranged on the glass substrate 100.
[0032] It should be noted that the second binding position 230 is used for binding with the FPC board.
[0033] Refer to Figure 1 , in an embodiment, it further includes a chip 300, and the chip 300 is arranged on the glass substrate 100. It should be noted that the chip 300 is used to control the display screen to display images.
[0034] Refer to Figure 1 , in an embodiment, the PIN foot component 200 further includes an alignment mark 240, and the alignment mark 240 is arranged on the glass substrate 100.
[0035] It should be noted that the alignment mark 240 is used for positioning the FPC board during binding.
[0036] Refer to Figure 1 , in an embodiment, a display area 110 is formed on the glass substrate 100.
[0037] It should be noted that the display area 110 is used for displaying images.
[0038] The solution of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have their own focuses. For the parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily essential to the present application. In addition, it can be understood that the steps in the method embodiments of the present application can be adjusted, combined, and deleted according to actual needs, and the modules in the device embodiments of the present application can be combined, divided, and deleted according to actual needs.
[0039] The various embodiments of the present application have been described above. The above description is exemplary and not exhaustive, and is also not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of the technology in the market, or to enable other ordinary skilled in the art in the technical field to understand the embodiments disclosed herein.
Claims
1. A structure for preventing ACF gold balls from being crushed, characterized in that, Comprising: A glass substrate; A PIN foot component, the PIN foot component includes a first binding position and a test position, a groove is formed on the first binding position, and the test position is arranged in the groove.
2. The structure for preventing crushing of ACF gold balls according to claim 1, wherein, The depth of the groove is 20μm.
3. The structure for preventing the crushing of ACF gold balls according to claim 1, wherein, The end of the test position is adjacent to the glass substrate.
4. The structure for preventing ACF gold balls from being crushed according to claim 1, wherein, The PIN foot component further includes a second binding position, the second binding position is located on one side of the first binding position, and the second binding position is arranged on the glass substrate.
5. The structure for preventing ACF gold balls from being crushed according to claim 1, wherein, The PIN foot component includes a plurality of the first binding positions, and each of the first binding positions is respectively arranged on the glass substrate at intervals.
6. The structure for preventing ACF gold balls from being crushed according to claim 5, characterized in that, The groove is correspondingly formed on each of the first binding positions.
7. The structure for preventing the crushing of ACF gold balls according to claim 6, wherein, The PIN foot component includes a plurality of the test positions, and each test position is respectively arranged in each of the grooves in a one-to-one correspondence.
8. The structure for preventing ACF gold balls from being crushed according to claim 1, wherein It further includes a chip, and the chip is arranged on the glass substrate.
9. The structure for preventing the crushing of ACF gold balls according to claim 1, characterized in that, The PIN foot component further includes an alignment mark, and the alignment mark is arranged on the glass substrate.
10. The structure for preventing the crushing of ACF gold balls according to claim 1, characterized in that, A display area is formed on the glass substrate.