Component stripping equipment

Abstract

The utility model relates to element stripping equipment which comprises a machine table and a stripping device. The stripping device is arranged on the machine table, can move relative to the machine table, and comprises a laser module, a mounting seat and an optical module. The laser module is used for generating laser. The optical module is connected with the mounting seat and comprises a plurality of micro lenses. The adjusting mechanism is used for moving the optical module. The laser passes through the mounting base and the plurality of micro lenses of the optical module to generate a plurality of stripping light beams.

Description

Technical Field

[0001] The utility model relates to a production device of light-emitting elements, in particular to an element peeling device. Background Art

[0002] The light-emitting wafers, light-emitting elements or light-emitting layers located on a wafer can be peeled off by laser technology, thin-film transfer technology or other technologies. Among them, the laser peeling technology is to penetrate the carrier plate of the wafer with a laser so that the energy of the laser acts uniformly between the carrier plate and the light-emitting wafer to separate the carrier plate and the light-emitting wafer.

[0003] At present, the laser peeling technology can be divided into complete peeling or partial (selective) peeling. Complete peeling is to peel off all the light-emitting wafers on the wafer. This method cannot readjust the spacing of the light-emitting wafers and requires a laser module with a higher wattage. Therefore, the equipment cost is relatively high. Partial peeling is to allow the laser to pass through a mask pattern design to project onto the selected light-emitting wafer position, or to use a scanning laser peeling device to peel off the selected light-emitting wafer. Although this method can readjust the spacing of the light-emitting wafers and selectively peel off the light-emitting wafers, it requires a corresponding mask and also requires a relatively large wattage laser module, which will increase the equipment cost. Moreover, currently, whether through a mask or scanning, only single-piece peeling can be performed, and it takes a long time for large-scale peeling. Summary of the Utility Model

[0004] In view of the above-mentioned deficiencies, the element peeling device of the utility model can batch-selectively peel off light-emitting wafers, light-emitting elements or light-emitting layers from the wafer without using an expensive mask.

[0005] The element peeling device of the utility model includes a machine platform and a peeling device. The peeling device is arranged on the machine platform and can move relative to the machine platform, and includes a laser module, a mounting seat and an optical module. The laser module is used to generate a laser. The optical module is connected to the mounting seat and includes a plurality of microlenses. Among them, the laser passes through the mounting seat and the plurality of microlenses of the optical module to generate a plurality of peeling beams.

[0006] In this way, the element peeling device of the utility model can batch-peel off a plurality of light-emitting elements from the wafer through a plurality of peeling beams to select or batch-peel off the light-emitting elements. Description of the Drawings

[0007] Figure 1 is a schematic diagram of the composition of an embodiment of the element peeling device of the utility model;

[0008] Figure 2 is a continuation Figure 1 of the schematic diagram of the peeling device and the transfer device moving downward;

[0009] Figure 3 is a schematic diagram showing the downward movement of the peeling device and the conveying device that continues; Figure 2 of the peeling device and the conveying device;

[0010] Figure 4 is a schematic diagram showing the rightward movement of the peeling device and the conveying device that continues; Figure 3 of the peeling device and the conveying device;

[0011] Figure 5 is a schematic diagram showing the downward movement of the peeling device and the conveying device that continues; Figure 4 of the peeling device and the conveying device;

[0012] Figure 6 is a schematic diagram showing the upward movement of the peeling device and the conveying device that continues; Figure 5 of the peeling device and the conveying device.

[0013] Among them, reference numerals:

[0014] 100: Component peeling equipment;

[0015] 10: Machine platform;

[0016] 30: Peeling device;

[0017] 31: Laser module;

[0018] 311: Laser;

[0019] 33: Body;

[0020] 35: Adjusting mechanism;

[0021] 351: Motor;

[0022] 37: Optical module;

[0023] 371: Microlens;

[0024] 373: Peeling beam;

[0025] 50: Conveying device;

[0026] 70: Carrier board;

[0027] 90: Incoming product;

[0028] 91: Support layer;

[0029] 93: Light-emitting element. Detailed implementation manners

[0030] Such as Figure 1 and 2As shown in the figure, the component peeling device 100 of the present utility model includes a machine platform 10, a peeling device 30 and a handling device 50. The machine platform 10 is used to carry a carrier plate 70. In this embodiment, the carrier plate 70 is a hard or soft temporary carrier plate (carry), and its material is, for example, a polymer material (Polydimethylsiloxane, PDMS) with viscosity to fix the light-emitting components.

[0031] The peeling device 30 is disposed on the machine platform 10 and can move relative to the machine platform 10. It includes a laser module 31, a mounting base and an optical module 37. The movement of the peeling device 30 can be achieved through a single-axis or multi-axis movement mechanism such as a gantry or a robotic arm.

[0032] The laser module 31 is used to generate a laser 311. Among them, Figure 1 in the laser module 31, it is not necessary to generate the laser 311. Therefore, the laser is only shown in Figure 2 this figure. In this embodiment, the laser is a flat-top beam. The flat-top beam has a flat-top distribution with steep edges. The flat-top distribution range forms light energy with substantially the same energy density, and the range can be in patterns such as rectangular, circular, or linear.

[0033] In this embodiment, the mounting base includes a body 33 and an adjustment mechanism 35. The adjustment mechanism 35 is connected to the body 33. The optical module 37 is connected to the adjustment mechanism 35 and includes a plurality of microlenses 371. The adjustment mechanism 35 is used to move the position of the optical module 37 so that the optical module 37 is displaced relative to the body 33. The laser 311 passes through the body 33 and the plurality of microlenses 371 of the optical module 37 to generate a plurality of peeling beams 373.

[0034] The adjustment mechanism 35 includes two motors 351 and is used to drive the optical module 37 along the extension direction of the movement axis. The two motors 351 are located at opposite positions of the movement axis (for example, at both ends of the movement axis respectively). The movement axis is, for example, the X-axis or Y-axis of a two-dimensional plane. The two motors 351 can translate the optical module 37 along the extension direction of the movement axis to move the optical module 37. Thereby, when the optical module 37 moves from its original position to a new position, the projection position of the peeling beam 373 will also shift. In other embodiments, the mounting base may not have an adjustment mechanism, that is, the optical module is fixed on the mounting base and cannot move relative to the mounting base.

[0035] The handling device 50 is connected to the machine tool 10, can move relative to the machine tool 10, and is used to handle a supplied product 90. The handling device 50 can handle the supplied product 90 through a single-axis or multi-axis moving mechanism such as a gantry or a robotic arm. The supplied product 90 is, for example, a wafer or a light-emitting element adhered to an epitaxial substrate through a film. The material of the epitaxial substrate is, for example, sapphire (Sapphire) to allow laser light to penetrate. The supplied product 90 includes a support layer 91 and a plurality of light-emitting elements 93 connected to the support layer 91. The light-emitting elements 93 are, for example, an epitaxial layer or a light-emitting diode element (LED). The epitaxial layer is, for example, gallium nitride (GaN), and its basic structure is composed of an active layer, a P-type semiconductor cladding layer, and an N-type semiconductor cladding layer. In other embodiments, the handling device 50 can be a device independent of the machine tool 10. Therefore, the component peeling device 100 is not limited to having the handling device 50.

[0036] Subsequently, the operation of the component peeling device 100 of the present invention will be described. As Figure 1 shown, the handling device 50 of the component peeling device 100 transports the supplied product 90 above the carrier plate 70. Then, as Figure 2 shown, the light-emitting element 93 of the supplied product 90 contacts the carrier plate 70. Then, the laser module 31 projects a laser beam 311 so that the microlens 371 of the optical module 37 correspondingly focuses into a plurality of peeling beams 373. The peeling beam 373 acts between the support layer 91 and the light-emitting element 93 of the supplied product 90. The peeling beam 373 does not irradiate the entire support layer 91 but irradiates the selected light-emitting element 93. Therefore, the laser energy of the laser module 31 can be a laser module generated with a relatively lower energy compared to the current complete peeling technology to reduce the cost of the laser module. Furthermore, the microlens 371 can effectively concentrate the energy of the laser beam 311 to reduce the loss of the energy of the laser beam 311.

[0037] Subsequently, as Figure 3 shown, the peeling device 30 and the handling device 50 are lifted upward so that the light-emitting element 93 after being acted on by the peeling beam 373 remains on the carrier plate 70, while the other light-emitting elements 93 not irradiated by the peeling beam 373 remain on the support layer 91 of the supplied product 90. Then, as Figure 4 shown, the peeling device 30 and the handling device 50 can move to another area of the carrier plate 70, and the motor 351 of the adjustment mechanism 35 translates the optical module 37 to make the microlens 371 correspond to the unpeeled light-emitting element 93. Then, as Figure 5As shown, the peeling device 30 and the handling device 50 again bring the light-emitting element 93 of the incoming product 90 into contact with the carrier plate 70, and the laser module 31 projects the laser 311 again to generate a peeling beam 373 to separate the light-emitting element 93 from the support layer 91. Finally, as Figure 6 shown, the peeling device 30 and the handling device 50 are lifted upward, and the light-emitting element 93 is fixed on the carrier plate 70.

[0038] In this way, the element peeling device 100 of the present utility model can batch peel a plurality of light-emitting elements 93 according to the rearrangement requirements of the light-emitting elements 93, for example, according to the pixel arrangement positions, and arrange them on the carrier plate 70 to improve the time consumed by the current single-light-emitting-element peeling method. In this embodiment, the light-emitting element 93 of the incoming product 90 is peeled while in contact with the carrier plate 70, but in other embodiments, the light-emitting element 93 of the incoming product 90 can also be peeled without contacting the carrier plate 70.

[0039] In addition, when different arrangements of the light-emitting elements 93 are required, other optical modules corresponding to the arrangement of the microlenses can be selected. In this way, the element peeling device of the present utility model does not require a photomask, and can further improve the problem of laser energy loss, thereby reducing the cost of the overall device.

Claims

1. A component peeling device, characterized in that, Comprising: A machine platform; And A peeling device, disposed on the machine platform and movable relative to the machine platform, and comprising a laser module, a mounting base and an optical module, wherein the laser module is used to generate a laser, the optical module is connected to the mounting base and comprises a plurality of microlenses, and wherein the laser passes through the mounting base and the plurality of microlenses of the optical module to generate a plurality of peeling beams.

2. The element peeling device according to claim 1, wherein The mounting base comprises a body and an adjustment mechanism, the adjustment mechanism being connected to the body and the optical module and used to move the optical module.

3. The element peeling device according to claim 2, wherein The adjustment mechanism comprises a motor, connected to the optical module and used to drive the optical module along the extending direction of a movement axis.

4. The element peeling device according to claim 3, wherein, The adjustment mechanism comprises another motor, connected to the optical module and used to drive the optical module along the extending direction of the movement axis, the motor and the another motor being located at opposite positions of the movement axis.

5. The element peeling device according to claim 1, characterized in that, The laser of the laser module is a flat-top beam.

6. The element peeling device according to claim 1, wherein It further comprises a handling device, connected to the machine platform and used to handle a supplied product, the supplied product comprising a support layer and a plurality of light-emitting elements connected to the support layer, and the plurality of peeling beams acting between the support layer and the plurality of light-emitting elements.

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