Heat dissipation equipment for power equipment

Abstract

The utility model discloses heat dissipation equipment for power equipment, which comprises a heat exchange pipe and a circulating pipe, the heat exchange pipe and the circulating pipe are both square pipelines, the heat exchange pipe and the circulating pipe are arranged in parallel, the circulating pipe is formed by combining two sections of independent and separated pipelines, and the two sections of independent and separated pipelines are arranged in parallel. A circulating pump is arranged between the two sections of independent and separated pipelines of the circulating pipe, and the water inlet end and the water outlet end of the circulating pump are respectively communicated and connected with the two sections of independent and separated pipelines of the circulating pipe. Through the arrangement of the heat exchange pipe, the circulating pipe and the cooling bin, under the action of the circulating pump, cooling liquid can be continuously cooled by the semiconductor cooling fins in the circulating flowing process, meanwhile, a plurality of adjacent water dispersing bins and water collecting bins can be connected in a penetrating mode, and the cooling efficiency is improved. And the action area of the device can be changed by increasing or reducing the number of equipment under the condition that only one circulating pump exists, and the application range of the device in the heat dissipation field is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation equipment for power equipment. Background Technique

[0002] During the operation of power equipment, due to the consumption of electric energy to do work, the equipment will generate a certain amount of heat. High temperature will increase the operating load of the equipment. When the internal temperature of the equipment is relatively high, it is easy to catch fire, posing certain potential safety hazards. Chinese Patent (Publication No.: CN116783703A) discloses a radiator for power equipment, including a cooling plate provided with a water inlet and a water outlet, and a water tank is provided. The water tank is formed in a plate shape inside the cooling plate and forms a cooling water flow path connected to the water inlet and the water outlet. A plurality of collision column parts connected to the top surface and the bottom surface are formed in the water tank. The cooling plate is composed of a first plate and a second plate arranged at a specified interval. A ventilation layer is provided between the first plate and the second plate. Branch pipes branching to the first plate and the second plate are respectively provided behind the water inlet and the water outlet. Any one of the upper part and the lower part of the first water tank of the first plate arranged on the upper part of the cooling plate is formed thinner than the other. Any one of the upper part and the lower part of the second water tank of the second plate arranged on the lower part of the cooling plate is formed thinner than the other. A partition wall part for separating the cooling water flow path into a water inlet side flow path and a water outlet side flow path is formed in the water tank.

[0003] However, there are some drawbacks in the existing radiators for power equipment when in use, such as:

[0004] Most of the existing heat dissipation of power equipment adopts the water-cooling heat dissipation method. However, since water-cooling requires a closed water flow pipeline, traditional water-cooling equipment needs to be customized according to the volume of the equipment to be cooled. This also makes the traditional water-cooling radiator can only be used for specific power equipment, with a small application range and unable to increase or decrease the heat dissipation area as needed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a heat dissipation equipment for power equipment to solve the problem that most of the existing heat dissipation of power equipment adopts the water-cooling heat dissipation method. However, since water-cooling requires a closed water flow pipeline, traditional water-cooling equipment needs to be customized according to the volume of the equipment to be cooled. This also makes the traditional water-cooling radiator can only be used for specific power equipment, with a small application range and unable to increase or decrease the heat dissipation area as needed.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A heat dissipation device for a power device, comprising: a heat exchange pipe and a circulation pipe. Both the heat exchange pipe and the circulation pipe are square pipes. The heat exchange pipe and the circulation pipe are arranged parallel to each other. The circulation pipe is composed of two independent and separate pipes. A circulation pump is installed between the two independent and separate pipes of the circulation pipe. The water inlet end and the water outlet end of the circulation pump are respectively connected to the two independent and separate pipes of the circulation pipe in a through manner. The two ends of the heat exchange pipe and the circulation pipe are respectively connected to a cooling chamber in a through manner. The heat exchange pipe and the circulation pipe are connected through the cooling chambers at both ends. The circulation pump is used to drive the liquid to circulate in the heat exchange pipe, the cooling chamber and the circulation pipe. A semiconductor heat sink is fixedly installed on the outer wall of the cooling chamber. The refrigerating end of the semiconductor heat sink is attached to the cooling chamber. The semiconductor heat sink is used to cool the liquid flowing through the inside of the cooling chamber.

[0008] Furthermore, another side of the semiconductor heat sink is fixedly attached with a metal heat dissipation fin. The metal heat dissipation fin is attached to the heating end of the semiconductor heat sink. The metal heat dissipation fin is used to conduct the heat on the semiconductor heat sink. A heat dissipation fan is fixedly installed at the air inlet of one side of the metal heat dissipation fin. The heat dissipation fan is used to cool the metal heat dissipation fin by air cooling.

[0009] Furthermore, a water collecting chamber is connected between the water inlet end of the circulation pump and the circulation pipe in a through manner. A water dispersing chamber is connected between the water outlet end of the circulation pump and the circulation pipe in a through manner. Adjacent two water collecting chambers and adjacent two water dispersing chambers are connected through pipes in a through manner.

[0010] Furthermore, a heat preservation outer shell is sleeved outside the heat exchange pipe. The heat exchange pipe, the cooling chamber and the circulation pipe are all arranged inside the heat preservation outer shell. The semiconductor heat sink penetrates through the heat preservation outer shell. The circulation pump is fixedly installed on the outer surface of the heat preservation outer shell.

[0011] Furthermore, an installation plate is fixedly connected to the end of the heat preservation outer shell. The installation plate is provided with installation holes for installation. Magnets for adsorption and fixation are fixedly arranged on the installation plate.

[0012] Furthermore, a water collecting sealing cover is installed on the connecting hole on the side of the outermost water collecting chamber in a threaded manner. A water dispersing sealing cover is installed on the connecting hole on the side of the outermost water dispersing chamber in a threaded manner.

[0013] Compared with the prior art, the beneficial effects of the present utility model are:

[0014] The utility model is provided with a heat exchange pipe, a circulation pipe and a cooling bin. Under the action of a circulation pump, the cooling liquid can be continuously cooled by a semiconductor heat sink during the circulating flow. At the same time, a plurality of adjacent water distribution bins and water collection bins can be connected through, so that the number of devices can be increased or decreased to change the action area of the device with only one circulation pump, and the application range of the device in the heat dissipation field is improved. Brief Description of the Drawings

[0015] Figure 1 is a schematic perspective view of the combined structure of the product in an embodiment of the utility model;

[0016] Figure 2 For the utility model Figure 1 is a schematic perspective view of the main heat dissipation mechanism of the product in the embodiment, seen from the front;

[0017] Figure 3 For the utility model Figure 1 is a schematic perspective view of the main heat dissipation mechanism of the product in the embodiment, seen from the back;

[0018] Figure 4 For the utility model Figure 1 is a schematic perspective view of the auxiliary heat dissipation mechanism of the product in the embodiment.

[0019] Reference Signs:

[0020] 101, heat exchange pipe; 102, circulation pipe; 103, circulation pump; 104, semiconductor heat sink; 105, cooling bin; 201, metal heat dissipation fins; 202, heat dissipation fan; 301, water distribution bin; 302, water collection bin; 400, heat preservation housing; 501, mounting plate; 502, magnet; 601, water distribution sealing cover; 602, water collection sealing cover. Detailed Embodiment

[0021] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-4 , wherein, Figure 1 is a schematic perspective view of the combined structure of the product in an embodiment of the utility model; Figure 2 For the utility model Figure 1 is a schematic perspective view of the main heat dissipation mechanism of the product in the embodiment, seen from the front; Figure 3 For the utility model Figure 1Schematic rear three-dimensional structure diagram of the main heat dissipation mechanism of the product in the embodiment; Figure 4 This utility model Figure 1 Schematic three-dimensional structure diagram of the auxiliary heat dissipation mechanism of the product in the embodiment.

[0023] A heat dissipation device for power equipment, comprising: a heat exchange pipe 101 and a circulation pipe 102. Both the heat exchange pipe 101 and the circulation pipe 102 are square pipes. The heat exchange pipe 101 and the circulation pipe 102 are arranged parallel to each other. The circulation pipe 102 is composed of two independent and separated pipes. A circulation pump 103 is installed between the two independent and separated pipes of the circulation pipe 102. The water inlet end and the water outlet end of the circulation pump 103 are respectively connected through the two independent and separated pipes of the circulation pipe 102. The two ends of the heat exchange pipe 101 and the circulation pipe 102 are respectively and commonly connected through a cooling chamber 105. The heat exchange pipe 101 and the circulation pipe 102 are connected through the cooling chambers 105 at both ends. The circulation pump 103 is used to drive the liquid to circulate in the heat exchange pipe 101, the cooling chamber 105 and the circulation pipe 102. A semiconductor heat sink 104 is fixedly installed on the outer wall of the cooling chamber 105. The refrigerating end of the semiconductor heat sink 104 is attached to the cooling chamber 105. The semiconductor heat sink 104 is used to cool the liquid flowing through the inside of the cooling chamber 105;

[0024] Among them, the purpose of setting the heat exchange pipe 101 and the circulation pipe 102 as square pipes is to make the contact area between the pipes and the equipment to be cooled larger, which is more conducive to heat exchange and heat dissipation;

[0025] Among them, the heat exchange pipe 101, the circulation pipe 102 and the cooling chamber 105 are filled with a cooling liquid. This cooling liquid should preferably be a liquid with good heat exchange effect, such as automotive coolant;

[0026] By setting the heat exchange pipe 101, the circulation pipe 102 and the cooling chamber 105, under the action of the circulation pump 103, the cooling liquid can be continuously cooled by the semiconductor heat sink 104 during the circulation process. At the same time, multiple adjacent water-dispersing chambers 301 and water-collecting chambers 302 can be connected through, and it is possible to increase or decrease the number of devices to change the action area of the device with only one circulation pump 103, improving the applicable range of the device in the field of heat dissipation.

[0027] Further, another side of the semiconductor heat sink 104 is fixedly attached with a metal heat fin 201. The metal heat fin 201 is attached to the heating end of the semiconductor heat sink 104. The metal heat fin 201 is used to conduct the heat on the semiconductor heat sink 104. A cooling fan 202 is fixedly installed at the air inlet on one side of the metal heat fin 201. The cooling fan 202 is used to cool the metal heat fin 201 by air cooling;

[0028] Among them, the blowing direction of the cooling fan 202 needs to be set in a direction away from the water collecting chamber 302 or the water dispersing chamber 301. Since the relatively low-temperature coolant will flow inside the water collecting chamber 302 and the water dispersing chamber 301, if the cooling fan 202 blows the high-temperature air on the metal heat sink 201 towards the water collecting chamber 302 and the water dispersing chamber 301, it will increase the temperature of the coolant inside them, which is not conducive to the heat dissipation work.

[0029] Further, a water collecting chamber 302 is connected through and between the water inlet end of the circulation pump 103 and the circulation pipe 102, and a water dispersing chamber 301 is connected through and between the water outlet end of the circulation pump 103 and the circulation pipe 102. Adjacent two water collecting chambers 302 and adjacent two water dispersing chambers 301 are connected through pipes;

[0030] By connecting the adjacent water dispersing chambers 301 and water collecting chambers 302 of multiple such devices through, the circulation pump 103 can circulate the coolant inside all the connected circulation pipes 102 at the same time, which is convenient for the combined use of the equipment.

[0031] Further, a heat preservation housing 400 is sleeved outside the heat exchange pipe 101. The heat exchange pipe 101, the cooling chamber 105 and the circulation pipe 102 are all arranged inside the heat preservation housing 400. The semiconductor heat sink 104 penetrates through the heat preservation housing 400. The circulation pump 103 is fixedly installed on the outer surface of the heat preservation housing 400;

[0032] Among them, since relatively low-temperature coolant needs to flow inside the heat exchange pipe 101, the cooling chamber 105 and the circulation pipe 102, using the heat preservation housing 400 to carry out heat preservation protection on them can reduce the heat exchange between the low-temperature coolant and the outside world, and further ensure that the coolant only exchanges heat with the electrical equipment, improving the heat dissipation efficiency.

[0033] Further, an installation plate 501 is fixedly connected to the end of the heat preservation housing 400. The installation plate 501 is provided with installation holes for installation, and a magnet 502 for adsorption and fixation is fixedly arranged on the installation plate 501;

[0034] Among them, when there are suitable mounting holes on the power equipment, the device can be mounted on the power equipment using bolts. If there are no mounting conditions on the power equipment, the device can also be adsorbed on the power equipment using the magnet 502, which facilitates the installation of the device.

[0035] Furthermore, a water collection sealing cover 602 is threadedly mounted on the communication hole on the side of the outermost water collection chamber 302, and a water dispersion sealing cover 601 is threadedly mounted on the communication hole on the side of the outermost water dispersion chamber 301.

[0036] Among them, since there is no connection point between the outermost water collection chamber 302 and the water dispersion chamber 301, in order to prevent coolant leakage, the sealing cover can be used to block it.

[0037] To sum up, for a heat dissipation device for power equipment provided by the present utility model, during operation, an appropriate number of the devices are selected for assembly according to the area that needs to be dissipated. During assembly, adjacent water collection chambers 302 and adjacent water dispersion chambers 301 are connected through pipes. The unconnected interfaces on the outermost water collection chamber 302 and the water dispersion chamber 301 are blocked by the water collection sealing cover 602 and the water dispersion sealing cover 601 respectively. Then, the circulation pump 103, the semiconductor heat sink 104, and the radiator fan 202 are simultaneously started to work. During this process, the temperature on one side of the semiconductor heat sink 104 decreases while the temperature on the other side increases. At the same time, the semiconductor heat sink 104 cools the liquid passing through the inside of the cooling chamber 105 and transfers the temperature to the metal heat dissipation fins 201. Then, the radiator fan 202 blows the temperature on the metal heat dissipation fins 201 into the external air. The coolant cooled by the semiconductor heat sink 104 circulates through the heat exchange pipe 101, the cooling chamber 105, and the circulation pipe 102. Since these three are all in contact with the power equipment, the heat generated inside the power equipment will be taken away by the coolant and transferred to the outside by the semiconductor heat sink 104, thereby achieving the heat dissipation and cooling effect on the power equipment.

[0038] By providing the heat exchange pipe 101, the circulation pipe 102, and the cooling chamber 105, under the action of the circulation pump 103, the cooling liquid can be continuously cooled by the semiconductor heat sink 104 during the circulating flow. At the same time, multiple adjacent water dispersion chambers 301 and water collection chambers 302 can be connected through pipes, enabling the number of devices to be increased or decreased to change the working area of the device with only one circulation pump 103, thereby improving the applicable range of the device in the field of heat dissipation.

[0039] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for a power device, comprising: Heat exchange pipe (101) and circulation pipe (102), characterized in that both the heat exchange pipe (101) and the circulation pipe (102) are square pipes, the heat exchange pipe (101) and the circulation pipe (102) are arranged parallel to each other, the circulation pipe (102) is composed of two independent and separate pipes, a circulation pump (103) is installed between the two independent and separate pipes of the circulation pipe (102), the water inlet end and the water outlet end of the circulation pump (103) are respectively and through-connected to the two independent and separate pipes of the circulation pipe (102), the heat exchange pipe (101) and the circulation pipe (102) are respectively and through-connected to a cooling bin (105) at both ends, the heat exchange pipe (101) and the circulation pipe (102) are through-connected through the cooling bins (105) at both ends, the circulation pump (103) is used to drive the liquid to circulate in the heat exchange pipe (101), the cooling bin (105) and the circulation pipe (102), a semiconductor heat sink (104) is fixedly installed on the outer wall of the cooling bin (105), the refrigerating end of the semiconductor heat sink (104) is in contact with the cooling bin (105), and the semiconductor heat sink (104) is used to cool the liquid flowing through the inside of the cooling bin (105).

2. The heat dissipation device for a power device according to claim 1, wherein, Another side of the semiconductor heat sink (104) is fixedly attached with a metal heat dissipation fin (201), the metal heat dissipation fin (201) is in contact with the heating end of the semiconductor heat sink (104), the metal heat dissipation fin (201) is used to conduct the heat on the semiconductor heat sink (104), and a cooling fan (202) is fixedly installed at the air inlet on one side of the metal heat dissipation fin (201), and the cooling fan (202) is used to cool the metal heat dissipation fin (201) by air cooling.

3. The heat dissipation device for a power device according to claim 1, characterized in that, A water collecting bin (302) is through-connected between the water inlet end of the circulation pump (103) and the circulation pipe (102), a water dispersing bin (301) is through-connected between the water outlet end of the circulation pump (103) and the circulation pipe (102), and adjacent two water collecting bins (302) and adjacent two water dispersing bins (301) are through-connected by pipes.

4. The heat dissipation device for a power device according to claim 1, characterized in that, A heat preservation outer shell (400) is sleeved outside the heat exchange pipe (101), the heat exchange pipe (101), the cooling bin (105) and the circulation pipe (102) are all arranged inside the heat preservation outer shell (400), the semiconductor heat sink (104) penetrates through the heat preservation outer shell (400), and the circulation pump (103) is fixedly installed on the outer surface of the heat preservation outer shell (400).

5. The heat dissipation device for a power device according to claim 4, characterized in that, An installation plate (501) is fixedly connected to the end of the heat preservation outer shell (400), the installation plate (501) is provided with installation holes for installation, and magnets (502) for adsorption and fixation are fixedly arranged on the installation plate (501).

6. The heat dissipation device for a power device according to claim 3, wherein A water collection sealing cover (602) is threadedly installed on the communication hole on the side of the outermost water collection bin (302), and a water dispersion sealing cover (601) is threadedly installed on the communication hole on the side of the outermost water dispersion bin (301).

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