Directional absorption and discharge structure for condensate water and semiconductor refrigeration cabinet with directional absorption and discharge structure

Abstract

The utility model discloses a directional absorption and discharge structure of condensate water and a semiconductor refrigeration cabinet thereof, the directional absorption and discharge structure comprises a refrigeration inner cavity, a semiconductor refrigeration assembly and a drainage piece, the absorption end of the drainage piece is arranged below a refrigeration channel in the semiconductor refrigeration assembly; the discharge end of the drainage piece is arranged outside the refrigeration inner cavity and is close to the heat dissipation piece. A drainage piece used for collecting condensate water is additionally arranged below the refrigeration channel, and the discharge end of the drainage piece is arranged outside the refrigeration inner cavity and is close to the heat dissipation piece. When the condensate water drips downwards to the absorption end of the drainage piece, the condensate water is directionally conveyed to the discharge end of the drainage piece under the action of the drainage piece, is evaporated under the heat action of the heat dissipation piece and is discharged out of the refrigeration inner cavity, so that directional absorption and discharge of the condensate water are achieved, the structure of the refrigeration cabinet can be simplified, the occupied space of the refrigeration cabinet is saved, and the service life of the refrigeration cabinet is prolonged. And the condensed water can be prevented from polluting the refrigerating inner cavity of the refrigerating cabinet, so that the defects in the prior art are overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration equipment, in particular to a directional absorption and discharge structure of condensed water and a semiconductor refrigerated cabinet thereof. Background Art

[0002] In the prior art, refrigerated cabinets such as refrigerators, wine cabinets, and mirror cabinets will all generate condensed water. In most cases, either a water receiving tray for collecting condensed water is arranged at the bottom of the refrigerated cabinet; or a drain pipe is externally connected to the bottom of the refrigerated cabinet to discharge the condensed water externally.

[0003] Since refrigerated cabinets are generally installed on the wall of the application scenario, if a water receiving tray is used to collect condensed water, the water receiving tray may overflow after being filled with condensed water. Therefore, it is extremely inconvenient to manually remove the water receiving tray and pour out the water, and the user experience is not good. If an external drain pipe is used to discharge the condensed water, the drain pipe will be exposed outside, affecting the aesthetics. Content of the Utility Model

[0004] The purpose of the utility model is to provide a directional absorption and discharge structure of condensed water and a semiconductor refrigerated cabinet thereof, which utilizes a drainage sheet to achieve the directional absorption and discharge of condensed water in the refrigerated cabinet, can not only simplify the structure of the refrigerated cabinet, save the occupied space of the refrigerated cabinet, but also prevent the condensed water from polluting the refrigeration cavity of the refrigerated cabinet, so as to overcome the deficiencies in the prior art.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] A directional absorption and discharge structure of condensed water includes a refrigeration cavity, a semiconductor refrigeration component, and a drainage sheet; a refrigeration installation opening and a drainage avoidance opening are formed in the top wall of the refrigeration cavity, the semiconductor refrigeration component is installed in the refrigeration cavity through the refrigeration installation opening, and the heat dissipation end of the semiconductor refrigeration component faces the outside of the refrigeration cavity, and the cold dissipation end of the semiconductor refrigeration component faces the inside of the refrigeration cavity; the drainage sheet is installed in the refrigeration cavity through the drainage avoidance opening.

[0007] The semiconductor refrigeration component includes a heat conduction member, a semiconductor refrigeration chip, and a heat dissipation member which are arranged in sequence from bottom to top, and the cold end surface of the semiconductor refrigeration chip is attached to the upper surface of the heat conduction member, and the hot end surface of the semiconductor refrigeration chip is attached to the lower surface of the heat dissipation member; a plurality of parallel refrigeration channels are arranged on the lower surface of the heat conduction member, and the refrigeration channels extend in the horizontal direction; the absorption end of the drainage sheet is arranged below the refrigeration channels, and the discharge end of the drainage sheet is arranged outside the refrigeration cavity and close to the heat dissipation member.

[0008] Preferably, the heat conduction member includes a heat conduction block and heat dissipation fins; the upper surface of the heat conduction block is in contact with the cold end face; a plurality of the heat dissipation fins are provided, and the plurality of heat dissipation fins are connected to the lower surface of the heat conduction block at intervals and arranged vertically, and a refrigeration channel is formed between two adjacent heat dissipation fins;

[0009] The condensate directional absorption and discharge structure further includes a guide fan, the guide fan is installed at the inner top of the refrigeration cavity, and the air inlet of the guide fan faces the inside of the refrigeration cavity, and the air outlet of the guide fan faces one end of the refrigeration channel.

[0010] Preferably, the guide fan, the heat conduction member and the drainage fin are sequentially installed at the inner top of the refrigeration cavity in the left-right direction, and the refrigeration channel extends in the left-right direction;

[0011] The air outlet of the guide fan faces the left end of the refrigeration channel, the middle of the drainage fin is arranged near the right end of the refrigeration channel, and a ventilation hole is formed in the middle of the drainage fin.

[0012] Preferably, it further includes a dirt-proof cover, the dirt-proof cover is detachably installed at the inner top of the refrigeration cavity, and the dirt-proof cover and the refrigeration cavity together form an installation cavity for accommodating the guide fan, the heat conduction member and the drainage fin;

[0013] The bottom of the dirt-proof cover is provided with a refrigeration inlet and a refrigeration outlet, the air inlet of the guide fan is communicated with the inside of the refrigeration cavity through the refrigeration inlet, and the ventilation hole is communicated with the inside of the refrigeration cavity through the refrigeration outlet.

[0014] Preferably, the heat dissipation member includes a heat dissipation plate and heat dissipation fins; the lower surface of the heat dissipation plate is in contact with the hot end face; a plurality of the heat dissipation fins are provided, and the plurality of heat dissipation fins are connected to the upper surface of the heat dissipation plate at intervals and arranged vertically, and a heat dissipation channel is formed between two adjacent heat dissipation fins;

[0015] The discharge end of the drainage fin is arranged at one end of the heat dissipation channel.

[0016] Preferably, the heat dissipation channel extends in the left-right direction, and the discharge end of the drainage fin is arranged near the right end of the heat dissipation channel.

[0017] Preferably, it further includes a heat dissipation cover, the heat dissipation cover is detachably installed at the top of the refrigeration cavity, and the heat dissipation cover is used to cover the heat dissipation member;

[0018] The top of the heat sink is provided with a heat dissipation inlet and a heat dissipation outlet. The heat dissipation inlet is communicated with the left end of the heat dissipation channel, and the heat dissipation outlet is communicated with the right end of the heat dissipation channel.

[0019] Preferably, it further includes a mounting base. The mounting base is arranged between the heat sink and the refrigeration cavity, and the semiconductor refrigeration assembly is mounted on the refrigeration cavity through the mounting base. A downward protruding accommodation step is provided at the bottom of the mounting base, and the accommodation step is communicated with the refrigeration mounting opening.

[0020] Preferably, it further includes a positioning heat insulation member and a heat conduction heat insulation member;

[0021] The upper surface of the positioning heat insulation member is attached to the lower surface of the heat dissipation plate, and a positioning hole for accommodating the semiconductor refrigeration chip is provided in the middle of the positioning heat insulation member;

[0022] The heat conduction heat insulation member is abutted between the positioning heat insulation member and the heat conduction member. An installation hole for accommodating the heat conduction block is provided in the middle of the heat conduction heat insulation member, and the heat conduction heat insulation member is located inside the accommodation step.

[0023] A semiconductor refrigerated cabinet includes the above-mentioned condensate water directional absorption and discharge structure.

[0024] The technical solution provided by the present invention may include the following beneficial effects:

[0025] 1. A drainage piece for collecting condensate water is added below the refrigeration channel, and the discharge end of the drainage piece is arranged outside the refrigeration cavity and close to the heat dissipation member. When the condensate water drips downward to the absorption end of the drainage piece, the condensate water is subjected to directional transportation towards its discharge end under the action of the drainage piece, and finally evaporates under the heat of the heat dissipation member and is discharged from the refrigeration cavity, so as to realize the directional absorption and discharge of condensate water, which can not only simplify the structure of the refrigerated cabinet, save the occupied space of the refrigerated cabinet, but also prevent the condensate water from polluting the refrigeration cavity of the refrigerated cabinet, so as to overcome the deficiencies in the prior art.

[0026] 2. The semiconductor refrigeration assembly is mounted on the top wall of the refrigeration cavity through the refrigeration mounting opening. The characteristic that the cold air has a large density can be utilized to make the air carrying cold sink and fill the inside of the refrigeration cavity, so as to reduce the operating power of the semiconductor refrigeration chip and achieve the purpose of energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of a condensate water directional absorption and discharge structure of the present invention.

[0028] Figure 2 is an exploded schematic structural diagram of a condensate water directional absorption and discharge structure of the present invention.

[0029] Figure 3 It is a top view of a structure for directional absorption and discharge of condensed water of the present utility model.

[0030] Figure 4 It is Figure 3 a partial structural schematic diagram in the A-A direction in

[0031] Figure 5 It is Figure 4 a schematic diagram of the structural decomposition of

[0032] Among them: refrigeration inner cavity 1, semiconductor refrigeration assembly 2, heat conduction member 21, heat conduction block 211, heat dissipation fins 212, refrigeration channel 201, semiconductor refrigeration chip 22, heat dissipation member 23, heat dissipation plate 231, heat dissipation fins 232, heat dissipation channel 202, drainage sheet 3, ventilation holes 301, diversion fan 4, anti-pollution cover 5, refrigeration inlet 501, refrigeration outlet 502, heat dissipation cover 6, heat dissipation inlet 601, heat dissipation outlet 602, mounting seat 7, positioning heat insulation member 8, heat conduction heat insulation member 9. Specific embodiments

[0033] The following details the embodiments of the present utility model. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0034] This technical solution provides a structure for directional absorption and discharge of condensed water, including a refrigeration inner cavity 1, a semiconductor refrigeration assembly 2, and a drainage sheet 3; a refrigeration installation opening and a drainage avoidance opening are provided on the top wall of the refrigeration inner cavity 1, the semiconductor refrigeration assembly 2 is installed in the refrigeration inner cavity 1 through the refrigeration installation opening, and the heat dissipation end of the semiconductor refrigeration assembly 2 faces the inside of the refrigeration inner cavity 1, and the heat dissipation end of the semiconductor refrigeration assembly 2 faces the outside of the refrigeration inner cavity 1; the drainage sheet 3 is installed in the refrigeration inner cavity 1 through the drainage avoidance opening;

[0035] The semiconductor refrigeration assembly 2 includes a heat conduction member 21, a semiconductor refrigeration chip 22, and a heat dissipation member 23 arranged in sequence from bottom to top, and the cold end face of the semiconductor refrigeration chip 22 is attached to the upper surface of the heat conduction member 21, and the hot end face of the semiconductor refrigeration chip 22 is attached to the lower surface of the heat dissipation member 23; a plurality of parallel refrigeration channels 201 are provided on the lower surface of the heat conduction member 21, and the refrigeration channels 201 extend in the horizontal direction; the absorption end of the drainage sheet 3 is arranged below the refrigeration channels 201, and the discharge end of the drainage sheet 3 is arranged outside the refrigeration inner cavity 1 and close to the heat dissipation member 23.

[0036] Since refrigerated cabinets are generally installed on the walls of the application scenarios, if a water receiving tray is used to collect condensed water, there is a possibility that the water receiving tray will overflow after being filled with condensed water. Therefore, it is extremely inconvenient to manually remove the water receiving tray and pour out the water, resulting in a poor user experience. If an external drainage pipe is connected to drain the condensed water, the drainage pipe will be exposed outside, affecting the aesthetics.

[0037] Therefore, to solve the problems in the prior art, this technical solution proposes a structure for the directional absorption and discharge of condensed water, as Figures 1-5 shown, which includes a refrigeration inner cavity 1, a semiconductor refrigeration component 2 for regulating the temperature inside the refrigeration inner cavity 1, and a drainage sheet 3 for collecting condensed water and realizing the directional transportation of condensed water. It should be noted that the semiconductor refrigeration component 2 in this solution includes a semiconductor refrigeration chip 22, which is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through an electric couple composed of two semiconductor materials, one end of the electric couple absorbs heat and the other end releases heat. In other words, the semiconductor refrigeration chip 22 is made of two semiconductor materials, forming a hot end and a cold end. The cold end continuously absorbs heat to achieve refrigeration, and the hot end continuously releases heat to achieve refrigeration.

[0038] The working process of the structure for the directional absorption and discharge of condensed water in this solution includes the following steps: After the structure is powered on, the semiconductor refrigeration component 2 starts and refrigerates through the heat conduction component 21. After the gas inside the refrigeration inner cavity 1 exchanges heat through the refrigeration channel 201 and carries cold, the cold air sinks to fill the inside of the refrigeration inner cavity 1, thereby refrigerating the refrigeration inner cavity 1. During the refrigeration process of the refrigeration inner cavity 1, since the gas inside the refrigeration inner cavity 1 exchanges heat in the refrigeration channel 201, condensed water will be generated on the channel wall of the refrigeration channel 201. To prevent the condensed water from contaminating the refrigeration inner cavity 1, a drainage sheet 3 for collecting condensed water is added below the refrigeration channel 201 in this solution, and the discharge end of the drainage sheet 3 is set outside the refrigeration inner cavity 1 and close to the heat dissipation component 23. When the condensed water drips downward to the absorption end of the drainage sheet 3, the condensed water is made to move directionally towards its discharge end under the action of the drainage sheet 3, and finally evaporates under the heat of the heat dissipation component 23 and is discharged from the refrigeration inner cavity 1 to achieve the directional absorption and discharge of condensed water. This can not only simplify the structure of the refrigerated cabinet, save the occupied space of the refrigerated cabinet, but also prevent the condensed water from contaminating the refrigeration inner cavity of the refrigerated cabinet, thus overcoming the deficiencies in the prior art.

[0039] It should be noted that the drainage sheet 3 in this solution can be a water-absorbing sponge, and there is no limitation here.

[0040] In addition, the semiconductor refrigeration module 2 of this solution is installed on the top wall of the refrigeration inner cavity 1 through the refrigeration installation opening. By taking advantage of the characteristic that the cold air has a high density, the air carrying cold can sink and fill the inside of the refrigeration inner cavity 1, so as to reduce the operating power of the semiconductor refrigeration chip 22 and achieve the purpose of energy saving.

[0041] For further illustration, the heat conduction member 21 includes a heat conduction block 211 and heat dissipation fins 212; the upper surface of the heat conduction block 211 is attached to the cold end face; there are multiple heat dissipation fins 212, and the multiple heat dissipation fins 212 are connected to the lower surface of the heat conduction block 211 at intervals, and the heat dissipation fins 212 are vertically arranged, and a refrigeration channel 201 is formed between the two heat dissipation fins 212;

[0042] It further includes a diversion fan 4, the diversion fan 4 is installed on the inner top of the refrigeration inner cavity 1, and the air inlet of the diversion fan 4 faces the inside of the refrigeration inner cavity 1, and the air outlet of the diversion fan 4 faces one end of the refrigeration channel 201.

[0043] In a specific embodiment of this technical solution, multiple vertically arranged heat dissipation fins 212 are arranged at intervals, so as to form multiple refrigeration channels 201 for heat exchange of air, so as to improve the refrigeration efficiency of the semiconductor refrigeration module 2.

[0044] In addition, a diversion fan 4 for realizing the rapid directional flow of the air in the refrigeration inner cavity 1 is also arranged on the inner top of the refrigeration inner cavity 1, so as to further improve the refrigeration efficiency of the semiconductor refrigeration module 2.

[0045] For further illustration, the diversion fan 4, the heat conduction member 21 and the diversion piece 3 are sequentially installed on the inner top of the refrigeration inner cavity 1 in the left-right direction, and the refrigeration channel 201 extends in the left-right direction;

[0046] The air outlet of the diversion fan 4 faces the left end of the refrigeration channel 201, the middle part of the diversion piece 3 is arranged close to the right end of the refrigeration channel 201, and a ventilation hole 301 is opened in the middle part of the diversion piece 3.

[0047] In order to reduce the occupied space of the directional absorption and emission structure and make the volume of the refrigeration cabinet more compact, this solution also optimizes the structural arrangement of the diversion fan 4, the heat conduction member 21 and the diversion piece 3, so that the air inside the refrigeration inner cavity 1 sequentially passes through the diversion fan 4, the refrigeration channel 201 and the ventilation hole 301 to form a gas cycle.

[0048] For further illustration, it further includes an anti-fouling cover 5, the anti-fouling cover 5 is detachably installed on the inner top of the refrigeration cavity 1, and the anti-fouling cover 5 and the refrigeration cavity 1 together enclose an installation cavity for accommodating the diversion fan 4, the heat conduction member 21 and the drainage fins 3;

[0049] The bottom of the anti-fouling cover 5 is provided with a refrigeration inlet 501 and a refrigeration outlet 502. The air inlet of the diversion fan 4 is communicated with the inside of the refrigeration cavity 1 through the refrigeration inlet 501, and the ventilation holes 301 are communicated with the inside of the refrigeration cavity 1 through the refrigeration outlet 502.

[0050] In a preferred embodiment of the present technical solution, an anti-fouling cover 5 for further preventing condensate water from polluting the refrigeration cavity 1 is further provided on the inner top of the refrigeration cavity 1, so as to realize the functional separation of the installation cavity and the storage cavity in the refrigeration cavity 1.

[0051] For further illustration, the heat dissipation member 23 includes a heat dissipation plate 231 and heat dissipation fins 232; the lower surface of the heat dissipation plate 231 is attached to the hot end surface; a plurality of heat dissipation fins 232 are provided, and the plurality of heat dissipation fins 232 are connected to the upper surface of the heat dissipation plate 231 at intervals, and the heat dissipation fins 232 are vertically arranged, and a heat dissipation channel 202 is formed between the two heat dissipation fins 232;

[0052] The discharge end of the drainage fin 3 is arranged at one end of the heat dissipation channel 202.

[0053] Further, the heat dissipation member 23 of this solution has the same structural arrangement as the heat conduction member 21, which is beneficial to reducing the design difficulty and cost of the structure. It should be noted that the working process of the heat dissipation member 23 is specifically as follows: after the structure is powered on, the semiconductor refrigeration assembly 2 starts and refrigerates on the heat conduction member 21. At this time, the gas outside the refrigeration cavity 1 exchanges heat through the heat dissipation channel 202, so as to take away the heat generated by the heat dissipation member 23 and realize heat dissipation.

[0054] For further illustration, the heat dissipation channel 202 extends in the left-right direction, and the discharge end of the drainage fin 3 is arranged close to the right end of the heat dissipation channel 202.

[0055] In this way, it is convenient to quickly and directionally transport the condensate water into the interior of the refrigeration cavity 1 on the premise of ensuring the drainage effect.

[0056] For further illustration, it further includes a heat dissipation cover 6, the heat dissipation cover 6 is detachably installed on the top of the refrigeration cavity 1, and the heat dissipation cover 6 is used to cover the heat dissipation member 23;

[0057] The top of the heat dissipation cover 6 is provided with a heat dissipation inlet 601 and a heat dissipation outlet 602. The heat dissipation inlet 601 is communicated with the left end of the heat dissipation channel 202, and the heat dissipation outlet 602 is communicated with the right end of the heat dissipation channel 202.

[0058] Furthermore, a heat dissipation cover 6 is also sleeved outside the heat dissipation member 23 of this solution. On the one hand, it can prevent the exposure of the heat dissipation 23 and cause pollution. On the other hand, it can play a guiding role in the heat dissipation air flow to ensure the effective realization of the performance of the semiconductor refrigeration sheet 22.

[0059] Furthermore, it also includes a mounting seat 7. The mounting seat 7 is arranged between the heat dissipation cover 6 and the refrigeration cavity 1. The semiconductor refrigeration assembly 2 is mounted on the refrigeration cavity 1 through the mounting seat 7; a downward protruding accommodation step is provided at the bottom of the mounting seat 7, and the accommodation step is communicated with the refrigeration mounting opening.

[0060] In a preferred embodiment of this technical solution, a mounting seat 7 is further added between the heat dissipation cover 6 and the refrigeration cavity 1, and particularly, a downward protruding accommodation step is provided at the bottom of the mounting seat 7 to facilitate the stable installation of the semiconductor refrigeration assembly 2 on the top wall of the refrigeration cavity 1.

[0061] Furthermore, it also includes a positioning and heat insulation member 8 and a heat conduction and heat insulation member 9;

[0062] The upper surface of the positioning and heat insulation member 8 is attached to the lower surface of the heat dissipation plate 231. A positioning hole for accommodating the semiconductor refrigeration sheet 22 is provided in the middle of the positioning and heat insulation member 8;

[0063] The heat conduction and heat insulation member 9 is abutted between the positioning and heat insulation member 8 and the heat conduction member 21. An installation hole for accommodating the heat conduction block 211 is provided in the middle of the heat conduction and heat insulation member 9, and the heat conduction and heat insulation member 9 is located inside the accommodation step.

[0064] As a better solution of the above embodiment, this solution is also provided with a positioning and heat insulation member 8 and a heat conduction and heat insulation member 9. On the one hand, it can play a positioning role in the installation of the semiconductor refrigeration sheet 22 to ensure the installation stability of the semiconductor refrigeration sheet 22. On the other hand, it can also prevent the cold and heat generated by the semiconductor refrigeration sheet 22 from dissipating to the side, ensuring the full transfer of cold and heat.

[0065] A semiconductor refrigeration cabinet includes the above-mentioned structure for directional absorption and discharge of condensed water.

[0066] It should be noted that the semiconductor refrigeration cabinet of this solution includes but is not limited to refrigerators, wine cabinets, mirror cabinets, and cosmetic storage cabinets with refrigeration functions.

[0067] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0068] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0069] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention; the orientation words "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0070] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure for the device. For example, if the device in the figure is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding interpretations are made for the spatial relative descriptions used here.

[0071] In addition, it should be noted that the use of terms such as "first", "second" etc. to define components is only for the convenience of differentiating the corresponding components. Without further statement, the above terms have no special meanings, and thus should not be construed as limiting the protection scope of the present utility model.

[0072] It should be noted that the terms "first", "second" etc. in the description, claims and above-mentioned drawings of this application are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here.

[0073] The technical principle of the present utility model has been described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present utility model, and should not be construed as limiting the protection scope of the present utility model in any way. Based on the explanations herein, those skilled in the art can readily conceive of other specific embodiments of the present utility model without creative efforts, and these embodiments will all fall within the protection scope of the present utility model.

Claims

1. A directional absorption and discharge structure for condensate water, characterized in that: It includes a refrigeration inner cavity, a semiconductor refrigeration component and a drainage sheet; a refrigeration installation opening and a drainage avoidance opening are formed in the top wall of the refrigeration inner cavity, the semiconductor refrigeration component is installed in the refrigeration inner cavity through the refrigeration installation opening, and the heat dissipation end of the semiconductor refrigeration component faces the inside of the refrigeration inner cavity, and the heat dissipation end of the semiconductor refrigeration component faces the outside of the refrigeration inner cavity; the drainage sheet is installed in the refrigeration inner cavity through the drainage avoidance opening; The semiconductor refrigeration component includes a heat conduction member, a semiconductor refrigeration sheet and a heat dissipation member which are arranged in sequence from bottom to top, and the cold end face of the semiconductor refrigeration sheet is attached to the upper surface of the heat conduction member, and the hot end face of the semiconductor refrigeration sheet is attached to the lower surface of the heat dissipation member; a plurality of parallel refrigeration channels are arranged on the lower surface of the heat conduction member, and the refrigeration channels extend in the horizontal direction; the absorption end of the drainage sheet is arranged below the refrigeration channels, and the discharge end of the drainage sheet is arranged outside the refrigeration inner cavity and close to the heat dissipation member.

2. The directional absorption and discharge structure of condensate water according to claim 1, characterized in that: The heat conduction member includes a heat conduction block and heat dissipation fins; the upper surface of the heat conduction block is attached to the cold end face; a plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins are connected to the lower surface of the heat conduction block at intervals and are vertically arranged, and the refrigeration channels are formed between the two heat dissipation fins; The condensate directional absorption and discharge structure further includes a guide fan, the guide fan is installed on the inner top of the refrigeration inner cavity, and the air inlet of the guide fan faces the inside of the refrigeration inner cavity, and the air outlet of the guide fan faces one end of the refrigeration channel.

3. The directional absorption and discharge structure of condensate water according to claim 2, characterized in that: The guide fan, the heat conduction member and the drainage sheet are installed on the inner top of the refrigeration inner cavity in sequence along the left-right direction, and the refrigeration channels extend along the left-right direction; The air outlet of the guide fan faces the left end of the refrigeration channel, the middle part of the drainage sheet is arranged close to the right end of the refrigeration channel, and a ventilation hole is formed in the middle part of the drainage sheet.

4. The directional absorption and discharge structure of condensate water according to claim 3, characterized in that: It further includes a pollution prevention cover, the pollution prevention cover is detachably installed on the inner top of the refrigeration inner cavity, and the pollution prevention cover and the refrigeration inner cavity jointly enclose an installation cavity for accommodating the guide fan, the heat conduction member and the drainage sheet; The bottom of the pollution prevention cover is provided with a refrigeration inlet and a refrigeration outlet, the air inlet of the guide fan is communicated with the inside of the refrigeration inner cavity through the refrigeration inlet, and the ventilation hole is communicated with the inside of the refrigeration inner cavity through the refrigeration outlet.

5. The directional absorption and discharge structure of condensate water according to claim 2, characterized in that: The heat dissipation member includes a heat dissipation plate and heat dissipation fins; the lower surface of the heat dissipation plate is attached to the hot end face; a plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins are connected to the upper surface of the heat dissipation plate at intervals and are vertically arranged, and heat dissipation channels are formed between the two heat dissipation fins; The discharge end of the drainage sheet is arranged at one end of the heat dissipation channel.

6. The directional absorption and discharge structure of condensate water according to claim 5, characterized in that: The heat dissipation channels extend along the left-right direction, and the discharge end of the drainage sheet is arranged close to the right end of the heat dissipation channel.

7. The directional absorption and discharge structure of condensed water according to claim 6, characterized in that: It further includes a heat dissipation cover, the heat dissipation cover is detachably installed on the top of the refrigeration inner cavity, and the heat dissipation cover is used to cover the heat dissipation member; A heat dissipation inlet and a heat dissipation outlet are formed in the top of the heat dissipation cover. The heat dissipation inlet is communicated with the left end of the heat dissipation channel, and the heat dissipation outlet is communicated with the right end of the heat dissipation channel.

8. The directional absorption and discharge structure of condensate water according to claim 7, characterized in that: It further includes a mounting seat which is arranged between the heat dissipation cover and the refrigeration inner cavity. The semiconductor refrigeration assembly is mounted in the refrigeration inner cavity through the mounting seat. A downward protruding accommodation step is formed in the bottom of the mounting seat, and the accommodation step is communicated with the refrigeration mounting opening.

9. The directional absorption and discharge structure of condensate water according to claim 8, wherein: It further includes a positioning heat insulation member and a heat conduction heat insulation member. The upper surface of the positioning heat insulation member is attached to the lower surface of the heat dissipation plate, and a positioning hole for accommodating the semiconductor refrigeration chip is formed in the middle of the positioning heat insulation member. The heat conduction heat insulation member is abutted between the positioning heat insulation member and the heat conduction member. An installation hole for accommodating the heat conduction block is formed in the middle of the heat conduction heat insulation member, and the heat conduction heat insulation member is located inside the accommodation step.

10. A semiconductor refrigerator, characterized in that: It includes the condensate water directional absorption and discharge structure according to any one of claims 1 to 9.

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