IGBT DBC substrate cleaning carrier capable of adjusting angle

Abstract

The utility model relates to an IGBT DBC substrate cleaning carrier capable of adjusting the angle, which comprises a plurality of identical profile frames, and the adjacent profile frames are fixedly attached and connected. The profile frame comprises a first profile plate, a second profile plate, a plurality of middle frames used for containing base plates and a plurality of connecting parts used for installing the middle frames. The first profile plate and the second profile plate are arranged in parallel, the connecting parts are connected between the bottom of the first profile plate and the bottom of the second profile plate in parallel at intervals, and the bottom of the middle frame is hinged to the connecting parts in a damping mode. According to the DBC substrate cleaning device, the angle of the middle frame is controlled through the connecting part, the DBC substrate inserted into the middle frame can be cleaned in all directions, water on the cleaned DBC substrate can flow away quickly and cannot be left on the surface of a product, and drying is easy.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to an IGBT DBC substrate cleaning carrier capable of adjusting the angle. Background Art

[0002] The traditional IGBT DBC substrate cleaning carrier is in the shape of a tray, and two clamping pieces need to be made. One clamping piece is used to place the product, and the other clamping piece positions and magnetically clamps the product. Since the sizes of the two clamping pieces are fixed, the traditional IGBT DBC substrate cleaning carrier can only place products of one specification, and the cleaning angle of the product cannot be adjusted during the cleaning process. It can only be placed horizontally for cleaning, resulting in residual flux on the cleaned product, which leads to poor subsequent wire bonding quality, and there is a lot of liquid residue on the product after cleaning and it is not easy to dry.

[0003] Therefore, aiming at the problem that the IGBT DBC substrate cleaning carrier in the prior art can only place products of one specification and is difficult to adjust the cleaning angle, resulting in residual flux on the product and poor subsequent wire bonding quality, an IGBT DBC substrate cleaning carrier capable of adjusting the angle is needed. Summary of the Utility Model

[0004] The utility model provides an IGBT DBC substrate cleaning carrier capable of adjusting the angle, which solves the problems of only being able to place products of one specification and being difficult to adjust the cleaning angle, resulting in residual flux on the product and poor subsequent wire bonding quality.

[0005] The utility model is realized by the following technical solutions: it includes a plurality of identical profile frames, and the adjacent profile frames are fixedly and fittingly connected; the profile frame includes a first profile plate, a second profile plate, a plurality of intermediate frames for placing the substrate and a plurality of connecting parts for installing the intermediate frames; the first profile plate and the second profile plate are placed side by side and in parallel, and a plurality of the connecting parts are connected in parallel and at intervals between the bottoms of the first profile plate and the second profile plate, and the bottom of the intermediate frame is damped and hinged on the connecting part.

[0006] In order to better realize the utility model, further optimization is made in the above structure, and both the first profile plate and the second profile plate are hollow plates.

[0007] In order to better realize the utility model, further optimization is made in the above structure, and the four corners of the first profile plate and the four corners of the second profile plate are fixedly connected by four connecting rods to form a square cavity.

[0008] In order to better realize the utility model, further optimization is made in the above structure, and the connecting part is a damping hinge shaft.

[0009] To better implement the present utility model, further optimization is made to the above structure. The middle frame includes a first rod, a second rod, and a third rod. The first rod and the second rod are respectively perpendicular to both ends of the third rod, such that the middle frame is a square frame with an open upper end. The inner walls of the first rod, the second rod, and the third rod are all provided with card slots, and a through hole is provided at the bottom of the third rod. The third rod is damped and hinged between the first profile plate and the second profile plate through the through hole.

[0010] To better implement the present utility model, further optimization is made to the above structure. The connecting part sequentially passes through the through hole at the bottom of the plate body of the first profile plate, the through hole at the bottom of the third rod of the middle frame, and the through hole at the bottom of the plate body of the second profile plate to realize the connection of the three.

[0011] To better implement the present utility model, further optimization is made to the above structure. The model of the middle frame can be set according to the size of the DBC substrate.

[0012] To better implement the present utility model, further optimization is made to the above structure. The number of middle frames is the same as the number of connecting parts.

[0013] To better implement the present utility model, further optimization is made to the above structure. The interval between each connecting part is greater than or equal to the length of the middle frame.

[0014] The present utility model has the following beneficial effects compared with the prior art:

[0015] The IGBT DBC substrate cleaning carrier capable of adjusting the angle provided by the present utility model includes a plurality of identical profile frames, which are fixedly and adhesively connected between adjacent profile frames; the profile frame includes a first profile plate, a second profile plate, a plurality of middle frames for placing the substrate, and a plurality of connecting parts for installing the middle frames; the first profile plate and the second profile plate are placed side by side and parallel, and a plurality of connecting parts are connected in parallel and at intervals between the bottoms of the first profile plate and the second profile plate, and the bottom of the middle frame is damped and hinged on the connecting part. With this structure, the DBC substrate can be cleaned in all directions, and the water on the DBC substrate after cleaning can also flow away quickly without remaining on the product surface, and it is easy to dry. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is the front view of an IGBT DBC substrate cleaning carrier capable of adjusting the angle in the present utility model;

[0018] Figure 2 It is a side view of a cleaning carrier for an IGBT DBC substrate capable of adjusting the angle in the present utility model.

[0019] Figure 3 It is a schematic diagram of the middle frame in the present utility model.

[0020] In the figure:

[0021] 1 - First profile plate; 2 - Second profile plate; 3 - Middle frame; 4 - Connecting part; 5 - First rod; 6 - Second rod; 7 - Third rod; 8 - Card slot. Specific implementation manner

[0022] To make the purpose, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other implementation manners obtained by those of ordinary skill in the art without creative efforts based on the embodiments in the present utility model belong to the scope protected by the present utility model.

[0023] In the description of the present utility model, it should be noted that unless otherwise stated, the meaning of "a plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present utility model, it should also be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0025] Embodiment 1:

[0026] In this embodiment, a cleaning carrier for an IGBT DBC substrate capable of adjusting the angle, such as Figure 1 , Figure 2As shown, it includes multiple identical profile frames, which are fixedly and fittingly connected between adjacent profile frames; the profile frame includes a first profile plate, a second profile plate, multiple intermediate frames for placing the substrate, and multiple connecting parts for installing the intermediate frames; the first profile plate and the second profile plate are placed side by side and parallel, and multiple connecting parts are connected in parallel and at intervals between the bottoms of the first profile plate and the second profile plate, and the bottom of the intermediate frame is damping-hinged on the connecting part.

[0027] With this structure, the DBC substrate can be cleaned in all directions, and the water on the DBC substrate after cleaning can also flow away quickly without remaining on the product surface, and it is easy to dry. The model of the intermediate frame can be set according to the size of the DBC substrate, so that this cleaning carrier can place DBC substrates of various specifications.

[0028] Furthermore, both the first profile plate 1 and the second profile plate 2 are hollow plates, which is convenient for the operator to observe the cleaning degree; the four corners of the first profile plate 1 and the four corners of the second profile plate 2 are fixedly connected by four connecting rods to form a square cavity. Multiple intermediate frames 3 are all square frames with open upper ends, and clamping grooves 8 are provided along the inner walls of the intermediate frames 3, and the DBC substrate can be inserted into the frame through the clamping grooves 8.

[0029] The connecting parts 4 are all damping hinge shafts, which are rotatable and angle-fixable rotating shafts, and can adjust and fix the relative angle between the intermediate frame 3 and the profile plate.

[0030] The intermediate frame 3 includes a first rod 5, a second rod 6 and a third rod. The first rod 5 and the second rod 6 are respectively vertically arranged at both ends of the third rod 7 to form a square frame with an open upper end. Clamping grooves 8 are provided on the inner walls of the first rod 5, the second rod 6 and the third rod 7 to insert the DBC substrate, and through holes are provided at the bottom of the third rod 7 for installing the connecting parts 4. Specifically, the DBC substrate can be inserted into the intermediate frame 3 through the clamping grooves 8; the connecting parts 4 sequentially pass through the through holes at the bottom of the plate body of the first profile plate 1, the through holes at the bottom of the third rod 7 of the intermediate frame 3 and the through holes at the bottom of the plate body of the second profile plate 2 to realize the connection of the three. The third rod is damping-hinged between the first profile plate and the second profile plate through the through hole.

[0031] It should be noted that when using the substrate cleaning carrier in this embodiment to clean the substrate, the angle of the intermediate frame 3 is controlled through the connecting part 4, so that the DBC substrate inserted into the intermediate frame 3 through the clamping groove 8 can be cleaned in all directions, and the water on the DBC substrate after cleaning can also flow away quickly without remaining on the product surface, and it is easy to dry.

[0032] The model of the intermediate frame 3 can be set according to the size of the DBC substrate, so that this cleaning carrier can place DBC substrates of various specifications.

[0033] Multiple profile frames can hold more intermediate frames 3, enabling the vehicle to clean multiple DBC substrates simultaneously and saving cleaning time.

[0034] The number of intermediate frames 3 is the same as the number of connecting parts 4. Only when the numbers correspond can each intermediate frame 3 and connecting part 4 be used.

[0035] The interval between each pair of connecting parts 4 is greater than or equal to the length of the intermediate frame 3. This setting ensures that adjacent intermediate frames 3 do not block each other during cleaning.

[0036] As described above, only the specific embodiments of the present invention are given, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An IGBT DBC substrate cleaning carrier capable of adjusting the angle, characterized in that: It includes multiple identical profile frames, which are fixedly and fittingly connected between adjacent profile frames; the profile frame includes a first profile plate (1), a second profile plate (2), multiple intermediate frames (3) for placing substrates, and multiple connecting parts (4) for installing the intermediate frames; the first profile plate (1) and the second profile plate (2) are placed side by side and parallel, and multiple of the connecting parts are connected in parallel and at intervals between the bottoms of the first profile plate and the second profile plate, and the bottom of the intermediate frame is damped and hinged on the connecting part.

2. The cleaning carrier for IGBT DBC substrate capable of adjusting the angle according to claim 1, characterized in that: Both the first profile plate (1) and the second profile plate (2) are hollow plates.

3. The cleaning carrier for IGBT DBC substrate capable of adjusting the angle according to claim 2, wherein: The four corners of the first profile plate (1) and the four corners of the second profile plate (2) are fixedly connected by four connecting rods to form a square cavity.

4. The cleaning carrier for IGBT DBC substrate capable of adjusting the angle according to claim 3, wherein: The connecting part (4) is a damped hinge shaft.

5. A cleaning carrier for an IGBT DBC substrate capable of adjusting the angle according to any one of claims 1-4, characterized in that: The intermediate frame (3) includes a first rod (5), a second rod (6) and a third rod (7). The first rod (5) and the second rod (6) are respectively arranged perpendicular to both ends of the third rod (7). The inner walls of the first rod (5), the second rod (6) and the third rod (7) are all provided with clamping grooves (8). The bottom of the third rod (7) is provided with a through hole, and the third rod is damped and hinged between the first profile plate and the second profile plate through the through hole.

6. The cleaning carrier for an IGBT DBC substrate capable of adjusting the angle according to claim 5, characterized in that: The number of the intermediate frames (3) is the same as the number of the connecting parts (4).

7. The cleaning carrier for IGBT DBC substrate capable of adjusting the angle according to claim 6, characterized in that: The intervals between each of the connecting parts (4) are the same and greater than or equal to the length of the intermediate frame (3).

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