Battery protection board and battery

Abstract

The utility model relates to a battery protection board and a battery. The battery protection board comprises a first circuit board, a first packaging layer, a first device, a second device, a conductive piece and a second circuit board. According to the battery protection board, the first device and the second device are electrically connected to the first surface and the second surface of the first circuit board respectively, so that compared with an existing battery protection board in which the first device and the second device are packaged on two hard boards respectively, one hard board can be saved; therefore, the size of the battery protection plate can be reduced to meet the miniaturization requirement of a customer, the technological process is simplified, the structure of the battery protection plate is simplified, the yield of the battery protection plate is improved, and the cost of the battery protection plate is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of batteries, and particularly to a battery protection board and a battery. Background Art

[0002] The current battery protection board divides the devices into two parts (the first device and the second device). The system-in-package (SIP) process is used to package the first device and the first rigid board to form the first packaging module, and the system-in-package process is used to package the second device and the second rigid board to form the second packaging module. Then, the first packaging module and the second packaging module are respectively mounted on the front and back surfaces of the flexible board. However, the current battery protection board has technical problems such as large size, inability to meet the miniaturization requirements of customers, long process flow, complex structure, low yield rate, and high cost. Summary of the Utility Model

[0003] The purpose of the present application is to provide a battery protection board, a battery protection board, and a battery pack, which can solve the technical problems existing in the current battery protection board, such as large size, inability to meet the miniaturization requirements of customers, long process flow, complex structure, low yield rate, and high cost.

[0004] To solve the above problems, the present application provides a battery protection board having intersecting first and second directions; the battery protection board includes: a first circuit board, the two side surfaces of which in the first direction are respectively a first surface and a second surface; a first encapsulation layer encapsulated on the first surface of the first circuit board; a second encapsulation layer encapsulated on the second surface of the first circuit board; a first device electrically connected to the first surface of the first circuit board and encapsulated in the first encapsulation layer; a second device electrically connected to the second surface of the first circuit board and encapsulated in the second encapsulation layer; a conductive member electrically connected to the second surface of the first circuit board; and a second circuit board located on the side of the conductive member away from the first circuit board, and the conductive member is electrically connected to the second circuit board.

[0005] In some embodiments, the conductive member includes solder balls.

[0006] In some embodiments, the first device includes a first chip, a second chip, and an RLC circuit device arranged along the second direction.

[0007] In some embodiments, the second device includes a first MOS switch and a second MOS switch arranged along the second direction.

[0008] In some embodiments, the first device is surface-mounted, soldered, or wire-bonded and electrically connected to the first surface of the first circuit board.

[0009] In some embodiments, the second device is surface-mounted, soldered, or wire-bonded and electrically connected to the second surface of the first circuit board.

[0010] In some embodiments, the surface of the second encapsulation layer away from the first circuit board is attached to the surface of the second circuit board close to the first circuit board.

[0011] In some embodiments, there is a gap between the surface of the second encapsulation layer away from the first circuit board and the surface of the second circuit board close to the first circuit board.

[0012] In some embodiments, the two side surfaces of the second circuit board in the first direction are the third surface and the fourth surface respectively. The conductive component is electrically connected to the third surface of the second circuit board; the battery protection board further includes: a connector electrically connected to the third surface of the second circuit board; and a connection electrode electrically connected to the fourth surface of the second circuit board.

[0013] To solve the above problems, the present application also provides a battery, which includes the battery protection board of the present application and a battery cell electrically connected to the battery protection board.

[0014] The battery protection board of the present application electrically connects the first device and the second device to the first surface and the second surface of the first circuit board respectively. Compared with the existing battery protection board that separately encapsulates the first device and the second device on two rigid boards, one rigid board can be saved. Therefore, the size of the battery protection board can be reduced to meet the miniaturization requirements of customers, which is beneficial to simplifying the process flow, simplifying the structure of the battery protection board, improving the yield rate of the battery protection board, and reducing the cost of the battery protection board.

[0015] A first encapsulation layer is encapsulated on the first surface of the present application, and the first device is encapsulated in the first encapsulation layer. The first device is protected by the first encapsulation layer, and isolation between multiple first devices can also be achieved through the first encapsulation layer.

[0016] A second encapsulation layer is encapsulated on the second surface of the present application, and the second device is encapsulated in the second encapsulation layer. The second device is protected by the second encapsulation layer, and isolation between multiple second devices can also be achieved through the second encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 is a schematic diagram of the battery protection board of Embodiment 1 of the present application;

[0019] Figure 2 is a schematic diagram of the battery protection board of Embodiment 2 of the present application.

[0020] Description of the reference numerals:

[0021] 100, battery protection board;

[0022] 1, first circuit board; 2, first encapsulation layer; 3, second encapsulation layer; 4, first device; 5, second device; 6, conductive member; 7, second circuit board; 8, connector; 9, connection electrode;

[0023] 11, first surface; 12, second surface; 41, first chip; 42, second chip; 43, RLC circuit device; 51, first MOS switch; 52, second MOS switch; 71, third surface; 72, fourth surface. Detailed implementation manners

[0024] The following describes in detail the preferred embodiments of the present application in conjunction with the accompanying drawings of the specification, so as to fully introduce the technical content of the present application to those skilled in the art, to prove by example that the present application can be implemented, to make the technical content disclosed in the present application clearer, and to make it easier for those skilled in the art to understand how to implement the present application. However, the present application can be embodied in many different forms of embodiments, and the protection scope of the present application is not limited to the embodiments mentioned in the text. The description of the following embodiments is not used to limit the scope of the present application.

[0025] The directional terms mentioned in the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only the directions in the accompanying drawings. The directional terms used herein are used to explain and illustrate the present application, rather than to limit the protection scope of the present application.

[0026] In the accompanying drawings, components with the same structure are denoted by the same numerals, and components with similar structures or functions are denoted by similar numerals. In addition, for the sake of easy understanding and description, the size and thickness of each component shown in the accompanying drawings are arbitrarily shown, and the present application does not limit the size and thickness of each component.

[0027] Embodiment 1

[0028] Please refer to Figure 1 , Figure 1 is a schematic diagram of the battery protection board according to Embodiment 1 of the present application. The battery protection board 100 has an intersecting first direction M and a second direction N. In this embodiment, the first direction M and the second direction N are perpendicular to each other. In other embodiments, the first direction M and the second direction N may not be perpendicular.

[0029] Please refer to Figure 1, the battery protection board 100 includes: a first circuit board 1, a first encapsulation layer 2, a second encapsulation layer 3, a first device 4, a second device 5, a conductive member 6, a second circuit board 7, a connector 8, and a connection electrode 9.

[0030] Among them, the two side surfaces of the first circuit board 1 in the first direction M are respectively a first surface 11 and a second surface 12. In this embodiment, the first surface 11 is the upper surface of the first circuit board 1, and the second surface 12 is the lower surface of the first circuit board 1. In this embodiment, the first circuit board 1 is a printed circuit board (Printed Circuit Board, abbreviated as PCB).

[0031] Among them, the first encapsulation layer 2 is encapsulated on the first surface 11 of the first circuit board 1. The first encapsulation layer 2 is used to isolate different devices or chips among multiple first devices 4, prevent short circuits from occurring among multiple first devices 4, and can also use the first encapsulation layer 2 to protect the first device 4, prevent the first device 4 from being invaded by water vapor, and prevent the first device 4 from being damaged by external forces. The material of the first encapsulation layer 2 can be a thermosetting material made of a mixture of resin and filler. Among them, the resin can be a resin material such as epoxy resin, and the filler can be an inorganic material such as silicon dioxide (SiO2) or boron nitride (BN). The filler can adjust the properties of the resin to achieve the material properties of high thermal conductivity, high melting point, and low coefficient of thermal expansion (CTE). Of course, the material of the first encapsulation layer 2 can also be other types of materials, such as ceramics or glass, etc., and the embodiments of the present application do not make special restrictions.

[0032] Among them, the second encapsulation layer 3 is encapsulated on the second surface 12 of the first circuit board 1. The second encapsulation layer 3 is used to isolate different devices or chips among multiple second devices 5, prevent short circuits from occurring among multiple second devices 5, and can also use the second encapsulation layer 3 to protect the second device 5, prevent the second device 5 from being invaded by water vapor, and prevent the second device 5 from being damaged by external forces. The material of the second encapsulation layer 3 can be a thermosetting material made of a mixture of resin and filler. Among them, the resin can be a resin material such as epoxy resin, and the filler can be an inorganic material such as silicon dioxide (SiO2) or boron nitride (BN). The filler can adjust the properties of the resin to achieve the material properties of high thermal conductivity, high melting point, and low coefficient of thermal expansion (CTE). Of course, the material of the second encapsulation layer 3 can also be other types of materials, such as ceramics or glass, etc., and the embodiments of the present application do not make special restrictions.

[0033] Among them, the first device 4 is electrically connected to the first surface 11 of the first circuit board 1 and encapsulated in the first encapsulation layer 2. The first device 4 is surface-mounted, soldered or wire-bonded to the first surface 11 of the first circuit board 1. In this embodiment, the first device 4 is surface-mounted and electrically connected to the first surface 11 of the first circuit board 1. Specifically, the first device 4 is electrically connected to the first surface 11 of the first circuit board 1 through the surface-mounted technology (SMT) process. In other embodiments, the first device 4 can be electrically connected to the first surface 11 of the first circuit board 1 through the soldering (such as pads and solder balls) process, or can also be electrically connected to the first surface 11 of the first circuit board 1 through the wire bonding process.

[0034] In some embodiments, the first device 4 includes a first chip 41, a second chip 42 and an RLC circuit device 43 arranged along the second direction N. Among them, the first chip 41 can be used to detect the charging or discharging state of the single cells in the battery pack. The second chip 42 can control the conduction and cutoff of the second device 5 according to the charging or discharging state of the single cells provided by the first chip 41. The RLC circuit device 43 is a circuit structure composed of a resistor R, an inductor L and a capacitor C, and the RLC circuit device 43 can be used to ensure the normal operation of the circuit.

[0035] Among them, the second device 5 is electrically connected to the second surface 12 of the first circuit board 1 and encapsulated in the second encapsulation layer 3. The second device 5 is surface-mounted, soldered or wire-bonded to the second surface 12 of the first circuit board 1. In this embodiment, the second device 5 is surface-mounted and electrically connected to the second surface 12 of the first circuit board 1. Specifically, the second device 5 is electrically connected to the second surface 12 of the first circuit board 1 through the surface-mounted technology (SMT) process. In other embodiments, the second device 5 can be electrically connected to the second surface 12 of the first circuit board 1 through the soldering (such as pads and solder balls) process, or can also be electrically connected to the second surface 12 of the first circuit board 1 through the wire bonding process.

[0036] In some embodiments, the second device 5 includes a first MOS switch 51 and a second MOS switch 52 arranged along the second direction N. Among them, MOS is the abbreviation of MOSFET, and the full name of MOSFET is Metal-Oxide-Semiconductor Field-Effect Transistor, which is Metal-Oxide-Semiconductor Field-Effect Transistor in Chinese. Specifically, the second chip 42 can control the conduction and cutoff of the first MOS switch 51 and the second MOS switch 52 according to the charging or discharging state of the single cells provided by the first chip 41.

[0037] One end of the conductive member 6 is electrically connected to the second surface 12 of the first circuit board 1, and the other end is electrically connected to the second circuit board 7. In some embodiments, the conductive member 6 includes solder balls. In this embodiment, the conductive member 6 is a solder ball. By soldering the solder ball to the pad (not shown in the figure) on the second circuit board 7, the electrical connection between the first circuit board 1 and the second circuit board 7 can be achieved, which can overcome the warping problem of the second circuit board 7, reduce the phenomenon of false soldering, and improve the yield rate of the battery protection board 100.

[0038] In some embodiments, the surface of the second encapsulation layer 3 away from the first circuit board 1 is attached to the surface of the second circuit board 7 close to the first circuit board 1. This is because in the manufacturing process of the battery protection board, the first circuit board 1 is electrically connected to the second circuit board 7 through the conductive member 6 first, and then the second encapsulation layer 3 is formed between the first circuit board 1 and the second circuit board 7, resulting in that the second encapsulation layer 3 not only covers the second device 5 but also completely fills the gap between the first circuit board 1 and the second circuit board 7.

[0039] The second circuit board 7 is located on the side of the conductive member 6 away from the first circuit board 1. The two side surfaces of the second circuit board 7 in the first direction M are the third surface 71 and the fourth surface 72 respectively. In this embodiment, the third surface 71 is the upper surface of the second circuit board 7 close to the first circuit board 1, and the fourth surface 72 is the lower surface of the second circuit board 7 away from the first circuit board 1. Specifically, the conductive member 6 is electrically connected to the third surface 71 of the second circuit board 7. In this embodiment, the second circuit board 7 is a flexible printed circuit board (FPC).

[0040] In some embodiments, the connector 8 is electrically connected to the third surface 71 of the second circuit board 7. One end of the connector 8 away from the second circuit board 7 is connected to a power source. In this embodiment, the connector 8 uses a board to board (BTB) connector. In other embodiments, other types of connectors can also be used.

[0041] In some embodiments, the connection electrode 9 is electrically connected to the fourth surface 72 of the second circuit board 7. One end of the connection electrode 9 away from the second circuit board 7 is connected to a single cell.

[0042] Through the above solution, the battery protection board 100 of the present application electrically connects the first device 4 and the second device 5 to the first surface 11 and the second surface 12 of the first circuit board 1 respectively. Compared with the existing battery protection board that separately packages the first device and the second device on two hard boards, one hard board can be saved. Therefore, the size of the battery protection board 100 can be reduced to meet the miniaturization requirements of customers, which is beneficial to simplifying the process flow, simplifying the structure of the battery protection board, improving the yield rate of the battery protection board 100, and reducing the cost of the battery protection board 100.

[0043] Embodiment 2

[0044] Please refer to Figure 2 , Figure 2 which is a schematic diagram of the battery protection board according to Embodiment 2 of the present application. This embodiment includes most of the technical features of Embodiment 1. The difference between this embodiment and Embodiment 1 is that in some embodiments, there is a gap between the surface of the second encapsulation layer 3 away from the first circuit board 1 and the surface of the second circuit board 7 close to the first circuit board 1. This is because in the preparation process of the battery protection board, the second encapsulation layer 3 is first encapsulated on the second surface 12 of the first circuit board 1, the second encapsulation layer 3 covers the second device 5, then holes are opened on the second encapsulation layer 3 for ball planting to form the conductive member 6, and finally, electrical connection is made through the conductive member 6 and the pads (not shown in the figure) of the second circuit board 7, resulting in a gap between the surface of the second encapsulation layer 3 away from the first circuit board 1 and the surface of the second circuit board 7 close to the first circuit board 1.

[0045] Through the above solution, the battery protection board 100 of the present application electrically connects the first device 4 and the second device 5 to the first surface 11 and the second surface 12 of the first circuit board 1 respectively. Compared with the existing battery protection board that separately packages the first device and the second device on two hard boards, one hard board can be saved. Therefore, the size of the battery protection board 100 can be reduced to meet the miniaturization requirements of customers, which is beneficial to simplifying the process flow, simplifying the structure of the battery protection board, improving the yield rate of the battery protection board 100, and reducing the cost of the battery protection board 100.

[0046] In some embodiments, the present application further provides a battery, which includes the battery protection board of the above embodiment and a battery cell electrically connected to the battery protection board. Specifically, the tab of the battery cell is electrically connected to the connection electrode 9 of the battery protection board 100.

[0047] The above has introduced in detail a battery protection board and a battery provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A battery protection board, characterized in that, The battery protection board has intersecting first (M) and second (N) directions; The battery protection board includes: A first circuit board (1) whose two side surfaces in the first direction (M) are a first surface (11) and a second surface (12) respectively; A first encapsulation layer (2) encapsulated on the first surface (11) of the first circuit board (1); A second encapsulation layer (3) encapsulated on the second surface (12) of the first circuit board (1); A first device (4) electrically connected to the first surface (11) of the first circuit board (1) and encapsulated in the first encapsulation layer (2); A second device (5) electrically connected to the second surface (12) of the first circuit board (1) and encapsulated in the second encapsulation layer (3); A conductive member (6) electrically connected to the second surface (12) of the first circuit board (1); and A second circuit board (7) located on the side of the conductive member (6) away from the first circuit board (1), and the conductive member (6) is electrically connected to the second circuit board (7).

2. The battery protection board according to claim 1, wherein The conductive member (6) includes solder balls.

3. The battery protection board according to claim 1, wherein The first device (4) includes a first chip (41), a second chip (42) and an RLC circuit device (43) arranged along the second direction (N).

4. The battery protection board according to claim 1, wherein, The second device (5) includes a first MOS switch (51) and a second MOS switch (52) arranged along the second direction (N).

5. The battery protection board according to claim 1, characterized in that The first device (4) is surface-mounted, soldered or wire-bonded and electrically connected to the first surface (11) of the first circuit board (1).

6. The battery protection board according to claim 1, characterized in that, The second device (5) is surface-mounted, soldered or wire-bonded and electrically connected to the second surface (12) of the first circuit board (1).

7. The battery protection board according to claim 1, characterized in that, The surface of the second encapsulation layer (3) on the side away from the first circuit board (1) fits against the surface of the second circuit board (7) on the side close to the first circuit board (1).

8. The battery protection board according to claim 1, characterized in that, There is a gap between the surface of the second encapsulation layer (3) on the side away from the first circuit board (1) and the surface of the second circuit board (7) on the side close to the first circuit board (1).

9. The battery protection board according to claim 1, characterized in that The two side surfaces of the second circuit board (7) in the first direction (M) are a third surface (71) and a fourth surface (72) respectively, and the conductive member (6) is electrically connected to the third surface (71) of the second circuit board (7); The battery protection board further includes: A connector (8) electrically connected to the third surface (71) of the second circuit board (7); and A connection electrode (9) electrically connected to the fourth surface (72) of the second circuit board (7).

10. A battery, characterized in that, A battery protection board according to any one of claims 1-9 and a battery cell electrically connected to the battery protection board.

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