Mask assembly

Abstract

The mask assembly includes: a mask frame including an open region; at least one mask sheet covering the opening region of the mask frame; and a support bar disposed between the mask frame and the at least one mask sheet, the support bar extending in a first direction to traverse the opening region, and having both ends fixed to the mask frame. The at least one mask sheet includes: a plurality of sub-masks disposed side by side in a second direction crossing the first direction in which the support bars extend; and a connecting rod disposed between the sub-masks and connecting two adjacent sub-masks among the sub-masks. And the connecting rod is overlapped with the supporting rod in a plane graph.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10-2023-0107225, filed with the Korean Intellectual Property Office on August 16, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a mask assembly and a method of manufacturing a display device, and to a mask assembly and a device for manufacturing a display device capable of improving the deposition quality of a display device by preventing a shadow phenomenon. Background Art

[0004] Recently, electronic devices have been widely used. Electronic devices are used in various ways, such as mobile electronic devices and fixed electronic devices. To support various functions, such electronic devices include a display capable of providing visual information such as images or videos to a user.

[0005] A display is a device that visually displays data and is formed by depositing various layers such as an organic layer and a metal layer. Deposition materials may be deposited to form multiple layers of a display. In other words, deposition materials are ejected from a deposition source and deposited on a substrate through a mask assembly.

[0006] In this case, the mask sheet may be an extended mask sheet in which a plurality of sub-masks are connected to manufacture a display having a wide width. The plurality of sub-masks are connected to each other by connection rods. In this case, it is necessary to prevent interference with the support rods supporting the mask sheet.

[0007] The information disclosed in this background art may include information that does not constitute prior art that may be known to a person of ordinary skill in the art. Summary of the Utility Model

[0008] One or more embodiments include a mask assembly capable of improving the deposition quality of a display device by preventing a shadow phenomenon, and a device for manufacturing a display device.

[0009] However, one or more embodiments are merely examples, and the scope of the present disclosure is not limited thereto.

[0010] Additional aspects will be partially described in the following description, and will become apparent from the description, or may be learned by practicing the embodiments of the present disclosure.

[0011] According to one or more embodiments, a mask assembly may include: a mask frame including an opening region; at least one mask sheet covering the opening region of the mask frame; and a support bar disposed between the mask frame and the at least one mask sheet, the support bar extending in a first direction across the opening region, the support bar having an end fixed to the mask frame. The at least one mask sheet may include: a plurality of sub-masks arranged side by side in a second direction intersecting the first direction in which the support bar extends; and a connecting rod disposed between the plurality of sub-masks and connecting two adjacent sub-masks among the plurality of sub-masks. The connecting rod overlaps the support bar in a plan view.

[0012] The support bar may include an opening formed in the first direction, and the connecting rod may be received in the opening.

[0013] The width of the opening may be formed to be at least about 12 μm greater than the width of the connecting rod but less than about 18 μm.

[0014] The thickness of the connecting rod and the thickness of the support bar may be the same.

[0015] The plurality of sub-masks may contact the support bar.

[0016] The plurality of sub-masks may include a first sub-mask, a second sub-mask, and a third sub-mask arranged side by side in the second direction, and the support bar may include: a first support bar extending in the first direction between the first sub-mask and the second sub-mask in a plan view, the first support bar including a first opening that receives a first connecting rod disposed between the first sub-mask and the second sub-mask; and a second support bar extending in the first direction between the second sub-mask and the third sub-mask in a plan view, the second support bar including a second opening that receives a second connecting rod disposed between the second sub-mask and the third sub-mask.

[0017] The width of the first support bar and the width of the second support bar may be different from each other.

[0018] The width of the first opening and the width of the second opening may be different from each other.

[0019] The at least one mask sheet may include a first mask sheet and a second mask sheet arranged side by side in the first direction, the support bar may include a first opening and a second opening spaced apart from each other in the first direction, the connecting rod of the first mask sheet may be received in the first opening, and the connecting rod of the second mask sheet may be received in the second opening.

[0020] The support bar may include a pair of parallel sub-bars each extending in the first direction, and the connecting bar may be accommodated between the pair of parallel sub-bars.

[0021] The distance between the pair of parallel sub-bars may be formed to be at least about 12 μm greater than the width of the connecting bar but less than about 18 μm.

[0022] The plurality of sub-masks may include a first sub-mask, a second sub-mask, and a third sub-mask arranged side by side in the second direction, and the support bar may include: a first support bar extending in the first direction between the first sub-mask and the second sub-mask in a plan view, the first support bar including a pair of parallel first sub-bars to accommodate a first connecting bar disposed between the first sub-mask and the second sub-mask; and a second support bar extending in the first direction between the second sub-mask and the third sub-mask in a plan view, the second support bar including a pair of parallel second sub-bars to accommodate a second connecting bar disposed between the second sub-mask and the third sub-mask.

[0023] The spacing distance between the pair of parallel first sub-bars may be different from the spacing distance between the pair of parallel second sub-bars.

[0024] According to one or more embodiments, an apparatus for manufacturing a display device may include: a mask assembly facing a display substrate; and a deposition source facing the mask assembly on a side opposite to the side where the display substrate is disposed. The mask assembly may include: a mask frame including an opening region; at least one mask sheet covering the opening region of the mask frame; a support bar disposed between the mask frame and the at least one mask sheet, the support bar extending in a first direction to cross the opening region, the support bar having an end fixed to the mask frame. The at least one mask sheet may include: a plurality of sub-masks arranged side by side in a second direction crossing the first direction in which the support bar extends; and a connecting bar disposed between the plurality of sub-masks and connecting two adjacent sub-masks among the plurality of sub-masks. The connecting bar overlaps the support bar in a plan view.

[0025] The support bar may include an opening formed in the first direction, and the connecting bar may be accommodated in the opening of the support bar.

[0026] The width of the opening may be formed to be at least about 12 μm greater than the width of the connecting bar but less than about 18 μm.

[0027] The plurality of sub-masks may include a first sub-mask, a second sub-mask, and a third sub-mask arranged side by side in the second direction, and the support bars may include: a first support bar extending in the first direction between the first sub-mask and the second sub-mask in a plan view, the first support bar including a first opening that houses a first connecting rod disposed between the first sub-mask and the second sub-mask; and a second support bar extending in the first direction between the second sub-mask and the third sub-mask in a plan view, the second support bar including a second opening that houses a second connecting rod disposed between the second sub-mask and the third sub-mask.

[0028] The width of the first support bar and the width of the second support bar may be different.

[0029] The width of the first opening and the width of the second opening may be different.

[0030] The support bars may include a pair of parallel sub-bars each extending in the first direction, and the connecting rod may be housed between the pair of parallel sub-bars.

[0031] These and / or other aspects will become apparent and more readily understood from the description of the embodiments, claims, and drawings. Description of the Drawings

[0032] From the following description in conjunction with the drawings, the above and other aspects, features, and advantages of the embodiments will become more apparent, in which:

[0033] Figure 1 is a schematic cross-sectional view showing an apparatus for manufacturing a display device according to an embodiment;

[0034] Figure 2 is a schematic perspective view of a mask assembly according to an embodiment;

[0035] Figure 3 is a schematic plan view of a mask sheet according to an embodiment;

[0036] Figure 4 is a schematic cross-sectional view of a mask sheet according to an embodiment, and may correspond to a cross-section taken along Figure 3 line IV-IV';

[0037] Figure 5 is a schematic plan view of a support bar according to an embodiment;

[0038] Figure 6 is a schematic cross-sectional view of a mask assembly according to an embodiment, and may correspond to a cross-section taken along Figure 5 line VI-VI';

[0039] Figure 7 is a schematic cross-sectional view showing a comparison between a mask assembly according to an embodiment and a mask assembly according to a comparative example.

[0040] Figure 8 is a schematic plan view of a support bar according to an embodiment;

[0041] Figure 9 and Figure 10 is a schematic plan view of a support bar according to other embodiments;

[0042] Figure 11 is a schematic plan view of a display device manufactured using a display device manufacturing apparatus according to an embodiment; and

[0043] Figure 12 is a schematic cross-sectional view of a display device manufactured using a display device manufacturing apparatus according to an embodiment, and may correspond to a cross-section of the display device taken along line XII-XII' of Figure 11 the display device. DETAILED DESCRIPTION

[0044] Now, embodiments will be described in detail with reference to the drawings, in which examples of the embodiments are shown, and like reference numerals always refer to like elements. In this regard, the embodiments may have different forms and should not be construed as limited to the descriptions set forth herein. Therefore, the embodiments are described below with reference to the drawings to explain the various aspects of the descriptions.

[0045] As used herein, the term "and / or" is intended to include any combination of the terms "and" and "or" for purposes of its meaning and interpretation. For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in a conjunctive or disjunctive sense and can be understood to be equivalent to "and / or".

[0046] Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0047] Since the present disclosure allows for various variations and numerous embodiments, the embodiments will be shown in the drawings and described in detail in the written description. Hereinafter, the effects and features of the present disclosure and the methods for achieving these effects and features will be described more fully with reference to the drawings, in which embodiments of the present disclosure are shown. However, the present disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0048] One or more embodiments will now be described in more detail with reference to the accompanying drawings. Regardless of the figure numbers, those components that are the same or corresponding to each other are given the same reference numerals, and redundant explanations may be omitted.

[0049] It should be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another. For example, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0050] Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms.

[0051] It should also be understood that when used in this specification, the terms "comprises", "comprising", "includes", "including", and / or "has", "have", "having" and their variants specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0052] It should be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, the layer, region, or component may be directly or indirectly formed on the other layer, region, or component. For example, there may be intervening layers, regions, or components.

[0053] It will be understood that in this specification, when an element (or region, layer, or part, etc.) is referred to as being "on", "connected to", or "coupled to" another element, the element may be directly disposed on the other element, connected or coupled to the other element, or an intervening element may be disposed between the element and the other element.

[0054] It should be understood that the terms "connected to" or "coupled to" may include physical connection or electrical connection or coupling.

[0055] The term "overlaps with" or "overlapping" means that the first object may be above or below or on one side of the second object, and vice versa. Additionally, the term "overlaps with" may include laminating, stacking, facing or facing towards, extending throughout, covering or partially covering, or any other suitable term as would be recognized and understood by one of ordinary skill in the art.

[0056] When an element is described as "not overlapping" or "not overlapping with" another element, this may include the elements being spaced apart from each other, offset from each other, or separated from each other or any other suitable term as would be recognized and understood by one of ordinary skill in the art.

[0057] The terms "face" and "facing" mean that the first element can be directly or indirectly opposite the second element. In the case where a third element is between the first element and the second element, the first element and the second element can be understood to be indirectly opposite each other although still facing each other.

[0058] For ease of illustration, the dimensions of the elements in the drawings may be exaggerated or reduced. For example, since the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of illustration, the embodiments are not limited thereto.

[0059] In the following examples, the x-direction, y-direction, and z-direction are not limited to the three axes of a rectangular coordinate system and may be interpreted in a broader sense. For example, the x-direction, y-direction, and z-direction may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

[0060] When a particular embodiment can be implemented differently, a particular process sequence can be performed differently from the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described order.

[0061] Taking into account the measurements discussed and the errors associated with a particular number of measurements (i.e., the limitations of the measurement system), as used herein, "about" or "approximate" includes the stated value and represents within an acceptable deviation range of a particular value determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0062] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0063] Figure 1 is a schematic cross-sectional view showing an apparatus 2 for manufacturing a display device according to an embodiment.

[0064] The apparatus 2 may include a chamber 10, a first support member 20, a second support member 30, a mask assembly MA, a deposition source 50, a magnetic force unit 60, a vision unit 70, and a pressure regulator 80.

[0065] The chamber 10 may have a space formed therein, and a display substrate DS and a mask assembly MA may be accommodated in the chamber 10. An opening portion may be formed in the chamber 10, and a gate valve 11 may be provided in the opening portion of the chamber 10. In this case, according to the operation of the gate valve 11, the opening portion of the chamber 10 may be opened or closed.

[0066] The display substrate DS may refer to the substrate 100 during the manufacture of a display device, on which at least one layer among an organic layer, an inorganic layer, and a metal layer is deposited, which will be described later. For example, the display substrate DS may be the substrate 100 on which none of the organic layer, the inorganic layer, and the metal layer has been deposited yet.

[0067] The first support member 20 may support the display substrate DS. The first support member 20 may be in the form of a plate fixed to the inside of the chamber 10. According to an embodiment, the first support member 20 may be in the form of a shuttle on which the display substrate DS is safely placed and linearly movable within the chamber 10. According to an embodiment, the first support member 20 may include an electrostatic chuck or an adhesive chuck provided in the chamber 10 so as to be fixed to or movable within the chamber 10.

[0068] The second support member 30 may support the mask assembly MA. In this case, the second support member 30 may be disposed (or provided) within the chamber 10. The second support member 30 may be capable of finely adjusting the position of the mask assembly MA. In this case, the second support member 30 may be provided with a separate driver or alignment unit to enable the mask assembly MA to move in different directions.

[0069] According to an embodiment, the second support member 30 may be in the form of a shuttle. In this case, the second support member 30 may have the mask assembly MA safely placed thereon and may transfer the mask assembly MA. For example, the second support member 30 may move to the outside of the chamber 10 with the mask assembly MA safely placed thereon and enter the inside of the chamber 10 from the outside of the chamber 10.

[0070] In the above case, the first support member 20 and the second support member 30 may be integrally formed with each other. In this case, the first support member 20 and the second support member 30 may include a movable shuttle. The first support member 20 and the second support member 30 may include a structure for fixing the mask assembly MA and the display substrate DS while placing the display substrate DS on the mask assembly MA, and may linearly move the display substrate DS and the mask assembly MA simultaneously.

[0071] However, for the sake of illustration, the case where the first support member 20 and the second support member 30 are formed separately from each other and disposed at different positions and the first support member 20 and the second support member 30 are disposed inside the chamber 10 will now be described in detail.

[0072] The deposition source 50 may be disposed to face the mask assembly MA. A deposition material may be accommodated in the deposition source 50 and may be heated to evaporate or sublime. The deposition source 50 may be fixedly placed inside the chamber 10 or may be placed inside the chamber 10 to linearly move in one direction.

[0073] The mask assembly MA may be arranged inside the chamber 10. The mask assembly MA may include a mask frame 500 and a mask sheet 400. This will be described in more detail later. The deposition material may pass through the mask assembly MA and may be deposited on the display substrate DS.

[0074] The magnetic force unit 60 may be disposed inside the chamber 10 to face the display substrate DS and / or the mask assembly MA. The magnetic force unit 60 may apply a magnetic force to the mask assembly MA to force the mask assembly MA toward the display substrate DS. For example, the magnetic force unit 60 can not only prevent the mask sheet 400 from sagging but also allow the mask sheet 400 to be adjacent to the display substrate DS. The magnetic force unit 60 may maintain a uniform gap between the mask sheet 400 and the display substrate DS.

[0075] The vision unit 70 may be arranged inside the chamber 10 and may photograph the respective positions of the display substrate DS and the mask sheet 400. In this case, the vision unit 70 may include a camera that photographs the display substrate DS and the mask assembly MA. Based on the image captured by the vision unit 70, the respective positions of the display substrate DS and the mask assembly MA can be grasped, and the deformation of the mask assembly MA can be confirmed. Based on the image, the position of the display substrate DS on the first support member 20 can be finely adjusted, or the position of the mask assembly MA on the second support member 30 can be finely adjusted. However, the case where the respective positions of the display substrate DS and the mask assembly MA are aligned by finely adjusting the position of the mask assembly MA on the second support member 30 will now be focused on and described in detail.

[0076] The pressure regulator 80 can be connected to the chamber 10 and can regulate the internal pressure of the chamber 10. For example, the pressure regulator 80 can regulate the internal pressure of the chamber 10 to be the same as or similar to the atmospheric pressure. The pressure regulator 80 can also regulate the internal pressure of the chamber 10 to be the same as or similar to the vacuum state.

[0077] The pressure regulator 80 can include a connecting pipe 81 connected to the chamber 10 and a pump 82 provided on the connecting pipe 81. In this case, according to the operation of the pump 82, external air can be introduced through the connecting pipe 81, or the gas inside the chamber 10 can be guided to the outside through the connecting pipe 81.

[0078] Regarding the method of manufacturing a display device (not shown) by using the above-described apparatus 2 for manufacturing a display device, first, a display substrate DS can be prepared.

[0079] The pressure regulator 80 can maintain the inside of the chamber 10 in a state equal to or similar to the atmospheric pressure, and the gate valve 11 can be operated to open the opening portion of the chamber 10.

[0080] Thereafter, the display substrate DS can be inserted from the outside of the chamber 10 into the inside of the chamber 10. At this time, the display substrate DS can be inserted into the chamber 10 in various ways. For example, the display substrate DS can be inserted from the outside of the chamber 10 into the inside of the chamber 10 through a robotic arm or the like provided outside the chamber 10. According to an embodiment, in the case where the first support member 20 is formed in the form of a shuttle, the first support member 20 can be transported from the inside of the chamber 10 to the outside of the chamber 10, and the display substrate DS can be placed on the first support member 20 through a separate robotic arm or the like placed outside the chamber 10, and the first support member 20 can be inserted from the outside of the chamber 10 into the inside of the chamber 10.

[0081] The mask assembly MA can be in a state of being disposed inside the chamber 10 as described above. According to an embodiment, the mask assembly MA can be inserted into the chamber 10 from the outside of the chamber 10 in the same or similar manner as the display substrate DS.

[0082] In the case where the display substrate DS is inserted into the chamber 10, the display substrate DS can be placed on the first support member 20. At this time, the vision unit 70 can capture the respective positions of the display substrate DS and the mask assembly MA. Based on the image captured by the vision unit 70, the respective positions of the display substrate DS and the mask sheet 400 can be grasped. At this time, the apparatus 2 for manufacturing a display device can include a separate controller (not shown) to control the respective positions of the display substrate DS and the mask assembly MA.

[0083] With the control of the respective positions of the display substrate DS and the mask assembly MA completed, the second support 30 can finely adjust the position of the mask assembly MA.

[0084] Thereafter, the deposition source 50 can be operated to supply a deposition material to the mask assembly MA, and the deposition material that has passed through the plurality of pattern holes of the mask sheet 400 can be deposited on the display substrate DS. At this time, the deposition source 50 can move parallel to the display substrate DS and the mask assembly MA, or the display substrate DS and the mask assembly MA can move parallel to the deposition source 50. In other words, the deposition source 50 can move relative to the display substrate DS and the mask assembly MA. At this time, the pump 82 can maintain the internal pressure of the chamber 10 in a form similar to or the same as a vacuum by sucking gas into the chamber 10 and discharging the gas to the outside.

[0085] As described above, the deposition material supplied by the deposition source 50 can pass through the mask assembly MA and can be deposited on the display substrate DS, thereby forming at least one of a plurality of layers such as an organic layer, an inorganic layer, and a metal layer stacked in the display device to be described later.

[0086] Figure 2 is a schematic perspective view of the mask assembly MA according to an embodiment, and shows a mask assembly that can be used in the above-described apparatus for manufacturing a display device. Figure 3 is a schematic plan view of the mask sheet 400 according to an embodiment. Figure 4 is a schematic cross-sectional view of the mask sheet 400 according to an embodiment, and can correspond to a cross-section taken along Figure 3 the line IV-IV'.

[0087] Referring to Figures 2 to 4 , the mask assembly MA can include a mask frame 500, a mask sheet 400, a blocking bar 600, and a support bar 700.

[0088] The mask frame 500 can be formed by connecting a plurality of sides to each other, and can include an opening area OA defined by the plurality of sides. In other words, the opening area OA can be formed by being surrounded by the plurality of sides, and the opening area OA can pass through the center of the mask frame 500.

[0089] According to an embodiment, the mask frame 500 can be a rectangular frame. Of course, the shape of the mask frame 500 is not limited thereto, and can be various polygonal shapes. For ease of description, the case where the mask frame 500 is a rectangular frame will now be described in detail. It should be understood that the shapes disclosed herein include shapes that are substantially the same as the shapes disclosed herein.

[0090] In the case where the mask frame 500 is a rectangular frame, the plurality of sides can include in a first direction (e.g.,Figure 2 a first side S1 extending in a first direction (e.g., the x-direction in Figure 2 ), and a second side S2 extending in a second direction crossing the first direction (e.g., the y-direction in

[0091] The mask sheet 400 may be mounted on the mask frame 500 by being stretched. An opening area OA at the center of the mask frame 500 may be covered by the mask sheet 400. In Figure 2 , the mask sheet 400 may include a first mask sheet 400A and a second mask sheet 400B. However, according to an embodiment, one or more mask sheets 400 may be provided. In the case where two or more mask sheets 400 are provided, the mask sheets 400 may be arranged side by side on the mask frame 500. For example, the mask sheets 400 may be arranged side by side in a first direction ( Figure 2 the x-direction in

[0092] According to an embodiment, the mask sheet 400 may be an extended mask sheet 400 in which a plurality of sub-masks 410 are connected to each other. The mask sheet 400 has a very large width (the length in the Figure 3 x-direction), such that a display device having a very large width can be manufactured.

[0093] According to an embodiment, the mask sheet 400 may include sub-masks 410, connection rods 420, and a main clamping unit 430. According to an embodiment, the sub-masks 410 may be masks extending in a first direction ( Figure 3 the x-direction in Figure 3 ). However, the embodiment is not limited thereto. A plurality of sub-masks 410 may be provided. For example, the sub-masks 410 may include a first sub-mask 411, a second sub-mask 412, a third sub-mask 413, a fourth sub-mask 414, and a fifth sub-mask 415. As

[0094] Each sub-mask 410 may include one or more pattern holes PH. The pattern holes PH may be through-holes formed to allow deposition material to pass through the sub-mask 410. The deposition material that has passed through the sub-mask 410 may be deposited on the display substrate DS (see Figure 1 ).

[0095] The first sub-mask 411, the second sub-mask 412, and the third sub-mask 413 may be arranged side by side in a second direction ( Figure 3 the y-direction in ) that intersects the first direction. The first sub-mask 411, the second sub-mask 412, and the third sub-mask 413 may be spaced apart from each other by a selectable distance in the second direction.

[0096] A plurality of sub-masks 410, such as the first sub-mask 411, the second sub-mask 412, and the third sub-mask 413, may be connected to each other by connection rods 420. Specifically, the first sub-mask 411 and the second sub-mask 412 that are spaced apart from each other in the second direction may be connected to each other by a first connection rod 421. As Figure 4 shown, the first connection rod 421 may be arranged such that a part of the first connection rod 421 overlaps with the first sub-mask 411 and the second sub-mask 412. In this case, the first connection rod 421 may be provided on the lower surface of the first sub-mask 411 (e.g., Figure 4 the surface in the -z direction in ) and the lower surface of the second sub-mask 412. According to an embodiment, the first connection rod 421 may be spot-welded to the welding points WP located (or provided) on the respective upper surfaces of the first sub-mask 411 and the second sub-mask 412, and thus may be fixed to the first sub-mask 411 and the second sub-mask 412.

[0097] Similarly, the second sub-mask 412 and the third sub-mask 413 that are spaced apart from each other in the second direction may be connected to each other by a second connection rod 422, the third sub-mask 413 and the fourth sub-mask 414 that are spaced apart from each other in the second direction may be connected to each other by a third connection rod 423, and the fourth sub-mask 414 and the fifth sub-mask 415 that are spaced apart from each other in the second direction may be connected to each other by a fourth connection rod 424. As Figure 4 shown, the second connection rod 422 may be arranged such that a part of the second connection rod 422 overlaps with the second sub-mask 412 and the third sub-mask 413. In this case, the second connection rod 422 may be provided on the lower surface of the second sub-mask 412 and the lower surface of the third sub-mask 413. According to an embodiment, the second connection rod 422 may be spot-welded to the welding points WP located on the respective upper surfaces of the second sub-mask 412 and the third sub-mask 413, and thus may be fixed to the second sub-mask 412 and the third sub-mask 413.

[0098] The connecting rod 420 may extend in the direction in which the sub-masks 410 extend (e.g., in the first direction). The connecting rod 420 may connect the plurality of sub-masks 410 to each other while blocking the space between the plurality of sub-masks 410.

[0099] According to an embodiment, the connecting rod 420 may be disposed on the lower layer of the sub-mask 410. In other words, since the connecting rod 420 is welded and connected to the lower surface of the sub-mask 410, the connecting rod 420 may be disposed as the lower layer of the sub-mask 410 while forming a step.

[0100] In the case of connecting the sub-masks 410 to each other, the clamping units CL provided at both ends in the longitudinal direction (e.g., Figure 3 the x-direction in ) of each sub-mask 410 may be used to clamp and stretch each sub-mask 410. As Figure 2 shown, the clamping unit CL of each sub-mask 410 may be cut after connecting the sub-masks 410 to each other.

[0101] The main clamping unit 430 may be connected to the sub-mask 410 provided at one or both ends in the second direction among the plurality of sub-masks 410 arranged side by side in the second direction. For example, as Figure 3 shown, the main clamping unit 430 may be connected to the first sub-mask 411 and the fifth sub-mask 415. Similar to the above description, the main clamping unit 430 may be connected to the sub-mask 410 through the connecting rod 420. In the case of welding and fixing the mask sheet 400 to the mask frame 500, the main clamping unit 430 may be used to clamp the mask sheet 400 and stretch the mask sheet 400 in the second direction. According to an embodiment, the main clamping unit 430 may be cut after the mask sheet 400 is fixed to the mask frame 500.

[0102] Returning to Figure 2 , the shielding rod 600 may be disposed between the mask frame 500 and the mask sheet 400, and may block the space between the plurality of mask sheets 400. According to an embodiment, the shielding rod 600 may be provided as one shielding rod and may block the space between the first mask sheet 400A and the second mask sheet 400B. According to an embodiment, in the case of providing three or more mask sheets 400, a plurality of shielding rods 600 may be provided, and the plurality of shielding rods 600 may be spaced apart from each other in the first direction and arranged parallel to each other. The shielding rod 600 may be in the second direction (e.g., Figure 2extends in the y - direction (e.g., within) to cross the interior of the mask frame 500, such as the opening area OA of the mask frame 500. The mask frame 500 may include holes for receiving both ends of the shielding rod 600. The shielding rod 600 may be located between a plurality of mask sheets 400, and thus may block (or prevent) the deposition material from passing through between two adjacent mask sheets 400.

[0103] The support rod 700 may extend in a first direction (e.g., Figure 2 the x - direction within) to cross the interior of the mask frame 500, such as the opening area OA of the mask frame 500. According to an embodiment, a plurality of support rods 700 may be provided, and the plurality of support rods 700 may be spaced apart from each other and arranged parallel to each other in a second direction (e.g., Figure 2 the y - direction within). The support rod 700 may cross the shielding rod 600 in the opening area OA and may be located above the shielding rod 600. The mask frame 500 may include holes for receiving both ends of the shielding rod 700, but the embodiment is not limited thereto. The support rod 700 may support the mask sheet 400 in the opening area OA to prevent the mask sheet 400 from sagging.

[0104] Figure 5 is a schematic plan view of the support rod 700 according to an embodiment. Figure 6 is a schematic cross - sectional view of the mask assembly MA (see Figure 1 ) according to an embodiment, and may correspond to a cross - section taken along the line VI - VI' of Figure 5 .

[0105] Referring to Figure 5 and Figure 6 , according to an embodiment, the support rod 700 may be arranged to overlap with the connecting rod 420 of the mask sheet 400 in a plan view. Specifically, the support rod 700 may include a first support rod 710, a second support rod 720, a third support rod 730, and a fourth support rod 740. The first support rod 710 may extend through the mask sheet 400. For example, the first support rod 710 may extend in the first direction between the first sub - mask 411 and the second sub - mask 412. At this time, the first support rod 710 may be arranged to overlap with the first connecting rod 421 of the mask sheet 400. Similarly, it will be understood that the second support rod 720 to the fourth support rod 740 may be arranged to overlap with the second connecting rod 422 to the fourth connecting rod 424 of the mask sheet 400, respectively. Since each of the second support rod 720 to the fourth support rod 740 is similar to the first support rod 710, the following description will focus on the first support rod 710.

[0106] According to an embodiment, each support bar 700 may include an opening OP. The opening OP may be a through-hole extending in a direction in which the support bar 700 extends (e.g., in a first direction). For example, the opening OP may include a first opening OP1, a second opening OP2, a third opening OP3, and a fourth opening OP4. According to an embodiment, the openings OP may be provided in a number corresponding to the number of mask sheets 400. For example, in the case where two mask sheets 400 are provided as shown in Figure 2 each support bar 700 may include two openings OP corresponding to the first mask sheet 400A and the second mask sheet 400B.

[0107] The opening OP may accommodate the above-described connecting rod 420. In other words, the width of the connecting rod 420 (e.g., the length in the y direction in Figure 5 ) may be formed to be greater than the width of the opening OP such that the connecting rod 420 may be accommodated in the opening OP. Thus, as shown in Figure 6 the connecting rod 420 may be accommodated in the opening OP formed in the support bar 700, and the sub-mask 410 (see Figure 3 ) may be supported in contact with the support bar 700. In this case, the connecting rod 420 is not provided on the support bar 700 but is accommodated inside the support bar 700, and thus a step difference between the support bar 700 and the sub-mask 410 may be prevented.

[0108] According to an embodiment, the width of the opening OP may be formed to be greater than the width of the connecting rod 420 by at least about 12 μm but less than about 18 μm. Thus, a tolerance for accommodating the connecting rod 420 may be ensured, and at the same time, during cleaning of the mask assembly MA, the cleaning solution may be easily discharged without accumulating between the support bar 700 and the connecting rod 420.

[0109] According to an embodiment, the thickness of the connecting rod 420 (the length in the z direction) may be equal to the thickness of the support bar 700 (the length in the z direction). Thus, in the case where the mask sheet 400 is supported by the support bar 700, the sub-mask 410 may be supported in contact with the support bar 700, and a step difference may not be formed between the connecting rod 420 and the support bar 700.

[0110] Figure 7 is a schematic cross-sectional view showing a comparison between a mask assembly MA (see Figure 1 ) according to an embodiment and a mask assembly MA according to a comparative example. Specifically, the mask assembly MA according to the embodiment is shown on the right side, and the mask assembly MA according to the comparative example is shown on the left side.

[0111] Refer to Figure 7, according to an embodiment, the mask assembly MA can prevent the shadow phenomenon. The shadow phenomenon refers to the phenomenon where the deposited material is not deposited with a normal deposition thickness when the deposited material passes through the mask sheet 400 (see Figure 1 ) and is deposited on the display substrate DS (see Figure 1 ). In the case where the connecting rod 420 is disposed above the support rod 700 as in the comparative example, compared with the present disclosure, the distance between the deposition source 50 and the support rod 700 may be reduced. Therefore, the non-deposition region SH where the deposited material cannot be deposited because the non-deposition region SH is blocked by the support rod 700 may increase. According to an embodiment, since the connecting rod 420 is received in the opening OP of the support rod 700, the distance between the deposition source 50 and the support rod 700 can be increased compared with the comparative example. Therefore, the non-deposition region SH where the deposited material cannot be deposited because the non-deposition region SH is blocked by the support rod 700 can be reduced, and the shadow phenomenon can be prevented.

[0112] According to the comparative example, the cleaning solution for cleaning the mask assembly MA may accumulate in the region where the connecting rod 420 and the support rod 700 are in contact with each other. Therefore, it is difficult to discharge the cleaning solution, resulting in a shortened life of the mask assembly MA. According to an embodiment, since the connecting rod 420 is received in the opening OP of the support rod 700 and the cleaning solution can be easily discharged through the opening OP, the accumulation of the cleaning solution between the connecting rod 420 and the support rod 700 can be prevented.

[0113] Figure 8 is a schematic plan view of the support rod 700 according to an embodiment. Since the support rod 700 according to an embodiment is similar to the previously described support rod 700, the differences between them will now be focused on and described.

[0114] Referring to Figure 8 and in combination with Figure 3 , according to an embodiment, the width W1 of the first support rod 710 may be different from the width W2 of the second support rod 720. For example, the width W1 of the first support rod 710 may be greater than the width W2 of the second support rod 720. According to an embodiment, the width R1 of the opening OP (e.g., the first opening OP1) of the first support rod 710 may be different from the width R2 of the opening OP (e.g., the second opening OP2) of the second support rod 720. For example, the width R1 of the first opening OP1 may be greater than the width R2 of the second opening OP2.

[0115] Since the width W1 of the first support rod 710 and the width W2 of the second support rod 720 are different from each other, and the width R1 of the first opening OP1 and the width R2 of the second opening OP2 are different from each other, display devices 1 of various sizes can be manufactured (see Figure 11)。For example, the first sub-mask 411 and the second sub-mask 412 may have different sizes, and the second sub-mask 412 and the third sub-mask 413 may have different sizes. Therefore, the width of the first connecting rod 421 that connects the first sub-mask 411 to the second sub-mask 412 may need to be different from the width of the second connecting rod 422 that connects the second sub-mask 412 to the third sub-mask 413. Therefore, the first opening OP1 and the second opening OP2 that respectively accommodate the first connecting rod 421 and the second connecting rod 422 may need to have different widths. The width W1 of the first support rod 710 may need to be different from the width W2 of the second support rod 720.

[0116] Figure 9 and Figure 10 is a schematic plan view of the support rod 700 according to other embodiments. Since the support rod 700 according to the embodiment is similar to the previously described support rod 700, the differences between them will now be focused on and described.

[0117] Referring Figure 9 , according to an embodiment, the support rod 700 may include a pair of parallel sub-rods each extending in a first direction. For example, the first support rod 710 may include a pair of parallel first sub-rods 711 each extending in the first direction, the second support rod 720 may include a pair of parallel second sub-rods 721 each extending in the first direction, the third support rod 730 may include a pair of parallel third sub-rods 731 each extending in the first direction, and the fourth support rod 740 may include a pair of parallel fourth sub-rods 741 each extending in the first direction. A pair of parallel first sub-rods 711 may be spaced apart from each other in a second direction. The distance between a pair of parallel first sub-rods 711 may be defined as the spacing distance SS.

[0118] The connecting rod 420 may be accommodated between a pair of parallel sub-rods. According to an embodiment, the width of the spacing distance SS may be formed to be at least about 12 μm but less than about 18 μm larger than the width of the connecting rod 420. Therefore, the support rod 700 can ensure a tolerance for accommodating the connecting rod 420, and at the same time, the cleaning solution can be easily discharged during the cleaning of the mask assembly MA (see Figure 1 ) without accumulating between the support rod 700 and the connecting rod 420.

[0119] Referring Figure 10 and in combination with Figure 3, according to an embodiment, the first support bar 710 may include a pair of parallel first sub - bars 711 each extending in a first direction. The pair of parallel first sub - bars 711 may be spaced apart from each other by a spacing distance SS1 in a second direction. The second support bar 720 may include a pair of parallel second sub - bars 721 each extending in the first direction. The pair of parallel second sub - bars 721 may be spaced apart from each other by a spacing distance SS2 in the second direction.

[0120] In this case, according to an embodiment, the width W1 of the first support bar 710 may be different from the width W2 of the second support bar 720. For example, the width W1 of the first support bar 710 may be greater than the width W2 of the second support bar 720. According to an embodiment, the spacing distance SS1 between the first sub - bars 711 may be different from the spacing distance SS2 between the second sub - bars 721. For example, the spacing distance SS1 between the first sub - bars 711 may be greater than the spacing distance SS2 between the second sub - bars 721.

[0121] Since the width W1 of the first support bar 710 and the width W2 of the second support bar 720 are different from each other, and the spacing distance SS1 between the first sub - bars 711 and the spacing distance SS2 between the second sub - bars 721 are different from each other, display devices 1 of various sizes can be manufactured (see Figure 11 ). For example, the first sub - mask 411 and the second sub - mask 412 may have different sizes, and the second sub - mask 412 and the third sub - mask 413 may have different sizes. Therefore, the width of the first connecting rod 421 connecting the first sub - mask 411 to the second sub - mask 412 may need to be different from the width of the second connecting rod 422 connecting the second sub - mask 412 to the third sub - mask 413. Therefore, the spacing distance SS1 between the first sub - bars 711 accommodating the first connecting rod 421 may need to be different from the spacing distance SS2 between the second sub - bars 721 accommodating the second connecting rod 422. The width W1 of the first support bar 710 may need to be different from the width W2 of the second support bar 720.

[0122] Figure 11 is a schematic plan view of the display device 1 manufactured by using a display device manufacturing apparatus according to an embodiment.

[0123] Referring to Figure 11 , the display device 1 manufactured according to an embodiment may include a display area DA and a peripheral area PA located around the display area DA. The display device 1 may provide an image through an array of a plurality of pixels PX arranged in a two - dimensional (2D) manner in the display area DA.

[0124] The peripheral region PA does not provide an image and can surround all or part of the display region DA. A driver or the like for supplying an electrical signal or power to a pixel circuit corresponding to each pixel PX can be provided in the peripheral region PA. A pad that is an area where an electronic device or a printed circuit board (PCB) can be electrically connected can be provided in the peripheral region PA.

[0125] Now, a case where the display device 1 can include an organic light emitting diode OLED (see Figure 12 ) as a light emitting element will be described, but the display device 1 according to the present disclosure is not limited thereto. According to an embodiment, the display device 1 can be a light emitting display including an inorganic light emitting diode, for example, an inorganic light emitting display. The inorganic light emitting diode can include a PN junction diode including a material based on an inorganic material semiconductor. In the case where a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and the energy generated by the recombination of the holes and electrons is converted into light energy, thereby emitting light of a given color. The aforementioned inorganic light emitting diode can have a width of several micrometers to several hundred micrometers. According to an embodiment, the aforementioned inorganic light emitting diode can be referred to as a micro light emitting diode (LED). According to an embodiment, the display device 1 can be a quantum dot light emitting display device.

[0126] The display device 1 can be used not only as a display screen of portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs), but also as a display screen of various products such as televisions, notebook computers, monitors, billboards, and Internet of Things (IoT) devices. The display device 1 according to an embodiment can also be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMDs). The display device 1 according to an embodiment can also be used as an instrument panel of an automobile, a central instrument panel of an automobile, or a central information display (CID) of a dashboard, an in-vehicle mirror display that serves as a substitute for a side view mirror of an automobile, and a display screen arranged on the rear side of the front seats to be used as an entertainment device for rear passengers of an automobile.

[0127] Figure 12 is a schematic cross-sectional view of the display device 1 manufactured using a display device manufacturing apparatus according to an embodiment, and can correspond to a cross-section of the display device 1 taken along the Figure 11 line XII-XII'.

[0128] Referring to Figure 12 , the display device 1 can include a stacked structure of a substrate 100, a pixel circuit layer PCL, a display element layer DEL, and a packaging layer 300. The aforementioned display substrate DS (see Figure 1)It may be, for example, a stack of at least one of a pixel circuit layer PCL, a display element layer DEL, and a packaging layer 300 on a substrate 100 during the manufacture of the display device 1.

[0129] The substrate 100 may have a multi-layer structure, which includes a matrix layer containing a polymer resin and an inorganic layer. For example, the substrate 100 may include a matrix layer containing a polymer resin and an inorganic insulating layer. For example, the substrate 100 may include a first matrix layer 101, a first barrier layer 102, a second matrix layer 103, and a second barrier layer 104 stacked in sequence. The first matrix layer 101 and the second matrix layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), triacetyl cellulose (TAC), or / and cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may include inorganic insulating materials such as silicon oxide, silicon nitride, and / or silicon oxynitride. The substrate 100 may be flexible.

[0130] The pixel circuit layer PCL is disposed on the substrate 100. In Figure 12 it, the pixel circuit layer PCL may include a thin film transistor TFT, and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116 disposed below or / and above the components of the thin film transistor TFT.

[0131] The buffer layer 111 may reduce or prevent foreign substances, moisture, or ambient air from infiltrating from below the substrate 100, and may provide a flat surface for the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may be a single layer or multiple layers including an inorganic insulating material.

[0132] The thin film transistor TFT on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polysilicon. For example, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region C and a drain region D and a source region S disposed on both sides of the channel region C, respectively. The gate electrode GE may overlap with the channel region C.

[0133] The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed as a multi-layer or a single layer including the foregoing materials.

[0134] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ). The zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0135] A second gate insulating layer 113 may be included to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ). The zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0136] The upper electrode Cst2 of the storage capacitor Cst may be disposed on the second gate insulating layer 113. The upper electrode Cst2 may overlap with the gate electrode GE located therebelow. The overlapping gate electrode GE and upper electrode Cst2 and the second gate insulating layer 113 located between the gate electrode GE and the upper electrode Cst2 may constitute the storage capacitor Cst. In other words, the gate electrode GE may serve as the lower electrode Cst1 of the storage capacitor Cst.

[0137] Therefore, the storage capacitor Cst and the thin film transistor TFT may overlap each other. According to an embodiment, the storage capacitor Cst and the thin film transistor TFT may not overlap each other.

[0138] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may be a single layer or a multi-layer including the above materials.

[0139] The interlayer insulating layer 114 may cover the upper electrode Cst2. Within the spirit and scope of the present disclosure, the interlayer insulating layer 114 may include silicon oxide (SiO2), silicon nitride (SiN x) Silicon oxynitride (SiO x N y ), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ), etc. Zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulating layer 114 may be a single layer or multiple layers including the aforementioned inorganic insulating material.

[0140] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be respectively connected to the drain region D and the source region S through contact holes formed in the insulating layer under the drain electrode DE and the source electrode SE. The drain electrode DE and the source electrode SE may include a highly conductive material. Each of the source electrode SE and the drain electrode DE may include a conductive material including Mo, Al, Cu, and Ti, and may be a single layer or multiple layers including the aforementioned materials. According to an embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0141] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material, such as a general polymer (such as polystyrene (PS)), polymethyl methacrylate (PMMA), a polymer derivative having a phenolic group, an acrylic-based polymer, an imide-based polymer, an allyl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a parylene polymer, a vinyl alcohol-based polymer, or a blend thereof.

[0142] The second planarization insulating layer 116 may be located on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulating material, such as a general polymer (such as polystyrene (PS)), polymethyl methacrylate (PMMA), a polymer derivative having a phenolic group, an acrylic-based polymer, an imide-based polymer, an allyl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a parylene polymer, a vinyl alcohol-based polymer, or a blend thereof.

[0143] The display element layer DEL may be disposed on the pixel circuit layer PCL having the above structure. The display element layer DEL may include an organic light emitting diode OLED as a display element (e.g., a light emitting element), and the organic light emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. For example, the organic light emitting diode OLED may emit red light, green light, or blue light, or may emit red light, green light, blue light, or white light. The organic light emitting diode OLED may emit light through a light emitting region, and the light emitting region may be defined as a pixel PX.

[0144] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115.

[0145] The pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). According to an embodiment, the pixel electrode 210 may include a reflective layer including, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound of these materials. According to an embodiment, the pixel electrode 210 may further include a film formed of ITO, IZO, ZnO, or In2O3 above / below the foregoing reflective layer.

[0146] A pixel defining layer 117 having an opening 117OP is disposed on the pixel electrode 210, and a central portion of the pixel electrode 210 is exposed through the opening 117OP. The pixel defining layer 117 may include an organic insulating material and / or an inorganic insulating material. The opening 117OP may define a light emitting region of light emitted by the organic light emitting diode OLED. For example, the width of the opening 117OP may correspond to the size / width of the light emitting region. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 117OP of the pixel defining layer 117 corresponding to the pixel PX.

[0147] The intermediate layer 220 may include an emission layer 222 formed to correspond to the pixel electrode 210. The emission layer 222 may include a low molecular organic material or a high molecular organic material that emits light of an optional color. For example, the emission layer 222 may include an inorganic insulating material or may include quantum dots.

[0148] According to an embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 disposed below and above the emission layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include an HTL and a hole injection layer (HIL). The second functional layer 223, as a component disposed above the emission layer, may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 221 and / or the second functional layer 223 may be a common layer that completely covers the substrate 100, similar to the common electrode 230 to be described later.

[0149] The common electrode 230 may be disposed on the pixel electrode 210 and may overlap with the pixel electrode 210. The common electrode 230 may include a conductive material having a low work function. For example, the common electrode 230 may include a (semi)transparent layer including, for example, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy of these materials. For example, the common electrode 230 may further include a layer including, such as ITO, IZO, ZnO, or In2O3, on the (semi)transparent layer including any one of the above materials. The common electrode 230 may be integrally formed to completely cover the substrate 100.

[0150] The encapsulation layer 300 may be disposed on the display element layer DEL and cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. According to an embodiment, Figure 12 it is shown that the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330.

[0151] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic material selected from among alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer-based material. Examples of the polymer-based material may include an acrylic-based resin, an epoxy-based resin, polyimide, and polyethylene. According to an embodiment, the organic encapsulation layer 320 may include an acrylate resin. The organic encapsulation layer 320 may be formed by curing a monomer or by coating a polymer. The organic encapsulation layer 320 may be transparent.

[0152] Although not shown in the figures, the touch sensor layer may be disposed on the encapsulation layer 300, and the optical function layer may be disposed on the touch sensor layer. The touch sensor layer may obtain coordinate information based on an external input (e.g., a touch event). The optical function layer may reduce the reflectance of light (external light) incident on the display device 1 from the outside, and / or may improve the color purity of the light emitted by the display device 1. According to an embodiment, the optical function layer may include a phase retarder and / or a polarizer. The phase retarder may be of a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be of a film type or a liquid crystal coating type. The film type polarizer may include a stretched synthetic resin film, and the liquid crystal coating type polarizer may include liquid crystals arranged in an optional arrangement. The phase retarder and the polarizer may further include a protective film, respectively.

[0153] An adhesive member may be disposed between the touch sensor layer and the optical function layer. The adhesive member may employ an adhesive member commonly used in the art without limitation. The adhesive member may be a pressure-sensitive adhesive (PSA) member.

[0154] According to an embodiment, the deposition quality of the deposited material may be improved by improving the alignment of the mask assembly.

[0155] The effects of the present disclosure are not limited to the foregoing effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0156] It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those of ordinary skill in the art will understand that various changes in form and detail may be made in the embodiments without departing from the spirit and scope defined by the appended claims.

Claims

1. A mask component, characterized in that, The mask assembly includes: A mask frame including an opening area; At least one mask sheet covering the opening area of the mask frame; and Support bars disposed between the mask frame and the at least one mask sheet, the support bars extending in a first direction to cross the opening area, the support bars having ends fixed to the mask frame, wherein The at least one mask sheet includes: A plurality of sub-masks arranged side by side in a second direction intersecting the first direction in which the support bars extend; and Connecting rods disposed between the plurality of sub-masks and connecting two adjacent sub-masks among the plurality of sub-masks, and The connecting rods overlap the support bars in a plan view.

2. The mask assembly according to claim 1, wherein The support bars include openings formed in the first direction, and The connecting rods are received in the openings.

3. The mask assembly according to claim 2, wherein, The width of the openings is formed to be at least 12 μm but less than 18 μm larger than the width of the connecting rods.

4. The mask assembly according to claim 2, wherein, The plurality of sub-masks contact the support bars.

5. The mask assembly according to claim 1, wherein The plurality of sub-masks include a first sub-mask, a second sub-mask, and a third sub-mask arranged side by side in the second direction, and The support bars include: A first support bar extending in the first direction between the first sub-mask and the second sub-mask in a plan view, the first support bar including a first opening that receives a first connecting rod disposed between the first sub-mask and the second sub-mask; and A second support bar extending in the first direction between the second sub-mask and the third sub-mask in a plan view, the second support bar including a second opening that receives a second connecting rod disposed between the second sub-mask and the third sub-mask.

6. The mask assembly according to claim 5, wherein, The width of the first support bar is different from the width of the second support bar.

7. The mask assembly according to claim 1, wherein The at least one mask sheet includes a first mask sheet and a second mask sheet arranged side by side in the first direction, The support bars include a first opening and a second opening spaced apart from each other in the first direction, and The connecting rod of the first mask sheet is received in the first opening, and the connecting rod of the second mask sheet is received in the second opening.

8. The mask assembly according to claim 1, wherein The support bars include a pair of parallel sub-bars each extending in the first direction, and The connecting rods are received between the pair of parallel sub-bars.

9. The mask assembly according to claim 8, wherein, The distance between the pair of parallel sub-bars is formed to be at least 12 μm but less than 18 μm larger than the width of the connecting rods.

10. The mask assembly according to claim 8, wherein The plurality of sub-masks include a first sub-mask, a second sub-mask, and a third sub-mask arranged side by side in the second direction, and The support bars include: The first support bar extends in the first direction between the first sub-mask and the second sub-mask in a plan view, and the first support bar includes a pair of parallel first sub-bars to accommodate a first connecting bar disposed between the first sub-mask and the second sub-mask; and The second support bar extends in the first direction between the second sub-mask and the third sub-mask in a plan view, and the second support bar includes a pair of parallel second sub-bars to accommodate a second connecting bar disposed between the second sub-mask and the third sub-mask.

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