Pressure-resistant temperature and pressure sensor
A robust warm-pressure sensor for CO2 heat pumps, using a metal membrane with silicon strain gauges and a secure internal framework, addresses the durability issue, ensuring stable operation under high pressures.
Patent Information
- Application Number
- CN202422125546.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The pressure resistance of existing temperature pressure sensors is difficult to meet the high pressure requirements of CO2 heat pump systems, especially under the operating pressure of 15MPa.
The pressure-sensitive core is made using the MSG silicon strain gauge principle, and the circuit board and pressure-sensitive core are fixed through the limit matching structure between the inner bracket and the shell to ensure that it works stably in a high-pressure environment.
The pressure resistance performance of the temperature pressure sensor is improved, so that it can work normally under the 15MPa pressure of the CO2 heat pump system, ensuring the stability and reliability of the system.
Smart Images

Figure CN223106987U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of temperature and pressure sensors, in particular to a pressure-resistant temperature and pressure sensor. Background Technique
[0002] In the national plan for responding to the Kigali Amendment, the support and encouragement for CO2 heat pump technology are clearly defined. CO2 heat pumps use CO2 as the refrigerant, while ordinary heat pumps generally use environmentally friendly refrigerants. The working principles of both are basically the same, both belonging to vapor compression type, but there are also slight differences. CO2 heat pumps belong to supercritical cycles. Temperature and pressure sensors play an important role in monitoring, safety control, and performance optimization in CO2 heat pump systems, helping to ensure the stable operation of the system and improve energy efficiency. The working pressure of the CO2 refrigeration system can reach up to 15 MPa at most, and the pressure resistance of existing temperature and pressure sensors is difficult to meet the requirements. Summary of the Invention
[0003] Object of the Invention: In order to overcome the deficiencies in the prior art, the utility model provides a pressure-resistant temperature and pressure sensor with good pressure resistance performance to meet the high-pressure requirements during the working process.
[0004] Technical Solution: To achieve the above object, a pressure-resistant temperature and pressure sensor of the utility model includes a sensor housing, a circuit board, and a pressure sensing core body installed in the sensor housing; the sensor housing is composed of an upper housing and a lower housing fixedly connected, and an inner bracket is sandwiched between the upper housing and the lower housing; an installation slot is provided on the inner bracket, and the pressure sensing core body is correspondingly placed in the installation slot, and the circuit board is pressed on the pressure sensing core body; several barbs are also provided on the inner bracket, and each barb is respectively hooked on the outer edge of the upper surface of the circuit board.
[0005] Further, the pressure sensing component of the pressure sensing core body is a metal diaphragm, and two silicon strain gauges are sintered on the metal diaphragm to form a Wheatstone bridge on the pressure sensing core body.
[0006] Further, the two silicon strain gauges are sintered on the metal diaphragm through glass glue.
[0007] Further, an annular supporting surface is provided on the inner bracket, and the supporting surface correspondingly supports the edge area of the circuit board; the installation slot is located at the center of the inner bracket, and the pressure sensing core body in the installation slot correspondingly supports the central area of the circuit board.
[0008] Further, the inner bracket is in limit fit with the upper housing to limit the relative rotation of the inner bracket with respect to the upper housing; the inner bracket is in limit fit with the circuit board to limit the relative rotation of the circuit board with respect to the inner bracket.
[0009] Further, a plurality of limiting clamping grooves are arranged on the outer edge of the circuit board, and the barbs are correspondingly clamped in the limiting clamping grooves, so that the inner bracket is in limiting cooperation with the circuit board.
[0010] Further, a plurality of limiting slots are arranged on the inner bracket, and a plurality of limiting blocks are arranged on the lower side of the upper shell. The limiting blocks are correspondingly inserted into the limiting slots, so that the inner bracket is in limiting cooperation with the upper shell.
[0011] Further, each of the limiting slots corresponds to each of the barbs, and the limiting slots are located outside the barbs. The barbs can be bent and deformed towards the direction of the limiting slots to hook the circuit board. After the limiting blocks are inserted into the limiting slots, the barbs are blocked from bending towards the direction of the limiting slots.
[0012] Further, a covering cavity is formed in the upper part of the lower shell, the lower part of the upper shell is embedded in the covering cavity, and a gap for clamping the inner bracket is formed between the lower part of the upper shell and the bottom of the covering cavity.
[0013] Beneficial effects: A pressure-resistant temperature and pressure sensor of the present utility model has the following beneficial effects:
[0014] 1) The circuit board and the pressure sensing core are fixed by the inner bracket, and the fixing effect is good. The pressure sensing core and the circuit board are not easy to displace inside the sensor, with higher stability and better pressure resistance performance;
[0015] 2) The pressure sensing core inside the temperature and pressure sensor is made by using the MSG silicon strain gauge principle. Compared with ordinary pressure sensing cores, it has stronger pressure resistance and can work normally under the pressure of a 15MPA CO2 heat pump system. Description of the Drawings
[0016] Att Figure 1 is a schematic diagram of the external structure of the temperature and pressure sensor;
[0017] Att Figure 2 is a schematic diagram of the internal structure of the temperature and pressure sensor;
[0018] Att Figure 3 is a schematic diagram of the limiting cooperation between the inner bracket and the upper shell;
[0019] Att Figure 4 is a schematic diagram of the circuit board installed on the inner bracket;
[0020] Att Figure 5 is a schematic diagram of the pressure sensing core installed on the inner bracket. Detailed Embodiments
[0021] The present utility model will be further described below with reference to the drawings.
[0022] As shown in Att Figures 1 to 5 the pressure-resistant temperature and pressure sensor described above
[0023] A pressure-resistant temperature and pressure sensor. The temperature and pressure sensor includes a sensor housing, and a circuit board 1, a pressure sensing core 11, a pin 13 and a connecting pipe are installed in the sensor housing. Both the pressure sensing core 11 and the pin 13 are connected to the circuit board 1. During the operation of the temperature and pressure sensor, the pressure sensing core 11 transmits the measured pressure information to the circuit board 1, and the circuit board 1 then transmits the pressure information through the pin 13. The connecting pipe is arranged below the pressure sensing core 11, and the inside of the connecting pipe is a detection channel. The fluid can reach the pressure sensing surface of the pressure sensing core 11 along the detection channel 12, and then the pressure sensing core 11 measures the pressure of the fluid. A thermistor is arranged on one side of the connecting pipe. The thermistor is connected to the circuit board 1 through a pin. The thermistor can measure the temperature of the fluid in the connecting pipe and transmit the temperature information to the circuit board 1.
[0024] The sensor housing is composed of an upper housing 2 and a lower housing 3 which are fixedly connected, and an inner bracket 4 is clamped between the upper housing 2 and the lower housing 3. As shown in the appendix Figure 5 As shown, an installation slot 10 is arranged on the inner bracket 4. The shape of the installation slot 10 corresponds to that of the pressure sensing core. The pressure sensing core 11 is correspondingly placed in the installation slot 10. As shown in the appendix Figure 4 As shown, the circuit board 1 is correspondingly pressed on the pressure sensing core 11. A number of barbs 6 are also arranged on the inner bracket 4. As shown in the appendix Figure 2 and 4 As shown, each barb 6 is respectively hooked on the outer edge of the upper surface of the circuit board 1. The installation slot 10 can limit the displacement of the pressure sensing core 11 in the horizontal direction, and the barb 6 is hooked on the circuit board 1, and the circuit board 1 is pressed on the pressure sensing core 11. Therefore, the barb 6 can limit the displacement of the pressure sensing core 11 in the vertical direction, so that the circuit board 1 and the pressure sensing core 11 can be stable in the sensor, and further improve the pressure resistance performance of the pressure sensing core 11 during operation. Thus, the temperature and pressure sensor of the present utility model can work normally under the pressure of a 15MPA CO2 heat pump system.
[0025] The pressure sensing component of the pressure sensing core 11 is a metal diaphragm, specifically a stainless steel diaphragm. Two silicon strain gauges are sintered on the metal diaphragm to form a Wheatstone bridge on the pressure sensing core 11. Specifically, the two silicon strain gauges are sintered on the metal diaphragm through glass glue. Since the pressure sensing core 11 is made by using the MSG silicon strain gauge principle, it has a stronger pressure resistance ability compared with ordinary pressure sensing cores and can be extended to CO2 heat pump systems.
[0026] The inner bracket 4 is provided with an annular bearing surface 5, and the bearing surface 5 correspondingly supports the edge area of the circuit board 1; the installation card slot 10 is located at the center of the inner bracket 4, and the pressure-sensitive core 11 in the installation card slot 10 correspondingly supports the central area of the circuit board 1. With the cooperation of the bearing surface 5 and the pressure-sensitive core 11, the support effect on the circuit board 1 is better, the circuit board 1 is more stable, and correspondingly, the pressure-sensitive core 11 is also more stable.
[0027] The inner bracket 4 is in limit fit with the upper shell 2 to limit the rotation of the inner bracket 4 relative to the upper shell 2. The inner bracket 4 is in limit fit with the circuit board 1 to limit the rotation of the circuit board 1 relative to the inner bracket 4. Thus, the horizontal displacement of the circuit board 1 in the sensor housing can be prevented, making the circuit board 1 and the pressure-sensitive core 11 more stable in the sensor housing, and correspondingly, the pressure resistance performance can also be improved.
[0028] Specifically, as shown in the appendix Figure 4 As shown, a plurality of limit card slots 7 are provided on the outer edge of the circuit board 1, and the barbs 6 are correspondingly clamped in the limit card slots 7, so that the inner bracket 4 is in limit fit with the circuit board 1, thereby restricting the rotation of the circuit board 1 relative to the inner bracket 4.
[0029] As shown in the appendix Figure 3 As shown, a plurality of limit slots 8 are provided on the outer edge of the inner bracket 4, and a plurality of limit plugs 9 are provided on the lower side edge of the upper shell 2. The limit plugs 9 are correspondingly inserted into the limit slots 8, so that the inner bracket 4 is in limit fit with the upper shell 2, thereby restricting the rotation of the inner bracket 4 relative to the upper shell 2.
[0030] Each of the limit slots 8 corresponds to one of the barbs 6, and the limit slot 8 is located outside the barb 6. During the process of installing the circuit board 1 onto the inner bracket 4, the barb 6 can be bent and deformed towards the direction of the limit slot 8, enabling the circuit board 1 to enter between the barb 6 and the bearing surface 5, so that the barb 6 hooks the circuit board 1 to complete the fixation of the circuit board 1. And since the limit slot 8 is correspondingly located outside the barb 6, after the limit plug 9 is inserted into the limit slot 8, the limit plug 9 will block the barb 6 from bending towards the direction of the limit slot 8, so that the barb 6 can always keep hooking the circuit board 1 and prevent the circuit board 1 from displacing in the sensor housing.
[0031] As shown in the appendix Figure 1 and 2 As shown, in one embodiment, the upper shell 2 is a plastic part, the lower shell 3 is an aluminum shell, and a covering cavity is formed in the upper part of the lower shell 3. The lower part of the upper shell 2 is correspondingly embedded in the covering cavity, and a gap for clamping the inner bracket 4 is formed between the lower part of the upper shell 2 and the bottom of the covering cavity, so that the inner bracket 4 is kept stable in the sensor housing.
[0032] In summary, in the present utility model, a special pressure-sensitive core body 11 made based on the principle of MSG silicon strain gauge is selected, which has strong pressure resistance; moreover, an inner bracket 4 is used as an inner assembly component of the sensor housing, making the pressure-sensitive core body 11 more stable within the sensor housing and further improving the pressure resistance ability.
[0033] The above description is only a preferred embodiment of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model.
Claims
1. A pressure-resistant temperature and pressure sensor, characterized in that: It includes a sensor housing, a circuit board (1) and a pressure sensing core (11) installed in the sensor housing; the sensor housing is composed of an upper housing (2) and a lower housing (3) fixedly connected, and an inner bracket (4) is sandwiched between the upper housing (2) and the lower housing (3); an installation slot (10) is provided on the inner bracket (4), the pressure sensing core (11) is correspondingly placed in the installation slot (10), and the circuit board (1) is pressed on the pressure sensing core (11); a number of barbs (6) are also provided on the inner bracket (4), and each barb (6) is respectively hooked on the outer edge of the upper surface of the circuit board (1).
2. The pressure-resistant temperature and pressure sensor according to claim 1, characterized in that: The pressure sensing component of the pressure sensing core (11) is a metal diaphragm, and two silicon strain gauges are sintered on the metal diaphragm to form a Wheatstone bridge on the pressure sensing core (11).
3. The pressure-resistant temperature and pressure sensor according to claim 2, wherein: The two silicon strain gauges are sintered on the metal diaphragm through glass glue.
4. A pressure-resistant temperature and pressure sensor according to claim 1, characterized in that: An annular supporting surface (5) is provided on the inner bracket (4), and the supporting surface (5) correspondingly supports the edge area of the circuit board (1); the installation slot (10) is located at the center of the inner bracket (4), and the pressure sensing core (11) in the installation slot (10) correspondingly supports the center area of the circuit board (1).
5. A pressure-resistant temperature and pressure sensor according to claim 1, characterized in that: The inner bracket (4) is in limit fit with the upper housing (2) to limit the relative rotation of the inner bracket (4) with respect to the upper housing (2); the inner bracket (4) is in limit fit with the circuit board (1) to limit the relative rotation of the circuit board (1) with respect to the inner bracket (4).
6. The pressure-resistant temperature and pressure sensor according to claim 5, wherein: A number of limit slots (7) are provided on the outer edge of the circuit board (1), and the barbs (6) are correspondingly placed in the limit slots (7) to make the inner bracket (4) and the circuit board (1) in limit fit.
7. The pressure-resistant temperature and pressure sensor according to claim 6, characterized in that: A number of limit slots (8) are provided on the inner bracket (4), and a number of limit plugs (9) are provided on the lower side of the upper housing (2), and the limit plugs (9) are correspondingly inserted into the limit slots (8) to make the inner bracket (4) and the upper housing (2) in limit fit.
8. A pressure-resistant temperature and pressure sensor according to claim 7, characterized in that: Each limit slot (8) corresponds to each barb (6) one by one, and the limit slot (8) is located outside the barb (6), and the barb (6) can be bent and deformed in the direction of the limit slot (8) to hook the circuit board (1); after the limit plug (9) is inserted into the limit slot (8), it blocks the barb (6) from bending in the direction of the limit slot (8).
9. The pressure-resistant temperature and pressure sensor according to claim 1, wherein: An encapsulation cavity is formed in the upper part of the lower housing (3), the lower part of the upper housing (2) is embedded in the encapsulation cavity, and a gap for clamping the inner bracket (4) is formed between the lower part of the upper housing (2) and the bottom of the encapsulation cavity.