PCBA module of intelligent wearable device

Abstract

The utility model belongs to the technical field of circuit boards, particularly relates to a PCBA (Printed Circuit Board Assembly) module of intelligent wearable equipment, and provides the following scheme aiming at the problems that the heat dissipation effect of the PCBA module is seriously influenced and the heat dissipation effect is not ideal because the equipment is provided with an external shell and a shell is arranged outside the PCBA module, and the PCBA module comprises a PCBA module main body, the four corners of the bottom of the PCBA module body are each fixedly provided with a screw used for being matched with a nut for installation and fixation, the PCBA module body is provided with a plurality of heat dissipation through holes, and the open type heat dissipation assembly is arranged above the PCBA module body and used for improving the heat dissipation effect of the PCBA module body. When the PCBA module is used, the open type heat dissipation assembly is designed and comprises the two heat dissipation fans and the U-shaped graphene heat dissipation fins, the heat dissipation efficiency of the PCBA module is remarkably improved, the working temperature of key components such as a control chip can be reduced, the service life of the key components is prolonged, and the equipment performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a PCBA module of an intelligent wearable device. Background Art

[0002] A PCBA module (PCBA is the abbreviation of Printed Circuit Board Assembly, that is, a printed circuit board assembly) is one of the core components in an intelligent wearable device. It integrates circuit design, electronic components, connectors, sensors, etc., and is a key part to realize the functions of the device. The PCBA module of an intelligent wearable device is a technology-intensive product, which requires interdisciplinary knowledge and skills, including electronic engineering, software development, material science, etc.

[0003] After retrieval, a PCBA module heat dissipation device disclosed in the patent with the publication number CN217563835U relates to the field of PCBA modules. It sets a heat dissipation component inside the housing, and the heat dissipation component conducts heat dissipation treatment on the PCBA module, and discharges the heat after heat dissipation out of the housing through heat dissipation holes. However, since the device already has an external housing, setting another housing outside the PCBA module will undoubtedly seriously affect the heat dissipation effect of the PCBA module, resulting in an unsatisfactory heat dissipation effect.

[0004] In view of the above problems, the utility model document proposes a PCBA module of an intelligent wearable device. Summary of the Utility Model

[0005] The utility model provides a PCBA module of an intelligent wearable device, which solves the defect that in the prior art, since the device already has an external housing, setting another housing outside the PCBA module will undoubtedly seriously affect the heat dissipation effect of the PCBA module, resulting in an unsatisfactory heat dissipation effect.

[0006] The utility model provides the following technical solutions:

[0007] A PCBA module of an intelligent wearable device, comprising:

[0008] A PCBA module main body, at the four corners of the bottom of the PCBA module main body, screws for cooperating with nuts for installation and fixation are fixedly arranged, and a plurality of heat dissipation through holes are arranged on the PCBA module main body;

[0009] An open-type heat dissipation component, which is arranged above the PCBA module main body and is used to improve the heat dissipation effect of the PCBA module main body.

[0010] In a possible design, the open-type heat dissipation component includes two heat dissipation fans arranged directly above the main body of the PCBA module. The frames of the two heat dissipation fans are fixedly connected. The rotating shafts of the heat dissipation fans penetrate through the outer walls of the corresponding mounting brackets and are fixedly provided with synchronous pulleys. The two synchronous pulleys are connected by the same synchronous belt.

[0011] In a possible design, a temperature sensor for supporting use is arranged on one side of the control chip on the main body of the PCBA module. One of the heat dissipation fans is electrically connected to the input power supply of the main body of the PCBA module through a wire.

[0012] In a possible design, U-shaped heat dissipation fins are fixedly arranged on both sides of the frames of the two heat dissipation fans. The two bottom ends of the U-shaped heat dissipation fins are fixedly connected to the surface edges of the main body of the PCBA module.

[0013] In a possible design, the U-shaped heat dissipation fins are made of graphene material.

[0014] In a possible design, the heat dissipation vias are subjected to solder mask treatment to prevent solder paste loss.

[0015] In a possible design, the diameter of the heat dissipation vias is 0.3 mm.

[0016] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present invention.

[0017] The working principle and usage process of this technical solution are as follows:

[0018] When the smart wearable device is working, the electronic components on the main body of the PCBA module will generate heat. This heat is first transferred to the other side of the PCB through the conductive lines and heat dissipation vias on the PCB. At the same time, the temperature sensor monitors the module temperature in real time. When the temperature exceeds the preset threshold, the heat dissipation fans are started. Through the driving action of the synchronous pulleys and the synchronous belt, the two fans rotate synchronously. The cold air blown by the heat dissipation fans passes through the U-shaped heat dissipation fins and exchanges heat with the surface of the module, taking away the heat. The heat dissipation fins made of graphene material further improve the heat dissipation efficiency due to their excellent thermal conductivity. Finally, through the coordinated action of the heat dissipation vias, the heat dissipation fans and the heat dissipation fins, the PCBA module of the smart wearable device can effectively reduce the temperature and ensure the stable operation of the device.

[0019] The present invention has the following beneficial effects:

[0020] The utility model designs an open - type heat dissipation component, including two synchronously operating cooling fans and U - shaped graphene heat dissipation fins, which significantly improves the heat dissipation efficiency of the PCBA module. This helps to reduce the operating temperature of key components such as control chips, extend their service life and improve the device performance.

[0021] In the utility model, the diameter of the heat dissipation through - holes is set to 0.3 mm, which not only ensures good heat dissipation effect, but also avoids the influence of too large hole diameter on the strength and electrical performance of the circuit board. And the heat dissipation through - holes are subjected to solder mask treatment, effectively preventing the loss of solder paste during the PCB board manufacturing process, ensuring the stability and reliability of the circuit board. Brief Description of the Drawings

[0022] Figure 1 It is a three - dimensional structure schematic diagram of a PCBA module of an intelligent wearable device provided by an embodiment of the utility model;

[0023] Figure 2 It is a schematic diagram of the structure of another perspective of a PCBA module of an intelligent wearable device provided by an embodiment of the utility model;

[0024] Figure 3 It is a disassembled structure schematic diagram of a PCBA module of an intelligent wearable device provided by an embodiment of the utility model;

[0025] Figure 4 It is a schematic diagram of the open - type heat dissipation component structure of a PCBA module of an intelligent wearable device provided by an embodiment of the utility model.

[0026] Reference Numerals: 1. PCBA module main body; 2. Control chip; 3. Temperature sensor; 4. Screw; 5. Cooling fan; 6. Synchronous pulley; 7. Timing belt; 8. U - shaped heat dissipation fin; 9. Heat dissipation through - hole. Detailed Embodiment

[0027] Next, the technical solutions in the embodiments of the utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the utility model.

[0028] In the description of the utility model, it should be understood that the terms "opening", "upper", "middle", "length", "inner", etc. indicating orientation or positional relationship are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the utility model.

[0029] To keep the following description of the embodiments of the present utility model clear and concise, the detailed descriptions of known functions and known components are omitted in the present utility model.

[0030] Embodiment 1

[0031] Please refer to Figures 1-4 , a PCBA module, comprising:

[0032] The PCBA module main body 1 and an open - type heat dissipation component. The PCBA module main body 1 is the core part of the whole module. Four screws 4 are respectively and fixedly installed at the four corners of its bottom. The design of these screws 4 facilitates the cooperation with the corresponding nuts to achieve the stable installation of the module in the smart wearable device. In addition, a plurality of heat dissipation through - holes 9 with a diameter of 0.3 mm are designed on the PCBA module main body 1, and these through - holes increase the air circulation inside the module;

[0033] The open - type heat dissipation component is arranged directly above the PCBA module main body 1 to improve the heat dissipation efficiency of the module. Specifically, the component includes two cooling fans 5. The frames of these two cooling fans 5 are connected to each other through fixed connectors to form an integral structure. The rotating shaft of each cooling fan 5 penetrates the outer wall of its corresponding mounting bracket, and a synchronous pulley 6 is fixedly installed on the rotating shaft. The two synchronous pulleys 6 are connected by a synchronous belt 7 for transmission connection to realize the synchronous operation of the two cooling fans 5, thereby improving the uniformity and efficiency of heat dissipation;

[0034] To further optimize the heat dissipation effect, a supporting temperature sensor 3 is also arranged on one side of the control chip 2 of the PCBA module main body 1. This temperature sensor 3 can real - time monitor the temperature of the control chip 2 and its surrounding area, and transmit signals to the control system as needed to control the on - off of the cooling fan 5. One of the cooling fans 5 is directly electrically connected to the input power supply of the PCBA module main body 1 through a wire to realize the basic power supply;

[0035] In addition, to increase the heat dissipation area and efficiency, U - shaped heat dissipation fins 8 are respectively and fixedly installed on both sides of the frames of the two cooling fans 5. The two bottom ends of these U - shaped heat dissipation fins 8 are firmly connected to the surface edge of the PCBA module main body 1 to form an extended heat dissipation surface.

[0036] This application can be used for the circuit board of smart wearable devices, and can also be used in other fields applicable to this application.

[0037] Embodiment 2

[0038] Improved on the basis of Embodiment 1:

[0039] A PCBA module of a smart wearable device, which is applied in the field of circuit boards;

[0040] Please refer to Figure 3 , the U-shaped heat dissipation fin 8 is made of graphene. Due to its excellent thermal conductivity, this material can more effectively conduct heat from the PCBA module body 1 to the air, thereby further improving the heat dissipation effect;

[0041] The heat dissipation vias 9 are subjected to solder mask treatment to prevent the loss of solder paste during the manufacturing process and ensure the stability and reliability of the circuit board.

[0042] However, as is well known to those skilled in the art, the working principles and wiring methods of the control chip 2, the temperature sensor 3, and the cooling fan 5 are common knowledge, and they all belong to conventional means or well-known common knowledge. Therefore, they will not be elaborated here. Those skilled in the art can make any selection according to their needs or convenience.

[0043] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present utility model, and all of them should be covered by the protection scope of the present utility model; without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A PCBA module of an intelligent wearable device, characterized in that, Including: A PCBA module main body (1), screws (4) for cooperating with nuts for installation and fixation are fixedly arranged at the four corners of the bottom of the PCBA module main body (1), and a plurality of heat dissipation through holes (9) are arranged on the PCBA module main body (1); An open - type heat dissipation component, which is arranged above the PCBA module main body (1) and is used to improve the heat dissipation effect of the PCBA module main body (1).

2. The PCBA module of an intelligent wearable device according to claim 1, characterized in that, The open - type heat dissipation component includes two cooling fans (5) arranged directly above the PCBA module main body (1), the frames of the two cooling fans (5) are fixedly connected, the rotating shafts of the cooling fans (5) penetrate through the outer walls of the corresponding mounting brackets and are fixedly provided with synchronous wheels (6), and the two synchronous wheels (6) are drivingly connected by the same synchronous belt (7).

3. The PCBA module of an intelligent wearable device according to claim 2, characterized in that, A temperature sensor (3) for supporting use is arranged on one side of the control chip (2) on the PCBA module main body (1), and one of the cooling fans (5) is electrically connected to the input power supply of the PCBA module main body (1) through a wire.

4. The PCBA module of an intelligent wearable device according to claim 2, characterized in that, U - shaped heat dissipation fins (8) are fixedly arranged on both sides of the frames of the two cooling fans (5), and the two bottom ends of the U - shaped heat dissipation fins (8) are fixedly connected to the surface edges of the PCBA module main body (1).

5. The PCBA module of an intelligent wearable device according to claim 4, characterized in that, The U - shaped heat dissipation fins (8) are made of graphene material.

6. The PCBA module of an intelligent wearable device according to claim 1, characterized in that, The heat dissipation through holes (9) are subjected to solder mask treatment to prevent solder paste loss.

7. The PCBA module of an intelligent wearable device according to claim 6, characterized in that, The diameter of the heat dissipation through holes (9) is 0.3 mm.

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