Reflow soldering flux recovery box and reflow soldering equipment

Abstract

The utility model discloses a reflow soldering flux recycling box and reflow soldering equipment, and relates to the technical field of reflow soldering. The reflow soldering flux recycling box is used for extracting mixed gas in a furnace chamber of reflow soldering equipment and cleaning the furnace chamber. The reflow soldering flux recycling box comprises a box body, a cleaning assembly, a fan and a streaming assembly. Wherein the box body is provided with an air inlet and an air outlet, and the air inlet and the air outlet are both used for communicating with the furnace chamber; the cleaning assembly is arranged in the inner cavity of the box body and is used for refrigerating and filtering gas; the fan is arranged in the box body, an inlet of the fan is communicated with the inner cavity of the box body, and an outlet of the fan is communicated with the air outlet; the streaming assembly is arranged in the inner cavity of the box body and used for guiding gas in the inner cavity of the box body to flow in a snakelike mode so that gaseous scaling powder in the gas can be liquefied and separated out, the streaming assembly is close to the gas inlet, the cleaning assembly is close to the gas outlet, and the quality of welded products is effectively guaranteed through the reflow soldering scaling powder recycling box.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering, and more specifically, to a reflow soldering flux recovery box. In addition, the utility model also relates to a reflow soldering device including the above reflow soldering flux recovery box. Background Art

[0002] When connecting surface-mounted components to a PCB, the reflow soldering process is often used. It is not only efficient but also enables highly automated production. When manufacturing electronic products using a reflow soldering device, first, solder paste is printed on the connection surface of the PCB, then components are mounted, and then the PCB board with the mounted components is placed into the furnace chamber of the reflow soldering device for high-temperature soldering. In this process, to improve the soldering efficiency and quality, a part of high-temperature soldering flux is usually added to the solder paste.

[0003] However, at this time, the flux in the solder paste will volatilize under high temperature in the furnace chamber. During the long-term use of the reflow soldering device, the gaseous flux in the furnace chamber is very likely to condense to form an oily substance or a flocculent substance, and the condensed substance dripping onto the product board will greatly affect its quality.

[0004] In summary, how to ensure the quality of the products soldered by the reflow soldering device is an urgent problem to be solved by those skilled in the art at present. Summary of the Utility Model

[0005] In view of this, the purpose of the utility model is to provide a reflow soldering flux recovery box, and using this reflow soldering flux recovery box can effectively ensure the quality of soldered products.

[0006] Another purpose of the utility model is to provide a reflow soldering device including the above reflow soldering flux recovery box.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] A reflow soldering flux recovery box is used to extract the mixed gas in the furnace chamber of a reflow soldering device and clean it, and includes:

[0009] A box body, which has an air inlet and an air outlet, and both the air outlet and the air inlet are used to communicate with the furnace chamber;

[0010] A cleaning component is arranged in the inner cavity of the box body and is used to cool and filter the gas;

[0011] A fan is arranged in the box body, and the inlet of the fan is communicated with the inner cavity of the box body, and the outlet is communicated with the air outlet;

[0012] The flow-around component is arranged in the inner cavity of the box body and is used to guide the gas in the inner cavity of the box body to flow in a serpentine shape, so that the gaseous flux in the gas is liquefied and precipitated. And the flow-around component is close to the air inlet, and the cleaning component is close to the air outlet.

[0013] Preferably, the flow-around component includes a plurality of partition plates. One end of some of the partition plates in the first direction abuts against the box body, and there is a gap between the other end and the box body. For the remaining partition plates, there is a gap between one end in the first direction and the box body, and the other end abuts against the box body. A continuous bent channel is formed by enclosing some box walls of the box body and a plurality of the partition plates.

[0014] Preferably, all the partition plates are flat plates. A plurality of the partition plates are arranged in parallel, and a plurality of the partition plates are arranged in the third direction, and the third direction is perpendicular to the partition plates.

[0015] Preferably, the box body includes a rectangular shell;

[0016] The back plate of the rectangular shell has an inlet and an outlet, so that gas can flow into or out of the rectangular shell along the width direction of the rectangular shell;

[0017] Both the cleaning component and the flow-around component are arranged inside the rectangular shell. Both the cleaning component and the flow-around component are located between the inlet and the outlet of the rectangular shell, and the cleaning component and the flow-around component are arranged along the length direction of the rectangular shell.

[0018] Preferably, among adjacent partition plates, the area of one partition plate projected onto another partition plate is 10%-80% of its area.

[0019] Preferably, the partition plate is a medical stone plate; or the partition plate is a metal plate.

[0020] Preferably, the box body further includes the air inlet pipe and the air outlet pipe. The first end of the air inlet pipe is inserted into the inlet of the rectangular shell, and the first end of the air outlet pipe is inserted into the outlet of the rectangular shell. And the air inlet is the second end opening of the air inlet pipe located outside the rectangular shell, and the air outlet is the second end opening of the air outlet pipe located outside the rectangular shell.

[0021] Preferably, the box body further includes a recovery box, and the recovery box is arranged inside the rectangular shell for receiving the liquid flux.

[0022] Preferably, the panel of the rectangular shell has a first installation opening, and further includes a first cover plate that can be buckled on the rectangular shell to seal the first installation opening. The partition plate can pass through the first installation opening to be installed in the inner cavity of the rectangular shell;

[0023] The rectangular housing has a plurality of the mounting portions, and a plurality of the partition plates can be selectively arranged in corresponding mounting portions.

[0024] A reflow soldering device includes the reflow soldering flux recovery box according to any one of the above.

[0025] For the reflow soldering flux recovery box provided by the present utility model, the box body is of a hollow structure, and it is provided with an air inlet and an air outlet communicating with its own inner cavity, and a blower is arranged on the upper surface of the box body. The inlet of the blower communicates with the inner cavity of the box body, and the outlet communicates with the air outlet of the box body. Then, when in use, the air outlet and the air inlet are conducted to the furnace cavity through a pipeline or the like. Under the pumping action of the gas, the mild gas in the furnace cavity is pumped out, so that it flows into the inner cavity of the box body through the air inlet and flows out through the air outlet to be pushed back into the furnace cavity.

[0026] Correspondingly, a flow-around component and a cleaning component are arranged in the inner cavity of the box body. The cleaning component is close to the air inlet, and the cleaning component is close to the air outlet. Then, the gas flowing into the inner cavity of the box body is guided by the flow-around component, and the gas flows in a meandering manner. During this process, the temperature of the gas decreases due to multiple flow-arounds, and part or all of the gaseous flux can be liquefied and separated from the mixed gas. Then, the remaining gas flows through the cleaning component to be cooled and filtered by it. Finally, the gas containing nitrogen is returned to the furnace cavity. By using this reflow soldering flux recovery box, the gaseous flux in the gas can be liquefied and precipitated first, avoiding blockage of the cleaning component caused by the gaseous flux flowing into it, and the clean gas can be returned to the furnace cavity, so as to reduce nitrogen consumption and be beneficial to stabilizing the nitrogen concentration value in the furnace cavity, greatly improving the quality of the welded products. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0028] Figure 1 It is an exploded view of a specific embodiment provided by the present utility model;

[0029] Figure 2 It is a cross-sectional view of a specific embodiment provided by the present utility model;

[0030] Figure 3 It is a schematic diagram of the flow path of a specific embodiment provided by the present utility model;

[0031] Figure 4 It is an overall schematic diagram of a specific embodiment provided by the present utility model;

[0032] Figure 5 It is a schematic diagram of the use of a specific embodiment provided by the present utility model.

[0033] Reference numerals:

[0034] 1 - Box body; 11 - Rectangular housing; 111 - First mounting opening; 112 - Second mounting opening; 113 - Mounting part; 114 - Locking pin; 12 - Intake pipe; 13 - Exhaust pipe; 14 - Recycling box; 15 - First cover plate; 16 - Second cover plate;

[0035] 2 - Cleaning assembly; 21 - Condensing assembly; 22 - Filter screen;

[0036] 3 - Fan; 31 - Supercharging volute; 32 - High-temperature resistant motor; 33 - Supercharging impeller;

[0037] 4 - Flow-around assembly; 41 - Partition board; 42 - Continuously bent channel;

[0038] 5 - Locking elbow clamp;

[0039] 100 - Reflow soldering flux recycling box; 200 - Frame. Specific embodiments

[0040] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0041] The core of the present utility model is to provide a reflow soldering flux recycling box, and using this reflow soldering flux recycling box can effectively ensure the quality of welded products. Another core of the present utility model is to provide a reflow soldering equipment including the above-mentioned reflow soldering flux recycling box.

[0042] Please refer to Figure 1 , the present utility model provides a reflow soldering flux recycling box for extracting the mixed gas in the furnace cavity of a reflow soldering equipment and cleaning it, including a box body 1, a cleaning assembly 2, a fan 3 and a flow-around assembly 4.

[0043] Among them, the box body 1 has an air inlet and an air outlet, both of which are used to communicate with the furnace cavity; the cleaning component 2 is arranged in the inner cavity of the box body 1 and is used for refrigerating and filtering the gas; the fan 3 is arranged on the box body 1, and the inlet of the fan 3 communicates with the inner cavity of the box body 1, and the outlet communicates with the air outlet; the flow-around component 4 is arranged in the inner cavity of the box body 1 and is used to guide the gas in the inner cavity of the box body 1 to flow in a serpentine shape, so that the gaseous flux in the gas is liquefied and precipitated, and the flow-around component 4 is close to the air inlet, and the cleaning component 2 is close to the air outlet.

[0044] As Figures 1 to 3 shown, the box body 1 is a hollow structure, and it is provided with an air inlet and an air outlet that communicate with its own inner cavity, and a fan 3 is arranged on the box body 1. The inlet of the fan 3 communicates with the inner cavity of the box body 1, and the outlet communicates with the air outlet of the box body 1. Then, when in use, the air outlet and the air inlet are connected to the furnace cavity through pipelines or the like. Under the pumping action of the gas, the gentle gas in the furnace cavity is pumped out, so that it flows into the inner cavity of the box body 1 through the air inlet and flows out through the air outlet to be pushed back into the furnace cavity.

[0045] Correspondingly, a flow-around component 4 and a cleaning component 2 are arranged in the inner cavity of the box body 1, and the cleaning component 2 is close to the air inlet, while the cleaning component 2 is close to the air outlet. Then, the gas flowing into the inner cavity of the box body 1 flows in a meandering manner under the guidance of the flow-around component 4. During this process, the temperature of the gas decreases due to multiple flow-arounds, and part or all of the gaseous flux can be liquefied and separated from the mixed gas. Then, the remaining gas flows through the cleaning component 2 to be refrigerated and filtered by it. Finally, the gas containing nitrogen is returned to the furnace cavity. By using this reflow soldering flux recovery box, the gaseous flux in the gas can be liquefied and precipitated first, avoiding the blockage of the cleaning component 2 caused by the inflow of the gaseous flux, and the clean gas can be returned to the furnace cavity, which is beneficial to reducing nitrogen consumption and stabilizing the nitrogen concentration value in the furnace cavity, greatly improving the quality of the welded products. And under the action of the flow-around component 4, it is beneficial to reduce the possibility of blockage of the cleaning component 2, so as to extend the maintenance period of this reflow soldering flux recovery box and save manpower and material resources.

[0046] It should be noted that the type of the flow-around component 4 is not limited. For example, the flow-around component 4 may include a cylinder with both ends open, and the cylinder wall of the cylinder has a convex structure extending into its inner cavity. The cylinder and the convex structure cooperate to enclose and form a continuous bending channel 42.

[0047] It also should be noted that the type of the cleaning component 2 is not limited. For example, the cleaning component 2 includes a condenser and a filter box connected in series, or the cleaning component 2 includes an inner box body 1, a condensation component 21 and a filter net 22. The condensation component 21 is arranged in the inner cavity of the inner wall to cool the gas flowing into it through the inlet of the inner box body 1, and the filter net 22 is arranged at the outlet of the inner box body 1, so that the gas can only flow out after passing through the filter net 22.

[0048] It should also be noted that the type and installation method of the fan 3 are not limited, as long as it can pump and deliver gas. For example, the fan 3 can be an axial-flow fan 3 installed inside the box body 1.

[0049] It should also be noted that the length of the path for the gas to flow through the flow-around component 4 is not limited, as long as it can meet the need for the gaseous flux to cool down and liquefy. For example, the distance for the gas to flow from the air inlet to the inlet of the cleaning component 2 is L1, while the distance for the gas to flow from the air inlet to the inlet of the cleaning component 2 after removing the flow-around component 4 from the reflow soldering flux recovery box is L2, and L1 = 4L2.

[0050] Based on the above embodiments, the flow-around component 4 includes several partition plates 41. For some partition plates 41, the first end along the first direction abuts against the box body 1, and there is a gap between the second end and the box body 1. For the remaining partition plates 41, there is a gap between the first end and the box body 1 along the first direction, and the second end abuts against the box body 1, so as to form a continuous bending channel 42 by enclosing with a part of the box wall of the box body 1 and several partition plates 41.

[0051] In some specific embodiments, as Figure 1 and Figure 3 shown, the upper ends of some partition plates 41 abut against the box wall, while there is a gap between the lower ends and the box wall for the gas to flow through. The lower ends of the remaining partition plates 41 abut against the box wall, while there is a gap between the upper ends and the box wall for the gas to flow through, so that the gas can flow in a serpentine manner up and down as Figure 2 shown.

[0052] In some other specific embodiments, referring to the orientation shown in Figures 1 to 3 the left sides of some partition plates 41 abut against the box body 1, while there is a gap between the right sides and the box body 1 for the gas to flow through. The right sides of the remaining partition plates 41 abut against the box body 1, while there is a gap between the left sides and the box body 1 for the gas to flow through, so that the gas can flow in a serpentine manner left and right.

[0053] It should be noted that the shape of the partition plate 41 and the cooperation mode between the partition plate 41 and the box body 1 are not limited, as long as a serpentine flow channel can be formed to guide the gas flow.

[0054] It should also be noted that the type of the partition plate 41 and the composition of the flow-around component 4 are not limited, as long as the gas can be guided to flow in a serpentine manner and the liquid flux can be liquefied and separated out.

[0055] In some specific embodiments, all the partition plates 41 in the flow-around component 4 are made of elvan slate. With such a setting, the flow-around component 4 also has the ability to adsorb gaseous flux.

[0056] In some specific embodiments, all the partition plates 41 in the flow-around component 4 are made of steel plates, which is beneficial to improving the stiffness of the flow-around component 4 while reducing costs and manufacturing difficulties.

[0057] In some specific embodiments, some of the partition plates 41 in the flow-around component 4 are made of meitnerite plates, and the remaining are made of steel plates. For example, several partition plates 41 near the air inlet are all made of meitnerite plates, and several partition plates 41 near the air outlet are all made of steel plates. Or, half of the partition plates 41 in the flow-around component 4 are made of meitnerite plates and the other half are made of steel plates, and the meitnerite plates and the steel plates are arranged alternately. Of course, the types and arrangements of the partition plates 41 in this embodiment are not limited to the above examples.

[0058] On the basis of the above embodiments, the partition plates 41 are all flat plates, and several partition plates 41 are arranged in parallel and arranged in the third direction, and the third direction is perpendicular to the partition plates 41.

[0059] In some specific embodiments, as Figures 1 to 2 shown, the partition plates 41 are arranged side by side in the transverse direction, and the partition plates 41 extend along a plane perpendicular to the transverse direction. Such a setting is beneficial to reducing the assembly difficulty of the recycling box.

[0060] It should be noted that the distance between adjacent partition plates 41 is not limited as long as it can meet the needs of gas flow and flux liquefaction. For example, the distance between adjacent partition plates 41 ranges from 40 to 120 mm.

[0061] On the basis of the above embodiments, the box body 1 includes a rectangular shell 11; the back plate of the rectangular shell 11 has an inlet and an outlet so that gas can flow into or out of the rectangular shell 11 along the width direction of the rectangular shell 11; the cleaning component 2 and the flow-around component 4 are both arranged inside the rectangular shell 11, the cleaning component 2 and the flow-around component 4 are both located between the inlet and the outlet of the rectangular shell 11, and the cleaning component 2 and the flow-around component 4 are arranged along the length direction of the rectangular shell 11.

[0062] As Figure 1 and Figure 2 shown, the inlet and the opening of the rectangular shell 11 are both located on its back plate so that gas can flow into it along the width direction of the rectangular shell 11 and deflect 90 degrees to flow towards the flow-around component 4. Similarly, the gas flowing through the cleaning component 2 needs to deflect 90 degrees before it can flow out through the outlet of the rectangular shell 11. Such a setting is beneficial to ensuring the liquefaction effect of the liquid flux, and the structure of the recycling box is simple and convenient for installation and use.

[0063] Further, as Figure 1 and Figure 2As shown, in some specific embodiments, the inlet of the rectangular housing 11 is located at one end in its own width direction, and the outlet of the rectangular housing 11 is located at the other end in its own width direction. Correspondingly, the fan 3 includes a supercharging volute 31, a high-temperature resistant motor 32, and a supercharging impeller 33. The supercharging impeller 33 is coaxially fixedly connected to the output end of the high-temperature resistant motor 32. The supercharging volute 31 is fixedly connected to the wall of the high-temperature resistant motor 32, and the supercharging impeller 33 is inserted into the supercharging volute 31. The circumferential surface of the supercharging volute 31 has an outlet, and the end surface away from the motor has an inlet. The fan 3 is installed on the side plate of the rectangular housing 11 near its outlet, and the supercharging volute 31 and the supercharging impeller 33 inside it are inserted into the interior of the box body 1. The inlet of the supercharging volute 31 communicates with the inner cavity of the box body 1, and the outlet is butted against the outlet of the rectangular housing 11, while the high-temperature resistant motor 32 is located outside the box body 1.

[0064] Based on the above embodiments, among adjacent partition plates 41, the area of one partition plate 41 projected onto another partition plate 41 is 10% - 80% of its area. Such a setting is made to be able to guide the gas to flow in a meandering manner while ensuring the effect of liquefying and separating the gaseous flux in the gas.

[0065] Based on the above embodiments, the box body 1 further includes an intake pipe 12 and an outlet pipe 13. The first end of the intake pipe 12 is inserted into the inlet of the rectangular housing 11, and the first end of the outlet pipe 13 is inserted into the outlet of the rectangular housing 11. The intake port is the opening at the second end of the intake pipe 12 located outside the rectangular housing 11, and the outlet port is the opening at the second end of the outlet pipe 13 located outside the rectangular housing 11.

[0066] As Figures 1 to 3 shown, a cleaning component 2 and a flow-around component 4 are installed in the hollow rectangular housing 11 to be able to process the mixed gas. An inlet and an outlet are opened on the wall of the rectangular housing 11, and an intake pipe 12 is inserted into the inlet, and an outlet pipe 13 is inserted into the outlet. The opening at the end of the intake pipe 12 located outside the rectangular housing 11 serves as the intake port, and the opening at the end of the outlet pipe 13 located outside the rectangular housing 11 serves as the outlet port.

[0067] It should be noted that there is no limitation on the extension direction of the partition plates 41 in the flow-around component 4, as long as it can guide the gas to flow in a meandering manner. For example, as Figure 2 shown, several partition plates 41 are all perpendicular to the top plate and the back plate of the rectangular housing 11, and / or several partition plates 41 are all perpendicular to the top plate of the rectangular housing 11 and the included angle with the back plate of the rectangular housing 11 is an acute angle.

[0068] Connect both the intake pipe 12 and the outlet pipe 13 to the furnace cavity. Start the air pump, and the gas in the furnace cavity can be pumped out, flowing through the intake port, the intake pipe 12, the left partial chamber of the box body 1, the flow-around component 4, the cleaning component 2, the fan 3, the outlet pipe 13 and the outlet port in sequence, so that it can flow back into the furnace cavity. With such a setting, the installation and use of this recovery box are convenient.

[0069] On the basis of the above embodiment, the box body 1 further includes a recovery box 14, and the recovery box 14 is arranged inside the rectangular shell 11 for receiving liquid soldering flux.

[0070] As Figure 1 shown, this reflow soldering flux recovery box is configured with a recovery box 14. The recovery box 14 is installed inside the box body 1. A partition board 41 that abuts against the top wall of the box body 1 is located directly above the recovery box 14, and the bottom ends of the remaining partition boards 41 extend into the recovery box 14 and abut against its bottom plate. Then, when the mixed gas flows through the flow-around component 4, the flux that cools and liquefies can fall into and / or flow into the recovery box 14. With such a setting, it is beneficial to collect the liquid soldering flux and prevent pollution.

[0071] Furthermore, the bottom plate of the recovery box 14 is provided with a handle, and the handle extends into the inner cavity of the recovery box 14. The handle can be a U-shaped rod or a hanging ring, etc., so as to facilitate taking out the recovery box 14 from the rectangular shell 11.

[0072] Still further, in some specific embodiments, the panel of the rectangular shell 11 has a first installation opening 111 and a second installation opening 112, and further includes a first cover plate 15 and a second cover plate 16. The first cover plate 15 can be hermetically buckled on the first installation opening 111, and the second cover plate 16 can be hermetically buckled on the second installation opening 112. So, after the flow-around component 4 is arranged at a preset position in the inner cavity of the box body 1 through the first installation opening 111 and the cleaning component 2 is arranged at a preset position in the inner cavity of the box body 1 through the second installation opening 112, the rectangular shell 11 can be sealed by the first cover plate 15 and the second cover plate 16.

[0073] Even further, as Figure 4 shown, the panel of the rectangular shell 11 is provided with a plurality of locking toggle clamps 5, and the panel of the rectangular shell 11 has a plurality of locking pins 114. Correspondingly, both the first cover plate 15 and the second cover plate 16 are provided with at least two through holes. The locking pins 114 pass through the corresponding through holes to position the corresponding first cover plate 15 and second cover plate 16, and the locking toggle clamps 5 can abut against the corresponding first cover plate 15 and second cover plate 16 to press them tightly on the rectangular shell 11.

[0074] Based on the above embodiments, the panel of the rectangular housing 11 has a first mounting opening 111, and further includes a first cover plate 15 that can be fastened to the rectangular housing 11 to seal the first mounting opening 111. The partition 41 can pass through the first mounting opening 111 to be mounted in the inner cavity of the rectangular housing 11. The rectangular housing 11 has a plurality of mounting portions 113, and a plurality of partitions 41 can be selectively arranged in the corresponding mounting portions 113.

[0075] As Figure 1 shown, a first mounting opening 111, such as a through hole in the shape of a rectangle or a trapezoid, is formed in the front panel of the rectangular housing 11. During assembly, several partitions 41 are placed into the inner cavity of the rectangular housing 11 through the first mounting opening 111. Correspondingly, a first cover plate 15 that can be fastened to the rectangular housing 11 is also provided to seal the first mounting opening 111 so that gas cannot flow out through it, thereby ensuring the sealing performance of the reflow solder flux recovery box.

[0076] As Figure 2 shown, the rectangular housing 11 is provided with a plurality of mounting portions 113. The mounting portions 113 can be connecting pins with threaded holes, angle steels, L-shaped profiles, hollow profiles, etc., so as to be detachably connected to the partition 41 through bolts and / or nuts. Such a setting is not only convenient for installation and maintenance, but also can install or disassemble the target partition 41 as needed, so as to retain a preset number of partitions 41 installed at preset positions in the reflow solder flux recovery box.

[0077] In addition to the above reflow solder flux recovery box 100, the present invention also provides a reflow soldering device including the reflow solder flux recovery box 100 disclosed in the above embodiments. For the structures of other parts of the reflow soldering device, please refer to the prior art and will not be elaborated herein.

[0078] As Figure 5 shown, in some specific embodiments, the frame 200 of the reflow soldering device is installed with a furnace body and the above reflow solder flux recovery box 100. One or two or three or other numbers of reflow solder flux recovery boxes 100 can be provided. For example, a corresponding reflow solder flux recovery box 100 is respectively provided below the preheating zone and the soldering zone of the furnace body.

[0079] It should be noted that the relational terms such as "first" and "second" described above are only used to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities. The "upper surface, lower surface, top, bottom" and the orientation terms "up, down, left, right" described above are all defined based on the accompanying drawings of the specification.

[0080] In the present specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0081] The above has introduced in detail the reflow soldering flux recovery box and the reflow soldering equipment provided by the present utility model. Specific examples are used herein to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present utility model, several improvements and modifications can still be made to the present utility model, and these improvements and modifications also fall within the protection scope of the present utility model.

Claims

1. A reflow soldering flux recovery box is used to extract the mixed gas in the furnace cavity of the reflow soldering equipment and clean it. It is characterized in that, Comprising: A box body (1) having an air inlet and an air outlet, both the air outlet and the air inlet being used to communicate with the furnace cavity; A cleaning component (2) provided in the inner cavity of the box body (1) for refrigerating and filtering the gas; A fan (3) provided in the box body (1), and the inlet of the fan (3) is communicated with the inner cavity of the box body (1), and the outlet is communicated with the air outlet; A flow-around component (4) provided in the inner cavity of the box body (1) for guiding the gas in the inner cavity of the box body (1) to flow in a serpentine shape, so that the gaseous flux in the gas is liquefied and precipitated, and the flow-around component (4) is close to the air inlet, and the cleaning component (2) is close to the air outlet.

2. The reflow soldering flux recovery box according to claim 1, wherein The flow-around component (4) includes a plurality of partition plates (41), and one end of a part of the partition plates (41) in the first direction abuts against the box body (1), and there is a gap between the second end and the box body (1), and there is a gap between one end of the remaining partition plates (41) in the first direction and the box body (1), and the second end abuts against the box body (1), so as to form a continuous bending channel (42) by enclosing a part of the box wall of the box body (1) and a plurality of the partition plates (41).

3. The reflow soldering flux recovery box according to claim 2, characterized in that The partition plates (41) are all flat plates, and the plurality of partition plates (41) are arranged in parallel, and the plurality of partition plates (41) are arranged in the third direction, and the third direction is perpendicular to the partition plates (41).

4. The reflow soldering flux recovery box according to claim 3, characterized in that, The box body (1) includes a rectangular shell (11); The back plate of the rectangular shell (11) has an inlet and an outlet, so that gas can flow into or out of the rectangular shell (11) along the width direction of the rectangular shell (11); The cleaning component (2) and the flow-around component (4) are both provided inside the rectangular shell (11), the cleaning component (2) and the flow-around component (4) are both located between the inlet and the outlet of the rectangular shell (11), and the cleaning component (2) and the flow-around component (4) are arranged along the length direction of the rectangular shell (11).

5. The reflow soldering flux recovery box according to claim 4, characterized in that, Among adjacent partition plates (41), the area of one partition plate (41) projected onto another partition plate (41) is 10%-80% of its area.

6. The reflow soldering flux recovery box according to claim 3, wherein, The partition plate (41) is a elvan plate; or the partition plate (41) is a metal plate.

7. The reflow soldering flux recovery box according to claim 6, wherein, The box body (1) further includes an air inlet pipe (12) and an air outlet pipe (13), the first end of the air inlet pipe (12) is inserted into the inlet of the rectangular shell (11), the first end of the air outlet pipe (13) is inserted into the outlet of the rectangular shell (11), and the air inlet is the second end opening of the air inlet pipe (12) located outside the rectangular shell (11), and the air outlet is the second end opening of the air outlet pipe (13) located outside the rectangular shell (11).

8. The reflow soldering flux recovery box according to claim 4, wherein, The box body (1) further includes a recovery box (14), and the recovery box (14) is provided inside the rectangular shell (11) for receiving the liquid flux.

9. The reflow soldering flux recovery box according to claim 8, characterized in that, The panel of the rectangular housing (11) has a first mounting opening (111). The box body (1) further includes a first cover plate (15) that can be fastened to the rectangular housing (11) to seal the first mounting opening (111). The partition plate (41) can pass through the first mounting opening (111) to be installed in the inner cavity of the rectangular housing (11). The rectangular housing (11) has a plurality of mounting parts (113), and a plurality of the partition plates (41) are selectively arranged in corresponding mounting parts (113).

10. A reflow soldering device, characterized in that, It includes the reflow soldering flux recovery box according to any one of the above claims 1-9.

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