Embedded wooden intelligent card
The laminated wood-based smart card design addresses high production costs and bending issues by using a wood frame to protect the INLAY layer, enhancing durability and reducing plastic pollution.
Patent Information
- Application Number
- CN202421942994.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-12
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-12
AI Technical Summary
Existing wooden smart cards are prone to cause coil breakage when bending, and have high manufacturing costs, difficult to recycle and poor environmental protection.
The inlay structure is adopted, and the INLAY layer is protected by a wooden frame layer. The first and second wooden outer layers are bonded through the upper and lower parts of the wooden frame layer. The multi-layer wooden frame layer design is combined to improve bending resistance. It also uses easily degraded wood materials to protect the coil from breaking.
It improves the service life of wooden smart cards, reduces plastic pollution, reduces manufacturing costs, and is more environmentally friendly when abandoned.
Smart Images
Figure CN223108372U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic cards, in particular to an inlaid wooden smart card. Background Art
[0002] A smart card is a plastic card with a built-in microchip that can store and transmit data for communication. It mainly includes two categories: contact smart cards and non-contact smart cards (including dual-interface chips or non-contact chip cards). Among them, contact smart cards usually use IC card technology and need to physically contact the card reader to exchange data. Non-contact smart cards, also known as touchless smart cards, allow data transmission through radio waves without physically contacting the card reader. Such cards use a 13.56 MHz wireless signal, and the embedded integrated circuit can store and transmit data. Non-contact smart cards include read-only RFID and CSN (Card Serial Number) or UID, which can communicate through radio waves and rewrite the chip information on the smart card. The advantage of this kind of card lies in its convenience of use and is suitable for various application scenarios, such as transportation, access control systems, etc. Existing smart cards mainly use non-renewable petrochemical-based materials such as PVC, PC, and PET as materials for producing the card body. Due to the convenience brought by the use of smart cards to life, the number of smart cards used globally is extremely large. Smart cards will be discarded due to factors such as technological upgrading, expiration of service life, damage, or being replaced. Most people are worried that the card information will be stolen and directly cut them into pieces and discard them, resulting in difficulties in resource recycling and environmental pollution due to non-degradability. Therefore, those skilled in the art have improved smart cards and designed smart cards made of wood materials. However, in existing wooden smart cards, wood veneer and coated glue are used as carriers for coils and chips, resulting in high manufacturing costs and easy breakage of the internal coils when the wooden smart card is bent, leading to card failure. Content of the Utility Model
[0003] In view of this, the utility model provides an inlaid wooden smart card with a more reasonable structural design. By setting a wooden frame layer, the INLAY layer of the smart card is embedded in the wooden frame layer, and wooden outer layers are provided on the upper and lower surfaces of the wooden frame layer, thereby realizing a wooden smart card. The wooden material is degradable, which is beneficial to environmental protection and has better bending resistance. The coils of the INLAY layer are not easily broken, improving the service life of the wooden smart card.
[0004] The technical solution disclosed by the present utility model is an inlaid wooden smart card, which includes a card base and an INLAY layer. The card base includes a wooden frame layer, a first wooden outer layer, and a second wooden outer layer. The wooden frame layer includes at least one layer, and the outer edge dimensions of the wooden frame layer are the same as those of the first wooden outer layer and the second wooden outer layer. A first punching hole position is provided inside the wooden frame layer, and the INLAY layer is inlaid in the first punching hole position. The wooden frame layer is laminated between the first wooden outer layer and the second wooden outer layer, and the first wooden outer layer, the second wooden outer layer are bonded to the wooden frame layer and the INLAY layer.
[0005] Furthermore, the INLAY layer includes a plastic thin sheet, a coil, and a chip. The coil is wound and implanted into the plastic thin sheet through an ultrasonic wire embedder, and the chip is welded to the coil.
[0006] Furthermore, the plastic thin sheet adopts any one of PVC thin sheets, ABS thin sheets, PET thin sheets, PETG thin sheets, and PC thin sheets.
[0007] Furthermore, the coil and the chip are coupled by an inductance coil and an RFID chip, and the formed INLAY layer is a non-contact radio frequency identification INLAY unit.
[0008] Furthermore, the coil and the chip are coupled by an induction coil and a memory chip, and the formed INLAY layer is a contact reading INLAY unit.
[0009] Furthermore, the coil and the chip are coupled by a dual induction coil and a CPU chip, and the formed INLAY layer is a dual-interface smart card INLAY unit.
[0010] Furthermore, a contact point metal sheet is coupled on the upper layer of the chip. A second punching hole position is provided on the first wooden outer layer, and the contact point metal sheet is inlaid and exposed in the second punching hole position.
[0011] Furthermore, the first wooden outer layer, the second wooden outer layer, and the wooden frame layer adopt any one of basswood, beech, cherry, sapelli, black walnut, birch, bamboo, and elm. The first wooden outer layer and the second wooden outer layer are made of the same kind of wood, and the wooden frame layer adopts wood harder than the first wooden outer layer and the second wooden outer layer.
[0012] Furthermore, the thickness of the first wooden outer layer and the second wooden outer layer is 0.15 - 0.3mm ± 0.08mm, the thickness of the wooden frame layer is 0.15 - 0.50mm ± 0.05mm. Glue or hot melt adhesive paper is coated on the surface where the first wooden outer layer, the second wooden outer layer are bonded to the INLAY layer, so that the thickness after bonding the first wooden outer layer, the second wooden outer layer to the wooden frame layer is 0.68mm - 1.40mm.
[0013] The inlaid wooden smart card designed by this solution has the following beneficial effects compared with the existing wooden smart cards. It retains the INLAY layer carrier made of traditional plastic material. The card base (the basic material of the smart card) of the wooden smart card is designed with wooden material. An inlaid wooden frame layer for placing the INLAY layer is designed, and the INLAY layer is protected by the wooden frame layer. Then, the first wooden outer layer and the second wooden outer layer are press-bonded on the upper and lower surfaces of the wooden frame layer. The wooden frame layer includes at least one layer. When the first wooden outer layer and the second wooden outer layer meet the thickness standard of the smart card, the wooden frame layer can be adjusted to be set from one layer to three layers as needed. In this way, through the composite bonding of multiple wooden frame layers, the anti-bending performance of the wooden frame layer is better, which is beneficial to protecting the coil of the INLAY layer from being easily broken and improving the service life of the wooden smart card. On the other hand, at the same time, the first wooden outer layer, the second wooden outer layer and the wooden frame layer are made of wooden materials and are easily degradable. Compared with the traditional plastic card base, it is beneficial to reduce plastic pollution. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic exploded view of the structure of the inlaid wooden smart card of the present utility model.
[0015] Figure 2 It is a schematic cross-sectional structure view of the inlaid wooden smart card of the present utility model.
[0016] Figure 3 It is a three-dimensional view of the overall structure of the non-contact single-interface card of the inlaid wooden smart card of the present utility model.
[0017] Figure 4 It is a three-dimensional view of the overall structure of the dual-interface card of the inlaid wooden smart card of the present utility model.
[0018] Reference Signs:
[0019] 1. Wooden frame layer; 2. First wooden outer layer; 3. Second wooden outer layer; 4. INLAY layer; 5. Contact point metal sheet. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Next, the technical solutions in the embodiments of the present disclosure will be clearly and completely described with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall also fall within the scope of protection of the present disclosure.
[0021] Please refer to Figure 1 、 Figure 2, an inlaid wooden smart card provided by this technical solution, which includes a card base and an INLAY layer 4. The card base includes a wooden frame layer 1, a first wooden outer layer 2, and a second wooden outer layer 3. The wooden frame layer 1 includes at least one layer, and the outer edge size of the wooden frame layer 1 is the same as that of the first wooden outer layer 2 and the second wooden outer layer 3. A first punching hole position is provided inside the wooden frame layer 1, and the INLAY layer 4 is inlaid in the first punching hole position. The wooden frame layer is stacked between the first wooden outer layer 2 and the second wooden outer layer 3, and the first wooden outer layer 2, the second wooden outer layer 3 are bonded to the wooden frame layer 1 and the INLAY layer 4.
[0022] Further, the INLAY layer 4 includes a plastic thin sheet, a coil, and a chip. The coil is wound and implanted into the plastic thin sheet by an ultrasonic wire embedder, and the chip is welded to the coil. The plastic thin sheet is any one of a PVC thin sheet, an ABS thin sheet, a PC thin sheet, a PET (polyethylene terephthalate) thin sheet, and a PETG (polyethylene terephthalate-1,4-cyclohexanedimethanol ester) thin sheet.
[0023] Refer to Figures 1 to 3 , in an embodiment, the coil and the chip are coupled by an inductive coil and an RFID chip, and the composed INLAY layer 4 is a non-contact radio frequency identification INLAY unit, which is made into a non-contact radio frequency induction smart card together with the wooden frame layer 1, the first wooden outer layer 2, and the second wooden outer layer 3.
[0024] In an embodiment, the coil and the chip are coupled by an induction coil and a memory chip, and the composed INLAY layer 4 is a contact reading INLAY unit, which is made into a smart IC card for physically contacting and reading data together with the wooden frame layer 1, the first wooden outer layer 2, and the second wooden outer layer 3.
[0025] Refer to Figure 4 , in an embodiment, the coil and the chip are coupled by a double induction coil and a CPU chip, and the composed INLAY layer 4 is a dual-interface smart card INLAY unit, which is made into a dual-interface composite smart card with non-contact radio frequency induction and contact reading data together with the wooden frame layer 1, the first wooden outer layer 2, and the second wooden outer layer 3. As a smart IC card or a dual-interface composite smart card, a contact point metal sheet 5 is coupled on the upper layer of the chip, and a second punching hole position is provided on the first wooden outer layer 2, and the contact point metal sheet 5 is inlaid and exposed in the second punching hole position.
[0026] Preferably, the first wood outer layer 2, the second wood outer layer 3 and the wood frame layer 1 are made of any one of basswood, beech, cherry, sapele, black walnut, birch, bamboo, elm. The first wood outer layer 2 and the second wood outer layer 3 are made of the same kind of wood. Preferably, the wood frame layer 1 is made of wood harder than the first wood outer layer 2 and the second wood outer layer 3.
[0027] When meeting the standard thickness of the smart card, which is 0.5mm - 1mm, the thickness of the first wood outer layer 2 and the second wood outer layer 3 is 0.15 - 0.3mm ± 0.08mm, and the thickness of the wood frame layer 1 is 0.15 - 0.50mm ± 0.05mm. The surfaces of the first wood outer layer 2 and the second wood outer layer 3 that are bonded to the INLAY layer 4 are coated with glue or hot melt adhesive paper, so that the thickness after bonding the first wood outer layer 2, the second wood outer layer 3 and the wood frame layer 1 is 0.68mm - 1.40mm.
[0028] Through the embodiment of the application scheme, a wood frame layer 1 for inlaid placement of the INLAY layer 4 is designed. The INLAY layer 4 is protected by the wood frame layer 1, and then the first wood outer layer 2 and the second wood outer layer 3 are press-bonded on the upper and lower surfaces of the wood frame layer 1. The wood frame layer 1 includes at least one layer. When the first wood outer layer 2 and the second wood outer layer 3 meet the thickness standard of the smart card, the wood frame layer 1 can be adjusted to be set from one layer to three layers as needed. In this way, through the composite bonding of multiple layers of the wood frame layer 1, the anti-bending performance of the wood frame layer 1 is better, which is beneficial to protecting the coil of the INLAY layer 4 from being broken and improving the service life of the wood smart card.
[0029] Meanwhile, the first wood outer layer 2, the second wood outer layer 3 and the wood frame layer 1 are made of wood materials and are easily degradable, which is beneficial to reducing plastic pollution compared with traditional plastic card bases.
[0030] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technologies in the market, or to enable other ordinary technical personnel in the technical field to understand the embodiments disclosed herein.
Claims
1. An inlaid wooden smart card, comprising a card base and an INLAY layer, characterized in that The card base includes a wooden frame layer, a first wooden outer layer, and a second wooden outer layer. The wooden frame layer includes at least one layer, and the outer edge dimensions of the wooden frame layer are the same as those of the first wooden outer layer and the second wooden outer layer. A first punching hole position is provided inside the wooden frame layer, and the INLAY layer is inlaid in the first punching hole position. The wooden frame layer is laminated between the first wooden outer layer and the second wooden outer layer, and the first wooden outer layer, the second wooden outer layer are bonded to the wooden frame layer and the INLAY layer.
2. The inlaid wooden smart card according to claim 1, characterized in that, The INLAY layer includes a plastic sheet, a coil, and a chip. The coil is wound and implanted into the plastic sheet by an ultrasonic wire embedder, and the chip is welded to the coil.
3. The inlaid wooden smart card according to claim 2, characterized in that, The plastic sheet is any one of PVC sheet, ABS sheet, PET sheet, PETG sheet, and PC sheet.
4. The inlaid wooden smart card according to claim 2, wherein The coil and the chip are coupled by an inductance coil and an RFID chip, and the formed INLAY layer is a non-contact radio frequency identification INLAY unit.
5. The inlaid wooden smart card according to claim 2, wherein, The coil and the chip are coupled by an induction coil and a memory chip, and the formed INLAY layer is a contact reading INLAY unit.
6. The inlaid wooden smart card according to claim 2, wherein The coil and the chip are coupled by a double induction coil and a CPU chip, and the formed INLAY layer is a dual-interface smart card INLAY unit.
7. The inlaid wooden smart card according to any one of claims 5-6, characterized in that, A contact point metal sheet is coupled on the upper layer of the chip, and a second punching hole position is provided on the first wooden outer layer, and the contact point metal sheet is inlaid and exposed in the second punching hole position.
8. The inlaid wooden smart card according to claim 1, characterized in that, The first wooden outer layer, the second wooden outer layer, and the wooden frame layer are made of any one of basswood, beech, cherry, sapelli, black walnut, birch, bamboo, and elm. The first wooden outer layer and the second wooden outer layer are made of the same kind of wood, and the wooden frame layer is made of wood harder than the first wooden outer layer and the second wooden outer layer.
9. The inlaid wooden smart card according to claim 1, wherein The thickness of the first wooden outer layer and the second wooden outer layer is 0.15 - 0.3mm ± 0.08mm, the thickness of the wooden frame layer is 0.15 - 0.50mm ± 0.05mm, and the surfaces of the first wooden outer layer, the second wooden outer layer bonded to the INLAY layer are coated with glue or hot melt adhesive paper, so that the thickness after bonding the first wooden outer layer, the second wooden outer layer to the wooden frame layer is 0.68mm - 1.40mm.