Semiconductor spraying device and system

Abstract

The utility model provides a semiconductor spraying device and system, and relates to the technical field of semiconductor spraying. The device comprises a first shell, a second shell, an ejector rod, a vacuum pipeline, spraying equipment and a first conveying mechanism. The first shell and the second shell are oppositely arranged, the spraying equipment and the vacuum pipeline both penetrate through the first shell, the ejector rod is connected with the second shell, and the first conveying mechanism is arranged in the second shell. And the ejector rod is used for driving the second shell to move upwards after the first conveying mechanism receives the semiconductor product, so that the first shell and the second shell form a sealed cavity. And the vacuum pipeline is used for extracting air in the sealed cavity. The ejector rod is further used for driving the second shell to move downwards to the original position after the semiconductor product is sprayed, so that the first conveying mechanism conveys the semiconductor product to the next device. According to the semiconductor spraying device provided by the invention, the thickness of the spraying material on the surface of the semiconductor product can be ensured to be uniform, and the spraying quality and the spraying compactness are greatly improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor spraying, and more particularly, to a semiconductor spraying device and system. Background Art

[0002] Semiconductor glue coating is one of the important process steps in the semiconductor packaging process, which is directly related to the stability and reliability of chip performance. An effective semiconductor glue coating process can protect the chip and improve its environmental tolerance, thereby ensuring the service life, performance, and quality of electronic products.

[0003] Currently, most spraying methods use air or inert gas for spraying, and the spraying material is coated on the surface of semiconductor products through methods such as electrostatic adsorption or thermal softening. This spraying method has problems such as poor spraying density, uneven spraying thickness, and low spraying quality.

[0004] In summary, how to ensure uniform thickness of the spraying material on the surface of semiconductor products and improve spraying quality is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0005] The purpose of this application is to provide a semiconductor spraying device to ensure uniform thickness of the spraying material on the surface of semiconductor products and improve spraying quality.

[0006] Another purpose of this application is to provide a semiconductor spraying system to perform full-automatic spraying on both sides of semiconductor products and improve spraying quality.

[0007] To achieve the above purposes, the technical solutions adopted in this application are as follows:

[0008] On the one hand, this application provides a semiconductor spraying device, which includes: a first housing, a second housing, a top rod, a vacuum pipeline, a spraying device, and a first conveying mechanism; the first housing and the second housing are arranged opposite to each other, the spraying device and the vacuum pipeline both penetrate the first housing, the top rod is connected to the second housing, and the first conveying mechanism is arranged inside the second housing.

[0009] The top rod is used to drive the second housing to move upward after the first conveying mechanism receives a semiconductor product, so that the first housing and the second housing form a sealed cavity; the vacuum pipeline is used to extract the air inside the sealed cavity.

[0010] The top rod is also used to drive the second housing to move downward to its original position after the semiconductor product spraying is completed, so that the first conveying mechanism conveys the semiconductor product to the next device.

[0011] Further, the semiconductor spraying device further includes a first sealing ring and a second sealing ring. The first sealing ring is disposed at one end of the first housing close to the second housing, and the second sealing ring is disposed at one end of the second housing close to the first housing.

[0012] Further, the upper surface of the first conveying mechanism is flush with one end of the second housing close to the first housing.

[0013] Further, the spraying equipment includes a material storage module and a nozzle module. The material storage module is connected to the nozzle module. The material storage module is disposed outside the first housing, and the nozzle module penetrates through the first housing.

[0014] Further, the material storage module includes a material pressure pipeline and a spraying liquid material bucket. One end of the spraying liquid material bucket is connected to the material pressure pipeline, and the other end of the spraying liquid material bucket is connected to the nozzle module.

[0015] Further, the nozzle module includes a nozzle conveying mechanism and a nozzle. The nozzle conveying mechanism penetrates through the first housing. One end of the nozzle conveying mechanism is connected to the material storage module, and the other end of the nozzle conveying mechanism is provided with the nozzle.

[0016] The nozzle conveying mechanism drives the nozzle to move so that the nozzle sprays one side of the semiconductor product.

[0017] On the other hand, the present application further provides a semiconductor spraying system. The semiconductor spraying system includes: a flipping mechanism and two semiconductor spraying devices as described in any one of the foregoing embodiments. The two semiconductor spraying devices are respectively a first semiconductor spraying device and a second semiconductor spraying device. The flipping mechanism is disposed between the first semiconductor spraying device and the second semiconductor spraying device.

[0018] The flipping mechanism is used to rotate the semiconductor product by 180° after being sprayed by the first semiconductor spraying device and then convey it to the second semiconductor spraying device.

[0019] Further, the flipping mechanism includes a second conveying mechanism and a third conveying mechanism. The second conveying mechanism and the third conveying mechanism are disposed vertically relative to each other.

[0020] Two opposite surfaces of the second conveying mechanism and the third conveying mechanism are used to clamp the semiconductor product after being sprayed by the first semiconductor spraying device, and drive the semiconductor product to rotate 180° and then convey it to the second semiconductor spraying device.

[0021] Further, the semiconductor spraying system further includes: a feeding box, a discharging box, a feeding conveying mechanism, and a discharging conveying mechanism.

[0022] The feeding transfer mechanism is used to transfer the semiconductor products in the feeding box to the first semiconductor spraying device, and the discharging transfer mechanism is used to transfer the semiconductor products sprayed by the second semiconductor spraying device to the discharging box.

[0023] Further, the upper surfaces of the feeding transfer mechanism and the discharging transfer mechanism are flush with one end of the second housing close to the first housing.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] The present application provides a semiconductor spraying device and system. By providing a ejector rod on the second housing, the closing and separation of the second housing and the first housing can be controlled. By providing a first transfer mechanism inside the second housing, it can ensure that the semiconductor products enter and exit the semiconductor spraying device. When the semiconductor products reach the designated position driven by the first transfer mechanism, the ejector rod drives the second housing to move upward, so that the first housing and the second housing form a sealed cavity. At the same time, the vacuum pipeline extracts the air in the sealed cavity to form a vacuum chamber, ensuring that the spraying equipment sprays the semiconductor products in a vacuum state. By evaporating the spraying liquid as a target, the vapor molecules diffuse in the vacuum environment and deposit on the surface of the semiconductor products, ensuring that the thickness of the sprayed coating on the surface of the semiconductor products is uniform, greatly improving the spraying quality and spraying compactness, and enhancing the reliability of the products.

[0026] In addition, by providing a flipping mechanism between the two semiconductor spraying devices, the full-automatic vacuum spraying of both sides of the semiconductor products is realized, ensuring good consistency in the spraying thickness of the front and back sides of the semiconductor products, less manual intervention, and high efficiency.

[0027] To make the above objects, features and advantages of the present application more obvious and understandable, the following specific preferred embodiments are given below and described in detail in conjunction with the accompanying drawings. Description of the Drawings

[0028] To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] Figure 1 One of the schematic structural diagrams of a semiconductor spraying device provided by an embodiment of the present application;

[0030] Figure 2 Another schematic structural diagram of a semiconductor spraying device provided by an embodiment of the present application;

[0031] Figure 3 Yet another schematic structural diagram of a semiconductor spraying device provided by an embodiment of the present application;

[0032] Figure 4 One of the schematic structural diagrams of a semiconductor spraying system provided by an embodiment of the present application;

[0033] Figure 5 Schematic structural diagram of a flipping mechanism provided by an embodiment of the present application;

[0034] Figure 6 Another schematic structural diagram of a semiconductor spraying system provided by an embodiment of the present application.

[0035] Reference numerals: 10 - semiconductor spraying device; 20 - semiconductor product; 110 - first housing; 120 - second housing; 130 - ejector rod; 140 - vacuum pipeline; 150 - spraying equipment; 151 - material pressure pipeline; 152 - spraying liquid material bucket; 153 - nozzle transfer mechanism; 154 - nozzle; 160 - first transfer mechanism; 170 - first sealing ring; 180 - second sealing ring; 310 - first semiconductor spraying device; 320 - second semiconductor spraying device; 330 - flipping mechanism; 331 - second transfer mechanism; 332 - third transfer mechanism; 340 - feeding box; 350 - feeding transfer mechanism; 360 - discharging transfer mechanism; 370 - discharging box. Detailed implementation manners

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application usually described and illustrated in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but merely represents the selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0038] It should be noted that: similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0039] The following will make a detailed description of some embodiments of the present application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0040] As described in the background art, most of the current spraying methods use air or inert gas for spraying, and the spray coating is applied to the surface of the semiconductor product by methods such as electrostatic adsorption or thermal softening. This spraying method has problems such as poor spraying density, uneven spraying thickness, and low spraying quality.

[0041] In summary, how to ensure the uniform thickness of the spray coating on the surface of the semiconductor product and improve the spraying quality is a technical problem that those skilled in the art urgently need to solve.

[0042] To solve the above technical problems, please refer to Figure 1 , the embodiment of the present application provides a semiconductor spraying device 10. The semiconductor spraying device 10 includes: a first housing 110, a second housing 120, a top rod 130, a vacuum pipeline 140, a spraying device 150, and a first conveying mechanism 160.

[0043] Among them, the first housing 110 and the second housing 120 are arranged opposite to each other. The spraying device 150 and the vacuum pipeline 140 both penetrate through the first housing 110, and the ejector rod 130 is connected to the bottom outside the second housing 120. The first transfer mechanism 160 is arranged inside the second housing 120 and is used to support and transfer the semiconductor product 20.

[0044] At the beginning, the first housing 110 and the second housing 120 are separated, and the semiconductor product 20 is transferred onto the first transfer mechanism 160 through the gap between the first housing 110 and the second housing 120.

[0045] The ejector rod 130 is used to drive the second housing 120 to move upward after the first transfer mechanism 160 receives the semiconductor product 20, so that the first housing 110 and the second housing 120 form a sealed cavity. The vacuum pipeline 140 is used to extract the air in the sealed cavity to ensure that the cavity formed by the first housing 110 and the second housing 120 is a vacuum cavity.

[0046] The ejector rod 130 is also used to drive the second housing 120 to move downward to its original position after the semiconductor product 20 is sprayed by the spraying device 150, so that the first transfer mechanism 160 transfers the semiconductor product 20 to the next device through the gap between the first housing 110 and the second housing 120.

[0047] Based on the above design, by arranging the ejector rod 130 on the second housing 120, the closing and separation of the second housing 120 and the first housing 110 can be controlled. By arranging the first transfer mechanism 160 inside the second housing 120, it can ensure that the semiconductor product 20 enters and exits the semiconductor spraying device 10. When the semiconductor product 20 reaches the position to be sprayed driven by the first transfer mechanism 160, the ejector rod 130 drives the second housing 120 to move upward, so that the first housing 110 and the second housing 120 form a sealed cavity. At the same time, the vacuum pipeline 140 extracts the air in the sealed cavity to form a vacuum chamber, ensuring that the spraying device 150 sprays the semiconductor product 20 in a vacuum state. By evaporating the spraying liquid as a target, the vapor molecules diffuse in the vacuum environment and deposit on the surface of the semiconductor product 20, ensuring that the thickness of the sprayed coating on the surface of the semiconductor product 20 is uniform, greatly improving the spraying quality and spraying compactness, and enhancing the reliability of the product.

[0048] Optionally, in order to enable the semiconductor product 20 to smoothly enter and exit the semiconductor spraying device 10, the upper surface of the first transfer mechanism 160 is flush with one end of the second housing 120 close to the first housing 110.

[0049] Further, in order to ensure that the second housing 120 can be closely attached to the first housing 110 under the drive of the ejector rod 130, in the embodiment of the present application, the semiconductor spraying device 10 further includes a first sealing ring 170 and a second sealing ring 180. Among them, the first sealing ring 170 is arranged at one end of the first housing 110 close to the second housing 120, and the second sealing ring 180 is arranged at one end of the second housing 120 close to the first housing 110.

[0050] After the semiconductor product 20 reaches the position to be sprayed under the drive of the first conveying mechanism 160, please refer to Figure 2 , the ejector rod 130 pushes the second housing 120 upwards, and by squeezing the first sealing ring 170 and the second sealing ring 180, it is ensured that the first housing 110 and the second housing 120 can be closely attached to form a sealed space. Then, the air in the sealed cavity is extracted through the vacuum pipeline 140 to ensure that the semiconductor product 20 is sprayed in a vacuum cavity.

[0051] To more specifically illustrate the spraying method of the spraying device 150 on the semiconductor product 20, please refer to Figure 3 , in the embodiment of the present application, the spraying device 150 includes a material storage module and a nozzle module. Among them, the material storage module is connected to the nozzle module, the material storage module is arranged outside the first housing 110, and the nozzle module penetrates the first housing 110.

[0052] Specifically, the material storage module includes a material pressure pipeline 151 and a spraying liquid bucket 152. One end of the spraying liquid bucket 152 is connected to the material pressure pipeline 151, and the other end of the spraying liquid bucket 152 is connected to the nozzle module. The nozzle module includes a nozzle conveying mechanism 153 and a nozzle 154. The nozzle conveying mechanism 153 penetrates the first housing 110. One end of the nozzle conveying mechanism 153 is connected to the material storage module, and the other end of the nozzle conveying mechanism 153 is provided with a nozzle 154.

[0053] When the semiconductor product 20 is located at the position to be sprayed and the cavity formed by the first housing 110 and the second housing 120 is a vacuum cavity, the material pressure pipeline 151 is opened, and the spraying liquid in the spraying liquid bucket 152 is sprayed through the nozzle 154. Among them, the nozzle conveying mechanism 153 can drive the nozzle 154 to move arbitrarily according to the length and height of the semiconductor product 20, so that the nozzle 154 sprays one side of the semiconductor product 20.

[0054] After the semiconductor product 20 is sprayed, the vacuum is broken, the ejector rod 130 retracts to drive the first housing 110 to move down to the original position, and the semiconductor product 20 is conveyed to the next device under the drive of the first conveying mechanism 160.

[0055] It can be seen that in the above embodiments, after the semiconductor product 20 passes through the semiconductor spraying device 10, one side of the semiconductor product 20 can be sprayed. However, in actual production, most semiconductor products 20 need to be sprayed on both sides.

[0056] To ensure the consistency of the spraying on the front and back sides of the semiconductor product 20, please refer to Figure 4 , an embodiment of the present application further provides a semiconductor spraying system, which includes a flipping mechanism 330 and two semiconductor spraying devices as described in any one of the foregoing embodiments.

[0057] Among them, the two semiconductor spraying devices are respectively a first semiconductor spraying device 310 and a second semiconductor spraying device 320, and the flipping mechanism 330 is arranged between the first semiconductor spraying device 310 and the second semiconductor spraying device 320.

[0058] The flipping mechanism 330 is used to rotate the semiconductor product 20 by 180° after being sprayed by the first semiconductor spraying device 310 and then convey it to the second semiconductor spraying device 320.

[0059] For the specific structure of the flipping mechanism 330, please refer to Figure 5 , in the embodiment of the present application, the flipping mechanism 330 includes a second conveying mechanism 331 and a third conveying mechanism 332, and the second conveying mechanism 331 and the third conveying mechanism 332 are arranged vertically relative to each other. That is, the second conveying mechanism 331 can be arranged directly below the third conveying mechanism 332 or directly above the third conveying mechanism 332.

[0060] The following takes the case where the second conveying mechanism 331 is arranged directly below the third conveying mechanism 332 as an example for illustration.

[0061] When the semiconductor product 20 finishes spraying on the front side after passing through the first semiconductor spraying device 310, the semiconductor product 20 is conveyed by the first conveying mechanism 160 to between the second conveying mechanism 331 and the third conveying mechanism 332. At this time, the front side of the semiconductor product 20 faces upward.

[0062] The two opposite surfaces of the second conveying mechanism 331 and the third conveying mechanism 332 clamp the semiconductor product 20 and drive the semiconductor product 20 to rotate 180° together. At this time, the second conveying mechanism 331 is located directly above the third conveying mechanism 332, and the back side of the semiconductor product 20 faces upward.

[0063] The two opposite surfaces of the second conveying mechanism 331 and the third conveying mechanism 332 after rotation drive the semiconductor product 20 to move to the second semiconductor spraying device 320 to spray the back side of the semiconductor product 20.

[0064] Please refer to Figure 6, in the embodiment of the present application, the semiconductor spraying system further includes: a feeding box 340, a feeding transfer mechanism 350, a discharging transfer mechanism 360, and a discharging box 370. Among them, the feeding transfer mechanism 350 is used to transfer the semiconductor product 20 in the feeding box 340 to the first semiconductor spraying device 310, and the discharging transfer mechanism 360 is used to transfer the semiconductor product 20 after being sprayed by the second semiconductor spraying device 320 to the discharging box 370.

[0065] Based on the above design, the double-sided full-automatic vacuum spraying of the semiconductor product 20 can be realized, ensuring the spraying consistency of the front and back sides of the semiconductor product 20, avoiding manual turning, having less manual intervention, high efficiency, and high reliability of the product after spraying.

[0066] Furthermore, in order to ensure that the semiconductor product 20 can smoothly enter the first semiconductor spraying device 310 and smoothly exit the second semiconductor spraying device 320. In the embodiment of the present application, the upper surfaces of the feeding transfer mechanism 350 and the discharging transfer mechanism 360 are flush with one end of the second housing 120 close to the first housing 110.

[0067] In summary, the embodiment of the present application provides a semiconductor spraying device and system. By setting a ejector rod on the second housing, the closing and separation of the second housing and the first housing can be controlled. By setting a first transfer mechanism in the second housing, it can ensure that the semiconductor product enters and exits the semiconductor spraying device. When the semiconductor product reaches the designated position driven by the first transfer mechanism, the ejector rod drives the second housing to move upward, so that the first housing and the second housing form a sealed cavity. At the same time, the vacuum pipeline extracts the air in the sealed cavity to form a vacuum chamber, ensuring that the spraying equipment sprays the semiconductor product in a vacuum state. By evaporating the spraying liquid as a target, the vapor molecules diffuse in the vacuum environment and deposit on the surface of the semiconductor product, ensuring that the thickness of the spraying material on the surface of the semiconductor product is uniform, greatly improving the spraying quality and spraying density, and enhancing the reliability of the product.

[0068] In addition, by setting a flipping mechanism between the two semiconductor spraying devices, the double-sided full-automatic vacuum spraying of the semiconductor product is realized, ensuring good consistency in spraying thickness on the front and back sides of the semiconductor product, less manual intervention, and high efficiency.

[0069] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0070] For those skilled in the art, it is obvious that the present application is not limited to the details of the above-described exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present application. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A semiconductor spraying device, characterized in that, The semiconductor spraying device includes: a first housing, a second housing, a push rod, a vacuum pipeline, a spraying device, and a first conveying mechanism; The first housing and the second housing are arranged opposite to each other. The spraying device and the vacuum pipeline both penetrate the first housing. The push rod is connected to the second housing, and the first conveying mechanism is arranged inside the second housing; The push rod is used to drive the second housing to move upward after the first conveying mechanism receives the semiconductor product, so that the first housing and the second housing form a sealed cavity; the vacuum pipeline is used to extract the air in the sealed cavity; The push rod is further used to drive the second housing to move downward to its original position after the spraying of the semiconductor product is completed, so that the first conveying mechanism conveys the semiconductor product to the next device.

2. The semiconductor spraying device according to claim 1, wherein The semiconductor spraying device further includes a first sealing ring and a second sealing ring. The first sealing ring is arranged at one end of the first housing close to the second housing, and the second sealing ring is arranged at one end of the second housing close to the first housing.

3. The semiconductor spraying device according to claim 1, wherein The upper surface of the first conveying mechanism is flush with one end of the second housing close to the first housing.

4. The semiconductor spraying device according to claim 1, characterized in that, The spraying device includes a material storage module and a nozzle module. The material storage module is connected to the nozzle module. The material storage module is arranged outside the first housing, and the nozzle module penetrates the first housing.

5. The semiconductor spraying device according to claim 4, wherein, The material storage module includes a material pressure pipeline and a spraying liquid barrel. One end of the spraying liquid barrel is connected to the material pressure pipeline, and the other end of the spraying liquid barrel is connected to the nozzle module.

6. The semiconductor spraying device according to claim 4, wherein The nozzle module includes a nozzle conveying mechanism and a nozzle. The nozzle conveying mechanism penetrates the first housing. One end of the nozzle conveying mechanism is connected to the material storage module, and the other end of the nozzle conveying mechanism is provided with the nozzle; The nozzle conveying mechanism drives the nozzle to move, so that the nozzle sprays one side of the semiconductor product.

7. A semiconductor spraying system, characterized in that, The semiconductor spraying system includes: a flipping mechanism and two semiconductor spraying devices as described in any one of claims 1-6. The two semiconductor spraying devices are respectively a first semiconductor spraying device and a second semiconductor spraying device. The flipping mechanism is arranged between the first semiconductor spraying device and the second semiconductor spraying device; The flipping mechanism is used to rotate the semiconductor product by 180° after being sprayed by the first semiconductor spraying device and then convey it to the second semiconductor spraying device.

8. The semiconductor spraying system according to claim 7, wherein, The flipping mechanism includes a second conveying mechanism and a third conveying mechanism. The second conveying mechanism and the third conveying mechanism are arranged vertically opposite to each other; The two opposite surfaces of the second conveying mechanism and the third conveying mechanism are used to clamp the semiconductor product after being sprayed by the first semiconductor spraying device, and drive the semiconductor product to rotate 180° and then convey it to the second semiconductor spraying device.

9. The semiconductor spraying system according to claim 7, wherein The semiconductor spraying system further includes: a feeding box, a discharging box, a feeding conveying mechanism, and a discharging conveying mechanism; The feeding transfer mechanism is used to transfer the semiconductor products in the feeding box to the first semiconductor spraying device, and the discharging transfer mechanism is used to transfer the semiconductor products after being sprayed by the second semiconductor spraying device to the discharging box.

10. The semiconductor spraying system according to claim 9, wherein, The upper surfaces of the feeding transfer mechanism and the discharging transfer mechanism are flush with one end of the second housing close to the first housing.

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