Heat dissipation triode
The design of a three-terminal device with curved sections and a heat sink grooves addresses heat dissipation inefficiencies, providing stable contact and cost-effective assembly.
Patent Information
- Application Number
- CN202422313924.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The existing transistors have poor heat dissipation effect, and the traditional screw connection method increases costs and is unstable, resulting in the problem of lifting and separation.
The arched part and chute structure of the substrate and the heat dissipation plate are adopted, and the counterhole and chute are snapped into the counterhole and the chute design through the bumps, ensuring the stable connection between the substrate and the heat dissipation plate, increasing the contact area and uniform stress, and simplifying the disassembly and assembly process.
It realizes efficient heat dissipation, reduces manufacturing costs, simplifies assembly processes, and improves connection stability and heat dissipation effect.
Smart Images
Figure CN223108885U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of triode structures, and particularly relates to a heat dissipation triode. Background Art
[0002] A triode is a commonly used electronic component for amplifying current or signals, mainly applied to signal amplifiers and electronic switches, etc. When a triode is in use, it will generate a large amount of heat. Only relying on the plastic package of the triode itself for heat dissipation, the heat dissipation effect is relatively poor. If the heat of the triode cannot be released, it is extremely easy to burn out the triode. In the prior art, the heat dissipation effect of the triode is improved by exposing the substrate of the triode outside the package and connecting a heat dissipation plate to the exposed substrate with screws. However, such a structural design not only increases the cost due to the use of screws, but also increases the assembly process. And because the substrate of the triode is usually made of copper material, after being locked by screws, the unfastened parts are prone to warp, resulting in the separation of the substrate from the surface of the heat dissipation plate and failing to achieve the expected heat dissipation effect. Summary of the Utility Model
[0003] To solve the deficiencies of the prior art, the utility model provides a heat dissipation triode, which has a simple overall structure, a good heat dissipation structure, can effectively reduce the manufacturing cost, and simplifies the assembly process.
[0004] To achieve the purpose of the utility model, the following scheme is proposed:
[0005] A heat dissipation triode includes a substrate and a heat dissipation plate. Pins are provided at the front end of the substrate. At the front end of the top surface of the substrate, there is a rectangular package body for encapsulating the rear ends of the pins and a chip disposed on the top surface of the substrate.
[0006] On both sides of the substrate, arched portions are formed towards the top surface, and at least two groups of arched portions are provided along the front-rear connection direction of the substrate. The arched portions are all located outside the package body. A convex point is formed at the rear end of the substrate towards the bottom surface direction.
[0007] On both sides of the top surface of the heat dissipation plate, chutes are provided along the length direction. The height of the chutes is less than the distance between the top surface of the arched portion and the bottom surface of the substrate. The top surface of the heat dissipation plate has counterbores.
[0008] When the convex point is clamped inside the counterbore, the top surface of the heat dissipation plate contacts the bottom surface of the substrate. The two side edges of the substrate respectively pass through the two chutes, and the top surface of the arched portion abuts against the side wall of the chute.
[0009] The beneficial effects of the utility model are as follows:
[0010] (1) The arch-shaped part is used to press the substrate against the heat sink, which can also prevent the bumps from separating from the counterbores, ensuring the connection stability between the substrate and the heat sink, avoiding the use of screw connections, thus reducing costs. When disassembling and assembling, it is only necessary to relatively move the substrate or the heat sink 2 along the length direction, and the disassembly and assembly method is simpler.
[0011] (2) The purpose of arranging at least two groups of the arch-shaped parts along the connection line direction of the front and rear ends of the substrate is to make the force on each part of the substrate more balanced, avoid local warping of the substrate, and thus improve the fitting degree between the substrate and the heat sink.
[0012] (3) The solution also extends the substrate to both sides and the rear of the package body, increasing the contact area between the substrate and the heat sink, thereby improving the heat dissipation effect of the triode. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The drawings described herein are only for illustrating the selected embodiments, not all possible implementation schemes, and are not intended to limit the scope of the present utility model.
[0014] Figure 1 The top view structure diagram of the substrate and the heat sink of the present application is shown.
[0015] Figure 2 The overall structure diagram of the heat dissipation triode of the present application is shown.
[0016] Reference numerals in the drawings: substrate - 1, package body - 11, arch-shaped part - 12, bump - 13, rib - 14, through hole - 15, heat sink - 2, sliding groove - 21, counterbore - 22, heat sink fin - 23. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following describes the embodiments of the present utility model in detail with reference to the drawings. However, the embodiments described herein are only a part of the embodiments of the present utility model, not all of the embodiments.
[0018] As Figure 1 shown, a heat dissipation triode includes a substrate 1 and a heat sink 2. The front end of the substrate 1 is provided with pins. The front end of the top surface of the substrate 1 is provided with a package body 11 having a rectangular structure, so that the bottom surface of the substrate 1 is exposed outside the package body 11, and the rear end of the substrate 1 is exposed outside the package body 11. The package body 11 is used to package the rear end of the pins and the chip disposed on the top surface of the substrate 1.
[0019] Both sides of the substrate 1 are formed with arch-shaped parts 12 towards the top surface, and at least two groups of arch-shaped parts 12 are arranged along the connection line direction of the front and rear ends of the substrate 1. The arch-shaped parts 12 are all located outside the package body 11; the rear end of the substrate 1 is formed with bumps 13 towards the bottom surface. The arch-shaped parts 12 and the bumps 13 are integrally formed by stamping with the substrate 1.
[0020] On both sides of the top surface of the heat dissipation plate 2 along the length direction, there are sliding grooves 21, the height of the sliding grooves 21 is less than the distance between the top surface of the arched portion 12 and the bottom surface of the substrate 1, and the top surface of the heat dissipation plate 2 has counterbores 22.
[0021] As shown in Figure 1 Figure 2 As shown, when the bump 13 is clamped inside the counterbore 22, the top surface of the heat dissipation plate 2 contacts the bottom surface of the substrate 1, both sides of the substrate 1 respectively pass through the two sliding grooves 21, and the top surface of the arched portion 12 abuts against the side walls of the sliding grooves 21, so as to press the bottom surface of the substrate 1 against the top surface of the heat dissipation plate 2, so that a good contact state is maintained between the two, to ensure the effect of heat conduction, thereby improving the heat dissipation effect. Using the arched portion 12 to press the substrate 1 against the heat dissipation plate 2 can also prevent the bump 13 from separating from the counterbore 22, ensuring the connection stability between the substrate 1 and the heat dissipation plate 2. The purpose of arranging at least two groups of the arched portions 12 along the front-back end connection line direction of the substrate 1 is to make the force on each part of the substrate 1 more balanced, avoid local warping of the substrate 1, and thus improve the fitting degree between the substrate 1 and the heat dissipation plate 2. This solution also makes the substrate 1 extend to both sides and the rear of the package 11, increasing the contact area between the substrate 1 and the heat dissipation plate 2, thereby improving the heat dissipation effect of the triode. During disassembly and assembly, it is only necessary to move the substrate 1 or the heat dissipation plate 2 relative to each other along the length direction, and the disassembly and assembly method is simpler.
[0022] Preferably, as Figure 1 、 Figure 2 shown, a plurality of heat dissipation fins 23 are arranged at intervals on the back surface of the heat dissipation plate 2. The heat dissipation fins 23 are integrally formed with the heat dissipation plate 2 and the sliding grooves 21, and are all made of aluminum.
[0023] Preferably, as Figure 1 、 Figure 2 shown, a rib 14 is integrally formed on the front top surface of the substrate 1. There is a gap between the middle of the rib 14 and the top surface of the substrate 1. When the substrate 1 integrally forms the rib 14, a through hole 15 is formed below the rib 14. The rib 14 is located inside the package 11, and the through hole 15 is filled with materials for forming the package 11. By this design, embedding the rib 14 inside the package 11 can effectively improve the connection stability between the package 11 and the substrate 1 and prevent the package 11 from falling off.
[0024] Preferably, the length of the heat dissipation plate 2 is greater than the length of the substrate 1, so that the heat dissipation plate 2 can completely cover the bottom surface of the substrate 1 to increase the heat dissipation contact surface.
[0025] The foregoing are only the preferred embodiments of the present utility model and do not represent that they are the only ones or limit the present utility model. Those skilled in the art should understand that various changes or equivalent substitutions made to the present utility model without departing from the scope of the present utility model all fall within the scope of protection of the present utility model.
Claims
1. A heat dissipation triode, characterized in that, It includes a substrate (1) and a heat dissipation plate (2). The front end of the substrate (1) is provided with pins. The front end of the top surface of the substrate (1) is provided with a package body (11) in a rectangular structure. The package body (11) is used for encapsulating the rear end of the pins and the chip arranged on the top surface of the substrate (1). On both sides of the substrate (1), arched parts (12) are formed towards the top surface, and at least two groups of arched parts (12) are arranged along the connection direction of the front and rear ends of the substrate (1). The arched parts (12) are all located outside the package body (11). A bump (13) is formed at the rear end of the substrate (1) towards the bottom surface direction. On both sides of the top surface of the heat dissipation plate (2), chutes (21) are arranged along the length direction. The height of the chutes (21) is less than the distance between the top surface of the arched part (12) and the bottom surface of the substrate (1). The top surface of the heat dissipation plate (2) has a counterbore (22). When the bump (13) is clamped inside the counterbore (22), the top surface of the heat dissipation plate (2) contacts the bottom surface of the substrate (1). The two side edges of the substrate (1) respectively penetrate into the two chutes (21), and the top surface of the arched part (12) abuts against the side wall of the chute (21).
2. The heat dissipation triode according to claim 1, wherein Both the arched part (12) and the bump (13) are integrally formed by stamping with the substrate (1).
3. The heat dissipation triode according to claim 1, characterized in that, On the back surface of the heat dissipation plate (2), a plurality of heat dissipation fins (23) are arranged at intervals. The heat dissipation fins (23) are integrally formed with the heat dissipation plate (2) and the chutes (21).
4. A heat dissipation triode according to claim 1, characterized in that, On the front end top surface of the substrate (1), a rib (14) is integrally formed. There is a gap between the middle of the rib (14) and the top surface of the substrate (1). When the substrate (1) integrally forms the rib (14), a through hole (15) is formed below the rib (14). The rib (14) is located inside the package body (11), and the through hole (15) is filled with materials for forming the package body (11).
5. The heat dissipation triode according to claim 1, wherein The length of the heat dissipation plate (2) is greater than the length of the substrate (1).