Mounting structure of IPM module

Abstract

The utility model discloses a mounting structure of an IPM module, which belongs to the technical field of IPM module mounting, and comprises a circuit board, the IPM module, a semicircular plate, sliding blocks and a fixed pressing plate, the sliding blocks on the two sides slide in a vertical sliding groove and a semicircular groove through an arranged lifting handle, and finally the fixed pressing plate is pressed at the upper end of the IPM module. A sliding telescopic rod is contracted inwards through a spring in a tensioning assembly, so that a fixed pressing plate can press downwards when located above the IPM module, the IPM module can be fixed to a circuit board, the fixed pressing plate can move along a vertical sliding groove, a semicircular groove and a transverse sliding groove through rotating connection of a U-shaped support and a sliding sleeve, and therefore the IPM module can be fixed to the circuit board. After the IPM module is disassembled, the sliding block automatically moves inwards when located at the transverse sliding groove, and the sliding sleeve rotates along with movement of the fixed pressing plate through the arranged U-shaped support.

Description

Technical Field

[0001] The utility model belongs to the technical field of IPM module installation, and specifically relates to an installation structure of an IPM module. Background Art

[0002] The IPM internally integrates logic, control, detection, and protection circuits, which is convenient to use. It not only reduces the volume of the system and development time but also greatly enhances the reliability of the system, adapting to the current development direction of power devices, modularization, compounding, and power integrated circuits (PIC), and has been more and more widely used in the field of air conditioners.

[0003] When the IPM module is in use, the pins need to be installed in the mounting brackets on the circuit board. For example, Chinese invention patent CN118201210A discloses an installation structure of an IPM module, including a circuit board. Installation brackets for installing the IPM module body are provided on both sides of the upper end of the circuit board. A plurality of pin sockets are provided at the upper ends of the two installation brackets. A plurality of lead pins inserted into the pin sockets are installed on the outer walls of both sides of the IPM module body. A surrounding frame is connected to the upper ends of the two installation brackets. An installation top plate is connected to the upper end of the IPM module body. A locking mechanism is provided on the outer wall of the installation top plate. By pressing the two sliding plates provided, the two elastic limit blocks are contracted. At this time, through the resilience of the return spring, the IPM module body, the installation top plate, and the convex plate are separated from the inside of the surrounding frame, thus facilitating disassembly. Through the plug board and the convex plate provided, the lead pins on the IPM module body can be stored inside the plug board and the convex plate when not in use, and the lead pins can be prevented from being bent and broken during storage and transportation.

[0004] Although the above-mentioned prior art can fix the IPM module, when the IPM module is not installed, if the installation top plate is installed inside the installation bracket, the installation top plate needs to be removed during installation. If the installation top plate is not installed inside the installation bracket, the installation top plate is not easy to store and carry and is easy to lose. Summary of the Utility Model

[0005] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and the title of the utility model of this application, to avoid obscuring the purpose of this part, the abstract, and the title of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0006] To solve the problem raised in the above background art that when the IPM module is not installed, if the installation top plate is installed inside the installation bracket, the installation top plate needs to be removed during installation. If the installation top plate is not installed inside the installation bracket, the installation top plate is not easy to store and carry and is easy to lose, the utility model adopts the following technical solutions.

[0007] An installation structure of an IPM module, including a circuit board, an IPM module is installed at the upper end of the circuit board, semi-circular plates are installed on both sides of the circuit board, vertical plates are fixedly connected inside the semi-circular plates on both sides, semi-circular grooves are provided on the semi-circular plates, vertical sliding grooves are provided on the vertical plates, the vertical sliding grooves communicate with the semi-circular grooves, sliding blocks are slidably connected inside the vertical sliding grooves and semi-circular grooves on both sides, a fixing pressing plate is rotatably connected between the sliding blocks on both sides, a lifting handle is fixedly connected to the upper end of the fixing pressing plate, a tightening component is installed at the bottom of the fixing pressing plate, and the tightening component makes the fixing pressing plate have a downward pressure.

[0008] Preferably, installation bumps are fixedly connected to the outer walls of both sides of the semi-circular plates near the bottom, fixing bolts are provided on the installation bumps on both sides, and the fixing bolts are threadedly connected to the circuit board.

[0009] Preferably, a connecting cross plate is fixedly connected to the bottom of the semi-circular plates on both sides, a horizontal sliding groove is provided on the connecting cross plate, and both ends of the horizontal sliding groove communicate with the semi-circular grooves.

[0010] Preferably, a plurality of heat dissipation inner grooves are provided on the upper end of the fixing pressing plate.

[0011] Preferably, pin installation frames are installed on both sides of the upper end of the circuit board, a plurality of connecting pins are provided on the outer wall of the IPM module, and the plurality of connecting pins on both sides are respectively inserted into the pin installation frames on both sides.

[0012] Preferably, the tightening component includes a sliding sleeve, a sliding telescopic rod and a spring. The sliding sleeves are rotatably connected to both sides of the upper end of the circuit board. The sliding telescopic rods are telescopically connected inside the sliding sleeves on both sides. One end of the sliding telescopic rods on both sides is detachably connected to the bottom of the fixing pressing plate. Springs are provided inside the sliding sleeves on both sides, and the springs make the sliding telescopic rods have a force to contract inward.

[0013] Preferably, U-shaped brackets are detachably connected to the positions on the upper end of the circuit board opposite to the semi-circular plates on both sides. The openings of the U-shaped brackets on both sides face upward, and the sliding sleeves are rotatably connected to the inside of the U-shaped brackets.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. By setting the lifting handle, the sliding blocks on both sides slide inside the vertical sliding grooves and semi-circular grooves, and finally the fixing pressing plate presses on the upper end of the IPM module. The spring in the tightening component makes the sliding telescopic rod contract inward, so that the fixing pressing plate can press downward when it is located above the IPM module, thereby being able to fix the IPM module on the circuit board. Through the rotational connection between the U-shaped bracket and the sliding sleeve, the fixing pressing plate can move along the vertical sliding groove, the semi-circular groove and the horizontal sliding groove, and automatically move inward when the sliding block is located at the horizontal sliding groove after the IPM module is disassembled.

[0016] 2. The sliding sleeve rotates as the fixed pressing plate moves through the provided U-shaped bracket.

[0017] 3. Through the provision of the horizontal chute, the fixed pressing plate can enter the interior of the horizontal chute and move towards the pin mounting bracket after sliding to one side of the semi-circular plate, thereby reducing the area occupied by the fixed pressing plate on the circuit board.

[0018] 4. The provided heat dissipation inner groove can increase the contact area with the external air, thereby cooling the IPM module. Description of the Drawings

[0019] Figure 1 Schematic diagram of the installation structure of an IPM module in the present utility model;

[0020] Figure 2 Schematic diagram of the installation structure of the IPM module and the circuit board in the present utility model;

[0021] Figure 3 Schematic diagram of the structure of the fixed pressing plate moving along the semi-circular plate in the present utility model;

[0022] Figure 4 Schematic diagram of the heat dissipation inner groove structure in the present utility model;

[0023] Figure 5 Schematic diagram of the sliding sleeve and the sliding telescopic rod structure in the present utility model.

[0024] The corresponding relationship between the labels of each attached drawing in the figure and the component names is as follows:

[0025] 100, circuit board; 101, IPM module; 102, connection pin; 103, pin mounting bracket;

[0026] 200, fixed pressing plate; 201, semi-circular plate; 202, vertical chute; 203, semi-circular groove;

[0027] 204, mounting bump; 205, fixing bolt; 206, lifting handle; 207, sliding block;

[0028] 208, connecting cross plate; 209, horizontal chute; 210, heat dissipation inner groove; 211, U-shaped bracket;

[0029] 212, sliding sleeve; 213, sliding telescopic rod; 214, vertical plate. Detailed Embodiment

[0030] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given in conjunction with the accompanying drawings of the specification.

[0031] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Those skilled in the art may make similar extensions without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0032] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation manner of the present utility model. The phrase "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an individual or alternative embodiment that is mutually exclusive with other embodiments. The present utility model provides the following embodiments.

[0033] As Figure 1 shown, it is a schematic diagram of the installation structure of an IPM module according to a preferred embodiment of the present utility model. The installation structure of the IPM module in this embodiment includes a circuit board 100. An IPM module 101 is installed at the upper end of the circuit board 100. A fixed pressing plate 200 is located above the IPM module 101. In this embodiment, the IPM module 101 is pressed tightly above the circuit board 100 through the fixed pressing plate 200.

[0034] As Figure 2 shown, it is a schematic diagram of the installation structure of the IPM module and the circuit board in this embodiment. Pin mounting brackets 103 are installed on both sides of the upper end of the circuit board 100. A plurality of connection pins 102 are provided on the outer wall of the IPM module 101. The plurality of connection pins 102 on both sides are respectively inserted into the pin mounting brackets 103 on both sides. In this embodiment, the installation of the IPM module 101 is completed by inserting the connection pins 102 into the interiors of the pin mounting brackets 103.

[0035] As Figure 3As shown in the figure, it is a schematic diagram of the structure for the fixed pressing plate to move along the semi-circular plate. Semi-circular plates 201 are installed on both sides of the circuit board 100. Vertically arranged vertical plates 214 are fixedly connected inside the semi-circular plates 201 on both sides. A semi-circular groove 203 is provided on the semi-circular plate 201, and a vertical sliding groove 202 is provided on the vertical plate 214. The vertical sliding groove 202 communicates with the semi-circular groove 203. A sliding block 207 is slidably connected inside the vertical sliding grooves 202 and the semi-circular groove 203 on both sides. A fixed pressing plate 200 is rotatably connected between the sliding blocks 207 on both sides. A lifting handle 206 is fixedly connected to the upper end of the fixed pressing plate 200. In this embodiment, by holding the lifting handle 206, the sliding blocks 207 on both sides slide inside the vertical sliding groove 202 and the semi-circular groove 203, and finally the fixed pressing plate 200 presses on the upper end of the IPM module 101, thereby completing the fixation. When the IPM module 101 is not installed, the sliding blocks 207 on both sides slide from the vertical sliding groove 202 to one side inside the semi-circular groove 203, which is convenient for carrying, and it is not necessary to disassemble the fixed pressing plate 200 before installing the IPM module 101.

[0036] As Figure 3 shown, in order to conveniently install the semi-circular plates 201 on both sides above the IPM module 101, mounting bumps 204 are fixedly connected to the outer walls on both sides near the bottom of the semi-circular plates 201 on both sides. Fixing bolts 205 are provided on the mounting bumps 204 on both sides, and the fixing bolts 205 are threadedly connected to the circuit board 100. In this embodiment, through the cooperation of the fixing bolts 205 and the mounting bumps 204, the semi-circular plates 201 on both sides can be installed above the IPM module 101.

[0037] As Figure 4 shown, it is a schematic diagram of the structure of the heat dissipation inner groove in this embodiment. Connecting cross plates 208 are fixedly connected to the bottoms of the semi-circular plates 201 on both sides. A horizontal sliding groove 209 is provided on the connecting cross plate 208, and both ends of the horizontal sliding groove 209 communicate with the semi-circular groove 203. In this embodiment, through the setting of the horizontal sliding groove 209, after the fixed pressing plate 200 slides to one side of the semi-circular plate 201, it can enter the inside of the horizontal sliding groove 209 and move towards the pin mounting bracket 103, thereby reducing the area occupied by the fixed pressing plate 200 on the circuit board 100.

[0038] As Figure 4 shown, in order to better dissipate heat from the IPM module 101, in this embodiment, a plurality of heat dissipation inner grooves 210 are provided on the upper end of the fixed pressing plate 200. Through the heat dissipation inner grooves 210, the area of contact with the external air can be increased, thereby cooling the IPM module 101.

[0039] As Figure 5As shown, it is a schematic structural diagram of the sliding sleeve and the sliding telescopic rod in this embodiment. A U-shaped bracket 211 is detachably connected to the upper end of the circuit board 100 at the positions opposite to the two semi-circular plates 201 on both sides. The openings of the two U-shaped brackets 211 face upward. A sliding sleeve 212 is rotatably connected inside the two U-shaped brackets 211. A sliding telescopic rod 213 is telescopically connected inside the two sliding sleeves 212. One ends of the two sliding telescopic rods 213 are detachably connected to the bottom of the fixed pressing plate 200. Springs are arranged inside the two sliding sleeves 212. The springs enable the sliding telescopic rod 213 to have a force to contract inward. In this embodiment, the sliding telescopic rod 213 is made to contract inward by the springs, so that the fixed pressing plate 200 can be pressed downward when it is located above the IPM module 101, thereby fixing the IPM module 101 on the circuit board 100. Through the rotational connection between the U-shaped bracket 211 and the sliding sleeve 212, the fixed pressing plate 200 can move along the vertical sliding groove 202, the semi-circular groove 203, and the horizontal sliding groove 209. When the sliding block 207 is located at the horizontal sliding groove 209 after the IPM module 101 is disassembled, it automatically moves inward.

[0040] It should be noted that the above-mentioned sliding sleeve 212, sliding telescopic rod 213, and spring are the tensioning components in this embodiment. The tensioning components include but are not limited to the sliding sleeve 212, sliding telescopic rod 213, and spring. As long as it is a component that can make the fixed pressing plate 200 generate a downward pressure, it can be applied to this embodiment.

[0041] The above content further elaborates on the present invention in combination with specific implementation manners. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, which should all be regarded as belonging to the protection scope determined by the claims submitted for the present invention.

Claims

1. An installation structure of an IPM module, comprising a circuit board (100), and an IPM module (101) is installed at the upper end of the circuit board (100), characterized in that, Semicircular plates (201) are installed on both sides of the circuit board (100). Vertical plates (214) are fixedly connected inside the semicircular plates (201) on both sides. Semicircular grooves (203) are provided on the semicircular plates (201), and vertical sliding grooves (202) are provided on the vertical plates (214). The vertical sliding grooves (202) communicate with the semicircular grooves (203). A sliding block (207) is slidably connected inside the vertical sliding grooves (202) and the semicircular grooves (203) on both sides. A fixed pressing plate (200) is rotatably connected between the sliding blocks (207) on both sides. A lifting handle (206) is fixedly connected to the upper end of the fixed pressing plate (200). A tensioning component is installed at the bottom of the fixed pressing plate (200), and the tensioning component makes the fixed pressing plate (200) have a downward pressure.

2. The installation structure of the IPM module according to claim 1, characterized in that, Installation bumps (204) are fixedly connected to the outer walls on both sides near the bottom of the semicircular plates (201) on both sides. Fixing bolts (205) are provided on the installation bumps (204) on both sides, and the fixing bolts (205) are threadedly connected to the circuit board (100).

3. The installation structure of the IPM module according to claim 2, characterized in that, Connecting cross plates (208) are fixedly connected to the bottoms of the semicircular plates (201) on both sides. Transverse sliding grooves (209) are provided on the connecting cross plates (208), and both ends of the transverse sliding grooves (209) communicate with the semicircular grooves (203).

4. The installation structure of the IPM module according to claim 3, characterized in that, A plurality of heat dissipation inner grooves (210) are provided at the upper end of the fixed pressing plate (200).

5. The installation structure of the IPM module according to claim 4, characterized in that, Pin mounting brackets (103) are installed on both sides at the upper end of the circuit board (100). A plurality of connecting pins (102) are provided on the outer wall of the IPM module (101), and the plurality of connecting pins (102) on both sides are respectively inserted into the pin mounting brackets (103) on both sides.

6. The installation structure of the IPM module according to claim 5, characterized in that, The tensioning component includes a sliding sleeve (212), a sliding telescopic rod (213) and a spring. Sliding sleeves (212) are rotatably connected to both sides at the upper end of the circuit board (100). A sliding telescopic rod (213) is telescopically connected inside the sliding sleeves (212) on both sides. One end of the sliding telescopic rods (213) on both sides is detachably connected to the bottom of the fixed pressing plate (200). Springs are provided inside the sliding sleeves (212) on both sides, and the springs make the sliding telescopic rods (213) have a force to contract inward.

7. The mounting structure of the IPM module according to claim 6, characterized in that, U-shaped brackets (211) are detachably connected to the positions on both sides of the circuit board (100) at the upper end opposite to the semicircular plates (201) on both sides. The openings of the U-shaped brackets (211) on both sides face upward, and the sliding sleeves (212) are rotatably connected to the inside of the U-shaped brackets (211).

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