FPC bonding pad heat insulation structure
By setting the FR4 reinforcement plate, heat absorption layer and heat sink between the backlight pad and the main screen FPC, the heat conduction problem during backlight welding is solved, and the heat insulation and heat dissipation inside the backlight are achieved, preventing the diaphragm from burning, and enhancing the strength and heat dissipation effect of the welding area.
Patent Information
- Application Number
- CN202422220581.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-10
AI Technical Summary
The high temperature generated during backlight FPC welding is easily transmitted through the backlight backlight to the inside of the backlight, resulting in scalding of the diaphragm and poor spots.
A FR4 reinforcement board is set between the backlight pad and the main screen FPC, and a heat absorbing layer and a heat sink are set on its periphery. The heat insulation of the FR4 reinforcement board and the heat absorbing layer are used to combine the heat dissipation of the heat sink to reduce heat conduction to the backlight.
It effectively reduces scalding of the backlight internal diaphragm, improves the strength and heat dissipation ability of the welding area, and prevents poor spots.
Smart Images
Figure CN223093989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of FPC, in particular to an FPC pad heat insulation structure. Background Art
[0002] A display module generally includes a cover plate, a display screen and a backlight. A main screen FPC is usually bonded to the display screen, and the main screen FPC is used to connect to a customer main board to ensure the normal use of the display module. The main screen FPC needs to be bent to the back of the backlight, and a backlight FPC is bonded to the backlight. After the main screen FPC is bent to the back of the backlight, the backlight FPC is welded to the main screen FPC.
[0003] However, the high temperature generated during the welding of the backlight FPC is easily conducted to the inside of the backlight through the iron frame on the back of the backlight, causing burns to the diaphragm inside the backlight, and thus causing poor light spot appearance when lit. Summary of the Utility Model
[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an FPC pad heat insulation structure.
[0005] The purpose of the utility model is realized by the following technical solutions:
[0006] An FPC pad heat insulation structure includes: a backlight, a main screen FPC bent to the back of the backlight is placed on the back of the backlight, a backlight FPC is bonded to the backlight, the backlight FPC is welded to the main screen FPC, and a heat insulation member is arranged at the welding position of the main screen FPC relative to the backlight FPC.
[0007] In one embodiment, the heat insulation member is an FR4 reinforcing plate, and the FR4 reinforcing plate is located between the welding position of the backlight FPC and the main screen FPC.
[0008] In one embodiment, a backlight pad is arranged at the welding position of the main screen FPC relative to the backlight FPC, the end of the backlight FPC far from being bonded to the backlight is welded to the backlight pad, and the FR4 reinforcing plate is located between the backlight pad and the main screen FPC.
[0009] In one embodiment, the unilateral outer edge of the FR4 reinforcing plate is 3 mm larger than the unilateral outer edge of the backlight pad.
[0010] In one embodiment, the thickness of the FR4 reinforcing plate is 0.2 mm - 0.3 mm.
[0011] In one embodiment, a heat absorption layer is arranged on the FR4 reinforcing plate, and the heat absorption layer is arranged in the peripheral area of the FR4 reinforcing plate relative to the backlight pad.
[0012] In one embodiment, the heat-absorbing layer is made of thermally conductive silica gel.
[0013] In one embodiment, a heat sink is disposed at a position on the back surface of the backlight relative to the FR4 reinforcing plate, and the heat sink is used to dissipate the heat conducted from the backlight pad to the backlight.
[0014] In one embodiment, the heat sink is a graphite sheet or a steel sheet.
[0015] In one embodiment, the size of the heat sink is larger than the size of the FR4 reinforcing plate, and the heat sink covers the area of the main screen FPC relative to the FR4 reinforcing plate.
[0016] Compared with the prior art, the present utility model has at least the following advantages:
[0017] 1. A FPC pad heat insulation structure of the present utility model is provided with an FR4 reinforcing plate between the backlight pad and the main screen FPC to play a heat insulation role during welding, reducing the heat conduction to the inside of the backlight and causing film burns, and the FR4 reinforcing plate has a certain hardness, which can strengthen the strength of the welding area of the backlight FPC.
[0018] 2. A FPC pad heat insulation structure of the present utility model is provided with a heat-absorbing layer on the periphery of the FR4 reinforcing plate relative to the backlight pad to absorb heat from the peripheral area of the backlight pad, strengthening the heat dissipation capacity of the area around the backlight pad. The absorbed heat is isolated by the FR4 reinforcing plate, and a heat sink is disposed at a position on the backlight relative to the FR4 reinforcing plate to dissipate heat from the welding area of the backlight FPC, improving the heat dissipation capacity of the welding area of the backlight FPC, thereby minimizing the heat conducted to the inside of the backlight as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below.
[0020] Figure 1 is a schematic structural diagram of a FPC pad heat insulation structure provided by the present utility model;
[0021] Figure 2 is Figure 1 an enlarged schematic view of part A in
[0022] Figure 3 is a schematic structural diagram of the heat sink on the backlight in a FPC pad heat insulation structure provided by the present utility model.
[0023] Description of the drawings: 10, backlight; 20, main screen FPC; 21, backlight pad; 30, backlight FPC; 40, FR4 reinforcing plate; 50, heat absorption layer; 60, heat sink. Detailed implementation manners
[0024] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings.
[0025] An FPC pad heat insulation structure, referring to Figure 1 , includes a backlight 10, and a main screen FPC 20 bent to the back of the backlight 10 is placed on the back of the backlight 10. The main screen FPC 20 is bound to a display screen (not shown in the figure). One end of the main screen FPC 20 away from the binding to the display screen is bent to the back of the backlight 10.
[0026] Referring to Figure 1 , a backlight FPC 30 is bound to the backlight 10. One end of the backlight FPC 30 is bound to the backlight 10, and the other end of the backlight FPC 30 is welded to the main screen FPC 20. Since welding the backlight FPC 30 to the main screen FPC 20 will generate high temperature, and the high temperature conducting into the backlight 10 will cause scalding of the internal diaphragm of the backlight 10. Therefore, a heat insulation member is provided at the welding position of the main screen FPC 20 relative to the backlight FPC 30. The heat insulation member can play a heat insulation role during welding and reduce the heat conduction into the backlight 10 to cause diaphragm scalding.
[0027] Furthermore, referring to Figure 1 and Figure 2 , the heat insulation member is an FR4 reinforcing plate 40. The FR4 reinforcing plate 40 is an FR4 epoxy glass cloth laminate. Heat insulation materials are added to the FR4 reinforcing plate 40 to play a heat insulation role, and the FR4 reinforcing plate 40 has a certain hardness and can strengthen the strength of the welding area of the backlight FPC 30.
[0028] Referring to Figure 1 and Figure 2 , a backlight pad 21 is provided at the welding position of the main screen FPC 20 relative to the backlight FPC 30. The end of the backlight FPC 30 away from the binding to the backlight 10 is welded to the backlight pad 21. The FR4 reinforcing plate 40 is located between the backlight pad 21 and the main screen FPC 20 to conduct heat insulation when the backlight FPC 30 is welded to the backlight pad 21.
[0029] Referring to Figure 1 and Figure 2 , the unilateral outer edge of the FR4 reinforcing plate 40 is 3 mm larger than the unilateral outer edge of the backlight pad 21 to insulate the backlight pad 21 and its surrounding areas, increasing the heat insulation range.
[0030] Referring to Figure 1 andFigure 2 The thickness of the FR4 reinforcing plate 40 is 0.2 mm - 0.3 mm. The FR4 reinforcing plate 40 has a certain thickness, which can strengthen the hardness of the backlight pad 21.
[0031] Further, referring to Figure 1 and Figure 2 , a heat absorption layer 50 is provided on the FR4 reinforcing plate 40. The heat absorption layer 50 is disposed in the peripheral area of the FR4 reinforcing plate 40 relative to the backlight pad 21. The heat absorption layer 50 is used to absorb heat from the peripheral area of the backlight pad 21 when the backlight FPC 30 is welded to the backlight pad 21, strengthen the heat dissipation capacity of the area around the backlight pad 21, and the absorbed heat is isolated by the FR4 reinforcing plate 40.
[0032] Further, referring to Figure 1 and Figure 2 , the heat absorption layer 50 is made of thermally conductive silicone material.
[0033] Further, referring to Figure 3 , a heat sink 60 is provided at the position of the back surface of the backlight 10 relative to the FR4 reinforcing plate 40. The heat sink 60 is used to further dissipate the heat conducted from the backlight pad 21 to the backlight 10, so as to minimize the heat conducted into the interior of the backlight 10.
[0034] Referring to Figure 3 , the heat sink 60 is a graphite sheet or a steel sheet. The size of the heat sink 60 is larger than that of the FR4 reinforcing plate 40. The heat sink 60 covers the area of the main screen FPC 20 relative to the FR4 reinforcing plate 40 to dissipate heat from the welding area of the backlight FPC 30 and improve the heat dissipation capacity of the welding area of the backlight FPC 30.
[0035] This heat insulation structure plays a heat insulation role during welding by providing the FR4 reinforcing plate 40 between the backlight pad 21 and the main screen FPC 20, reducing the heat conduction into the interior of the backlight 10 and causing film burns. Moreover, the FR4 reinforcing plate 40 has a certain hardness, which can strengthen the strength of the welding area of the backlight FPC 30. The heat absorption layer 50 is provided on the periphery of the FR4 reinforcing plate 40 relative to the backlight pad 21 to absorb heat from the peripheral area of the backlight pad 21, strengthen the heat dissipation capacity of the area around the backlight pad 21, and the absorbed heat is isolated by the FR4 reinforcing plate 40. A heat sink 60 is provided at the position of the backlight 10 relative to the FR4 reinforcing plate 40 to dissipate heat from the welding area of the backlight FPC 30 and improve the heat dissipation capacity of the welding area of the backlight FPC 30, thereby minimizing the heat conducted into the interior of the backlight 10.
[0036] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.
Claims
1. An FPC pad heat insulation structure, characterized in that, Including: A backlight (10), a main screen FPC (20) bent to the back of the backlight (10) is placed on the back of the backlight (10), a backlight FPC (30) is bonded to the backlight (10), the backlight FPC (30) is welded to the main screen FPC (20), and a heat insulation member is provided at the welding position of the main screen FPC (20) relative to the backlight FPC (30).
2. The heat insulation structure of an FPC pad according to claim 1, characterized in that, The heat insulation member is an FR4 reinforcing plate (40), and the FR4 reinforcing plate (40) is located between the welding position of the backlight FPC (30) and the main screen FPC (20).
3. The FPC pad heat insulation structure according to claim 2, characterized in that, A backlight pad (21) is provided at the welding position of the main screen FPC (20) relative to the backlight FPC (30), one end of the backlight FPC (30) away from being bonded to the backlight (10) is welded to the backlight pad (21), and the FR4 reinforcing plate (40) is located between the backlight pad (21) and the main screen FPC (20).
4. The FPC pad heat insulation structure according to claim 3, characterized in that, The unilateral outer edge of the FR4 reinforcing plate (40) is 3 mm larger than the unilateral outer edge of the backlight pad (21).
5. The heat insulation structure of an FPC pad according to claim 4, characterized in that The thickness of the FR4 reinforcing plate (40) is 0.2 mm - 0.3 mm.
6. The FPC pad heat insulation structure according to claim 5, wherein, An endothermic layer (50) is provided on the FR4 reinforcing plate (40), and the endothermic layer (50) is provided in the peripheral area of the FR4 reinforcing plate (40) relative to the backlight pad (21).
7. The FPC pad heat insulation structure according to claim 6, characterized in that, The endothermic layer (50) is made of thermally conductive silicone material.
8. The heat insulation structure of an FPC pad according to claim 7, characterized in that, A heat sink (60) is provided at the position of the back of the backlight (10) relative to the FR4 reinforcing plate (40), and the heat sink (60) is used to dissipate the heat conducted from the backlight pad (21) to the backlight (10).
9. The FPC pad heat insulation structure according to claim 8, characterized in that, The heat sink (60) is a graphite sheet or a steel sheet.
10. The heat insulation structure of an FPC pad according to claim 9, wherein The size of the heat sink (60) is larger than the size of the FR4 reinforcing plate (40), and the heat sink (60) covers the area of the main screen FPC (20) relative to the FR4 reinforcing plate (40).