Silicon wafer drying device and solar cell production system
A three-component drying system for silicon wafers addresses residual chemical removal in clamp gaps, improving efficiency and preventing clamp deformation without temperature increase.
Patent Information
- Application Number
- CN202421997322.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-16
AI Technical Summary
In the prior art, the silicon wafer drying device cannot effectively remove the residue of the drug liquid in the gap between the conductive clamps, resulting in silicon wafer contamination and fixture corrosion, and increasing the hot air temperature or extending the time will affect production capacity or cause fixture deformation.
The synergistic effect of three combinations of hot air and suction components is adopted, including the first hot air component located above, the second hot air component below and the suction component. The hot air is blown into the silicon wafer clamp from the upper and lower directions and sucks the liquid to ensure effective drying and prevent the clamp from deforming.
It improves the drying efficiency of silicon wafers, effectively removes the residue of the liquid in the gap between the conductive clamps, prevents the clamp from deforming, and improves production efficiency and product quality.
Smart Images
Figure CN223106548U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of solar cell production, and particularly to a silicon wafer drying device and a solar cell production system. Background Art
[0002] Silicon wafers, including but not limited to half-cell wafers, are usually clamped by a fixture and driven into an electroplating tank for electroplating treatment to electroplate a layer such as a copper layer, a tin layer, etc. on the grid lines on the surface of the silicon wafer. After the electroplating process is completed and after being washed in a water tank, the fixture drives the silicon wafer into a drying device for drying treatment to remove the residual liquid medicine on the surfaces of the silicon wafer and the fixture.
[0003] In the related art, the bottom of the fixture can hold one or more silicon wafers, and two conductive clamping blocks are correspondingly provided above the installation position of each silicon wafer. The bottoms of the two conductive clamping blocks clamp the copper foil conduction band on the corresponding silicon wafer, so as to conduct electricity to the silicon wafer and complete the electroplating work in the electroplating tank.
[0004] Among them, during the drying process when the fixture is placed in the drying tank of the drying device, the hot air in the drying tank is blown upward from its bottom. Although it can dry the liquid medicine on the surfaces of the silicon wafer, the fixture, and the conductive clamping blocks, it cannot dry the liquid medicine remaining in the gap between the two conductive clamping blocks. When the drying process ends and the liquid medicine remaining in the gap between the two conductive clamping blocks drips downward onto the silicon wafer, it is likely to contaminate the silicon wafer and form dirty marks on the surface of the silicon wafer, and at the same time, it will also have an adverse impact on the subsequent electroplating process; in addition, the liquid medicine remaining on the conductive block is likely to corrode the conductive clamping block over time, reducing the service life of the conductive clamping block; furthermore, when the drying effect is improved by increasing the hot air temperature, it is easy to cause the fixture and the battery wafer to be deformed by heat; when the drying effect is improved by extending the process time, the production capacity will be greatly reduced. Summary of the Invention
[0005] Based on this, it is necessary to overcome the defects of the prior art and provide a silicon wafer drying device and a solar cell production system, which can effectively remove the liquid medicine remaining in the gap between the two conductive clamping blocks, improve the production efficiency, and at the same time prevent the fixture from having deformation defects.
[0006] A silicon wafer drying device, the silicon wafer drying device includes:
[0007] A drying tank body, which can support a silicon wafer fixture;
[0008] A first hot air assembly, which is connected to the drying tank body, is located above the silicon wafer fixture, and is used for blowing hot air toward the silicon wafer fixture;
[0009] An air suction assembly, which is connected to the drying tank body, is located above the wafer fixture, and is used for sucking the gas around the wafer fixture; and
[0010] A second hot air assembly, which is connected to the drying tank body, is located below the wafer fixture, and is used for discharging hot air towards the wafer fixture.
[0011] In one embodiment, the first hot air assembly includes at least one first air outlet nozzle with an adjustable arrangement angle, and the air suction assembly includes at least one air suction nozzle with an adjustable arrangement angle.
[0012] In one embodiment, the first hot air assembly further includes a first air outlet pipe arranged along the longitudinal direction Y of the drying tank body. The first air outlet nozzles are multiple and are arranged in sequence along the length direction of the first air outlet pipe; all the first air outlet nozzles are communicated with the first air outlet pipe, and each first air outlet nozzle is movably connected to the first air outlet pipe;
[0013] The air suction assembly further includes an air suction pipe arranged along the longitudinal direction Y of the drying tank body. The air suction pipe is arranged in parallel and at intervals with the first air outlet pipe. The air suction nozzles are multiple and are arranged in sequence along the length direction of the air suction pipe; all the air suction nozzles are communicated with the air suction pipe, and each air suction nozzle is movably connected to the air suction pipe.
[0014] In one embodiment, all the first air outlet nozzles are divided into multiple first groups arranged in sequence along the longitudinal direction Y, and each first group includes two first air outlet nozzles; all the air suction nozzles are divided into multiple second groups arranged in sequence along the longitudinal direction Y, and each second group includes two air suction nozzles; each of the first groups and each of the second groups are arranged in correspondence.
[0015] In one embodiment, the first hot air assembly further includes a plurality of first branch pipes connected in sequence along the length direction of the first air outlet pipe, and each of the first air outlet nozzles is movably connected to the corresponding first branch pipe; the air suction assembly further includes a plurality of second branch pipes connected in sequence along the length direction of the air suction pipe, and each of the air suction nozzles is movably connected to the corresponding second branch pipe; each of the first branch pipes and each of the second branch pipes are fixedly connected in correspondence.
[0016] In one embodiment, the flow cross-sectional area of the first air outlet nozzle gradually increases along the air outlet direction; and / or, the flow cross-sectional area of the air suction nozzle gradually decreases along the air return direction.
[0017] In one embodiment, the silicon wafer drying device further includes a suction mechanism and a heating mechanism; the suction part of the suction mechanism is connected to the air suction component, the air outlet part of the suction mechanism is connected to the first hot air component, and the heating mechanism is used for heating the air flow conveyed to the first hot air component.
[0018] In one embodiment, the silicon wafer drying device further includes a temperature sensor and a controller. The temperature sensor is used to sense the hot air temperature discharged from the first hot air component. The temperature sensor, the suction mechanism, and the heating mechanism are all electrically connected to the controller. The controller is used to control the working power of the heating mechanism and / or the suction power of the suction mechanism according to the hot air temperature.
[0019] In one embodiment, both the first hot air components and the air suction components are multiple. All the first hot air components and all the air suction components are alternately arranged in sequence along the width direction of the drying tank body; and / or,
[0020] The second hot air component includes a second air outlet pipe arranged along the longitudinal direction Y of the drying tank body, a hot air providing mechanism connected to the second air outlet pipe, and a plurality of second air outlet nozzles connected in sequence along the length direction of the second air outlet pipe.
[0021] A solar cell production system includes the silicon wafer drying device described above.
[0022] When the above-mentioned silicon wafer drying device and solar energy production system are working, the silicon wafer fixture after electroplating and cleaning treatment is placed on the drying tank body. The second hot air component blows hot air from below towards the silicon wafer fixture to dry the outer surface of the silicon wafer fixture and the silicon wafer, and remove the liquid medicine on the outer surface of the silicon wafer fixture and the silicon wafer. In addition, the first hot air component blows hot air from above towards the silicon wafer fixture, and the hot air can enter the gap between the two conductive clamping blocks of the silicon wafer fixture, so as to dry the residual liquid medicine at the gap. In addition, the air suction component performs a suction action to suck out the residual liquid medicine at the gap. It can be seen that under the synergistic action of the second hot air component, the first hot air component and the air suction component, not only can the outer surface of the fixture and the outer surface of the battery chip be effectively dried, but also the residual liquid medicine at the gap between the two conductive clamping blocks of the silicon wafer fixture can be effectively removed, thereby improving the production efficiency. At the same time, it is not necessary to improve the drying effect by increasing the drying temperature, that is, the required drying effect can be achieved by using an appropriate drying temperature, and it can prevent the silicon wafer fixture from being deformed due to overheating. Description of the Drawings
[0023] Figure 1 It is a structural diagram of a silicon wafer fixture placed on a drying tank body according to an embodiment of the present application.
[0024] Figure 2 The structure diagram of the silicon wafer fixture for installing silicon wafers in the structure shown. Figure 1 The structure diagram of the silicon wafer fixture for installing silicon wafers in the structure shown.
[0025] Figure 3 The structure diagram of the first hot air component and the air suction component of an embodiment of the present application arranged on the drying tank body.
[0026] Figure 4 The structure diagram of the first hot air component and the air suction component of an embodiment of the present application.
[0027] Figure 5 The structure diagram of a processing unit in the structure shown. Figure 4 The structure diagram of a processing unit in the structure shown.
[0028] Figure 6 The structure diagram of the second hot air component of an embodiment of the present application arranged on the drying tank body.
[0029] Figure 7 The structure diagram of the second hot air component of an embodiment of the present application.
[0030] 10. Drying tank body; 20. First hot air component; 21. First air outlet nozzle; 22. First air outlet pipe; 23. First group; 24. First branch pipe; 30. Air suction component; 31. Air suction nozzle; 32. Air suction pipe; 33. Second group; 34. Second branch pipe; 40. Second hot air component; 41. Second air outlet pipe; 42. Hot air providing mechanism; 43. Second air outlet nozzle; 50. Silicon wafer fixture; 51. Fixture body; 52. Wafer loading frame; 53. Conductive clamping part; 60. Suction mechanism; 70. Heating mechanism; 80. Air pressure regulating valve; 90. Silicon wafer. Detailed implementation manners
[0031] To make the above objects, features and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0032] As described in the background art, during the drying process when the fixture in the prior art is placed in the drying tank of the drying device, the hot air in the drying tank blows from its bottom upwards and cannot dry the liquid medicine remaining in the gap between the two conductive clamping blocks. After research by the inventor, it is found that the reason for this problem is that the bottoms of the two conductive clamping blocks tightly clamp the copper foil conductive tape on the corresponding silicon wafer, so there is no gap at the bottoms of the two conductive clamping blocks, making it inconvenient for the hot air in the drying tank to flow into the gap between the two conductive clamping blocks, resulting in the inability to effectively remove the liquid medicine at the gap between the two conductive clamping blocks.
[0033] For the above reasons, the present application provides a silicon wafer drying device and a solar cell production system, which can effectively remove the liquid medicine remaining in the gap between the two conductive clamping blocks, improve production efficiency, and prevent deformation defects of the fixture at the same time.
[0034] Refer to Figure 1 、 Figure 3 and Figure 6 , Figure 1 shows a structural diagram of the silicon wafer fixture 50 of an embodiment of the present application placed on the drying tank body 10. Figure 3 shows a structural diagram of the first hot air component 20 and the air suction component 30 of an embodiment of the present application arranged on the drying tank body 10. Figure 6 shows a structural diagram of the second hot air component 40 of an embodiment of the present application arranged on the drying tank body 10. A silicon wafer drying device provided by an embodiment of the present application includes: a drying tank body 10, a first hot air component 20, an air suction component 30, and a second hot air component 40. The drying tank body 10 can support the silicon wafer fixture 50. The first hot air component 20 is connected to the drying tank body 10, and the first hot air component 20 is located above the silicon wafer fixture 50, specifically, for example, arranged on the top of the drying tank body 10, and is used to blow hot air towards the silicon wafer fixture 50. The air suction component 30 is connected to the drying tank body 10, and the air suction component 30 is located above the silicon wafer fixture 50, specifically, for example, arranged on the top of the drying tank body 10, and is used to suck the gas around the silicon wafer fixture 50. The second hot air component 40 is connected to the drying tank body 10, and the second hot air component 40 is located below the silicon wafer fixture 50, specifically, for example, arranged on the bottom of the drying tank body 10, and is used to blow hot air towards the silicon wafer fixture 50.
[0035] Please refer to Figure 1 and Figure 2, in some embodiments, the silicon wafer fixture 50 includes a fixture body 51, a wafer mounting frame 52 provided on the fixture body 51, and a conductive clamping portion 53 provided on the fixture body 51 and located above the wafer mounting frame 52. The wafer mounting frame 52 is used to mount the silicon wafer 90 and plays a role in stably supporting the silicon wafer 90. The wafer mounting frame 52 is a hollow structure, so that the liquid inside the electroplating tank can smoothly contact the silicon wafer 90 during the electroplating process, thus not affecting the normal electroplating work of the silicon wafer 90, and when the silicon wafer 90 is inside the drying tank body 10, the silicon wafer 90 can also contact the hot air and be dried. In addition, the conductive clamping portion 53 specifically includes two conductive clamping blocks, which are used to clamp the copper foil conductive tape of the silicon wafer 90 and conduct electricity to the silicon wafer 90 during the electroplating process to complete the electroplating work of the silicon wafer 90.
[0036] Optionally, both the wafer mounting frame 52 and the conductive clamping portion 53 are provided with at least two, and are arranged in sequence along the longitudinal direction X of the fixture body 51, and each wafer mounting frame 52 and each conductive clamping portion 53 are correspondingly arranged. In this way, at least two silicon wafers 90 can be mounted on the fixture, so that one fixture can synchronously clamp multiple silicon wafers 90 for electroplating work, cleaning work and drying work, improving the production capacity. Of course, optionally, the wafer mounting frame 52 and the conductive clamping portion 53 can also be provided with one.
[0037] For the above-mentioned silicon wafer drying device, when working, the silicon wafer fixture 50 after electroplating and cleaning treatment is placed on the drying tank body 10, and the second hot air assembly 40 blows hot air from below towards the silicon wafer fixture 50 to dry the outer surface of the silicon wafer fixture 50 and the silicon wafer 90, and remove the liquid medicine on the outer surface of the silicon wafer fixture 50 and the silicon wafer 90; in addition, the first hot air assembly 20 blows hot air from above towards the silicon wafer fixture 50, and the hot air can enter the gap between the two conductive clamping blocks of the silicon wafer fixture 50, so as to dry the residual liquid medicine at the gap; in addition, the air suction assembly 30 performs a suction action, and can suck out the residual liquid medicine at the gap. It can be seen that under the synergistic action of the first hot air assembly 20, the air suction assembly 30 and the second hot air assembly 40, not only can the outer surface of the fixture and the outer surface of the battery chip be effectively dried, but also the residual liquid medicine at the gap between the two conductive clamping blocks of the silicon wafer fixture 50 can be effectively removed, thereby improving the production efficiency. At the same time, it is not necessary to improve the drying effect by increasing the drying temperature, that is, the required drying effect can be achieved by using an appropriate drying temperature, and the silicon wafer fixture 50 can be prevented from being deformed due to overheating.
[0038] Please refer to Figure 1 、 Figure 3 and Figure 6, in some embodiments, the wafer fixture 50 can be movably arranged along the longitudinal direction Y of the drying tank body 10. Specifically, the wafer drying device further includes a driving mechanism (not shown in the figure), and the driving mechanism includes but is not limited to various power mechanisms such as a conveying chain, a driving gear, a motor screw rod, and a robotic arm. The driving mechanism is used to drive the wafer fixture 50 to gradually move from the loading station to the unloading station along the longitudinal direction Y. The arrangement modes of the first hot air assembly 20, the air suction assembly 30, and the second hot air assembly 40 are independently adjusted and set according to actual needs. For example, they are all arranged along the longitudinal direction Y of the drying tank body 10, so that during the process of the wafer fixture 50 moving from the loading station to the unloading station, it will be heat-treated, which can improve the drying effect of the residual liquid medicine at the gap. In addition, more than one wafer fixture 50 can be placed on the drying tank body 10. For example, there can be two, three, four or more wafer fixtures 50. Each wafer fixture 50 moves sequentially along the drying tank body 10 and completes the drying action one by one, which can improve the production efficiency. Of course, the wafer fixture 50 can also be fixedly placed on the drying tank body 10, and can be directly taken away after the drying treatment on the drying tank body 10 is completed.
[0039] Please refer to Figures 3 to 5 , in one embodiment, the first hot air assembly 20 includes at least one first air outlet nozzle 21 with an adjustable arrangement angle. The air suction assembly 30 includes at least one air suction nozzle 31 with an adjustable arrangement angle. In this way, during actual use, the arrangement angle position of the first air outlet nozzle 21 can be flexibly adjusted according to actual needs, so that the first air outlet nozzle 21 faces downward towards the gap between the two conductive blocks, so that the hot air discharged can better enter the gap between the two conductive blocks, which can improve the cleaning effect of the residual liquid medicine; similarly, the arrangement angle position of the air suction nozzle 31 can be flexibly adjusted according to actual needs, so that the air suction nozzle 31 faces downward towards the gap between the two conductive blocks, so that the residual liquid medicine remaining in the gap between the two conductive blocks can be better sucked out, which can improve the cleaning effect of the residual liquid medicine.
[0040] In one embodiment, the first hot air assembly 20 further includes a first air outlet pipe 22 arranged along the longitudinal direction Y of the drying tank body 10. The first air outlet nozzles 21 are multiple and are sequentially arranged along the length direction of the first air outlet pipe 22. All the first air outlet nozzles 21 are communicated with the first air outlet pipe 22, and each first air outlet nozzle 21 is movably connected to the first air outlet pipe 22.
[0041] Specifically, the first air outlet nozzle 21 includes but is not limited to being connected to the first air outlet pipe 22 by a universal joint or being connected to the first air outlet pipe 22 by a flexible hose, so that the arrangement angle of the first air outlet nozzle 21 can be arbitrarily adjusted according to actual needs to improve the drying effect of the residual liquid medicine.
[0042] In one embodiment, the air suction assembly 30 further includes an air suction pipe 32 arranged along the longitudinal direction Y of the drying tank body 10. The air suction pipe 32 is arranged in parallel and spaced apart from the first air outlet pipe 22. A plurality of air suction nozzles 31 are arranged in sequence along the length direction of the air suction pipe 32. All the air suction nozzles 31 are communicated with the air suction pipe 32, and each air suction nozzle 31 is movably connected to the air suction pipe 32.
[0043] Specifically, the air suction nozzle 31 includes, but is not limited to, being connected to the second air outlet pipe 41 by means of a universal joint or being connected to the air suction pipe 32 by means of a hose, so that the arrangement angle of the air suction nozzle 31 can be adjusted arbitrarily according to actual needs to improve the drying effect of the residual liquid medicine.
[0044] In one embodiment, all the first air outlet nozzles 21 are divided into a plurality of first groups 23 arranged in sequence along the longitudinal direction Y. Each first group 23 includes two first air outlet nozzles 21; all the air suction nozzles 31 are divided into a plurality of second groups 33 arranged in sequence along the longitudinal direction Y. Each second group 33 includes two air suction nozzles 31. Each of the first groups 23 and each of the second groups 33 are arranged in correspondence. In this way, the correspondingly arranged first group 23 and second group 33 can cooperate to form a processing unit. On the one hand, the two first air outlet nozzles 21 blow hot air downward towards the gap between the two conductive blocks to dry the residual liquid medicine, and on the other hand, the two air suction nozzles 31 suck the hot air downward towards the gap between the two conductive blocks to remove the residual liquid medicine. The wafer fixture 50 moves along the longitudinal direction Y of the drying tank body 10 to a position corresponding to each processing unit, and each processing unit sequentially dries the wafer fixture 50 and the wafer 90 on the wafer fixture 50.
[0045] In one embodiment, the first hot air assembly 20 further includes a plurality of first branch pipes 24 sequentially connected and arranged along the length direction of the first air outlet pipe 22, and each first air outlet nozzle 21 is movably connected to each first branch pipe 24. In addition, the air suction assembly 30 further includes a plurality of second branch pipes 34 sequentially connected and arranged along the length direction of the air suction pipe 32, and each air suction nozzle 31 is movably connected to each second branch pipe 34. Each first branch pipe 24 is correspondingly connected and fixed to each second branch pipe 34. In this way, when the air is discharged, the hot air of the first air outlet pipe 22 enters each first branch pipe 24 respectively, and is transported to each first air outlet nozzle 21 through each first branch pipe 24; when the air is sucked, the hot air sucked by each air suction nozzle 31 enters each second branch pipe 34 correspondingly, and is collected and entered into the air suction pipe 32 through each second branch pipe 34. The first branch pipe 24 has more positions to install the first air outlet nozzle 21, and the first air outlet nozzle 21 can be installed at a suitable position on the first branch pipe 24 according to actual needs to improve the treatment effect of the residual liquid medicine. Similarly, there are more positions on the second branch pipe 34 to install the suction nozzle 31, and the suction nozzle 31 can be installed at a suitable position on the second branch pipe 34 according to actual needs to improve the treatment effect of the residual liquid medicine. In addition, since each first branch pipe 24 is connected and fixed with each second branch pipe 34, the first hot air component 20 and the suction component 30 can be fixedly connected together.
[0046] In some embodiments, each processing unit corresponds to two first branches 24 and two second branches 34. The two first branches 24 are arranged at an obtuse angle, and the two second branches 34 are arranged at an obtuse angle. The two first branches 24 and the two second branches 34 cooperate to form a quadrilateral, such as a rhombus. When the rhombus is arranged, it is conducive to the rational use of space and the number of first air outlet nozzles 21 and air suction nozzles 31 can be relatively reduced.
[0047] In one embodiment, the flow cross-sectional area of the first air outlet 21 gradually increases along the air outlet direction. Specifically, the first air outlet 21 includes but is not limited to a trumpet-shaped air outlet with a diameter gradually increasing along the air outlet direction. In this way, the air outlet area can be increased and the treatment effect of the residual liquid medicine can be improved.
[0048] In one embodiment, the flow cross-sectional area of the air suction nozzle 31 gradually decreases along the return air direction. Specifically, the air suction nozzle 31 includes but is not limited to a trumpet-shaped air nozzle with a diameter gradually decreasing along the air outlet direction. In this way, the return air area can be increased and the treatment effect of the residual liquid medicine can be improved.
[0049] See also Figures 3 to 5, in one embodiment, the wafer drying device further includes a suction mechanism 60 and a heating mechanism 70. The suction part of the suction mechanism 60 is connected to the air suction assembly 30, and the air outlet part of the suction mechanism 60 is connected to the first hot air assembly 20. The heating mechanism 70 is used to heat-treat the air flow delivered to the first hot air assembly 20. Thus, the suction mechanism 60 provides negative pressure to enable the air suction assembly 30 to suck in the air flow, the heating mechanism 70 heats the sucked air flow, and the heated air flow is ejected towards the wafer fixture 50 through the first hot air assembly 20. The ejected hot air dries the wafer fixture 50 and the wafer 90. It can be seen that under the driving force of the suction mechanism 60, the hot air flow realizes cyclic suction and blowing, which can greatly reduce energy consumption and costs.
[0050] Specifically, the wafer drying device further includes a wind pressure regulating valve 80. The wind pressure regulating valve 80 is arranged at any position between the air inlet part of the first hot air assembly 20 and the air outlet part of the suction mechanism 60, and can adjust the wind pressure to an appropriate value.
[0051] In some embodiments, the suction mechanism 60 includes, but is not limited to, power mechanisms such as centrifugal pumps, fans, etc. In addition, the heating mechanism 70 is set as an automatic on-line heating device, which can flexibly control the heating duration, heating efficiency, etc. according to the process requirements, so as to control the hot air temperature within a preset range. The heat can be transferred to the first hot air assembly 20 in a contact manner, including but not limited to electric control heaters, hot fluid circulation heat exchange pipelines, etc. The electric control heater is specifically, for example, an electric heating rod, an electric heating wire, etc. The hot fluid circulation heat exchange pipeline is, for example, a hot water circulation heat exchange pipeline, a hot air flow circulation heat exchange pipeline, etc.; or the heat can be transferred to the first hot air assembly 20 in a heat radiation manner, including but not limited to heating by burning a burner; it can also be an electromagnetic heating method, a chemical reaction heat, etc.
[0052] Among them, the preset range is specifically adjusted and set flexibly according to actual needs, and it is necessary to meet the requirement of being lower than the heat deformation temperature of the wafer fixture 50 and the wafer 90 to prevent the wafer fixture 50 and the wafer 90 from being deformed and damaged due to heat when the hot air temperature is too high. In addition, the temperature of the preset range cannot be too low, resulting in a poor drying effect on the residual liquid medicine.
[0053] In one embodiment, the silicon wafer drying device further includes a temperature sensor and a controller. The temperature sensor is used to sense the temperature of the hot air discharged by the first hot air assembly 20. The temperature sensor, the suction mechanism 60, and the heating mechanism 70 are all electrically connected to the controller. The controller is used to control the working power of the heating mechanism 70 and / or the suction power of the suction mechanism 60 according to the hot air temperature. When the temperature sensor senses that the hot air temperature is lower than the preset range, the controller controls the heating mechanism 70 to increase the working power so as to raise the hot air temperature to the preset range, and / or controls the suction mechanism 60 to increase the suction power, and sprays more hot air flows onto the silicon wafer fixture 50 to ensure the removal effect of the residual liquid medicine; when the temperature sensor senses that the hot air temperature is higher than the preset range, the controller controls the heating mechanism 70 to reduce the working power so as to lower the hot air temperature to the preset range, and / or controls the suction mechanism 60 to reduce the suction power, to avoid damage to the silicon wafer fixture 50 and the silicon wafer 90 due to the contact of a large amount of high-temperature hot air flows with the silicon wafer fixture 50 and the silicon wafer 90.
[0054] Please refer to Figures 3 to 5 , in one embodiment, there are multiple first hot air assemblies 20 and multiple air suction assemblies 30. All the first hot air assemblies 20 and all the air suction assemblies 30 are alternately arranged in sequence along the width direction of the drying tank body 10.
[0055] Please refer to Figure 6 and Figure 7 , in one embodiment, the second hot air assembly 40 includes a second air outlet pipe 41 arranged along the longitudinal direction Y of the drying tank body 10, a hot air providing mechanism 42 connected to the second air outlet pipe 41, and a plurality of second air outlet nozzles 43 connected in sequence along the length direction of the second air outlet pipe 41.
[0056] Specifically, the second air outlet pipe 41 is provided as one or more. When the second air outlet pipe 41 is provided as multiple, all the second air outlet pipes 41 are connected in parallel to the hot air providing mechanism 42. The hot air providing mechanism 42 includes a heating element capable of heating the air flow, and further includes a power mechanism for providing the discharge power for the air flow, which can not only heat the air flow, but also make the heated air flow spray upward onto the silicon wafer fixture 50.
[0057] In one embodiment, a solar cell production system includes the silicon wafer drying device according to any one of the above embodiments.
[0058] In the above-mentioned solar energy production system, during operation, the silicon wafer fixture 50 after electroplating and cleaning is placed on the drying tank body 10. The second hot air assembly 40 blows hot air towards the silicon wafer fixture 50 from below to dry the outer surfaces of the silicon wafer fixture 50 and the silicon wafer 90, removing the liquid medicine on the outer surfaces of the silicon wafer fixture 50 and the silicon wafer 90. In addition, the first hot air assembly 20 blows hot air towards the silicon wafer fixture 50 from above, and the hot air can enter the gap between the two conductive clamping blocks of the silicon wafer fixture 50, so as to dry the residual liquid medicine at the gap. In addition, the air suction assembly 30 performs a suction action to suck out the residual liquid medicine at the gap. It can be seen that under the synergistic action of the second hot air assembly 40, the first hot air assembly 20 and the air suction assembly 30, not only can the outer surface of the fixture and the outer surface of the battery wafer be effectively dried, but also the residual liquid medicine at the gap between the two conductive clamping blocks of the silicon wafer fixture 50 can be effectively removed, thereby improving the production efficiency. At the same time, it is not necessary to improve the drying effect by increasing the drying temperature, that is, the required drying effect can be achieved by using an appropriate drying temperature, and the silicon wafer fixture 50 can be prevented from being deformed due to excessive heating.
[0059] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0060] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0061] In this application, unless otherwise clearly stipulated and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0062] In this application, unless otherwise clearly stipulated and defined, if there are descriptions such as a first feature being "on" or "under" a second feature, its meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature.
[0063] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.
[0064] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.
[0065] The above-described embodiments only represent several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application patent shall be subject to the appended claims.
Claims
1. A silicon wafer drying device, characterized in that, The silicon wafer drying device includes: A drying tank body (10) capable of supporting a silicon wafer fixture (50); A first hot air component (20) connected to the drying tank body (10), located above the silicon wafer fixture (50) for discharging hot air towards the silicon wafer fixture (50); An air suction component (30) connected to the drying tank body (10), located above the silicon wafer fixture (50) for sucking the gas around the silicon wafer fixture (50); and A second hot air component (40) connected to the drying tank body (10), located below the silicon wafer fixture (50) for discharging hot air towards the silicon wafer fixture (50).
2. The silicon wafer drying device according to claim 1, wherein The first hot air component (20) includes at least one first air outlet nozzle (21) with an adjustable arrangement angle, and the air suction component (30) includes at least one air suction nozzle (31) with an adjustable arrangement angle.
3. The silicon wafer drying device according to claim 2, characterized in that, The first hot air component (20) further includes a first air outlet pipe (22) arranged along the longitudinal length direction Y of the drying tank body (10). The first air outlet nozzles (21) are multiple and are sequentially arranged along the length direction of the first air outlet pipe (22); all the first air outlet nozzles (21) are communicated with the first air outlet pipe (22), and each first air outlet nozzle (21) is movably connected to the first air outlet pipe (22); The air suction component (30) further includes an air suction pipe (32) arranged along the longitudinal length direction Y of the drying tank body (10). The air suction pipe (32) is arranged in parallel and at intervals with the first air outlet pipe (22). The air suction nozzles (31) are multiple and are sequentially arranged along the length direction of the air suction pipe (32); all the air suction nozzles (31) are communicated with the air suction pipe (32), and each air suction nozzle (31) is movably connected to the air suction pipe (32).
4. The silicon wafer drying device according to claim 3, wherein, All the first air outlet nozzles (21) are divided into multiple first groups (23) sequentially arranged along the longitudinal length direction Y, and each first group (23) includes two first air outlet nozzles (21); all the air suction nozzles (31) are divided into multiple second groups (33) sequentially arranged along the longitudinal length direction Y, and each second group (33) includes two air suction nozzles (31); each of the first groups (23) is correspondingly arranged with each of the second groups (33).
5. The silicon wafer drying device according to claim 3, wherein, The first hot air component (20) further includes multiple first branch pipes (24) sequentially communicated along the length direction of the first air outlet pipe (22), and each of the first air outlet nozzles (21) is movably connected to the corresponding first branch pipe (24); the air suction component (30) further includes multiple second branch pipes (34) sequentially communicated along the length direction of the air suction pipe (32), and each of the air suction nozzles (31) is movably connected to the corresponding second branch pipe (34); each of the first branch pipes (24) is fixedly connected to the corresponding second branch pipe (34).
6. The silicon wafer drying device according to claim 2, characterized in that, The flow cross-sectional area of the first air outlet nozzle (21) gradually increases along the air outlet direction; and / or, the flow cross-sectional area of the air suction nozzle (31) gradually decreases along the air return direction.
7. The silicon wafer drying device according to claim 1, wherein, The silicon wafer drying device further includes a suction mechanism (60) and a heating mechanism (70); the suction part of the suction mechanism (60) is connected to the air suction assembly (30), the air outlet part of the suction mechanism (60) is connected to the first hot air assembly (20), and the heating mechanism (70) is used for heating the air flow conveyed to the first hot air assembly (20).
8. The silicon wafer drying device according to claim 7, wherein, The silicon wafer drying device further includes a temperature sensor and a controller. The temperature sensor is used for sensing the hot air temperature discharged from the first hot air assembly (20). The temperature sensor, the suction mechanism (60), and the heating mechanism (70) are all electrically connected to the controller. The controller is used for controlling the working power of the heating mechanism (70) and / or controlling the suction power of the suction mechanism (60) according to the hot air temperature.
9. The silicon wafer drying device according to claim 1, characterized in that, Both the first hot air assembly (20) and the air suction assembly (30) are multiple. All the first hot air assemblies (20) and all the air suction assemblies (30) are alternately arranged in sequence along the width direction of the drying tank body (10); and / or, The second hot air assembly (40) includes a second air outlet pipe (41) arranged along the longitudinal direction Y of the drying tank body (10), a hot air providing mechanism (42) connected to the second air outlet pipe (41), and a plurality of second air outlet nozzles (43) connected in sequence along the length direction of the second air outlet pipe (41).
10. A solar cell production system, characterized in that, The solar cell production system includes the silicon wafer drying device according to any one of claims 1 to 9.