Jet flow liquid cooling heat dissipation device

Abstract

The utility model relates to the technical field of chip heat dissipation, and discloses a jet flow liquid cooling heat dissipation device. The jet flow liquid cooling heat dissipation device comprises a cover plate, wherein at least one water inlet head and two water outlet heads are arranged at the upper end of the cover plate; a water inlet cavity is formed in the bottom surface of the cover plate; the water inlet head is communicated with the water inlet cavity; the base is arranged on the bottom surface of the cover plate, a plurality of jet flow holes are formed in the base, a water outlet hole is formed in each of the two sides of the jet flow holes, the water outlet holes are communicated and connected with the water outlet head, and the jet flow holes are formed in the water inlet cavity; the chip assembly is arranged below the base and comprises a PCB (Printed Circuit Board) substrate and a chip, and the chip is electrically connected to the PCB substrate; wherein the bottom surface of the base is further provided with a receding cavity, the jet flow holes and the water outlet holes are respectively communicated and connected with the receding cavity, and the chip is arranged in the receding cavity. The jet flow liquid cooling heat dissipation device can improve the heat dissipation effect of the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a jet liquid cooling heat dissipation device. Background Art

[0002] With the rapid development of semiconductor technology, chips show a development trend of high integration, complexity and high frequency. Especially for the structure of multi-DIE chips, when the power is relatively large, the heat generated by the chips also increases, which has become a key factor hindering the improvement of chip performance and reliability. In order to ensure that the chips can exert the maximum performance and stability, the liquid cooling chip heat dissipation technology has been widely applied.

[0003] In the existing liquid cooling radiators, the newly injected coolant and the coolant originally stored in the radiator are in a mixed flow state, resulting in the coolant in the radiator being at a relatively high temperature for a long time. On the other hand, the flow channels of conventional radiators are relatively long, and the heat dissipation capacity of the coolant at the outlet section is weaker than that at the inlet section, resulting in unsatisfactory heat dissipation effect.

[0004] Therefore, there is an urgent need for a jet liquid cooling heat dissipation device to solve the above problems. Summary of the Utility Model

[0005] Based on the above, the purpose of the utility model is to provide a jet liquid cooling heat dissipation device to solve the problem of poor heat dissipation effect caused by the coolant in the existing water cooling radiator being at a relatively high temperature for a long time and the long flow channel of the radiator.

[0006] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0007] A jet liquid cooling heat dissipation device provided by the utility model includes:

[0008] A cover plate, an inlet head and at least one outlet head are arranged at the upper end of the cover plate; an inlet cavity is arranged at the bottom surface of the cover plate, and the inlet head is conductively connected to the inlet cavity;

[0009] A base, which is installed on the bottom surface of the cover plate. A plurality of jet holes are formed in the base, and outlet holes are respectively arranged on both sides of the plurality of jet holes. The outlet holes are conductively connected to the outlet heads, and the plurality of jet holes are arranged in the inlet cavity;

[0010] A chip assembly, which is installed below the base and includes a PCB substrate and a chip, and the chip is electrically connected to the PCB substrate;

[0011] Wherein, an avoidance cavity is further arranged on the bottom surface of the base, and the plurality of jet holes and the outlet holes are respectively conductively connected to the avoidance cavity, and the chip is placed in the avoidance cavity.

[0012] As an alternative technical solution of a jet liquid cooling and heat dissipation device, a confluence groove is formed on the bottom surface of the cover plate, and the confluence groove is conductively connected to the water outlet head.

[0013] As an alternative technical solution of a jet liquid cooling and heat dissipation device, both the confluence groove and the water outlet holes are in strip-shaped structures.

[0014] As an alternative technical solution of a jet liquid cooling and heat dissipation device, a sealing groove is provided around the avoidance cavity, and a sealing member is arranged in the sealing groove.

[0015] As an alternative technical solution of a jet liquid cooling and heat dissipation device, the chip assembly further includes a plurality of diffusion sheets, and the plurality of diffusion sheets are mounted on the upper end surface of the chip, and a plurality of capillary holes are provided on the diffusion sheets.

[0016] As an alternative technical solution of a jet liquid cooling and heat dissipation device, the plurality of diffusion sheets and the plurality of jet holes are both arranged in an array.

[0017] As an alternative technical solution of a jet liquid cooling and heat dissipation device, the cover plate and the base are hermetically assembled by welding, and an adhesive layer is provided between the base and the PCB substrate.

[0018] The beneficial effects of the present utility model are as follows:

[0019] A jet liquid cooling and heat dissipation device provided by the utility model includes: a cover plate, an inlet head and at least one outlet head are arranged on the upper end of the cover plate; an inlet cavity is arranged on the bottom surface of the cover plate, and the inlet head is conductively connected to the inlet cavity; a base, installed on the bottom surface of the cover plate, a plurality of jet holes are opened on the base, outlet holes are respectively arranged on both sides of the plurality of jet holes, the outlet holes are conductively connected to the outlet head, and the plurality of jet holes are placed in the inlet cavity; a chip assembly, installed below the base, including a PCB substrate and a chip, and the chip is electrically connected to the PCB substrate; wherein, a cavity avoidance is further arranged on the bottom surface of the base, the plurality of jet holes and the outlet holes are respectively conductively connected to the cavity avoidance, and the chip is placed in the cavity avoidance. Under the above structure, after the cover plate, the base and the chip assembly are assembled, a fence is formed between the inlet cavity and the confluence groove to isolate the inlet cavity from the confluence groove and the outlet holes, and the confluence groove, the outlet holes and the outlet head are conductively connected; when the coolant is injected from the inlet head into the inlet cavity under the action of positive pressure, and then jets to the chip or the diffusion sheet through a plurality of jet holes for heat dissipation, and finally under the action of negative pressure at both ends of the outlet head, the coolant is discharged from the outlet head through the outlet holes at both ends and the confluence groove in sequence, thus forming a water cycle; since the water injection path and the water output path of the coolant are isolated and separate routes, therefore, the newly injected coolant will not be confused with the coolant with a higher temperature remaining in the radiator, thus, the coolant jetting to the chip for heat dissipation remains at a lower temperature for a long time, improving the heat dissipation effect of the chip. On the other hand, the distance between the jet holes opened on the base and the chip is small, shortening the heat transfer path of the coolant, thereby improving the heat dissipation effect; when the coolant jets to the chip from the jet holes, a plurality of jet holes can evenly flush the coolant on the chip for heat dissipation, thus increasing the heat dissipation speed of the chip. Description of the Drawings

[0020] Figure 1 is an overall exploded schematic diagram of the jet liquid cooling and heat dissipation device of the utility model;

[0021] Figure 2 is a cross-sectional schematic diagram of the jet liquid cooling and heat dissipation device of the utility model;

[0022] Figure 3 is Figure 2 an enlarged schematic diagram of A in

[0023] Figure 4 is a bottom view of the cover plate in the embodiment of the utility model;

[0024] Figure 5 is a bottom view of the base in the embodiment of the utility model;

[0025] Figure 6 is a top view of the base in the embodiment of the utility model;

[0026] Figure 7It is the top view of the chip component in the embodiment of the present utility model;

[0027] Figure 8 It is the side view of the chip component in the embodiment of the present utility model.

[0028] In the figure: 1. Cover plate; 11. Water outlet head; 12. Water inlet head; 13. Water inlet cavity; 14. Confluence groove; 2. Base; 21. Water outlet hole; 22. Jet hole; 23. Sealing groove; 24. Avoidance cavity; 3. Chip component; 30. PCB substrate; 31. Chip; 32. Sealing member; 33. Diffusion sheet. Specific embodiments

[0029] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the sake of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0030] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0031] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is lower than that of the second feature.

[0032] In the description of this embodiment, the orientation or positional relationship such as "above", "below", "left", and "right" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0033] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0034] As Figures 1-8 shown, the present utility model provides a jet liquid cooling and heat dissipation device, which includes a cover plate 1. An inlet head 12 and at least one outlet head 11 are provided at the upper end of the cover plate 1; an inlet cavity 13 is provided on the bottom surface of the cover plate 1, and the inlet head 12 and the inlet cavity 13 are conductively connected; a base 2 is installed on the bottom surface of the cover plate 1, and a plurality of jet holes 22 are formed in the base 2. Outlet holes 21 are respectively provided on both sides of the plurality of jet holes 22, and the outlet holes 21 and the outlet heads 11 are conductively connected. The plurality of jet holes 22 are placed in the inlet cavity 13; a chip assembly 3 is installed below the base 2 and includes a PCB substrate 30 and a chip 31, and the chip 31 is electrically connected to the PCB substrate 30; wherein, a cavity avoidance 24 is further provided on the bottom surface of the base 2, and the plurality of jet holes 22 and the outlet holes 21 are respectively conductively connected to the cavity avoidance 24, and the chip 31 is placed in the cavity avoidance 24.

[0035] A jet liquid cooling and heat dissipation device provided by the present utility model forms a fence between the inlet cavity 13 and the confluence groove 14 to isolate the inlet cavity 13 from the confluence groove 14 and the outlet holes 21. The confluence groove 14, the outlet holes 21 and the outlet heads 11 are conductively connected to each other; when the coolant is injected from the inlet head 12 into the inlet cavity 13 under the action of positive pressure, and then jets to the chip 31 or the diffusion sheet 33 through a plurality of jet holes 22 for heat dissipation, and finally under the action of negative pressure of the two outlet heads 11, the coolant sequentially passes through the two outlet holes 21 and the confluence groove 14 and is discharged from the outlet heads 11. Thus, a water cycle is formed; since the water path for injecting the coolant and the water path for output are separate and isolated routes, therefore, it will not cause the newly injected coolant to be confused with the coolant with a higher temperature that originally remains in the radiator. Thus, the coolant jetting to the chip 31 for heat dissipation always maintains a lower temperature, improving the heat dissipation effect of the chip 31. On the other hand, the distance between the jet holes 22 formed in the base 2 and the chip 31 is relatively small, shortening the distance of heat transfer of the coolant, and thus improving the heat dissipation effect; when the coolant jets from the jet holes 22 to the chip 31, the plurality of jet holes 22 can evenly flush the coolant on the chip 31 for heat dissipation, thereby increasing the heat dissipation speed of the chip 31.

[0036] Specifically, as Figures 1-3As shown, there is one water inlet head 12, which is located at the middle position of the upper end of the cover plate 1. Preferably, there are two water outlet heads 11, which are arranged on the same axis on both sides of the water inlet head 12. It is also possible to set two water inlet heads 12 according to the heat dissipation requirement. The coolant flowing into the water inlet head 12 is injected by the positive pressure from the outside, and the coolant flowing out of the water outlet head 11 is output by the negative pressure from the outside, so as to form an optimal heat dissipation water cycle inside the whole heat dissipation device. The heat dissipation speed of the heat dissipation device for the chip 31 can also be changed by adjusting the pressures of the positive pressure and the negative pressure.

[0037] In this embodiment, as Figure 4 shown, on both sides of the bottom surface of the cover plate 1 located in the water inlet cavity 13, there is a strip-shaped confluence groove 14 respectively. The confluence groove 14 is conductively connected to the water outlet head 11. A baffle is formed between the confluence groove 14 and the water inlet cavity 13. After the cover plate 1 and the base 2 are welded or adhesively sealed and assembled, the jet holes 22 are located below the water inlet cavity 13. The baffle and the base 2 are closely attached to isolate the water inlet cavity 13 and the water outlet holes 21, so as to separate the water inlet route and the water outlet route into two separate waterways, and the heat dissipation effect will not be affected by the long-term mixing of water inlet and water outlet.

[0038] Furthermore, as Figure 5 and Figure 6 shown, a number of jet holes 22 are arranged in an array on the base 2, and the water outlet holes 21 are of a strip-shaped structure and are arranged on both sides of the number of jet holes 22 and are conductively connected to the confluence groove 14. The cavity avoidance 24 is opened on the bottom surface of the base 2, and the jet holes 22 and the water outlet holes 21 are both located in the cavity avoidance 24. A sealing groove 23 is provided around the cavity avoidance 24, and a sealing member 32 is provided in the sealing groove 23. The sealing member 32 can be an elastic sealing ring such as a rubber member or a silica gel member. The base 2 and the PCB substrate 30 are hermetically fixedly connected through an adhesive layer. When the base 2 and the PCB substrate 30 are assembled, the chip 31 is located in the cavity avoidance 24. The sealing ring closely adheres to the PCB substrate 30 under its own elastic force to form an effective sealing wall, further improving the sealing performance of the heat dissipation device.

[0039] Specifically, as Figure 7 and Figure 8As shown in the figure, a diffuser is provided on the chip 31. The diffuser is a copper or indium material layer with a number of capillary pores, which is a material structure with strong thermal conductivity. The coolant jets from the jet holes 22 onto the diffuser 33, enters the capillary pores under the action of positive pressure, and flows out from the water outlet holes 21 on both sides to absorb the heat generated by the chip 31 for heat dissipation. The setting of the capillary pores increases the contact area between the coolant and the diffuser 33, thereby enhancing the heat dissipation effect. In addition, the diffuser 33 can be arranged in an array structure, and each diffuser 33 corresponds to a chip 31 for heat dissipation. The distance between the diffuser 33 and the base 2 is preferably 0.5 mm. Therefore, when the coolant jets from the jet holes 22 onto the diffuser 33 and flows out from the water outlet holes 21 on both sides of the diffuser 33, the heat exchange distance therebetween is short, resulting in a better heat dissipation effect.

[0040] When the jet liquid cooling heat dissipation device of the present invention is in use, the coolant is injected into the water inlet chamber 13 from the water inlet head 12 under the action of positive pressure, jets through a number of jet holes 22 onto the diffuser 33 and enters the capillary pores for heat exchange, and finally is output from the water outlet head 11 through the water outlet holes 21 and the confluence groove 14 under the action of negative pressure, thus forming a high-efficiency liquid water circulation. The heat dissipation device separates the water circuits for inlet and outlet into separate circulation routes, avoiding confusion between the inlet and outlet water, resulting in the coolant being at a relatively high temperature for a long time, and a number of jet holes 22 evenly jet the coolant onto the diffuser 33 to shorten the heat exchange time to improve the heat dissipation effect. Moreover, the distance between the jet holes 22 and the diffuser 33 is short, so the heat exchange distance is short, resulting in a better heat dissipation effect.

[0041] The above is only a preferred embodiment of the present invention, and it does not impose any form of limitation on the present invention. Although the present invention is disclosed above in a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, when making some changes or modifications using the above-disclosed technical content as equivalent change equivalent embodiments, but as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical means of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A jet liquid cooling and heat dissipation device, characterized in that Comprising: A cover plate, an inlet head and at least one outlet head are provided at the upper end of the cover plate; an inlet cavity is provided on the bottom surface of the cover plate, and the inlet head is in conduction connection with the inlet cavity; A base, installed on the bottom surface of the cover plate, a plurality of jet holes are formed in the base, outlet holes are respectively arranged on both sides of the plurality of jet holes, the outlet holes are in conduction connection with the outlet heads, and the plurality of jet holes are arranged in the inlet cavity; A chip assembly, installed below the base, includes a PCB substrate and a chip, and the chip is electrically connected to the PCB substrate; Wherein, a cavity avoidance cavity is further provided on the bottom surface of the base, the plurality of jet holes and the outlet holes are respectively in conduction connection with the cavity avoidance cavity, and the chip is placed in the cavity avoidance cavity.

2. The jet liquid cooling and heat dissipation device according to claim 1, wherein A confluence groove is formed on the bottom surface of the cover plate, and the confluence groove is in conduction connection with the outlet head.

3. The jet liquid cooling and heat dissipation device according to claim 2, wherein Both the confluence groove and the outlet holes are in a strip-shaped structure.

4. A jet liquid cooling and heat dissipation device according to claim 1, characterized in that, A sealing groove is provided around the cavity avoidance cavity, and a sealing member is arranged in the sealing groove.

5. The jet liquid cooling and heat dissipation device according to claim 1, characterized in that The chip assembly further includes a plurality of diffusion sheets, the plurality of diffusion sheets are mounted on the upper end surface of the chip, and a plurality of capillary holes are provided on the diffusion sheets.

6. The jet liquid cooling and heat dissipation device according to claim 5, characterized in that, The plurality of diffusion sheets and the plurality of jet holes are both arranged in an array.

7. The jet liquid cooling and heat dissipation device according to claim 1, wherein, The cover plate and the base are hermetically assembled by welding, and an adhesive layer is provided between the base and the PCB substrate.

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