Novel computer assembly type CPU heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation devices, and discloses a novel computer assembly type CPU heat dissipation device which comprises a main body mechanism, an installation mechanism and a heat dissipation mechanism, the installation mechanism is located in the main body mechanism, the heat dissipation mechanism is located at the top of the installation mechanism, the main body mechanism comprises a main board, a clamping groove is formed in the top of the main board, and the clamping groove is located in the main board. A threaded hole is formed in the top of the main board, a clamping plate is clamped in the clamping groove, a mounting plate is fixedly connected to the top of the clamping plate, a mounting hole is formed in the top of the mounting plate, a connecting screw is in threaded connection with the interior of the mounting hole, and a mounting shell is fixedly connected to the inner side of the mounting plate. By arranging the clamping plates, when the clamping plates are clamped in the clamping grooves, the overall heat dissipation mechanism is installed in a limited mode, then the installation plate is fixedly installed on the top of the main board through the connecting screws, and meanwhile the connecting screws are in threaded connection with the interiors of the threaded holes, so that the overall heat dissipation mechanism is fixed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, and particularly relates to a new type of computer assembled CPU heat dissipation device. Background Technique

[0002] The CPU (Central Processing Unit), that is, the central processing unit, is one of the core components of a computer, responsible for interpreting computer instructions and processing data in computer software. The CPU is composed of an arithmetic unit, a controller, registers, etc., and is connected to other components through data and control buses.

[0003] When the CPU is working, its internal temperature will increase exponentially with time and computing power. Therefore, it is necessary to ensure that the internal temperature is within a certain range to ensure continuous operation. Therefore, heat dissipation needs to be added to the top of the CPU and it can be stably installed on the computer motherboard. Content of the Utility Model

[0004] To solve the above technical problems, the utility model provides a new type of computer assembled CPU heat dissipation device, including a main body mechanism, a mounting mechanism and a heat dissipation mechanism. The mounting mechanism is located inside the main body mechanism, and the heat dissipation mechanism is located on top of the mounting mechanism;

[0005] The main body mechanism includes a main board. A card slot is opened on the top of the main board, and a threaded hole is opened on the top of the main board. A card board is clamped inside the card slot. The top of the card board is fixedly connected with a mounting plate. A mounting hole is opened on the top of the mounting plate. A connecting screw is threadedly connected inside the mounting hole. The inner side of the mounting plate is fixedly connected with a mounting shell.

[0006] Through the above technical solution, by setting the card board, when the card board is clamped inside the card slot, the overall heat dissipation mechanism is limited and installed. Then, the connecting screw is used to fixedly install the mounting plate on the top of the main board, and at the same time, the connecting screw is threadedly connected inside the threaded hole.

[0007] As a further improvement of the above solution, the number of the card slots is set to two, and the two card slots are distributed on the top surface of the main board. The number of the threaded holes is set to four, and the four threaded holes are arranged on the top of the main board. The connecting screw is threadedly connected inside the threaded hole. The number of the mounting plates is set to two, and both ends of the mounting shell are fixedly connected to the inner side surfaces of the two mounting plates.

[0008] Through the above technical solution, by fixedly connecting the mounting shell between the two mounting plates, it is convenient to carry out the overall installation and fixing work.

[0009] As a further improvement of the above solution, the installation mechanism includes a CPU installation table. A placement groove is formed at the top of the CPU installation table, and a CPU main body is clamped inside the CPU installation table.

[0010] As a further improvement of the above solution, the bottom of the CPU installation table is fixedly connected to the top of the main board, and the two installation plates are symmetrically and evenly distributed on the surface of the main board with the center of the top of the CPU installation table as the center.

[0011] As a further improvement of the above solution, the heat dissipation mechanism includes a heat absorption plate. Heat conduction tubes are fixedly connected to both ends of the heat absorption plate. A heat dissipation plate is fixedly connected to the surface of the heat conduction tube. A fan frame is fixedly connected to the front of the heat dissipation plate. A fixing strip is fixedly connected inside the fan frame. A rotating rod is arranged inside the heat dissipation plate. A power connector is fixedly connected to the rear end of the rotating rod, and fan blades are arranged on the surface of the rotating rod.

[0012] Through the above technical solution, when the CPU main body is working, heat is conducted into the heat absorption plate, and then is introduced into the heat dissipation plate through the heat conduction tube. After connecting the power supply to the power connector, the motor inside drives the rotating rod to rotate, synchronously driving the fan blades to rotate, and the heat inside the heat dissipation plate is taken out by the wind force to achieve the function of dissipating heat from the CPU main body.

[0013] As a further improvement of the above solution, the bottom of the heat absorption plate is connected to the top of the CPU main body. The number of the heat dissipation plates is several, and several heat dissipation plates are evenly distributed on the surface of the heat conduction tube. Both ends are fixedly connected to the inner wall of the fan frame. The rotating rod penetrates through the heat dissipation plate. The power connector is arranged at the rear end of the heat dissipation plate. The number of the fan blades is several, and several fan blades are symmetrically and evenly distributed on the surface with the center of the front of the rotating rod as the center.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] In the present utility model, by setting the clamping plate, when the clamping plate is clamped inside the clamping groove, the overall heat dissipation mechanism is limited and installed. Then, the connecting screws are used to fixedly install the installation plate on the top of the main board, and at the same time, the connecting screws are threadedly connected inside the threaded holes to achieve the fixation of the overall heat dissipation mechanism.

[0016] In the present utility model, by setting the heat dissipation plate, when the CPU main body is working, heat is conducted into the heat absorption plate, and then is introduced into the heat dissipation plate through the heat conduction tube. After connecting the power supply to the power connector, the motor inside drives the rotating rod to rotate, synchronously driving the fan blades to rotate, and the heat inside the heat dissipation plate is taken out by the wind force to achieve the function of dissipating heat from the CPU main body. Description of the Drawings

[0017] Figure 1 This is a schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 This is a schematic diagram of the top structure of the main board of the present utility model;

[0019] Figure 3 This is the present utility model Figure 1 A magnified schematic diagram of the structure;

[0020] Figure 4 This is a front structural schematic diagram of the overall heat dissipation mechanism of the present utility model;

[0021] Figure 5 This is a back structural schematic diagram of the overall heat dissipation mechanism of the present utility model.

[0022] In the figure: 1, main body mechanism; 101, main board; 102, card slot; 103, threaded hole; 104, card board; 105, mounting plate; 106, mounting hole; 107, connecting screw; 108, mounting shell; 2, mounting mechanism; 201, CPU mounting table; 202, placement groove; 203, CPU main body; 3, heat dissipation mechanism; 301, heat absorption plate; 302, heat conduction pipe; 303, heat dissipation plate; 304, fan frame; 305, fixing strip; 306, rotating rod; 307, power connector; 308, fan blade. Specific implementation manners

[0023] Next, in combination with the accompanying drawings and specific implementation manners, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined with each other to form new embodiments.

[0024] Embodiment 1:

[0025] Please refer to Figures 1-5 , A new type of computer assembled CPU heat dissipation device in this embodiment includes a main body mechanism 1, a mounting mechanism 2 and a heat dissipation mechanism 3. The mounting mechanism 2 is located inside the main body mechanism 1, and the heat dissipation mechanism 3 is located on the top of the mounting mechanism 2;

[0026] The main body mechanism 1 includes a main board 101. A card slot 102 is opened at the top of the main board 101, and a threaded hole 103 is opened at the top of the main board 101. A card board 104 is clamped inside the card slot 102. The top of the card board 104 is fixedly connected to a mounting plate 105. A mounting hole 106 is opened at the top of the mounting plate 105. A connecting screw 107 is threadedly connected inside the mounting hole 106. The inner side of the mounting plate 105 is fixedly connected to a mounting shell 108. When the card board 104 is clamped inside the card slot 102 through the card board 104, the overall heat dissipation mechanism 3 is limited and installed, and then the mounting plate 105 is fixedly installed on the top of the main board 101 through the connecting screw 107.

[0027] There are two card slots 102, and the two card slots 102 are distributed on the top surface of the main board 101. There are four threaded holes 103, and the four threaded holes 103 are arranged on the top of the main board 101. The connecting screw 107 is threadedly connected inside the threaded hole 103. There are two mounting plates 105, and both ends of the mounting shell 108 are fixedly connected to the inner surfaces of the two mounting plates 105.

[0028] The installation mechanism 2 includes a CPU installation platform 201. A placement groove 202 is opened at the top of the CPU installation platform 201, and a CPU main body 203 is clamped inside the CPU installation platform 201.

[0029] The bottom of the CPU installation platform 201 is fixedly connected to the top of the main board 101. The two mounting plates 105 are symmetrically and evenly distributed on the surface of the main board 101 with the center of the top of the CPU installation platform 201 as the center.

[0030] The heat dissipation mechanism 3 includes a heat absorption plate 301. Heat conduction tubes 302 are fixedly connected to both ends of the large heat absorption plate 301. A heat dissipation plate 303 is fixedly connected to the surface of the heat conduction tube 302. A fan frame 304 is fixedly connected to the front of the heat dissipation plate 303. A fixing strip 305 is fixedly connected inside the fan frame 304. A rotating rod 306 is arranged inside the heat dissipation plate 303. A power connector 307 is fixedly connected to the rear end of the rotating rod 306. Blades 308 are arranged on the surface of the rotating rod 306.

[0031] The bottom of the heat absorption plate 301 is connected to the top of the CPU main body 203. There are several heat dissipation plates 303, and the several heat dissipation plates 303 are evenly distributed on the surface of the heat conduction tube 302 and are fixedly connected to the inner wall of the fan frame 304 at both ends. The rotating rod 306 penetrates through the heat dissipation plate 303. The power connector 307 is arranged at the rear end of the heat dissipation plate 303. There are several blades 308, and the several blades 308 are symmetrically and evenly distributed on the surface with the center of the front of the rotating rod 306 as the center.

[0032] The implementation principle of a new type of computer assembled CPU heat dissipation device in the embodiments of the present application is as follows: When installing the CPU main body 203, the CPU main body 203 is snap-fitted inside the CPU installation table 201. Subsequently, the card board 104 is snap-fitted inside the card slot 102 to limit and install the overall heat dissipation mechanism 3. Then, the connecting screw 107 is used to fixedly install the mounting plate 105 on the top of the main board 101. At the same time, the connecting screw 107 is threadedly connected inside the threaded hole 103. When the CPU main body 203 is working, the heat is conducted into the heat absorption plate 301 and then introduced into the heat dissipation plate 303 through the heat conduction tube 302. After connecting the power supply to the power connector 307, the motor inside drives the rotating rod 306 to rotate, synchronously driving the fan blade 308 to rotate, and taking out the heat inside the heat dissipation plate 303 through the wind force to achieve the function of dissipating heat from the CPU main body 203. The above implementation manner is only the preferred implementation manner of the present utility model and cannot be used to limit the protection scope of the present utility model. Any non-substantial changes and substitutions made by those skilled in the art on the basis of the present utility model belong to the protection scope required by the present utility model.

Claims

1. A new type of computer-assembled CPU heat dissipation device, characterized in that: It includes a main body mechanism (1), a mounting mechanism (2) and a heat dissipation mechanism (3). The mounting mechanism (2) is located inside the main body mechanism (1), and the heat dissipation mechanism (3) is located on top of the mounting mechanism (2). The main body mechanism (1) includes a main board (101). A card slot (102) is formed at the top of the main board (101), and a threaded hole (103) is formed at the top of the main board (101). A card board (104) is clamped inside the card slot (102). An installation board (105) is fixedly connected to the top of the card board (104). An installation hole (106) is formed at the top of the installation board (105). A connecting screw (107) is threadedly connected inside the installation hole (106). An installation shell (108) is fixedly connected to the inner side of the installation board (105).

2. A novel computer assembled CPU heat dissipation device according to claim 1, characterized in that: The number of the card slots (102) is two, and the two card slots (102) are distributed on the top surface of the main board (101). The number of the threaded holes (103) is four, and the four threaded holes (103) are provided at the top of the main board (101). The connecting screw (107) is threadedly connected inside the threaded hole (103). The number of the installation boards (105) is two, and both ends of the installation shell (108) are fixedly connected to the inner side surfaces of the two installation boards (105).

3. A novel computer assembled CPU heat dissipation device according to claim 1, characterized in that: The mounting mechanism (2) includes a CPU mounting platform (201). A placement groove (202) is formed at the top of the CPU mounting platform (201), and a CPU main body (203) is clamped inside the CPU mounting platform (201).

4. A novel computer assembled CPU heat dissipation device according to claim 3, characterized in that: The bottom of the CPU mounting platform (201) is fixedly connected to the top of the main board (101). The two installation boards (105) are symmetrically and evenly distributed on the surface of the main board (101) with the center of the top of the CPU mounting platform (201) as the symmetry center.

5. A novel computer-assembled CPU heat dissipation device according to claim 1, characterized in that: The heat dissipation mechanism (3) includes a heat absorption plate (301). Heat conduction tubes (302) are fixedly connected to both ends of the heat absorption plate (301). A heat dissipation plate (303) is fixedly connected to the surface of the heat conduction tube (302). A fan frame (304) is fixedly connected to the front of the heat dissipation plate (303). A fixing strip (305) is fixedly connected inside the fan frame (304). A rotating rod (306) is arranged inside the heat dissipation plate (303). A power connector (307) is fixedly connected to the rear end of the rotating rod (306). A fan blade (308) is arranged on the surface of the rotating rod (306).

6. The novel computer assembled CPU heat dissipation device according to claim 5, wherein: The bottom of the heat absorption plate (301) is connected to the top of the CPU main body (203). The number of the heat dissipation plates (303) is several, and the several heat dissipation plates (303) are evenly distributed on the surface of the heat conduction tube (302). Both ends are fixedly connected to the inner wall of the fan frame (304). The rotating rod (306) penetrates through the heat dissipation plate (303). The power connector (307) is arranged at the rear end of the heat dissipation plate (303). The number of the fan blades (308) is several, and the several fan blades (308) are symmetrically and evenly distributed on the surface with the center of the front of the rotating rod (306) as the symmetry center.

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