Novel optical transparent packaging structure
Optimizing the electrical path through the connection of lead frame and chip copper columns, solving the problem of excessive length of the line arc in traditional SO packaging structures, achieving higher production stability and packaging density.
Patent Information
- Application Number
- CN202422224929.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-11
AI Technical Summary
The wire drawing process of traditional SO packaging structures is complicated, resulting in excessive length of the wire arc, which increases production risks and costs.
The new optically transparent packaging structure is adopted to optimize the electrical connection path and reduce cross-wire and cross-chip arcs through the lead frame, copper column connection of the bottom and top chips.
It significantly reduces production risks and process difficulty, shortens the line length by more than half, reduces material use, and improves production stability and packaging density.
Smart Images
Figure CN223092885U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical packaging, in particular to a novel optical transparent packaging structure. Background Art
[0002] In the existing optical packaging technology, the traditional SO packaging structure has some obvious limitations. Especially in the product manufacturing process, due to the complexity of the wire bonding process, the wire arc length is too long, which not only increases the operation risk in the production process, but also raises the manufacturing cost. Summary of the Utility Model
[0003] The purpose of the utility model is to solve the deficiencies existing in the prior art, and to propose a novel optical transparent packaging structure.
[0004] In order to achieve the above purpose, the utility model adopts the following technical scheme: a novel optical transparent packaging structure, including:
[0005] A lead frame, on which pins and empty pins are provided;
[0006] A bottom chip disposed on the lead frame;
[0007] A top chip disposed on the bottom chip.
[0008] As a further description of the above technical solution:
[0009] A first copper pillar is provided on the bottom chip.
[0010] As a further description of the above technical solution:
[0011] A second copper pillar is provided on the top chip.
[0012] As a further description of the above technical solution:
[0013] Among the pins on the lead frame, four pins close to the side where the first copper pillar is located are connected to the first copper pillar through leads, and the first copper pillar is connected to the second copper pillar on the top chip close to the side where the first copper pillar is located through leads.
[0014] As a further description of the above technical solution:
[0015] Among the pins on the lead frame, four pins far from the side where the first copper pillar is located are connected to the second copper pillar on the top chip close to the side where the first copper pillar is located through leads.
[0016] The utility model has the following beneficial effects:
[0017] 1. Significantly reduces the product operation risk, reduces the process difficulty, and improves the stability of the production process and the reliability of the product by optimizing the design to reduce cross lines and cross-chip wire arcs.
[0018] 2. Effectively reduces the wire bonding length. Through the innovative packaging structure design, the wire length is significantly shortened by more than half, and at the same time, the arc height is reduced. This not only reduces the use of materials but also helps to reduce the overall thickness of the product and improve the packaging density. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 The upper view of a new optical transparent packaging structure proposed by the present utility model;
[0020] Figure 2 The side view of a new optical transparent packaging structure proposed by the present utility model.
[0021] Legend Explanation:
[0022] 1. Lead frame; 2. Bottom chip; 3. Top chip; 4. Pin; 5. Empty pin; 6. First copper pillar; 7. Second copper pillar. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0024] Refer to Figure 1-2 , an embodiment provided by the present utility model: a new optical transparent packaging structure, including:
[0025] A lead frame 1, on which pins 4 and empty pins 5 are provided;
[0026] A bottom chip 2 provided on the lead frame 1;
[0027] A top chip 3 provided on the bottom chip 2.
[0028] A first copper pillar 6 is provided on the bottom chip 2.
[0029] A second copper pillar 7 is provided on the top chip 3.
[0030] Four pins 4 on the lead frame 1 near the side where the first copper pillar 6 is located are connected to the first copper pillar 6 by leads, and the first copper pillar 6 is connected to the second copper pillar 7 on the top chip 3 near the side where the first copper pillar 6 is located by leads.
[0031] Four pins 4 on pin 4 away from the side where the first copper pillar 6 is located are connected to the second copper pillar 7 on the top chip 3 near the side where the first copper pillar 6 is located through leads.
[0032] The lead frame 1 is the foundation of the packaging structure and is usually made of a conductive material such as copper or copper alloy to ensure good electrical connection.
[0033] The lead frame 1 is designed with multiple pins 4 and empty pins 5. The pins 4 are used to connect to the external circuit, while the empty pins 5 are used for supporting the structure or as spare pins 4.
[0034] The bottom chip 2 is the first semiconductor chip in the packaging structure. It is fixed on the lead frame 1. The bottom chip 2 is provided with first copper pillars 6. These copper pillars are key parts of the electrical connection. They are made of a conductive material to ensure reliable connection with the top chip 3.
[0035] The top chip 3 is the second semiconductor chip in the packaging structure. It is placed on top of the bottom chip 2. The top chip 3 is provided with second copper pillars 7, corresponding to the copper pillars on the bottom chip 2 to achieve electrical connection.
[0036] Four pins 4 on the lead frame 1 near the side where the first copper pillar 6 is located are connected to the first copper pillar 6 through fine leads. These leads are made of a conductive material to ensure low-resistance and high-reliability electrical connection. The first copper pillar 6 is also connected to the second copper pillar 7 on the top chip 3 near the side where the first copper pillar 6 is located through a lead to form an electrical path.
[0037] Four pins 4 on pin 4 away from the side where the first copper pillar 6 is located are also connected to the second copper pillar 7 on the top chip 3 near the side where the first copper pillar 6 is located through leads, so as to ensure the realization of the electrical functions of the top chip 3.
[0038] Working principle:
[0039] Chip stacking: First, the bottom chip 2 is fixed on the lead frame 1, and then the top chip 3 is precisely placed on top of the bottom chip 2 to ensure the alignment of the copper pillars of the two.
[0040] Electrical connection: The pins 4 on the lead frame 1 are connected to the copper pillars on the bottom chip 2 and the top chip 3 through leads to form an electrical path. These leads not only provide electrical connection but also play a role in mechanical support.
[0041] Signal transmission: When the external circuit provides electrical signals to the packaging structure through the pins 4, these signals are transmitted to the chips through the leads and copper pillars to realize the functions of the chips.
[0042] The above structure significantly reduces the operation risk of the product, simplifies the process difficulty, and reduces the cross lines and cross-chip wire arcs through optimized design, thus improving the stability of the production process and the reliability of the product;
[0043] The above structure also effectively reduces the wire bonding length. Through the innovative package structure design, the wire length is significantly shortened by more than half, and at the same time, the arc height is reduced, which not only reduces the material usage but also helps to reduce the overall thickness of the product and improve the packaging density.
[0044] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A novel optically transparent encapsulation structure, characterized in that: Including: A lead frame (1) with pins (4) and blank pins (5) provided thereon; A bottom chip (2) disposed on the lead frame (1); A top chip (3) disposed on the bottom chip (2).
2. A novel optically transparent encapsulation structure according to claim 1, characterized in that: A first copper pillar (6) is provided on the bottom chip (2).
3. A novel optically transparent encapsulation structure according to claim 2, characterized in that: A second copper pillar (7) is provided on the top chip (3).
4. A novel optically transparent encapsulation structure according to claim 3, characterized in that: Four pins (4) on the lead frame (1) near the side where the first copper pillar (6) is located are connected to the first copper pillar (6) by leads, and the first copper pillar (6) is connected to the second copper pillar (7) on the top chip (3) near the side where the first copper pillar (6) is located by a lead.
5. A novel optically transparent encapsulation structure according to claim 4, wherein: Four pins (4) on the pins (4) away from the side where the first copper pillar (6) is located are connected to the second copper pillar (7) on the top chip (3) near the side where the first copper pillar (6) is located by leads.