Power converter

Abstract

The power converter comprises a housing, a circuit board and a plurality of capacitors, and the housing is used for accommodating the circuit board and the plurality of capacitors. The circuit board is used for fixing a plurality of capacitors. The capacitor comprises an upper surface, a lower surface and a peripheral surface, the upper surface and the lower surface are oppositely arranged in the first direction, the lower surface is closer to the circuit board than the upper surface in the first direction, and the peripheral surface is located between the upper surface and the lower surface. One or more bosses are further arranged on the radial outer circumferential faces of the capacitors, the bosses are used for bearing fixing glue, and the fixing glue is used for bonding every two adjacent capacitors. The distance between the boss and the upper surface is smaller than the distance between the boss and the lower surface in the first direction, and the first direction is perpendicular to the radial direction of the capacitor. The bosses are additionally arranged on the peripheral surfaces of the capacitors to assist in dispensing, and a plurality of capacitors are more tightly connected through the fixing glue, so that the vibration resistance and the impact resistance of the capacitors on a board are improved, and the risk of fracture of PINs is reduced.

Description

Technical Field

[0001] This application relates to the technical field of new energy power generation, and particularly to a power converter. Background Art

[0002] In order to improve the on-site delivery, commissioning, defect elimination and efficiency of products and reduce costs, more and more power converters require that the whole machine be transported to the customer site after all pre-integrations are completed in the production process. However, during transportation, it will face certain vibrations and impacts. Especially for printed circuit board (PCB) board-mounted devices such as square film capacitors, due to the small size of the PIN feet, there is a risk of solder joint cracking or even PIN foot fracture. Summary of the Utility Model

[0003] The technical problem to be solved by the embodiments of this application is to provide a power converter that is beneficial to reducing the risk of capacitor PIN foot fracture.

[0004] This application provides a power converter, which is used to convert direct current from a photovoltaic module or a storage battery into alternating current. It includes a housing, a circuit board and a plurality of capacitors, wherein: the housing is used to accommodate the circuit board and the plurality of capacitors. The circuit board is used to fix the plurality of capacitors. The capacitor includes an upper surface, a lower surface and an outer peripheral surface. Among them, the upper surface and the lower surface are arranged opposite to each other in a first direction. Along the first direction, the lower surface is closer to the circuit board than the upper surface, and the outer peripheral surface is located between the upper surface and the lower surface. One or more bosses are further provided along the radial outer peripheral surface of the capacitor. The bosses are used to carry fixing glue, and the fixing glue is used to bond two adjacent capacitors. Along the first direction, the distance between the boss and the upper surface is less than the distance between the boss and the lower surface, and the first direction is perpendicular to the radial direction of the capacitor.

[0005] In the power converter of this application, bosses are added on the outer peripheral surface of the capacitor to assist in dispensing glue. The plurality of capacitors are more closely connected through the fixing glue, improving the anti-vibration and anti-impact capabilities after the capacitors are mounted on the board, and reducing the risk of PIN foot fracture. In addition, the dispensing position is standardized by the bosses, effectively reducing the occurrence of fixing glue overflow, and the consistency is good.

[0006] In a possible implementation, when a plurality of bosses are provided along the radial outer peripheral surface of the capacitor, the distances between adjacent two of the plurality of bosses and the upper surface are different along the first direction. When two adjacent capacitors are mounted on the board, the distance between the two adjacent capacitors is controlled by the bosses, and an air duct is formed between the outer peripheral surfaces of the two adjacent capacitors, facilitating the heat dissipation of the capacitors. If the distances between adjacent two of the plurality of bosses on the outer peripheral surface of the capacitor and the upper surface are different, a stepped air duct is formed between the two adjacent bosses, which is beneficial to improving the heat dissipation effect.

[0007] In one possible implementation, a plurality of capacitors are arranged in an array on a circuit board, and a boss of one of two adjacent capacitors is arranged opposite to a boss of another of two adjacent capacitors and bonded by fixing glue. Along a first direction, the distance between a boss of one of two adjacent capacitors and the circuit board is equal to the distance between a boss of another of two adjacent capacitors and the circuit board. In this way, it is convenient for the bosses arranged opposite to each other in two adjacent capacitors to jointly carry the fixing glue, and the two adjacent capacitors are tightly connected by the bosses and the fixing glue, which is beneficial to improving the rigidity of the on-board capacitor and reducing the risk of PIN foot breakage.

[0008] In a possible implementation, when a plurality of bosses are arranged along the radial outer peripheral surface of the capacitor, there is a spacing between two adjacent bosses. With such an arrangement, when dispensing glue on the bosses, the amount of glue used can be effectively reduced.

[0009] In a possible implementation, a plurality of capacitors are arranged on a circuit board, and along the arrangement direction of two adjacent capacitors, a boss of one of the two adjacent capacitors abuts against a boss opposite to the other of the two adjacent capacitors. The bosses opposite to the two adjacent capacitors abut against each other, and the bosses abutting against each other in the two adjacent capacitors jointly carry the fixing glue, reducing or avoiding the fixing glue overflowing from the boss to the outer peripheral surface between the boss and the circuit board, which is beneficial to shortening the heat dissipation path of the internal components of the capacitor, thereby improving the capacitor's anti-vibration / impact capability while improving the heat dissipation effect of the capacitor.

[0010] In a possible implementation, the boss includes a first part, a second part, and a third part, and the two ends of the second part are connected to the first part and the third part respectively, and the first part and the third part are bent relative to the second part along the first direction toward one side of the upper surface. In this way, the first part, the second part, and the third part are integrated into one body, and can be an integrally formed structure. The first part and the third part play a role of blocking and limiting the fixing glue. Specifically, the fixing glue has fluidity, and when the unsolidified fixing glue is dripped on the second part, since the first part and the third part are bent relative to the second part along the first direction toward the upper surface to form a limit, the fixing glue is not easy to overflow from the first part and the third part.

[0011] In a possible implementation, the boss is a rectangular parallelepiped structure. A bump is provided on the side of the boss away from the circuit board along the first direction, and the bump has a guide surface, which is connected to the peripheral surface. As the distance between the guide surface and the circuit board decreases along the first direction, the distance between the guide surface and the peripheral surface gradually increases. In this way, when dispensing glue, the glue can be dispensed along the guide surface to improve the smoothness of the glue dispensing. After the glue dispensing is completed, the fixing glue is bonded to the guide surfaces of the two opposite bumps in the two adjacent capacitors, and the boss carries the fixing glue through the bump.

[0012] In a possible implementation, the boss is in the shape of a cuboid. A bump is provided on the side of the boss facing away from the outer peripheral surface. The bump has a flow guiding surface. Along the first direction, as the distance between the flow guiding surface and the circuit board decreases, the distance between the flow guiding surface and the outer peripheral surface gradually increases.

[0013] In a possible implementation, the bump and the boss are integrally formed. This setting simplifies the manufacturing process and effectively reduces production time and costs.

[0014] In a possible implementation, the capacitor includes a thin film capacitor and an electrolytic capacitor. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0016] Figure 1 It is a schematic diagram of the networking of a large-scale ground power station or a grid-connected energy storage system in an industrial and commercial application scenario provided by an embodiment of the present application;

[0017] Figure 2 It is a schematic structural diagram of a power converter provided by an embodiment of the present application;

[0018] Figure 3 It is a schematic structural diagram of a capacitor provided by an embodiment of the present application;

[0019] Figure 4 It is a schematic structural diagram of the connection of two capacitors in the power converter provided by an embodiment of the present application;

[0020] Figure 5 It is a schematic structural diagram of a capacitor provided by an embodiment of the present application;

[0021] Figure 6 It is a schematic structural diagram of another capacitor provided by an embodiment of the present application;

[0022] Figure 7 It is a schematic structural diagram of a boss in a capacitor provided by an embodiment of the present application;

[0023] Figure 8 It is a schematic connection diagram of the boss and the bump in the capacitor provided by an embodiment of the present application;

[0024] Figure 9 It is another schematic connection diagram of the boss and the bump in the capacitor provided by an embodiment of the present application.

[0025] Description of the Reference Numerals:

[0026] 100 - Power converter; 100a - Photovoltaic inverter; 100b - Energy storage converter; 200 - Photovoltaic module; 300 - Box-type substation; 400 - Step-up substation; 500 - Power grid; 600 - Energy storage system; 10 - Housing; 20 - Circuit board; 30 - Capacitor; 31 - Upper surface; 32 - Lower surface; 33 - Outer peripheral surface; 34 - Boss; 341 - First part; 342 - Second part; 343 - Third part; 35 - Receiving space; 36 - Bump; 361 - Flow guiding surface; 40 - Fixing glue; 50 - Air duct; X - First direction; Y - Second direction; Z - Third direction. Detailed implementation manners

[0027] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0028] Please refer to Figure 1 , Figure 1 which is a schematic diagram of the networking of a large-scale ground power station or industrial and commercial application scenario of a photovoltaic energy storage system provided in an embodiment of the present application. Among them, the photovoltaic module 200 converts solar energy into direct current through the photovoltaic effect, and the photovoltaic inverter 100a converts the direct current output by the photovoltaic module 200 into alternating current and further delivers the alternating current to the box-type substation 300. After converting the low-voltage alternating current output by the photovoltaic inverter 100a into medium-voltage alternating current, the box-type substation 300 further delivers the alternating current to the step-up substation 400 (power grid 500) or the box-type substation 300 corresponding to the energy storage system 600. The energy storage system 600 is used to store the unstable electric energy from the photovoltaic module 200, and outputs stable electric energy to the power grid 500 through the energy storage converter 100b and the corresponding box-type substation 300. It can be understood that the energy storage system 600 includes energy storage batteries, and the direct current of the energy storage batteries is converted into alternating current by the energy storage converter 100b. The energy storage converter 100b is also used to convert the alternating current of the box-type substation 300 corresponding to the energy storage system 600 into direct current to charge the energy storage system 600.

[0029] Figure 1 In the photovoltaic energy storage system shown, the photovoltaic inverter 100a and the energy storage converter 100b are the core devices for power conversion, and they are collectively referred to as the power converter 100. Below, the structure of the power converter 100 provided by the present application will be specifically introduced with reference to the accompanying drawings. It is worth mentioning that the power converter 100 provided by the present application can also be applied to a household photovoltaic system. Since the networking method of the household photovoltaic system is similar to Figure 1 that of the large-scale ground power station or industrial and commercial application scenario, the present application will not elaborate further.

[0030] Please refer to Figure 2 and Figure 3 , Figure 2 which is a schematic diagram of the structure of a power converter 100 provided in an embodiment of the present application;Figure 3 Schematic diagram of the structure of a capacitor 30 provided by an embodiment of the present application. The power converter 100 includes a housing 10, a circuit board 20, and a plurality of capacitors 30. The housing 10 houses the circuit board 20 and the plurality of capacitors 30. The circuit board 20 is used to fix the plurality of capacitors 30. The capacitor 30 is connected and fixed to the circuit board 20 through PIN pins and realizes electrical connection.

[0031] The capacitor 30 includes an upper surface 31, a lower surface 32, and an outer peripheral surface 33. Among them, the upper surface 31 and the lower surface 32 are oppositely arranged along the first direction X, and along the first direction X, the lower surface 32 is closer to the circuit board 20 than the upper surface 31. The outer peripheral surface 33 is located between the upper surface 31 and the lower surface 32.

[0032] Generally, the power converter 100 will face certain vibrations and impacts during transportation. Due to the small size of the PIN pins, there is a risk of solder joint cracking or even PIN pin breakage. In addition, the outer peripheral surface 33 of the capacitor 30 is smooth and has no obvious auxiliary dispensing features, which is not convenient for dispensing and fixing on the outer peripheral surface 33 of the capacitor 30, and the connection effect between the capacitors 30 is poor.

[0033] Please refer to Figure 4 , Figure 4 Schematic diagram of the connection structure of two capacitors 30 in the power converter 100 provided by an embodiment of the present application. In the present application, one or more bosses 34 are further provided along the radial outer peripheral surface 33 of the capacitor 30. The boss 34 is used to carry the fixing glue 40, and the fixing glue 40 is used to bond two adjacent capacitors 30. Adding the boss 34 on the outer peripheral surface 33 of the capacitor 30 to assist in dispensing, and connecting the plurality of capacitors 30 more closely through the fixing glue 40; in addition, during the dispensing process, the dispensing position is standardized through the boss 34, effectively reducing the occurrence of the fixing glue 40 overflowing, and the consistency is better. The distance between the boss 34 and the upper surface 31 along the first direction X is less than the distance between the boss 34 and the lower surface 32, and the first direction X is perpendicular to the radial direction of the capacitor 30. The boss 34 is provided at a position closer to the upper surface 31 on the outer peripheral surface 33, and the lower surface 32 of the capacitor 30 is connected and fixed to the circuit board 20 through PIN pins. In this way, both the upper and lower ends of the capacitor 30 are fixed, improving the anti-vibration and anti-impact capabilities of the capacitor 30 after being mounted on the board and reducing the risk of PIN pin breakage.

[0034] The capacitor 30 includes a thin film capacitor 30 and an electrolytic capacitor 30. For example, the capacitor 30 is a thin film capacitor 30, specifically a square thin film capacitor 30. The housing of the thin film capacitor 30 and the boss 34 are both plastic components, and the two can be connected into one body by injection molding. Also for example, the capacitor 30 is an electrolytic capacitor 30. The housing of the electrolytic capacitor 30 is usually an aluminum shell, and the boss 34 is a plastic component. The two can be connected and fixed by welding, gluing or bolt fixing.

[0035] Exemplarily, a part of the plurality of capacitors 30 may be arranged on the circuit board 20 along the second direction Y, and another part of the plurality of capacitors 30 may be arranged on the circuit board 20 along the third direction Z. Wherein, the first direction X may be the thickness direction of the circuit board 20, the second direction Y is the length direction of the circuit board 20, the third direction Z is the width direction of the circuit board 20, and the first direction X, the second direction Y, and the third direction Z are perpendicular to each other. In addition, a boss 34 is provided on the outer peripheral surface 33 of the capacitor 30, and a standardized layout is achieved according to the setting of the boss 34 when the capacitors 30 are arranged.

[0036] The capacitor 30 may be of a cylindrical structure, and a plurality of bosses 34 are arranged at intervals on the outer peripheral surface 33. A part of the boss 34 is fixedly connected to the outer peripheral surface 33, and another part of the boss 34 has a distance from the outer peripheral surface 33. Thus, among two adjacent capacitors 30, the abutting area between the boss 34 on one capacitor 30 and the opposite boss 34 on the other capacitor 30 is maximized, and more fixing glue 40 can be carried, improving the connection reliability between the two capacitors 30.

[0037] The capacitor 30 may also be of a prism structure, such as a regular quadrangular prism structure or a regular triangular prism structure. The surface of the boss 34 facing the outer peripheral surface 33 is integrally attached to the outer peripheral surface 33 of the capacitor 30, improving the connection reliability between the boss 34 and the outer peripheral surface 33. Moreover, among two adjacent capacitors 30, the abutting area between the boss 34 on one capacitor 30 and the opposite boss 34 on the other capacitor 30 is maximized, and more fixing glue 40 can be carried, improving the connection reliability between the two capacitors 30.

[0038] Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of a capacitor 30 provided in an embodiment of the present application. When a plurality of bosses 34 are arranged along the radial outer peripheral surface 33 of the capacitor 30, that is, a plurality of bosses 34 are arranged at intervals along the radial direction of the capacitor 30. Among the plurality of bosses 34 along the first direction X, the distances between two adjacent bosses 34 and the upper surface 31 are different. Each boss 34 has two adjacent bosses 34. For one of the bosses 34, along the first direction X, the distance from this boss 34 to the upper surface 31 is different from the distance from an adjacent boss 34 to the upper surface 31, and the distance from this boss 34 to the upper surface 31 is the same as the distance from another adjacent boss 34 to the upper surface 31.

[0039] Please refer to Figure 6 , Figure 6Another structural schematic diagram of a capacitor 30 provided by an embodiment of the present application. Also, for example, when a plurality of bosses 34 are provided on the radial outer peripheral surface 33 of the capacitor 30, the distances between two adjacent bosses 34 among the plurality of bosses 34 along the first direction X and the upper surface 31 are different. There are two adjacent bosses 34 for any one boss 34. For one of the bosses 34, along the first direction X, the distance from this boss 34 to the upper surface 31 is different from the distance from any one of the two adjacent bosses 34 to the upper surface 31.

[0040] When adjacent upper plates of two capacitors 30 are controlled by the bosses 34 to have a distance between the two adjacent capacitors 30, an air duct 50 is formed between the outer peripheral surfaces 33 of the two adjacent capacitors 30, which is convenient for the capacitor 30 to dissipate heat. Since the distances between two adjacent bosses 34 among the plurality of bosses 34 on the outer peripheral surface 33 of the capacitor 30 and the upper surface 31 are different, a stepped air duct 50 is formed between the two adjacent bosses 34, which is beneficial to improving the heat dissipation effect.

[0041] Exemplarily, a plurality of capacitors 30 are arranged on the circuit board 20. One boss 34 of one capacitor 30 among two adjacent capacitors 30 is disposed opposite to one boss 34 of the other capacitor 30 among the two adjacent capacitors 30 and adhered by a fixing glue 40. Along the first direction X, the distance from one boss 34 of one capacitor 30 among two adjacent capacitors 30 to the circuit board 20 is equal to the distance from one boss 34 of the other capacitor 30 among the two adjacent capacitors 30 to the circuit board 20. In this way, it is convenient for the oppositely disposed bosses 34 among two adjacent capacitors 30 to jointly carry the fixing glue 40, and the two adjacent capacitors 30 are tightly connected through the bosses 34 and the fixing glue 40, which is beneficial to improving the stiffness of the on-board capacitor 30 and reducing the risk of PIN foot fracture.

[0042] Exemplarily, when a plurality of bosses 34 are provided on the radial outer peripheral surface 33 of the capacitor 30, there is a distance between two adjacent bosses 34. For example, on the same capacitor 30, there is a distance between two adjacent bosses 34 along the circumferential direction of the capacitor 30. With such a setting, when dispensing glue on the bosses 34, the amount of glue used can be effectively reduced.

[0043] For example, the capacitor 30 has a regular quadrangular prism structure, and the outer peripheral surface 33 of the capacitor 30 includes a plurality of planes connected in sequence. Each plane is provided with a plurality of bosses 34, and there is a distance between two adjacent bosses 34 among the plurality of bosses 34 located on the same plane. In this way, compared with setting a long strip-shaped boss 34 on one plane, it can not only ensure the effective improvement of the connection reliability between two adjacent capacitors 30, but also effectively reduce the amount of glue used.

[0044] A plurality of capacitors 30 are arranged on the circuit board 20. Along the arrangement direction of two adjacent capacitors 30, the boss 34 of one capacitor 30 among two adjacent capacitors 30 abuts against the opposite boss 34 of the other capacitor 30 among two adjacent capacitors 30. Since the distance from the boss 34 of one capacitor 30 to the circuit board 20 along the first direction X is equal to the distance from the boss 34 of the other capacitor 30 to the circuit board 20 along the first direction X, after the adjacent capacitors 30 are placed on the circuit board 20, the opposite bosses 34 of two adjacent capacitors 30 abut against each other, and the mutually abutting bosses 34 of two adjacent capacitors 30 jointly carry the fixing glue 40, reducing or avoiding the fixing glue 40 from overflowing from the boss 34 to the outer peripheral surface 33 between the boss 34 and the circuit board 20, which is beneficial to shortening the heat dissipation path of the internal components of the capacitor 30, thereby improving the heat dissipation effect of the capacitor 30 while enhancing the anti-vibration / impact ability of the capacitor 30.

[0045] Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of a boss 34 in a capacitor 30 provided by an embodiment of the present application. The boss 34 includes a first part 341, a second part 342 and a third part 343, and two ends of the second part 342 are respectively connected to the first part 341 and the third part 343. The first part 341, the second part 342 and the third part 343 are all connected to the outer peripheral surface 33. The first part 341, the second part 342 and the third part 343 are integrated into one body and can be an integrally formed structure.

[0046] Both the first part 341 and the third part 343 are bent relative to the second part 342 along the first direction X towards the upper surface 31 side. In this way, the first part 341 and the third part 343 play a role of blocking and limiting. Specifically, the fixing glue 40 has fluidity during the dispensing process. When the unfixed fixing glue 40 drops on the second part 342, due to the first part 341 and the third part 343 being bent relative to the second part 342 along the first direction X towards the upper surface 31 to form a limit, the fixing glue 40 is not likely to overflow from the first part 341 and the third part 343.

[0047] In addition, after two adjacent capacitors 30 are installed on the circuit board 20, the mutually abutting bosses 34 jointly enclose a receiving space 35, and the receiving space 35 is used to accommodate the fixing glue 40, reducing the overflow of the fixing glue 40 and simultaneously improving the connection reliability of two adjacent capacitors 30. In addition, the opening of the receiving space 35 faces the upper surface 31, facilitating dropping glue into the receiving space 35 from the opening.

[0048] Please combine with Figure 8 , Figure 8Schematic diagram of a connection between a boss 34 and a bump 36 in a capacitor 30 provided by an embodiment of the present application. In one embodiment, the boss 34 has a cuboid structure. A bump 36 is provided on a side of the boss 34 facing away from the circuit board 20 along the first direction X. The bump 36 has a diversion surface 361. The diversion surface 361 is connected to the outer peripheral surface 33. Along the first direction X, as the distance between the diversion surface 361 and the circuit board 20 decreases, the distance between the diversion surface 361 and the outer peripheral surface 33 gradually increases. Among them, the diversion surface 361 can be a plane or an arc surface. When dispensing glue, the fixing glue 40 can flow along the diversion surface 361, improving the smoothness of glue dispensing. After glue dispensing is completed, the fixing glue 40 adheres to the diversion surfaces 361 of the opposite bumps 36 in two adjacent capacitors 30. The boss 34 bears the fixing glue 40 through the bump 36.

[0049] Among them, the cross-sectional shape of the bump 36 can be triangular, trapezoidal or other shapes. The cross-section of the bump 36 is parallel to the arrangement direction of the bump 36 and the outer peripheral surface 33.

[0050] Please refer to Figure 9 , Figure 9 Schematic diagram of another connection between a boss 34 and a bump 36 in a capacitor 30 provided by an embodiment of the present application. In another embodiment, a bump 36 is provided on a surface of the boss 34 facing away from the outer peripheral surface 33. The bump 36 has a diversion surface 361. Along the first direction X, as the distance between the diversion surface 361 and the circuit board 20 decreases, the distance between the diversion surface 361 and the outer peripheral surface 33 gradually increases. In this embodiment, among two adjacent capacitors 30, the bump 36 of one capacitor 30 abuts against the bump 36 of the other capacitor 30. A surface of the boss 34 facing away from the circuit board 20 along the first direction X is connected to the diversion surface 361. During the glue dispensing process, glue can be dropped from the surface of the boss 34 facing away from the circuit board 20 along the first direction X. The fixing glue 40 then flows along the diversion surface 361 until the fixing glue 40 fills the space between the opposite bumps 36 of two adjacent capacitors 30, realizing the fixation between two adjacent capacitors 30.

[0051] In other embodiments, a bump 36 is provided on a side of the boss 34 facing away from the circuit board 20 along the first direction X, and a bump 36 is also provided on a surface of the boss 34 facing away from the outer peripheral surface 33. Among them, the diversion surface 361 of the bump 36 on the side facing away from the circuit board 20 is directly connected to the diversion surface 361 of the bump 36 on the side facing away from the outer peripheral surface 33, that is, the diversion surface 361 of the bump 36 on the side facing away from the circuit board 20 and the diversion surface 361 of the bump 36 on the side facing away from the outer peripheral surface 33 together form a diversion surface 361 with a larger area.

[0052] Furthermore, in the present application, the boss 34 and the bump 36 are integrally formed. With this setting, the manufacturing process is simplified, effectively reducing production time and costs.

[0053] The surface of the boss 34 is provided with a texture area, and the texture area is bonded to the fixing glue 40. For example, a bump 36 is provided on the side of the boss 34 facing away from the outer peripheral surface 33, and the boss 34 is fixedly connected to the bump 36. A texture area can be provided on the flow guiding surface 361 of the bump 36. After the fixing glue 40 is filled between the bumps 36 of two adjacent capacitors 30, the setting of the texture area can enhance the bonding force between the fixing glue 40 and the bump 36, thereby improving the reliability of the connection between two adjacent capacitors 30.

[0054] Also for example, when the boss 34 is not provided with the bump 36 and the fixing glue 40 is bonded to the surface of the boss 34 facing away from the circuit board 20 in the first direction X, the texture area can be provided on the surface of the boss 34 facing away from the circuit board 20 to enhance the bonding force between the fixing glue 40 and the boss 34, thereby improving the reliability of the connection between two adjacent capacitors 30.

[0055] The value range of the surface roughness of the texture area is [6.3 μm, 12.5 μm]. In this way, the roughness of the texture area is neither too small nor too large, effectively ensuring the fluidity of the fixing glue 40 on the boss 34 or the bump 36, enabling the fixing glue 40 to bond the opposite bosses 34 or bumps 36 on two adjacent capacitors 30 under its own flow, and reducing the possibility of the cured fixing glue 40 falling off from the boss 34 or the bump 36, thus improving the reliability of the connection between two adjacent capacitors 30. Among them, the value of the surface roughness of the texture area can be 6.3 μm, 6.57 μm, 7.52 μm, 8.34 μm, 9.26 μm, 9.85 μm, 10.04 μm, 10.76 μm, 11.63 μm or 12.5 μm, not listed one by one.

[0056] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power converter, characterized in that, The power converter is used to convert direct current from a photovoltaic module or an energy storage battery into alternating current, and the power converter includes a housing, a circuit board, and a plurality of capacitors, wherein: The housing is used to accommodate the circuit board and the plurality of capacitors. The circuit board is used to fix the plurality of capacitors. The capacitor includes an upper surface, a lower surface and an outer peripheral surface, wherein the upper surface and the lower surface are arranged relative to each other along a first direction, the lower surface is closer to the circuit board than the upper surface along the first direction, the outer peripheral surface is located between the upper surface and the lower surface, and one or more bosses are also arranged on the outer peripheral surface along the radial direction of the capacitor, the bosses are used to carry fixing glue, and the fixing glue is used to bond two adjacent capacitors, the distance between the boss and the upper surface along the first direction is smaller than the distance between the boss and the lower surface, and the first direction is perpendicular to the radial direction of the capacitor.

2. The power converter according to claim 1, characterized in that, When the plurality of bosses are disposed on the outer peripheral surface along the radial direction of the capacitor, distances between two adjacent bosses of the plurality of bosses and the upper surface are different along the first direction.

3. The power converter according to claim 2, characterized in that, A plurality of the capacitors are arranged on the circuit board, a boss of one of two adjacent capacitors is arranged opposite to a boss of another of two adjacent capacitors and is bonded by the fixing glue; along the first direction, a distance between a boss of one of two adjacent capacitors and the circuit board is equal to a distance between a boss of another of two adjacent capacitors and the circuit board.

4. The power converter according to claim 2 or 3, characterized in that, When the plurality of bosses are arranged on the outer peripheral surface along the radial direction of the capacitor, there is a distance between two adjacent bosses.

5. The power converter according to claim 4, wherein A plurality of the capacitors are arranged on the circuit board, and along the arrangement direction of two adjacent capacitors, a boss of one of the two adjacent capacitors abuts against a boss opposite to the other of the two adjacent capacitors.

6. The power converter according to claim 5, wherein The boss includes a first part, a second part and a third part, the two ends of the second part are respectively connected to the first part and the third part, and the first part and the third part are both bent relative to the second part along the first direction toward one side of the upper surface.

7. The power converter according to claim 5, wherein The boss is a rectangular structure; a bump is provided on the side of the boss away from the circuit board along the first direction, and the bump has a guide surface, which is connected to the outer peripheral surface. Along the first direction, as the distance between the guide surface and the circuit board shortens, the distance between the guide surface and the outer peripheral surface gradually increases.

8. The power converter according to claim 5, wherein The boss is a rectangular parallelepiped structure; a convex block is provided on a side of the boss away from the outer peripheral surface, and the convex block has a guide surface. As the distance between the guide surface and the circuit board decreases along the first direction, the distance between the guide surface and the outer peripheral surface gradually increases.

9. The power converter according to claim 7, wherein, The convex block and the boss are integrally formed.

10. The power converter according to claim 1, characterized in that, The capacitors include film capacitors and electrolytic capacitors.

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