Automatic silicon wafer feeding and discharging device and solar cell production equipment

Abstract

The utility model relates to an automatic silicon wafer feeding and discharging device and solar cell production equipment. The silicon wafer automatic loading and unloading device is provided with the first detector for detecting the loading basket on the first conveying part, and is provided with the second detector for detecting whether the loading basket on the second conveying part is loaded with the silicon wafer to be coated or not. And when the first detector detects the loading basket, the second detector performs detection. When the second detector detects the to-be-coated silicon wafer, the feeding and discharging mechanism is automatically set to be in a production mode, and when the to-be-coated silicon wafer is not detected, the feeding and discharging mechanism is automatically set to be in a running frame mode, so that automatic switching between the production mode and the running frame mode is realized, the workload of production personnel is reduced, the labor cost is reduced, the time delayed by manual mode switching is reduced, and the production efficiency is improved. The loss caused by untimely mode switching is avoided, and the normal production is ensured. And moreover, the occurrence of loading lamination can be effectively reduced, the coated silicon wafers are prevented from flowing back to a loading area, the yield of battery production is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic technology, and particularly relates to a wafer automatic loading and unloading device and a solar cell production equipment. Background Art

[0002] At present, in the PVD coating process of solar cells such as heterojunction cells, an automatic loading and unloading machine is used for loading before coating and unloading after coating. The automatic loading and unloading machine is provided with a robotic arm and a loading mechanism. The robotic arm is used to transfer wafers onto the loading mechanism or take wafers off the loading mechanism, and the loading mechanism is used to load wafers through the coating machine.

[0003] The automatic loading and unloading machine has two working modes, namely the frame running mode and the production mode. When in the frame running mode, when the loading mechanism passes through the machine, the robotic arm does not perform loading and unloading, and the loading mechanism directly passes through the machine. When in the production mode, when the loading mechanism passes through the machine, the robotic arm will start to operate for loading and unloading.

[0004] In the production mode, if there is no wafer on the loading runway when the loading mechanism reaches the loading area, the loading robotic arm will continue to operate and alarm. If there is no blue film on the loading mechanism when the loading mechanism reaches the unloading area, the unloading robotic arm will continue to operate and alarm. At this time, production personnel need to manually switch to the frame running mode. Sometimes it is necessary to frequently switch between the two working modes, which is time-consuming and laborious. If the frame running mode is not switched in time during loading, it will cause wafer stacking during loading. If the production mode is not switched during unloading, the wafers on the loading mechanism will not be taken off and will flow back to the loading area, affecting the yield and output of the production line. Summary of the Utility Model

[0005] Based on this, it is necessary to provide a wafer automatic loading and unloading device and a solar cell production equipment to solve the problems of time-consuming and laborious manual switching between the frame running mode and the production mode and possible untimely switching.

[0006] One of the purposes of the utility model is to provide a wafer automatic loading and unloading device, and the solution is as follows:

[0007] A wafer automatic loading and unloading device includes a loading and unloading mechanism and a loading detection mechanism;

[0008] The loading and unloading mechanism includes a loading handling component, an unloading handling component, and a loading feeding component; in the production mode, the loading handling component is used to load wafers to be coated onto the loading feeding component, and the unloading handling component unloads the coated wafers on the loading feeding component; in the frame running mode, the loading handling component and the unloading handling component stop loading and unloading;

[0009] The loading and detecting mechanism includes a first conveying component, a second conveying component, a first detector, and a second detector; the first conveying component is used to convey the loading basket to the second conveying component, the second conveying component is used to drive the loading basket to approach the loading and unloading handling component, the first detector is used to detect the loading basket on the first conveying component, and the second detector is used to detect whether the loading basket on the second conveying component is loaded with the silicon wafers to be coated. When the first detector detects the loading basket, the second detector performs detection. When the second detector detects that the loading basket is loaded with the silicon wafers to be coated, the loading and unloading mechanism is set to the production mode; when the second detector does not detect that the loading basket is loaded with the silicon wafers to be coated, the loading and unloading mechanism is set to the running frame mode.

[0010] In one embodiment, the loading and detecting mechanism further includes a mounting seat and a rotating arm. The rotating arm is rotatably connected to the mounting seat, and the second detector is disposed on the rotating arm. When the first detector detects the loading basket on the first conveying component, the rotating arm rotates to drive the second detector to approach the second conveying component for detection, and drives the second detector to retract after the second detector completes the detection.

[0011] In one embodiment, the automatic silicon wafer loading and unloading device further includes a unloading and detecting mechanism. The unloading and detecting mechanism includes a third detector, and the third detector is used to detect whether the loading and feeding component is loaded with the coated silicon wafers; when the third detector detects that the loading and feeding component is loaded with the coated silicon wafers, the loading and unloading mechanism is set to the production mode; when the third detector does not detect that the loading and feeding component is loaded with the coated silicon wafers, the loading and unloading mechanism is set to the running frame mode.

[0012] In one embodiment, the first conveying component includes a conveyor belt.

[0013] In one embodiment, the second conveying component includes a support seat and a lifting frame. The lifting frame is used to carry the loading basket, and the lifting frame is movably disposed on the support seat and can drive the loading basket to rise or fall.

[0014] In one embodiment, the first detector is a motion sensor.

[0015] In one embodiment, the second detector is an infrared sensor.

[0016] In one embodiment, the third detector is an infrared sensor.

[0017] In one embodiment, the loading and unloading handling component includes a robotic arm.

[0018] In one embodiment, the material unloading and handling component includes a robotic arm.

[0019] In one of the embodiments, the loading and feeding component includes a carrier plate having a plurality of hollow loading areas.

[0020] Another object of the utility model is to provide a solar cell production device, the scheme is as follows:

[0021] A solar cell production device comprises a coating device and the automatic silicon wafer loading and unloading device described in any of the embodiments, wherein the coating device is used to coat the silicon wafers to be coated on the loading and feeding component to obtain coated silicon wafers.

[0022] Compared with the traditional solution, the above-mentioned silicon wafer automatic loading and unloading device and solar cell production equipment have the following beneficial effects:

[0023] The above-mentioned automatic loading and unloading device for silicon wafers and solar cell production equipment are provided with a first detector to detect the loading basket on the first conveying component, so as to determine whether there is a loading basket for loading, and a second detector is provided to detect whether the loading basket on the second conveying component is loaded with silicon wafers to be coated, so as to determine whether the loading basket is loaded or unloaded. When the first detector detects the loading basket, the second detector performs detection. When the second detector detects the silicon wafers to be coated, the loading and unloading mechanism is automatically set to the production mode. When the silicon wafers to be coated are not detected, the loading and unloading mechanism is automatically set to the running frame mode. Therefore, the above-mentioned automatic loading and unloading device for silicon wafers can realize the automatic switching between the production mode and the running frame mode, reduce the workload of production personnel, reduce labor costs, reduce the time wasted in manual mode switching, avoid losses caused by not having enough time to switch modes, and ensure normal production. In addition, it can effectively reduce the occurrence of loading stacking, prevent the coated silicon wafers from flowing back to the loading area, improve the battery production yield, and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a silicon wafer automatic loading and unloading device according to an embodiment;

[0025] Figure 2 It is a structural schematic diagram of a loading and feeding component in an automatic silicon wafer loading and unloading device according to an embodiment;

[0026] Figure 3 It is a schematic diagram of a rotating arm in an automatic silicon wafer loading and unloading device according to an embodiment of the present invention driving a second detector to perform detection;

[0027] Figure 4 It is a structural schematic diagram of a loading detection mechanism in an automatic loading and unloading device for silicon wafers according to an embodiment;

[0028] Figure 5Schematic diagram of the rotating arm retracting the second detector in the automatic wafer loading and unloading device of an embodiment;

[0029] Figure 6 Light diagram when the second detector does not detect the wafer to be coated on the loading basket;

[0030] Figure 7 Light diagram when the second detector detects the wafer to be coated on the loading basket;

[0031] Figure 8 Schematic structural diagram of the unloading detection mechanism in the automatic wafer loading and unloading device of the embodiment.

[0032] Explanation of reference numerals:

[0033] 10. Automatic wafer loading and unloading device; 100. Loading and unloading mechanism; 110. Loading handling component; 120. Unloading handling component; 130. Loading and feeding component; 131. Carrier plate; 1312. Hollow loading area; 200. Loading detection mechanism; 210. Second conveying component; 211. Support base; 212. Lifting frame; 220. First detector; 230. Second detector; 240. Mounting seat; 250. Rotating arm; 251. First connecting rod; 252. Second connecting rod; 253. First rotating shaft; 254. Second rotating shaft; 300. Unloading detection mechanism; 310. Third detector; 311. Emitter; 312. Receiver; 20. Loading basket; 30. Cooling chamber. Detailed implementation manners

[0034] To make the above objects, features and advantages of the present utility model more obvious and understandable, the following detailed description of the specific implementation manners of the present utility model is given with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0035] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0036] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0037] In the present utility model, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0039] The present utility model provides a silicon wafer automatic loading and unloading device.

[0040] As Figure 1 and Figure 2 shown, a silicon wafer automatic loading and unloading device 10 of an embodiment includes a loading and unloading mechanism 100 and a loading detection mechanism 200.

[0041] Among them, the loading and unloading mechanism 100 includes a loading handling component 110, an unloading handling component 120, and a loading and feeding component 130. The loading and feeding component 130 is used to convey the silicon wafers to be coated through a coating device for coating to obtain coated silicon wafers. The loading and unloading mechanism 100 has a production mode and a running frame mode. In the production mode, the loading handling component 110 is used to load the silicon wafers to be coated onto the loading and feeding component 130, and the unloading handling component 120 unloads the coated silicon wafers on the loading and feeding component 130. In the running frame mode, when the loading and feeding component 130 passes through the coating device, the loading handling component 110 and the unloading handling component 120 do not perform loading and unloading.

[0042] The loading detection mechanism 200 includes a first conveying component (not shown in the figure), a second conveying component 210, a first detector 220 and a second detector 230. The first conveying component is used to convey the loading basket 20 to the second conveying component 210. The loading basket 20 is used to load silicon wafers. In the production mode, the loading basket 20 needs to be loaded with silicon wafers. In the running frame mode, the loading basket 20 is not loaded with silicon wafers, and the loading feeding component 130 transports the loading basket 20 without silicon wafers through the coating device.

[0043] The second conveying component 210 is used to drive the loading basket 20 to approach the loading and transporting component 110 so that the loading and transporting component 110 can pick up materials. The first detector 220 is used to detect the loading basket 20 on the first conveying component. The second detector 230 is used to detect whether the loading basket 20 on the second conveying component 210 is loaded with silicon wafers to be coated. When the first detector 220 detects the loading basket 20 on the first conveying component, the second detector 230 performs a detection, that is, detects whether the loading basket 20 on the second conveying component 210 is loaded with silicon wafers to be coated. When the second detector 230 detects that the loading basket 20 is loaded with silicon wafers to be coated, the loading and unloading mechanism 100 is set to the production mode. When the second detector 230 does not detect that the loading basket 20 is loaded with silicon wafers to be coated, the loading and unloading mechanism 100 is set to the running frame mode.

[0044] The above-mentioned automatic loading and unloading device 10 for silicon wafers is provided with a first detector 220 to detect the loading basket 20 on the first conveying component, so as to determine whether there is a loading basket 20 for loading, and a second detector 230 is provided to detect whether the loading basket 20 on the second conveying component 210 is loaded with silicon wafers to be coated, so as to determine whether the loading basket 20 is loaded or unloaded. When the first detector 220 detects the loading basket 20, the second detector 230 performs detection. When the second detector 230 detects the silicon wafers to be coated, the loading and unloading mechanism 100 is automatically set to the production mode. When the silicon wafers to be coated are not detected, the loading and unloading mechanism 100 is automatically set to the running frame mode. Therefore, the above-mentioned automatic loading and unloading device 10 for silicon wafers can realize the automatic switching between the production mode and the running frame mode, reduce the workload of the production personnel, reduce the labor cost, reduce the time of manual mode switching, avoid the loss caused by the mode switching in time, and ensure normal production. In addition, it can effectively reduce the occurrence of loading stacking, prevent the coated silicon wafers from flowing back to the loading area, improve the battery production yield, and reduce the production cost.

[0045] like Figures 2 to 4As shown, in one example, the loading detection mechanism 200 further includes a mounting base 240 and a rotating arm 250. The rotating arm 250 is rotatably connected to the mounting base 240, and the second detector 230 is disposed on the rotating arm 250. When the first detector 220 detects the loading basket 20 on the first conveying member, the rotating arm 250 rotates to drive the second detector 230 to approach the second conveying member 210 for detection, and drives the second detector 230 to retract after the second detector 230 completes the detection. More specifically, the rotating arm 250 includes a first connecting rod 251, a second connecting rod 252, a first rotating shaft 253, and a second rotating shaft 254. The first connecting rod 251 is rotatably connected to the mounting base 240 through the first rotating shaft 253. The second connecting rod 252 is rotatably connected to the first connecting rod 251 through the second rotating shaft 254. The second detector 230 is disposed on the second connecting rod 252. In this example, when the second detector 230 is not detecting, it can be folded and retracted through the rotating arm 250, reducing energy consumption, avoiding mismeasurement, and reducing unnecessary losses.

[0046] In one example, the first detector 220 is a motion sensor.

[0047] In one example, the first conveying member includes a conveyor belt. The first detector 220 can be disposed, for example, above the conveyor belt. When the first conveying member drives the loading basket 20 to pass by the first detector 220, it can be detected by the first detector 220.

[0048] As Figure 2 shown, in one example, the second conveying member 210 includes a support base 211 and a lifting frame 212. The lifting frame 212 is used to carry the loading basket 20. The lifting frame 212 is movably disposed on the support base 211 and can drive the loading basket 20 to rise or fall. Further, after the loading basket 20 is conveyed to the lifting frame 212 by the first conveying member, the lifting frame 212 drives the loading basket 20 to rise to a certain height, which can trigger the feeding handling member 110 to act. The feeding handling member 110 conveys the wafers to be coated on the loading basket 20 to the loading feeding member 130 one by one.

[0049] In one example, the feeding handling member 110 includes a robotic arm. The robotic arm can pick up the wafers to be coated by adsorption or other means, for example.

[0050] As Figure 5 shown, in one example, the loading feeding member 130 includes a carrier plate 131. Further, the carrier plate 131 has a plurality of hollow loading areas 1312 for placing wafers. The hollow loading areas 1312 can enable both sides of the wafers to be coated.

[0051] In one example, the second detector 230 is an infrared sensor. The infrared sensor features high sensitivity, can quickly monitor the situation of the silicon wafer, and has a low misjudgment rate.

[0052] The infrared sensor can determine whether the loading basket 20 is loaded with silicon wafers to be coated by detecting the propagation distance when the detection signal is reflected. As Figure 6 shown, the infrared sensor sends a detection signal to the loading basket 20. After a distance L, the reflected signal is received by the receiver 312. At this time, the detection signal is reflected at the loading basket 20, indicating that there are no silicon wafers to be coated in the loading basket 20. At this time, the receiver 312 converts the received signal into an electrical signal and inputs it into the single-chip microcomputer for processing. The single-chip microcomputer decodes the serial data of the signal and sends a signal to the control system. Then, the control system completes the switching of the running frame mode.

[0053] As Figure 7 shown, the infrared sensor sends a detection signal to the loading basket 20. After a distance S, the reflected signal is received by the receiver 312. At this time, the detection signal is reflected at the silicon wafers to be coated, indicating that the loading basket 20 is loaded with silicon wafers to be coated. Then, the control system completes the switching of the production mode.

[0054] In one example, the blanking handling component 120 includes a robotic arm. The robotic arm can pick up the coated silicon wafers by adsorption or other means.

[0055] As Figure 8 shown, in one example, the automatic wafer loading and unloading device 10 further includes a blanking detection mechanism 300. The blanking detection mechanism 300 is disposed, for example, at the discharge port of the cooling chamber 30 of the coating device. The blanking detection mechanism 300 includes a third detector 310. The third detector 310 is used to detect whether the loading and feeding component 130 is loaded with coated silicon wafers. When the third detector 310 detects that the loading and feeding component 130 is loaded with coated silicon wafers, the loading and unloading mechanism 100 is set to the production mode. When the third detector 310 does not detect that the loading and feeding component 130 is loaded with coated silicon wafers, the loading and unloading mechanism 100 is set to the running frame mode.

[0056] In one example, the third detector 310 is an infrared sensor. The third detector 310 includes a transmitter 311 and a receiver 312 that are oppositely arranged. The infrared sensor features high sensitivity, can quickly monitor the situation of the silicon wafer, and has a low misjudgment rate.

[0057] The infrared sensor can determine whether there are coated silicon wafers loaded on the loading and feeding component 130 by detecting the strength of the reflected signal. When there are coated silicon wafers loaded on the loading and feeding component 130, the detection signal sent by the transmitter 311 is reflected by the coated silicon wafer, and the receiver 312 receives a weak signal. At this time, the receiver 312 converts the received signal into an electrical signal and inputs it into the single-chip microcomputer for processing. The single-chip microcomputer decodes the serial data of the signal and sends a signal to the control system, and then the control system completes the switching of the production mode.

[0058] When the loading and feeding component 130 is not loaded with coated silicon wafers, the receiver 312 will receive a strong but intermittent signal due to the blocking of the signal during the movement of the loading and feeding component 130, and then the control system completes the switching of the running frame mode.

[0059] Furthermore, the utility model provides a solar cell production device.

[0060] A solar cell production device according to an embodiment includes a coating device and any of the above-mentioned automatic silicon wafer loading and unloading devices 10. The coating device is used to coat the silicon wafers to be coated on the loading and feeding component 130 to obtain coated silicon wafers.

[0061] The above-mentioned silicon wafer automatic loading and unloading device 10 and solar cell production equipment have the following technical advantages:

[0062] (1) Automatic switching between production mode and running mode can be realized to reduce the workload of production personnel, reduce labor costs, reduce the time wasted on manual mode switching, avoid losses caused by insufficient mode switching, and ensure normal production.

[0063] (2) Effectively reduce the occurrence of stacking during loading and prevent the coated silicon wafers from flowing back to the loading area, thereby improving the battery production yield and reducing production costs.

[0064] (3) The automatic mode switching does not interfere with the host coating process and does not affect the original process.

[0065] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several variations and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. An automatic wafer loading and unloading device (10), characterized in that, It includes a loading and unloading mechanism (100) and a loading detection mechanism (200); The loading and unloading mechanism (100) includes a loading handling component (110), an unloading handling component (120), and a loading and feeding component (130); in the production mode, the loading handling component (110) is used to load the silicon wafers to be coated onto the loading and feeding component (130), and the unloading handling component (120) unloads the coated silicon wafers on the loading and feeding component (130); in the frame running mode, the loading handling component (110) and the unloading handling component (120) stop loading and unloading; The loading detection mechanism (200) includes a first conveying component, a second conveying component (210), a first detector (220), and a second detector (230); the first conveying component is used to convey the loading basket (20) to the second conveying component (210), the second conveying component (210) is used to drive the loading basket (20) to approach the loading handling component (110), the first detector (220) is used to detect the loading basket (20) on the first conveying component, and the second detector (230) is used to detect whether there are silicon wafers to be coated in the loading basket (20) on the second conveying component (210). When the first detector (220) detects the loading basket (20), the second detector (230) conducts detection. When the second detector (230) detects that there are silicon wafers to be coated in the loading basket (20), the loading and unloading mechanism (100) is set to the production mode; when the second detector (230) does not detect that there are silicon wafers to be coated in the loading basket (20), the loading and unloading mechanism (100) is set to the frame running mode.

2. The automatic wafer loading and unloading device (10) according to claim 1, characterized in that, The loading detection mechanism (200) further includes a mounting seat (240) and a rotating arm (250). The rotating arm (250) is rotatably connected to the mounting seat (240), and the second detector (230) is arranged on the rotating arm (250). When the first detector (220) detects the loading basket (20) on the first conveying component, the rotating arm (250) rotates to drive the second detector (230) to approach the second conveying component (210) for detection, and drives the second detector (230) to retract after the second detector (230) finishes detection.

3. The automatic wafer loading and unloading device (10) according to claim 1, characterized in that, The automatic silicon wafer loading and unloading device (10) further includes an unloading detection mechanism (300). The unloading detection mechanism (300) includes a third detector (310), and the third detector (310) is used to detect whether there are coated silicon wafers on the loading and feeding component (130); when the third detector (310) detects that there are coated silicon wafers on the loading and feeding component (130), the loading and unloading mechanism (100) is set to the production mode; when the third detector (310) does not detect that there are coated silicon wafers on the loading and feeding component (130), the loading and unloading mechanism (100) is set to the frame running mode.

4. The automatic wafer loading and unloading device (10) according to claim 3, characterized in that, The second detector (230) and / or the third detector (310) is an infrared sensor.

5. The automatic wafer loading and unloading device (10) according to any one of claims 1 to 4, characterized in that, The first conveying member includes a conveyor belt.

6. The automatic wafer loading and unloading device (10) according to any one of claims 1 to 4, characterized in that, The second conveying member (210) includes a support base (211) and a lifting frame (212). The lifting frame (212) is used to carry the loading basket (20). The lifting frame (212) is movably arranged on the support base (211) and can drive the loading basket (20) to rise or fall.

7. The automatic wafer loading and unloading device (10) according to any one of claims 1 to 4, characterized in that, The first detector (220) is a motion sensor.

8. The automatic wafer loading and unloading device (10) according to any one of claims 1 to 4, characterized in that, The loading handling member (110) and / or the unloading handling member (120) includes a robotic arm.

9. The automatic wafer loading and unloading device (10) according to any one of claims 1 to 4, characterized in that, The loading and feeding member (130) includes a carrier plate (131). The carrier plate (131) has a plurality of hollow loading areas (1312).

10. A solar cell production device, characterized in that, It includes a coating device and the silicon wafer automatic loading and unloading device (10) according to any one of claims 1 to 9. The coating device is used to coat the silicon wafer to be coated on the loading and feeding member (130) to obtain a coated silicon wafer.

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