Clamping type mobile phone heat dissipation support

Abstract

The utility model discloses a clamping type mobile phone heat radiation support which comprises a substrate, a front plate, a heat radiator, a semiconductor chilling plate, a control panel, a first clamping arm, a second clamping arm and a rear cover. The front plate is mounted on the front side of the substrate, the radiator is mounted on the rear side of the substrate, the substrate is provided with a positioning cavity, the semiconductor chilling plate is mounted in the positioning cavity, the front side of the semiconductor chilling plate is in contact with the front plate, the rear side of the semiconductor chilling plate is in contact with the radiator, and the control plate is mounted on the radiator and electrically connected with the semiconductor chilling plate. The first clamping arm is installed between the substrate and the left end of the radiator, the second clamping arm is installed between the substrate and the right end of the radiator, and the first clamping arm and the second clamping arm can move in the opposite direction or in the opposite direction. According to the utility model, the mobile phone can be conveniently clamped, the heat of the mobile phone can be transferred to the radiator by using the semiconductor chilling plate, and then the heat is radiated outwards through the radiator, so that the mobile phone is prevented from being continuously heated and hot, and the mobile phone is prevented from being damaged by high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone holders, in particular to a clamping type mobile phone heat dissipation holder. Background Art

[0002] At present, with the popularization of mobile devices such as mobile phones, mobile phone holders have also been widely used. In the prior art, a mobile phone holder usually includes a base and a clamping arm installed on the base. When in use, the base is fixed on a support fixing frame or other fixing mechanisms, and then the mobile phone is clamped between the clamping arms. Users can fix the mobile phone on the car console, bicycle or other occasions by using the mobile phone holder, and can also play games, watch TV dramas and live broadcasts more conveniently by using the mobile phone holder. However, the existing mobile phone holders usually do not have a heat dissipation function. After users play games, watch TV dramas and live broadcasts for a long time, the mobile phone will continuously heat up and become hot, and the generated high temperature is likely to damage the mobile phone. Summary of the Invention

[0003] The technical problem to be solved by the utility model is to provide a clamping type mobile phone heat dissipation holder in view of the deficiencies in the above-mentioned prior art. The mobile phone heat dissipation holder can conveniently clamp the mobile phone by using a first clamping arm and a second clamping arm, and during the process of clamping the mobile phone, the heat of the mobile phone can be transferred to a radiator by using a semiconductor refrigeration sheet, and then the heat is dissipated outward through the radiator, so as to avoid the mobile phone continuously heating up and becoming hot and avoid damage to the mobile phone caused by high temperature.

[0004] To solve the above technical problem, the technical solution of the utility model is: a clamping type mobile phone heat dissipation holder, including a base plate, a front plate, a radiator, a semiconductor refrigeration sheet, a control board, a first clamping arm, a second clamping arm and a rear cover; the front plate is installed on the front side of the base plate, the radiator is installed on the rear side of the base plate, the base plate is provided with a positioning cavity, the semiconductor refrigeration sheet is installed in the positioning cavity, the front side of the semiconductor refrigeration sheet is in contact with the front plate, the rear side of the semiconductor refrigeration sheet is in contact with the radiator, the control board is installed on the radiator and is electrically connected to the semiconductor refrigeration sheet, the first clamping arm is installed between the left ends of the base plate and the radiator, the second clamping arm is installed between the right ends of the base plate and the radiator, and the first clamping arm and the second clamping arm can move towards each other or away from each other.

[0005] Preferably, a cooling fan is installed on the rear side of the radiator, the control board is electrically connected to the cooling fan, and the rear cover is provided with a plurality of ventilation holes.

[0006] Preferably, two positioning cavities are arranged side by side on the base plate, a semiconductor refrigeration sheet is installed in each positioning cavity, the number of the cooling fans is two, and the positions of the two semiconductor refrigeration sheets correspond to the positions of the two cooling fans front and back.

[0007] Preferably, the control board is installed at the rear side of the middle part of the radiator and located in the area between the two cooling fans. A USB TYPE-C socket, control buttons and a digital display are provided on the control board, and a light-transmitting mirror corresponding to the digital display is provided on the rear cover.

[0008] Preferably, a cylindrical shell is connected to the middle part of the rear cover, and a support connecting cylinder is installed inside the cylindrical shell. A cylindrical hole for inserting an external support rod is provided inside the support connecting cylinder.

[0009] Preferably, the first clamping arm and the second clamping arm respectively include a sliding part and a clamping part connected to the outer end of the sliding part. The clamping parts of the first clamping arm and the second clamping arm are opposite to each other left and right. A spring is installed inside the sliding part. One end of the spring is connected to the sliding part, and the other end of the spring is connected to the middle part of the rear side of the substrate.

[0010] Preferably, two springs are respectively arranged side by side inside the sliding parts of the first clamping arm and the second clamping arm.

[0011] Preferably, the sliding parts of the first clamping arm and the second clamping arm are respectively provided with sliding part cavities. One end of the sliding part cavity close to the middle part of the substrate has an opening. The spring is movably installed inside the sliding part cavity. The other end of the spring passes through the opening, and the sliding part cavity is covered with a sliding part cover.

[0012] Preferably, a sliding groove for the sliding part to slide is provided between the substrate and the radiator, and silica gel pads are respectively provided on the opposite sides of the two clamping parts.

[0013] Preferably, the front plate is an aluminum alloy front plate, the substrate is an ABS plastic substrate, the radiator is an aluminum alloy radiator, the rear cover is an ABS plastic rear cover, and the first clamping arm and the second clamping arm are respectively ABS plastic clamping arms.

[0014] The beneficial effects of the present utility model are as follows: First, since a first clamping arm is installed between the left end of the substrate and the radiator, and a second clamping arm is installed between the right end of the substrate and the radiator, and the first clamping arm and the second clamping arm can move towards each other or away from each other, therefore, it is convenient to clamp the mobile phone when the first clamping arm and the second clamping arm move towards each other, and it is convenient to release the mobile phone when they move away from each other; Second, since the front plate is installed on the front side of the substrate, the radiator is installed on the rear side of the substrate, the substrate is provided with a positioning cavity, the semiconductor refrigeration chip is installed in the positioning cavity, the front side of the semiconductor refrigeration chip is in contact with the front plate, the rear side of the semiconductor refrigeration chip is in contact with the radiator, and the control board is installed on the radiator and electrically connected to the semiconductor refrigeration chip, therefore, during the process of clamping the mobile phone, the rear shell of the mobile phone is attached to the front plate, the heat of the mobile phone is transferred to the front plate, the semiconductor refrigeration chip then transfers the heat to the radiator, and the heat is dissipated outward through the radiator, thus achieving the purpose of cooling the mobile phone, avoiding the mobile phone from continuously generating heat and getting hot, and avoiding damage to the mobile phone due to high temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is one of the overall structure diagrams of Embodiment 1.

[0016] Figure 2 It is the second of the overall structure diagrams of Embodiment 1.

[0017] Figure 3 It is one of the dispersed structure diagrams of Embodiment 1.

[0018] Figure 4 It is the second of the dispersed structure diagrams of Embodiment 1.

[0019] Figure 5 It is the dispersed structure diagram of Embodiment 2. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The structural principle and working principle of the present utility model will be further described in detail below with reference to the accompanying drawings. Embodiment 1

[0021] As Figures 1 to 4As shown in the figure, the first embodiment of the present invention is a clamping type mobile phone heat dissipation bracket, including a substrate 1, a front plate 2, a radiator 3, a semiconductor refrigeration sheet 4, a control board 5, a first clamping arm 6, a second clamping arm 7 and a rear cover 8; the front plate 2 is installed on the front side of the substrate 1, the radiator 3 is installed on the rear side of the substrate 1, the substrate 1 is provided with a positioning cavity 11, the semiconductor refrigeration sheet 4 is installed in the positioning cavity 11, the front side of the semiconductor refrigeration sheet 4 is in contact with the front plate 2, the rear side of the semiconductor refrigeration sheet 4 is in contact with the radiator 3, the control board 5 is installed on the radiator 3 and is electrically connected to the semiconductor refrigeration sheet 4, the first clamping arm 6 is installed between the left ends of the substrate 1 and the radiator 3, the second clamping arm 7 is installed between the right ends of the substrate 1 and the radiator 3, and the first clamping arm 6 and the second clamping arm 7 can move towards each other or move away from each other. The utility model can conveniently clamp a mobile phone (not shown in the figure) when the first clamping arm 6 and the second clamping arm 7 move towards each other, and conveniently release the mobile phone when moving away from each other; during the process of clamping the mobile phone, the back shell of the mobile phone is attached to the front plate 2, the heat of the mobile phone is transferred to the front plate 2, the semiconductor refrigeration sheet 4 then transfers the heat to the radiator 3, and the heat is dissipated outward through the radiator 3, so as to achieve the purpose of cooling the mobile phone, avoid the mobile phone from continuously heating up, and avoid damage to the mobile phone caused by high temperature.

[0022] As Figure 3 and Figure 4 shown in the figure, a cooling fan 9 is installed on the rear side of the radiator 3, the control board 5 is electrically connected to the cooling fan 9, and the rear cover 8 is provided with a plurality of ventilation holes 81. The cooling fan 9 can quickly blow away the radiator 3 and blow it out through the ventilation holes 81. The substrate 1 is provided with two positioning cavities 11 in parallel, and a semiconductor refrigeration sheet 4 is installed in each positioning cavity 11. The number of the cooling fans 9 is two, and the positions of the two semiconductor refrigeration sheets 4 correspond to the positions of the two cooling fans 9 front and back. By setting two groups of semiconductor refrigeration sheets 4 and cooling fans 9, the mobile phone can be cooled efficiently.

[0023] As Figure 3 and Figure 4As shown in the figure, the control board 5 is installed at the middle rear side of the radiator 3 and located in the area between the two cooling fans 9. A USB TYPE-C socket 51 and control buttons 52 are provided at the side end of the control board 5, and a digital display 53 is provided at the rear side of the control board 5. The rear cover 8 is provided with a light-transmitting mirror 82 corresponding to the digital display 53. The USB TYPE-C socket 51 is used to insert an external power cord to supply power to the control board 5, the semiconductor refrigeration sheet 4 and the cooling fans 9; the control buttons 52 are used to control the opening, closing and gear adjustment. Pressing and holding can achieve opening and closing, and pressing briefly can achieve gear adjustment; the digital display 53 is used to display the gear and refrigeration temperature, and the light-transmitting mirror 82 can transmit light, enabling users to conveniently view the numbers on the digital display 53.

[0024] As Figures 2 - 4 shown, a cylindrical shell 83 is connected to the middle of the rear cover 8. A support connecting cylinder 84 is installed inside the cylindrical shell 83, and a cylindrical hole 841 for inserting an external support rod member is provided inside the support connecting cylinder 84. When watching TV dramas and live broadcasts, insert one end of the external support rod member into the cylindrical hole 841 to position the clamping mobile phone cooling bracket.

[0025] As Figures 1 to 4 shown, the first clamping arm 6 and the second clamping arm 7 respectively include a sliding part 61 and a clamping part 62 connected to the outer end of the sliding part 61. The clamping part 62 of the first clamping arm 6 and the clamping part 62 of the second clamping arm 7 are opposite to each other left and right. A spring 63 is installed inside the sliding part 61. One end of the spring 63 is connected to the sliding part 61, and the other end of the spring 63 is connected to the middle of the rear side of the substrate 1. Further, two springs 63 are respectively arranged side by side inside the sliding parts 61 of the first clamping arm 6 and the second clamping arm 7. The sliding parts 61 of the first clamping arm 6 and the second clamping arm 7 are respectively provided with a sliding part cavity 611. One end of the sliding part cavity 611 close to the middle of the substrate 1 has an opening 612. The spring 63 is movably installed inside the sliding part cavity 611, and the other end of the spring 63 passes through the opening 612. The sliding part cavity 611 is covered with a sliding part cover 613. When clamping a mobile phone, pull the first clamping arm 6 and the second clamping arm 7 apart by hand, place the mobile phone between the first clamping arm 6 and the second clamping arm 7, and then release the hand. The first clamping arm 6 and the second clamping arm 7 will move towards each other under the elastic action of the spring 63 to clamp the mobile phone. A sliding groove 12 for the sliding of the sliding part 61 is provided between the substrate 1 and the radiator 3, and silica gel pads 64 are respectively provided on the opposite sides of the two clamping parts 62. The sliding groove 12 can limit the sliding part 61 and provide a sliding space, and the silica gel pads 64 can prevent the clamping part 62 from scratching the mobile phone and can clamp the mobile phone more firmly.

[0026] As a preferred embodiment of the present utility model, the front plate 2 is an aluminum alloy front plate, the substrate 1 is an ABS plastic substrate, the radiator 3 is an aluminum alloy radiator, the rear cover 8 is an ABS plastic rear cover, and the first clamping arm 6 and the second clamping arm 7 are respectively ABS plastic clamping arms. Embodiment 2

[0027] As Figure 5 shown, Embodiment 2 of the present invention is a clamping type mobile phone heat dissipation bracket. Compared with Embodiment 1, the main difference lies in the different shapes of the control board 5 and the rear cover 8. In Embodiment 2, the USB TYPE-C socket 51 is provided at one end of the control board 5, the control button 52 is provided at the other end of the control board 5, and the digital display 53 is arranged at the rear side of the control board 5. The other structures of Embodiment 2 are similar to those of Embodiment 1 and will not be described in detail here.

[0028] The above are only the preferred embodiments of the present utility model. Any minor modifications, equivalent changes, and decorations made to the above embodiments based on the technical solutions of the present utility model are all within the scope of the technical solutions of the present utility model.

Claims

1. A clamping type mobile phone heat dissipation bracket, characterized in that: It includes a substrate, a front plate, a radiator, a semiconductor refrigeration sheet, a control board, a first clamping arm, a second clamping arm and a rear cover; the front plate is installed on the front side of the substrate, the radiator is installed on the rear side of the substrate, the substrate is provided with a positioning cavity, the semiconductor refrigeration sheet is installed within the positioning cavity, the front side of the semiconductor refrigeration sheet is in contact with the front plate, the rear side of the semiconductor refrigeration sheet is in contact with the radiator, the control board is installed on the radiator and electrically connected to the semiconductor refrigeration sheet, the first clamping arm is installed between the left ends of the substrate and the radiator, the second clamping arm is installed between the right ends of the substrate and the radiator, and the first clamping arm and the second clamping arm can move towards each other or away from each other.

2. The clamping mobile phone heat dissipation bracket according to claim 1, wherein: A cooling fan is installed on the rear side of the radiator, the control board is electrically connected to the cooling fan, and the rear cover is provided with a plurality of ventilation holes.

3. The clamping type mobile phone heat dissipation bracket according to claim 2, characterized in that: The substrate is provided with two positioning cavities in parallel, and a semiconductor refrigeration sheet is installed in each positioning cavity respectively. The number of the cooling fans is two, and the positions of the two semiconductor refrigeration sheets correspond to the positions of the two cooling fans front and back.

4. The clamping type mobile phone heat dissipation bracket according to claim 3, wherein: The control board is installed at the rear side of the middle of the radiator and in the area between the two cooling fans. The control board is provided with a USB TYPE-C socket, control buttons and a digital display, and the rear cover is provided with a light-transmitting mirror corresponding to the digital display.

5. The clamping type mobile phone heat dissipation bracket according to claim 1, wherein: A cylindrical shell is connected to the middle of the rear cover. A support connecting cylinder is installed within the cylindrical shell, and a cylindrical hole for inserting an external support rod member is provided within the support connecting cylinder.

6. The clamping type mobile phone heat dissipation bracket according to claim 1, characterized in that: The first clamping arm and the second clamping arm respectively include a sliding part and a clamping part connected to the outer end of the sliding part. The clamping part of the first clamping arm and the clamping part of the second clamping arm are opposite to each other left and right. A spring is installed within the sliding part, one end of the spring is connected to the sliding part, and the other end of the spring is connected to the middle of the rear side of the substrate.

7. The clamping mobile phone heat dissipation bracket according to claim 6, wherein: Two springs are respectively arranged in parallel within the sliding parts of the first clamping arm and the second clamping arm.

8. The clamping mobile phone heat dissipation bracket according to claim 7, characterized in that: The sliding parts of the first clamping arm and the second clamping arm are respectively provided with sliding part cavities. One end of the sliding part cavity close to the middle of the substrate has an opening. The spring is movably installed within the sliding part cavity, and the other end of the spring passes through the opening. The sliding part cavity is covered with a sliding part cover body.

9. The clamping type mobile phone heat dissipation bracket according to claim 6, wherein: A sliding groove for the sliding of the sliding part is provided between the substrate and the radiator, and silica gel pads are respectively provided on the opposite sides of the two clamping parts.

10. The clamping type mobile phone heat dissipation bracket according to any one of claims 1-9, characterized in that: The front plate is an aluminum alloy front plate, the substrate is an ABS plastic substrate, the radiator is an aluminum alloy radiator, the rear cover is an ABS plastic rear cover, and the first clamping arm and the second clamping arm are respectively ABS plastic clamping arms.

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