Optical module

Abstract

The utility model provides an optical module, and the optical module comprises a power management chip which is provided with frequency selection pins, and the voltages of the frequency selection pins are different, so that the switching frequencies of the power management chip are different; the control switch comprises an output pin, a control pin and at least two input pins, and is used for controlling one input pin to be conducted with the output pin according to the control signal; the voltages of the at least two input pins are different, and the output pin is connected with a frequency selection pin of the power management chip; the MCU is connected with a control pin of the control switch; the MCU stores the working state of the power consumption device and a control signal corresponding to the working state, and the MCU is used for selectively outputting the control signal corresponding to the working state according to the working state. In the application, the MCU controls the input pin of the control switch to be connected with the output pin according to the working state, so as to adjust the voltage of the frequency selection pin of the power management chip, further adjust the switching frequency of the power management chip, and ensure the working efficiency of the power management chip.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber communication technologies, and particularly to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the progress of optical communication technologies has become increasingly important. In optical communication technologies, an optical module is a tool for realizing the mutual conversion of optical and electrical signals, and is one of the key components in optical communication devices. At the same time as the development of optical communication technologies, it is required that the transmission rate of optical modules continues to increase. Summary of the Utility Model

[0003] The present disclosure provides an optical module to adjust the switching frequency of a power management chip.

[0004] In some embodiments, an optical module is provided, including:

[0005] A circuit board, on the surface of which are provided:

[0006] A power consumption device;

[0007] A power management chip, connected to the input pin of the power consumption device to supply power to the power consumption device; the power management chip has a frequency selection pin, and different voltages of the frequency selection pin are used to make the switching frequency of the power management chip different;

[0008] A control switch, including an output pin, a control pin, and at least two input pins, for selecting one of the at least two input pins to conduct with the output pin according to a control signal; different voltages of the at least two input pins, and the output pin is connected to the frequency selection pin of the power management chip;

[0009] An MCU, the output pin of which is connected to the control pin of the control switch to output the control signal; the MCU includes a register, in which the working state of the power consumption device and the control signal corresponding to the working state are stored, and the MCU is used to select the control signal corresponding to the working state according to the working state of the power consumption device.

[0010] The above technical solution has the following beneficial effects: In this application, it is utilized that different voltages of the frequency selection pin of the power management chip will result in different switching frequencies of the power management chip. The MCU is adopted to control one of the multiple input pins of the control switch to be connected to the output pin according to the working state of the power-consuming device, so as to adjust the voltage of the frequency selection pin of the power management chip, and further adjust the switching frequency of the power management chip, thereby reducing the switching loss of the power management chip and ensuring the working efficiency of the power management chip. Therefore, the technical problem that the switching frequencies of the power management chip are the same under different working states of the power-consuming device is overcome.

[0011] In some embodiments, an optical module is provided, including: The input pins of the control switch include a first input pin and a second input pin, and the voltages of the first input pin and the second input pin are different. The MCU includes a first output pin or a second output pin, the control switch includes a first control pin or a second control pin, the first output pin is connected to the first control pin, the second output pin is connected to the second control pin, the control signal is output from the first output pin or the second output pin, and the control switch controls the first input pin or the second input pin to be connected to the output pin of the control switch according to the control signal.

[0012] The above technical solution has the following beneficial effects: By adjusting the input pins of the control switch, the voltage of the frequency selection pin of the power management chip is adjusted, and further the switching frequency of the power management chip is adjusted, thereby reducing the switching loss of the power management chip and ensuring the working efficiency of the power management chip.

[0013] In some embodiments, an optical module is provided, including: The input pins of the control switch include a first input pin, a second input pin, a third input pin, and a fourth input pin, and the voltages of the first input pin, the second input pin, the third input pin, and the fourth input pin are all different. The MCU includes a first output pin and a second output pin, the control switch includes a first control pin and a second control pin, the first output pin is connected to the first control pin, the second output pin is connected to the second control pin, the control signal is output from the first output pin and the second output pin, and the control switch controls the first input pin or the second input pin or the third input pin or the fourth input pin to be connected to the output pin of the control switch according to the control signal.

[0014] The above technical solution has the following beneficial effects: By adjusting the input pin of the control switch, the voltage of the frequency selection pin of the power management chip is adjusted, and then the switching frequency of the power management chip is adjusted, thereby reducing the switching loss of the power management chip and ensuring the working efficiency of the power management chip.

[0015] In some embodiments, an optical module is provided, including: A power supply circuit is disposed on the surface of the circuit board. The power supply circuit includes an MOS transistor. The MOS transistor is connected to the input pin of the power management chip and the first input pin of the MCU to supply power to the power management chip and the MCU.

[0016] The output pin of the MCU is connected to the control pin of the power consumption device to control the power consumption device to complete the working state switching.

[0017] The above technical solution has the following beneficial effects: The MCU controls the power consumption device to complete the working state switching to know the working state of the power consumption device.

[0018] In some embodiments, an optical module is provided, including: A power supply circuit is disposed on the surface of the circuit board. The power supply circuit includes a soft-start chip. The first output pin of the soft-start chip is connected to the input pin of the power management chip and the first input pin of the MCU to supply power to the power management chip and the MCU.

[0019] The second output pin of the soft-start chip is connected to the second input pin of the MCU to monitor the working current of the soft-start chip.

[0020] The above technical solution has the following beneficial effects: The MCU can monitor the working current of the soft-start chip to know the working state of the power consumption device.

[0021] In some embodiments, an optical module is provided, including: The power consumption device is a digital signal processing chip.

[0022] The above technical solution has the following beneficial effects, which can limit the range of the power consumption device and further limit the power consumption device to a digital signal processing chip.

[0023] In some embodiments, an optical module is provided, including: The first input pin is connected to a voltage source through a first resistor, the second input pin is grounded through a second resistor, the third input pin is connected to the voltage source through a third resistor, the third input pin is grounded through a fourth resistor, the resistance values of the first resistor and the third resistor are different, and the resistance values of the second resistor and the fourth resistor are different.

[0024] The above technical solution has the following beneficial effects: Different input pins are connected to a voltage source or grounded through different resistors, so that the voltages of different input pins are different. When the output pin of the control switch is connected to different input pins, the voltages of the frequency selection pins of the power management chip are different, and the switching frequencies of the power management chip are different.

[0025] In some embodiments, an optical module is provided, including: An LC oscillation circuit is provided between the power management chip and the power-consuming device. The LC oscillation circuit includes an inductor and a capacitor. One end of the inductor is connected to the output pin of the power management chip, the other end of the inductor is connected to one end of the capacitor and the input pin of the power-consuming device, and the other end of the capacitor is grounded.

[0026] The above technical solution has the following beneficial effects: The LC oscillation circuit can provide a stable oscillation signal, thereby ensuring the accuracy and real-time performance of data transmission.

[0027] In some embodiments, an optical module is provided, including: A capacitor and a resistor are provided on the surface of the circuit board. One end of the capacitor is connected to the source electrode of the MOS transistor, the other end of the capacitor is connected to one end of the resistor and the gate electrode of the MOS transistor, and the other end of the resistor is grounded.

[0028] The above technical solution has the following beneficial effects: The capacitor and the resistor form a matching circuit, and the matching resistor and the MOS transistor form a soft-start circuit to delay the startup of the power supply circuit.

[0029] In some embodiments, an optical module is provided, including: A tunable laser for emitting light;

[0030] A coherent optical component connected to the tunable laser.

[0031] The above technical solution has the following beneficial effects: The tunable laser is used to emit light, and the coherent optical component can modulate the light into an optical signal so that the optical module can emit an optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 It is a partial structural diagram of an optical communication system provided according to some embodiments;

[0034] Figure 2A partial structure diagram of a host computer provided according to some embodiments;

[0035] Figure 3 A structure diagram of an optical module provided according to some embodiments;

[0036] Figure 4 An exploded view of an optical module provided according to some embodiments;

[0037] Figure 5 A structure diagram of a power supply circuit provided according to some embodiments;

[0038] Figure 6 A structure diagram of another power supply circuit provided according to some embodiments;

[0039] Figure 7 The internal structure principle of an optical module provided according to some embodiments Figure 1 ;

[0040] Figure 8 The internal structure principle of an optical module provided according to some embodiments Figure 2 ;

[0041] Figure 9 The internal structure principle of an optical module provided according to some embodiments Figure 3 ;

[0042] Figure 10 The internal structure principle of an optical module provided according to some embodiments Figure 4 ;

[0043] Figure 11 Another internal structure diagram of an optical module provided according to some embodiments;

[0044] Figure 12 Another internal structure principle of an optical module provided according to some embodiments Figure 1 ;

[0045] Figure 13 A structure diagram of an LC oscillator circuit provided according to some embodiments;

[0046] Figure 14 Another internal structure principle of an optical module provided according to some embodiments Figure 2 。 Detailed implementation manners

[0047] Next, some embodiments of the present disclosure will be clearly and detailedly described in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0048] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is construed in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or an upper limit on quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one, can be a direct connection, or can be indirectly connected through an intermediate medium; the use of the term "adapted to" or "configured to" implies open and inclusive language and does not exclude a device adapted to or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "identical", "consistent", "flush", etc. do not limit to absolute mathematical theory relationships, but also include an acceptable error range arising in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0049] In optical communication technology, in order to establish information transfer between information processing devices, it is necessary to load information onto light and utilize the propagation of light to achieve information transfer. Here, the light loaded with information is the optical signal. When the optical signal is transmitted in the information transmission device, the loss of optical power can be reduced, so that high-speed, long-distance, and low-cost information transfer can be achieved. The signals that information processing devices can recognize and process are electrical signals. Information processing devices generally include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablet computers, televisions, etc., and information transmission devices generally include optical fibers and optical waveguides, etc.

[0050] The optical module can realize the mutual conversion between optical signals and electrical signals between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information can be transmitted between multiple information processing devices through electrical signals, therefore, at least one of the multiple information processing devices needs to be directly connected to the optical module, without all the information processing devices being directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0051] Figure 1 Partial structural diagram of an optical communication system provided according to some embodiments. As Figure 1 shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0052] One end of the optical fiber 101 extends in the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0053] The optical communication system may include one or more optical fibers 101, and the optical fiber 101 is detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0054] The host computer 100 includes a housing generally in the shape of a cuboid, and an optical module connection hole 102 provided on the housing. The optical module connection hole 102 is configured to access the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0055] The host computer 100 further includes an external electrical connection hole, which can access an electrical signal network. For example, the external electrical connection hole includes a Universal Serial Bus (USB) connection hole or a network cable connection hole 104. The network cable connection hole 104 is configured to access a network cable 103, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal and transmits the fourth electrical signal into the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. In the above process of converting optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information may change.

[0056] In addition to including an optical network terminal, the host computer 100 further includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0057] Figure 2 It is a partial structure diagram of a host computer provided according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the radiator 107 has raised structures such as fins for increasing the heat dissipation area.

[0058] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 fixes the optical module 200, and the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing a two-way electrical signal connection between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, thereby establishing a two-way optical signal connection between the optical module 200 and the optical fiber 101.

[0059] Figure 3 It is a structural diagram of an optical module provided according to some embodiments. Figure 4 It is an exploded view of an optical module provided according to some embodiments. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a tunable laser 901, and a coherent optical component 902.

[0060] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell having two openings 204 and 205; the outer contour of the shell generally presents a rectangular body.

[0061] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0062] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to realize the upper shell 201 covering the lower shell 202.

[0063] The direction where the line connecting the two openings 204 and 205 is located may be consistent with the length direction of the optical module 200 or may not be consistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 the right end), and the opening 205 is also located at the end of the optical module 200 ( Figure 3The left end). Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port and is configured to access the external optical fiber 101 so that the optical fiber 101 connects the tunable laser 901 and the coherent optical component 902 in the optical module 200.

[0064] Adopting the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the tunable laser 901, the coherent optical component 902, etc. into the above-mentioned housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices. In addition, when assembling the circuit board 300, the tunable laser 901, the coherent optical component 902, etc., it is convenient for the deployment of the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0065] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

[0066] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer or to release the fixed connection between the optical module 200 and the host computer.

[0067] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging component of the unlocking component 600; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the fixation of the optical module 200 to the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0068] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components can include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips can include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0069] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connectors in the cage 106 of the host computer 100.

[0070] The circuit board 300 also includes a gold finger formed on its end surface. The gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is electrically connected to the electrical connectors in the cage 106. The gold finger can be provided only on the surface of one side of the circuit board 300 (for example, Figure 4 the upper surface shown), or can be provided on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions with a large demand for the number of pins. The gold finger is configured to establish an electrical connection with the host computer to achieve functions such as power supply, grounding, inter-integrated circuit (I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in cooperation with rigid circuit boards as a supplement to rigid circuit boards.

[0071] The tunable laser 901 is connected to the circuit board 300 and is used to emit light.

[0072] The optical module also includes a transmitting fiber optic adapter and a receiving fiber optic adapter. The transmitting fiber optic adapter is used to transmit high-frequency optical signals, and the receiving fiber optic adapter is used to receive high-frequency optical signals.

[0073] The coherent optical component 902 is placed on the circuit board and is used to implement the conversion of high-speed optoelectronic signals. Specifically, the coherent optical component 902 includes an optical emission interface, an optical reception interface, and a local oscillator optical interface. The optical emission interface extends out a first optical fiber, the optical reception interface extends out a second optical fiber, and the local oscillator optical interface extends out a third optical fiber. The optical emission interface is connected to the transmitting fiber optic adapter, the optical reception interface is connected to the receiving fiber optic adapter, and the local oscillator optical interface is connected to the tunable laser 901. The first optical fiber, the second optical fiber, and the third optical fiber form an optical fiber array. The coherent optical component is connected to the transmitting fiber optic adapter, the receiving fiber optic adapter, and the tunable laser 901 respectively through the optical fiber array. The coherent optical component 902 is also connected to the DSP chip.

[0074] The light emitted by the tunable laser 901 is input into the coherent optical component 902 through the local oscillator optical interface, and the laser is split inside the coherent optical component 902. One of the beams is used as the transmitted beam and enters the coherent modulation chip inside the coherent optical component. Under the drive of the high-frequency electrical signal of the DSP chip, electro-optic signal conversion is realized, and the converted high-frequency optical signal is output from the optical emission interface of the module; the other beam is used as the local oscillator beam and is coherently demodulated with the high-frequency optical signal input into the coherent optical component 902 from the optical reception port of the module. The demodulated electrical signal enters the DSP chip for signal processing, thus completing the optoelectronic signal conversion.

[0075] In some embodiments, a power management chip 303 may be provided on the surface of the circuit board 300. The power management chip 303 can convert the input voltage into the required output voltage to supply power to the electrical appliances. The electrical appliances can be an MCU or a power-consuming device.

[0076] The power management chip 303 adjusts the output voltage and the magnitude of the voltage by controlling the on / off of the switch. Among them, the switching frequency is an important parameter affecting the efficiency. The switching frequency determines the speed of output voltage or current regulation, and thus affects the working efficiency of the power management chip. Generally, a higher switching frequency can achieve a faster regulation speed, which is beneficial for application scenarios that require fast response. However, a higher switching frequency will also bring some problems, such as increasing the complexity and cost of the circuit. In addition, too high a switching frequency will cause relatively large switching losses, thereby reducing the working efficiency. Therefore, selecting an appropriate switching frequency is crucial for optimizing the working efficiency of the power management chip.

[0077] The power management chip 303 may include a frequency selection pin. When the voltage of the frequency selection pin changes, the switching frequency of the power management chip 303 changes. Exemplarily, when the voltage of the frequency selection pin increases from small to large, the switching frequency of the power management chip 303 increases from small to large.

[0078] In some embodiments, an MCU 301 may be disposed on the surface of the circuit board 300. When the operating voltage required by the MCU 301 is equal to the voltage provided by the gold finger, the voltage provided by the gold finger does not need to be transmitted to the MCU 301 through the power management chip 303. When the operating voltage required by the MCU 301 is not equal to the voltage provided by the gold finger, the voltage provided by the gold finger is transmitted to the MCU 301 through the power management chip 303.

[0079] Taking the case where the operating voltage required by the MCU 301 is equal to the voltage provided by the gold finger as an example, the power supply circuit of the optical module is introduced. Figure 5 It is a structural diagram of a power supply circuit provided according to some embodiments. As Figure 5 shown, in some embodiments, the power supply circuit 360 may include an MOS transistor 361. The source electrode of the MOS transistor 361 is connected to the power supply gold finger through a circuit trace, and the power supply gold finger supplies power to the MOS transistor 361 through the circuit trace. The drain electrode of the MOS transistor 361 may be connected to the power supply pin of the power management chip 303 and the power supply pin of the MCU 301 to supply power to the MCU 301 and the power management chip 303.

[0080] When the voltage difference between the drain electrode and the gate electrode of the MOS transistor 361 is less than the threshold value, the MOS transistor 361 is turned on. After the MOS transistor 361 is turned on, power can be supplied to the power management chip 303 and the MCU 301.

[0081] In some embodiments, the power supply circuit 360 may include a capacitor C x 362 and a resistor R x 363. One end of the capacitor C x 362 may be connected to the source electrode of the MOS transistor 361, and the other end of the capacitor C x 362 may be connected to the gate electrode of the MOS transistor 361. One end of the resistor R x 363 may be connected to the other end of the capacitor C x 362, and the other end of the resistor R x 363 may be grounded.

[0082] The capacitor C x 362 and the resistor R x 363 form a matching circuit. The larger the RC value of the matching circuit, the longer the power-on time. The matching circuit and the MOS transistor 361 form a soft-start circuit. The RC value of the matching circuit affects the power-on time of the soft-start circuit, that is, the RC value of the matching circuit affects the power-on time of the MOS transistor 361. Among them, the R value is the resistance value of the resistor R x and the C value is the capacitance value of the capacitor C x .

[0083] Figure 6The structural diagram of another power supply circuit provided according to some embodiments is as follows. As Figure 6 shown, in some embodiments, the power supply circuit 360 may include a soft-start chip 364. The input pin of the soft-start chip 364 is connected to the power supply gold finger through circuit traces, and the power supply gold finger supplies power to the soft-start chip 364 through circuit traces. The first output pin 3641 of the soft-start chip 364 may be connected to the input pin 331 of the power management chip 303 and the first input pin 312 of the MCU 301, so that the soft-start chip 364 can supply power to the power management chip 303 and the MCU 301. The second output pin 3642 of the soft-start chip 364 may be connected to the second input pin 314 of the MCU 301, so that the MCU 301 can monitor the working current of the second output pin 3642 of the soft-start chip 364.

[0084] As Figure 4 shown, in some embodiments, a power consumption device 304 may be provided on the surface of the circuit board 300. The power consumption device 304 is connected to the output pin 333 of the power management chip 303, so that the power consumption device 304 operates under the supply voltage provided by the power management chip 303.

[0085] In some embodiments, the power consumption device 304 may be a DSP chip 341, that is, the DSP chip 341 is connected to the output pin 333 of the power management chip 303, so that the power management chip 303 supplies power to the DSP chip 341. The working state of the DSP chip 341 may include at least two types, and each working state of the DSP chip 341 corresponds to a working current. The working state of the DSP chip 341 may characterize the rate of data processing of the DSP chip 341. By way of example, the rate of data processing characterized by the working state of the DSP chip 341 may be 400G.

[0086] The power consumption of the DSP chip accounts for the main part of the entire optical module. The power supply circuit for supplying power to the DSP chip, that is, the working efficiency of the power management chip, will affect the overall power consumption of the entire optical module. The working efficiency of the power management chip is related to the working current of the DSP chip and the switching frequency of the power management chip. The working current of the DSP chip 341 is related to the working state of the DSP chip 341, that is, when the working state of the DSP chip 341 changes, the working current of the DSP chip 341 changes. If the working current of the DSP chip 341 changes and the switching frequency of the power management chip remains unchanged, it may cause an increase in the switching losses of the power management chip (including turn-on losses and turn-off losses. Turn-on losses occur when the power transistor of the power management chip changes from the cut-off state to the on state, while turn-off losses occur when the power transistor of the power management chip changes from the on state to the cut-off state), resulting in a decrease in the working efficiency of the power management chip.

[0087] Figure 7 The internal structure principle of an optical module provided according to some embodiments Figure 1 . Figure 8 The internal structure principle of an optical module provided according to some embodiments Figure 2 . As Figure 7 and Figure 8 shown, to solve this problem, in some embodiments, the output pin 333 of the power management chip 303 is connected to the input pin 3411 of the DSP chip 341. The MCU 301 can dynamically adjust the switching frequency of the power management chip 303 according to the working state of the DSP chip 341, so that the switching frequency of the power management chip 303 is appropriate to reduce the switching loss of the power management chip, and further ensure the working efficiency of the power management chip 303.

[0088] In some embodiments, the MCU 301 can send a control signal corresponding to the working state according to the working state of the DSP chip 341.

[0089] In some embodiments, the MCU 301 can determine the working state of the DSP chip 341 according to the control instruction sent by the host computer. The third output pin 313 of the MCU 301 can be connected to the control pin 3412 of the DSP chip 341, so that the MCU can first control the DSP chip 341 to switch the working state according to the control instruction sent by the host computer, and then send a control signal corresponding to the switched working state.

[0090] In some embodiments, the MCU can determine the working state of the DSP chip 341 according to the working current in the power supply circuit. The second input pin 314 of the MCU 301 can be connected to the second output pin of the soft start chip 364, so that the MCU can read the working current of the soft start chip 364 and determine the working state of the DSP chip 341 according to the working current. The MCU sends a control signal corresponding to the working state of the DSP chip 341.

[0091] In some embodiments, a control switch 302 can be arranged on the surface of the circuit board 300. The control pin 322 of the control switch 302 can be connected to the output pin 315 of the MCU 301 to receive the control signal sent by the MCU 301.

[0092] The control switch 302 may include at least two input pins 323 with different voltages. The control switch 302 may control the conduction between one input pin and the output pin 321 according to the received control signal. Exemplarily, the control signal includes a first control signal and a second control signal. The control switch 302 may control the conduction between the first input pin and the output pin 321 according to the first control signal, and the control switch 302 may control the conduction between the second input pin and the output pin 321 according to the second control signal.

[0093] The voltages of different input pins of the control switch 302 are different. When different input pins are conducted with the output pin 321, the voltage of the output pin 321 of the control switch 302 is also different.

[0094] The output pin 321 of the control switch 302 may be connected to the frequency selection pin 332 of the power management chip 303. When the voltage of the output pin 321 of the control switch 302 changes, the voltage of the frequency selection pin 332 of the power management chip 303 changes, and the switching frequency of the power management chip 303 also changes.

[0095] The number of operating states of the DSP chip 341 is less than or equal to the number of input pins of the control switch 302. The number of voltages of the frequency selection pin 332 of the power management chip 303 corresponds at least to the number of operating states of the DSP chip 341, so that the number of switching frequencies of the power management chip 303 corresponds at least to the number of operating states of the DSP chip 341.

[0096] Figure 9 For the internal structure principle of an optical module provided according to some embodiments Figure 3 。 Figure 9 For the case where the power consumption device has two operating states. As Figure 9 shown, in some embodiments, the MCU 301 may include a register 311, and the register 311 may store multiple operating states of the DSP chip 341 and the control signals corresponding to each operating state. Exemplarily, the register stores the first operating state of the DSP chip 341 and the first control signal, and the first operating state corresponds to the first control signal; the register stores the second operating state of the DSP chip 341 and the second control signal, and the second operating state corresponds to the second control signal.

[0097] In some embodiments, when the MCU 301 receives a control instruction sent by the host computer, it first controls the DSP chip 341 to switch from one operating state to another operating state, and then selects and outputs the control signal corresponding to the switched operating state from the register.

[0098] In some embodiments, the register 311 of the MCU 301 may store the operating current of the soft-start chip 364 and the operating state of the DSP chip 341 corresponding to the operating current. The MCU 301 may determine the operating state of the DSP chip 341 according to the operating current of the soft-start chip 364 of the power supply circuit 306, and select a control signal corresponding to the operating state from the register 311 for output.

[0099] In some embodiments, the output pin 315 may include a first output pin 3151. The first output pin 3151 may output a first control signal or a second control signal.

[0100] In some embodiments, the output pin 315 may include a second output pin 3152. The second output pin 3152 may output a first control signal or a second control signal.

[0101] The MCU 301 may select the first output pin 3151 or the second output pin 3152 to output a control signal, so that the MCU 301 can output a first control signal or a second control signal. At this time, the first control signal is 0 and the second control signal is 1; or, the first control signal is 1 and the second control signal is 0.

[0102] In some embodiments, the control pin 322 may include a first control pin 3221. The first control pin 3221 may be connected to the first output pin 3151 of the MCU 301 to facilitate the transmission of the control signal from the MCU 301 to the control switch 302.

[0103] In some embodiments, the control pin 322 may include a second control pin 3222. The second control pin 3222 may be connected to the second output pin 3152 of the MCU 301 to facilitate the transmission of the control signal from the MCU 301 to the control switch 302.

[0104] The MCU 301 may select the first output pin 3151 or the second output pin 3152 to output a control signal, then the first control pin 3221 or the second control pin 3222 of the control switch 302 receives the control signal. Exemplarily, when the first output pin 3151 of the MCU 301 outputs a control signal, the first control pin 3221 of the control switch 302 receives the control signal; when the second output pin 3152 of the MCU 301 outputs a control signal, the second control pin 3222 of the control switch 302 receives the control signal.

[0105] In some embodiments, at least two input pins 323 may include a first input pin 3231 and a second input pin 3232. The first input pin 3231 is connected to a voltage source through a first resistor R1, and the second input pin 3232 is grounded through a second resistor R2, so that the voltages of the first input pin 3231 and the second input pin 3232 are different.

[0106] The MCU 301 outputs a control signal corresponding to the operating state of the DSP chip 341. The control switch 302 controls the conduction of the first input pin 3231 or the second input pin 3232 and the output pin 321 according to the control signal, so as to adjust the voltage of the frequency selection pin 332 of the power management chip 303, and further adjust the switching frequency of the power management chip 303. Exemplarily, the MCU 301 outputs a first control signal corresponding to the first operating state of the DSP chip 341. The control switch 302 controls the conduction of the first input pin 3231 and the output pin 321 according to the first control signal. The voltage of the frequency selection pin 332 of the power management chip 303 is a first voltage value, and the switching frequency of the power management chip 303 is a first frequency value. The MCU 301 outputs a second control signal corresponding to the second operating state of the DSP chip 341. The control switch 302 controls the conduction of the second input pin 3232 and the output pin 321 according to the second control signal. The voltage of the frequency selection pin 332 of the power management chip 303 is a second voltage value, and the switching frequency of the power management chip 303 is a second frequency value.

[0107] Figure 10 For the internal structure principle of an optical module provided according to some embodiments Figure 4 。 Figure 10 For the case where the DSP chip 341 has four operating states. As Figure 10 shown, in some embodiments, the output pin 315 may include a first output pin 3151 and a second output pin 3152. Both the first output pin 3151 and the second output pin 3152 can output control signals, so that the MCU 301 can output a first control signal or a second control signal or a third control signal or a fourth control signal. The first control signal at this time may be 00, the second control signal may be 01, the third control signal may be 10, and the fourth control signal may be 11.

[0108] In some embodiments, the control pin 322 may include a first control pin 3221 and a second control pin 3222. The first control pin 3221 may be connected to the first output pin 3151 of the MCU 301, and the second control pin 3222 may be connected to the second output pin 3152 of the MCU 301, so as to output the control signal from the first output pin 3151 and the second output pin 3152 of the MCU 301, and then receive it by the first control pin 3221 and the second control pin 3222 of the control switch 302.

[0109] In some embodiments, at least two input pins 323 may include a first input pin 3231, a second input pin 3232, a third input pin 3233, and a fourth input pin 3234. The first input pin 3231 is connected to the voltage source through a first resistor R1, the third input pin 326 is connected to the voltage source through a third resistor R3, the second input pin 3232 is grounded through a second resistor R2, and the fourth input pin 3234 is grounded through a fourth resistor R4.

[0110] The resistance values of the first resistor R1 and the third resistor R3 are different, so that the voltages of the first input pin 3231 and the third input pin 3233 are different. The resistance values of the second resistor R2 and the fourth resistor R4 are different, so that the voltages of the second input pin 3232 and the fourth input pin 3234 are different, and further the voltages of the first input pin 3231, the second input pin 3232, the third input pin 3233, and the fourth input pin 3234 are all different. When the output pin 321 of the control switch 302 is connected to different input pins, the voltages of the frequency selection pin 332 of the power management chip 303 are different, and the switching frequencies of the power management chip 303 are different.

[0111] The MCU 301 outputs a control signal corresponding to the working state of the DSP chip 341. The control switch 302 controls the first input pin 3231 or the second input pin 3232 or the third input pin 3233 or the fourth input pin 3234 to conduct with the output pin 321 according to the control signal, so as to adjust the voltage of the frequency selection pin 332 of the power management chip 303, and further adjust the switching frequency of the power management chip 303.

[0112] Figure 11 It is an internal structure diagram of another optical module provided according to some embodiments. Figure 12 It is the internal structure principle of another optical module provided according to some embodiments Figure 1 . Such as Figure 11 and Figure 12As shown, in some embodiments, an LC oscillator circuit 305 may be provided on the surface of the circuit board 300. The LC oscillator circuit 305 is used to generate a stable oscillation signal. The input end of the LC oscillator circuit 305 may be connected to the output pin of the power management chip 303, and the output end of the LC oscillator circuit 305 may be connected to the input pin of the power-consuming device 304 to provide a stable oscillation signal, thereby ensuring the accuracy and real-time performance of data transmission.

[0113] Figure 13 FIG. is a structural diagram of an LC oscillator circuit provided according to some embodiments. Figure 14 FIG. is the internal structure principle of another optical module provided according to some embodiments Figure 2 . As Figure 13 and Figure 14 shown, in some embodiments, the LC oscillator circuit 305 may include an inductor L351 and a capacitor C y 352. One end of the inductor L351 serves as the input end of the LC oscillator circuit 305, and the input end of the LC oscillator circuit 305 is connected to the output pin of the power management chip 303. The other end of the inductor L351 may be connected to one end of the capacitor C y , and the other end of the capacitor C y 352 is grounded. The other end of the inductor L351 and one end of the capacitor C y 352 serve as the output end of the LC oscillator circuit 305, and the output end of the LC oscillator circuit 305 is connected to the power-consuming device 304.

[0114] When the capacitor is charged, energy is stored in the electric field; when the inductor is energized, energy is stored in the magnetic field. Through the alternating conversion of energy between these two components, the LC oscillator circuit can maintain a stable oscillation state to provide a stable oscillation signal.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, and are not intended to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that, Comprising: A circuit board, on the surface of which are provided: Power consumption devices; A power management chip, connected to the input pins of the power consumption devices to supply power to the power consumption devices; The power management chip has a frequency selection pin, and different voltages of the frequency selection pin are used to make the switching frequency of the power management chip different; A control switch, including an output pin, a control pin, and at least two input pins, for selecting one of the at least two input pins to conduct with the output pin according to a control signal; The voltages of the at least two input pins are different, and the output pin is connected to the frequency selection pin of the power management chip; An MCU, the output pin of which is connected to the control pin of the control switch to output the control signal; the MCU includes a register, in which the working state of the power consumption device and the control signal corresponding to the working state are stored, and the MCU is used to select the control signal corresponding to the working state according to the working state of the power consumption device.

2. The optical module according to claim 1, wherein The input pins of the control switch include a first input pin and a second input pin, the voltages of the first input pin and the second input pin are different, the MCU includes a first output pin or a second output pin, the control switch includes a first control pin or a second control pin, the first output pin is connected to the first control pin, the second output pin is connected to the second control pin, the control signal is output by the first output pin or the second output pin, and the control switch controls the first input pin or the second input pin to be connected to the output pin of the control switch according to the control signal.

3. The optical module according to claim 1, characterized in that, The input pins of the control switch include a first input pin, a second input pin, a third input pin, and a fourth input pin, the voltages of the first input pin, the second input pin, the third input pin, and the fourth input pin are all different, the MCU includes a first output pin and a second output pin, the control switch includes a first control pin and a second control pin, the first output pin is connected to the first control pin, the second output pin is connected to the second control pin, the control signal is output by the first output pin and the second output pin, and the control switch controls the first input pin or the second input pin or the third input pin or the fourth input pin to be connected to the output pin of the control switch according to the control signal.

4. The optical module according to claim 1, wherein A power supply circuit is provided on the surface of the circuit board, the power supply circuit includes a MOS transistor, and the MOS transistor is connected to the input pin of the power management chip and the first input pin of the MCU to supply power to the power management chip and the MCU; The output pin of the MCU is connected to the control pin of the power consumption device to control the power consumption device to complete the working state switching.

5. The optical module according to claim 1, wherein A power supply circuit is provided on the surface of the circuit board. The power supply circuit includes a soft-start chip. The first output pin of the soft-start chip is connected to the input pin of the power management chip and the first input pin of the MCU to supply power to the power management chip and the MCU. The second output pin of the soft-start chip is connected to the second input pin of the MCU to monitor the working current of the soft-start chip.

6. The optical module according to claim 1, wherein The power consumption device is a digital signal processing chip.

7. The optical module according to claim 3, wherein The first input pin is connected to a voltage source through a first resistor, the second input pin is grounded through a second resistor, the third input pin is connected to a voltage source through a third resistor, the third input pin is grounded through a fourth resistor, the resistance values of the first resistor and the third resistor are different, and the resistance values of the second resistor and the fourth resistor are different.

8. The optical module according to claim 1, wherein, An LC oscillation circuit is provided between the power management chip and the power consumption device. The LC oscillation circuit includes an inductor and a capacitor. One end of the inductor is connected to the output pin of the power management chip, the other end of the inductor is connected to one end of the capacitor and the input pin of the power consumption device, and the other end of the capacitor is grounded.

9. The optical module according to claim 4, characterized in that, Capacitors and resistors are provided on the surface of the circuit board. One end of the capacitor is connected to the source electrode of the MOS transistor, the other end of the capacitor is connected to one end of the resistor and the gate electrode of the MOS transistor, and the other end of the resistor is grounded.

10. The optical module according to claim 1, wherein The optical module further includes: A tunable laser for emitting light; A coherent optical component connected to the tunable laser.

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