Semiconductor carrying mechanical arm
By designing a semiconductor handling robot arm with clamping and lubrication mechanism, the semiconductor damage caused by unstable clamping in the prior art is solved, and efficient and safe semiconductor handling is achieved.
Patent Information
- Application Number
- CN202422089630.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-08-28
AI Technical Summary
During the existing semiconductor handling process, it is easy to cause unstable clamping due to mechanical arm deviation, resulting in semiconductor damage.
A semiconductor handling robot arm is designed, which adopts a clamping mechanism and a lubrication mechanism, including telescopic cylinders, mini cylinders, fixed clamping blocks and movable clamping blocks. The conveying arm is driven to accurately move through the rotary column, and the rotating column is lubricated through the lubrication mechanism to ensure clamping stability.
It achieves accuracy and stability during semiconductor handling, prevents slipping or falling, and ensures a safe and efficient handling process.
Smart Images
Figure CN223115207U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor handling robotic arm. Background Art
[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. From the perspective of both technology and economic development, the importance of semiconductors is very great. Most electronic products, such as the core units in computers, mobile phones or digital recorders, are extremely closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials. Therefore, a semiconductor handling robotic arm is particularly needed.
[0003] However, in the process of handling most existing semiconductors, vacuum adsorption technology is usually used. However, if there are some deviations or gaps in the robotic arm during alignment adsorption, it will lead to unstable clamping, thus causing damage to the semiconductors being handled. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a semiconductor handling robotic arm to solve the problem that most existing display screens cannot be fixed on the back of car seats, making it inconvenient for rear-seat passengers to observe the display screen. For younger passengers, they may be active in the back seat due to their high energy, thus causing certain safety problems as described in the above background art.
[0005] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor handling robotic arm, including a fixed platform, a rotating column is installed on the upper surface of the fixed platform, a handling arm is fixedly connected to the upper surface of the rotating column, a clamping mechanism is arranged on one side surface of the handling arm, and a lubricating mechanism is arranged on the outer surface of the rotating column;
[0006] Preferably, the outer surface size of the telescopic cylinder matches the inner surface size of the first receiving groove, and the outer surface size of the connecting block matches the inner surface size of the protective shell.
[0007] Preferably, the micro-cylinders are installed at equal intervals on the inner surface of the second receiving groove, and the anti-slip grooves are opened at equal intervals on the lower surface of the fixed clamping block.
[0008] Preferably, the size of the fixed clamping block is the same as that of the movable clamping block, and the outer surface size of the fixing plate matches the inner surface size of the second receiving groove.
[0009] Preferably, the outer surface size of the rotating column matches the inner surface size of the oil storage box, and the oil outlet holes are equally spaced on the inner surface of the oil storage box.
[0010] Preferably, the outer surface size of the oil-absorbing cotton matches the inner surface size of the oil storage box, and the outer surface size of the oil storage box matches the inner surface size of the protective baffle.
[0011] Preferably, the clamping mechanism includes a first storage groove, a telescopic cylinder, a protective shell, a connecting block, a second storage groove, a fixed clamping block, an anti-slip groove, a micro cylinder, a fixing plate and a movable clamping block. A first storage groove is formed on one side surface of the handling arm. The telescopic cylinder is installed on the inner surface of the first storage groove. A protective shell is fixedly connected to one side surface of the first storage groove. A connecting block is fixedly connected to one side surface of the telescopic cylinder. A second storage groove is formed on one side surface of the connecting block. A fixed clamping block is fixedly connected to one side surface of the connecting block. An anti-slip groove is formed on the lower surface of the fixed clamping block. The micro cylinder is installed on the inner surface of the second storage groove. A fixing plate is fixedly connected to the upper surface of the micro cylinder. A movable clamping block is fixedly connected to one side surface of the fixing plate.
[0012] Preferably, the lubricating mechanism includes an oil storage box, an oil outlet hole, an oil-absorbing cotton, an oil injection groove, a protective baffle and a through hole. The oil storage box is installed on the outer surface of the rotating column. The oil outlet holes are formed on the inner surface of the oil storage box. The oil-absorbing cotton is placed on the inner surface of the oil storage box. The oil injection groove is formed on the outer surface of the oil storage box. The protective baffle is installed on the outer surface of the oil storage box. The through hole is formed on the outer surface of the protective baffle.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: For this semiconductor handling robotic arm, through the settings of the first storage groove, telescopic cylinder, protective shell, connecting block, second storage groove, fixed clamping block, anti-slip groove, micro cylinder, fixed plate, and movable clamping block, when it is necessary to handle a semiconductor, the handling arm above the fixed platform is started. The handling arm rotates and moves through the rotating column. At this time, the telescopic cylinder in the first storage groove pushes the connecting block to move the fixed clamping block above the item to be handled. Then, the micro cylinder in the second storage groove inside the connecting block drives the fixed plate to be pushed upward, so that it drives the movable clamping block to clamp the item. Then, the handling arm drives the item to move through the rotating column to ensure the accuracy and stability during the handling process. When the handling arm moves to the designated position, the fixed clamping block and the movable clamping block will tightly clamp the semiconductor to prevent it from sliding or falling during the handling process. After the handling is completed, the handling arm will safely place the semiconductor at the designated position. At this time, the fixed clamping block and the movable clamping block will automatically loosen and release the semiconductor. The entire handling process is both fast and efficient, ensuring the safety and stability of the semiconductor during the handling process. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 FIG. is a schematic diagram of the overall external structure of the present utility model;
[0015] Figure 2 FIG. is a schematic diagram of the clamping mechanism structure of the present utility model;
[0016] Figure 3 FIG. is a schematic diagram of the structure of the oil storage box and the protective baffle of the present utility model used in cooperation;
[0017] Figure 4 For the present utility model Figure 3 Schematic diagram of the enlarged structure at position A.
[0018] In the figure: 1, fixed platform; 2, rotating column; 3, handling arm; 4, clamping mechanism; 401, first storage groove; 402, telescopic cylinder; 403, protective shell; 404, connecting block; 405, second storage groove; 406, fixed clamping block; 407, anti-slip groove; 408, micro cylinder; 409, fixed plate; 410, movable clamping block; 5, lubricating mechanism; 501, oil storage box; 502, oil outlet hole; 503, oil absorbing cotton; 504, oil injection groove; 505, protective baffle; 506, through hole. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0020] Please refer to Figures 1-4 , the present invention provides a technical solution: a semiconductor handling robotic arm, including a fixed platform 1, a rotating column 2 is installed on the upper surface of the fixed platform 1, a handling arm 3 is fixedly connected to the upper surface of the rotating column 2, a clamping mechanism 4 is arranged on one side surface of the handling arm 3, and a lubricating mechanism 5 is arranged on the outer surface of the rotating column 2;
[0021] The clamping mechanism 4 includes a first receiving groove 401, a telescopic cylinder 402, a protective shell 403, a connecting block 404, a second receiving groove 405, a fixed clamping block 406, an anti-slip groove 407, a micro cylinder 408, a fixing plate 409 and a movable clamping block 410. A first receiving groove 401 is opened on one side surface of the handling arm 3, a telescopic cylinder 402 is installed on the inner surface of the first receiving groove 401, a protective shell 403 is fixedly connected to one side surface of the first receiving groove 401, a connecting block 404 is fixedly connected to one side surface of the telescopic cylinder 402, a second receiving groove 405 is opened on one side surface of the connecting block 404, a fixed clamping block 406 is fixedly connected to one side surface of the connecting block 404, an anti-slip groove 407 is opened on the lower surface of the fixed clamping block 406, a micro cylinder 408 is installed on the inner surface of the second receiving groove 405, a fixing plate 409 is fixedly connected to the upper surface of the micro cylinder 408, and a movable clamping block 410 is fixedly connected to one side surface of the fixing plate 409. Through the settings of the first receiving groove 401, the telescopic cylinder 402, the protective shell 403, the connecting block 404, the second receiving groove 405, the fixed clamping block 406, the anti-slip groove 407, the micro cylinder 408, the fixing plate 409 and the movable clamping block 410, when it is necessary to handle a semiconductor, the handling arm 3 above the fixed platform 1 is started, and the handling arm 3 rotates and moves through the rotating column 2. At this time, the telescopic cylinder 402 in the first receiving groove 401 pushes the connecting block 404 to move the fixed clamping block 406 above the item to be handled. Then, the micro cylinder 408 in the second receiving groove 405 inside the connecting block 404 drives the fixing plate 409 to push upward, so that it drives the movable clamping block 410 to clamp the item. Then, the handling arm 3 is driven by the rotating column 2 to move the item.
[0022] Further, the lubrication mechanism 5 includes an oil storage box 501, an oil outlet hole 502, an oil-absorbing cotton 503, an oil injection groove 504, a protective baffle 505, and a through hole 506. The oil storage box 501 is installed on the outer surface of the rotating column 2. The inner surface of the oil storage box 501 is provided with the oil outlet hole 502. The oil-absorbing cotton 503 is placed on the inner surface of the oil storage box 501. The outer surface of the oil storage box 501 is provided with the oil injection groove 504. The protective baffle 505 is installed on the outer surface of the oil storage box 501. The outer surface of the protective baffle 505 is provided with the through hole 506. Through the settings of the oil storage box 501, the oil outlet hole 502, the oil-absorbing cotton 503, the oil injection groove 504, the protective baffle 505, and the through hole 506, the oil storage box 501 is installed on the outer side of the rotating column 2. Then, an oil injection tool passes through the through hole 506 on the outer side of the protective baffle 505 to connect it with the oil injection groove 504 for oil injection operation on the oil storage box 501. Then, the lubricating oil starts to seep out through the oil storage hole 502 and is then absorbed by the oil-absorbing cotton 503. During the rotation of the rotating column 2, it is lubricated.
[0023] Further, the outer surface size of the telescopic cylinder 402 matches the inner surface size of the first storage groove 401, and the outer surface size of the connecting block 404 matches the inner surface size of the protective shell 403. Through the setting of the telescopic cylinder 402, the rapid telescoping and positioning of the device can be realized, thereby achieving the stable support and flexible adjustment of the device.
[0024] Further, the micro cylinders 408 are installed at equal intervals on the inner surface of the second storage groove 405, and the anti-slip grooves 407 are opened at equal intervals on the lower surface of the fixed clamping block 406. Through the setting of the micro cylinders 408, it is ensured that there is sufficient grasping force when clamping the workpiece, and at the same time, the air pressure of the cylinder is adjusted in real time, so as to achieve precise clamping and releasing actions.
[0025] Further, the size of the fixed clamping block 406 is the same as that of the movable clamping block 410, and the outer surface size of the fixing plate 409 matches the inner surface size of the second storage groove 405. Through the setting of the fixed clamping block 406, it is used in cooperation with the movable clamping block 410 to achieve the clamping and grasping of the semiconductor.
[0026] Further, the outer surface size of the rotating column 2 matches the inner surface size of the oil storage box 501, and the oil outlet holes 502 are opened at equal intervals on the inner surface of the oil storage box 501. Through the setting of the oil storage box 501, the bottom of the oil storage box 501 is designed as an inclined structure to facilitate the smooth flow of the oil to the oil outlet hole 502. This not only ensures sufficient flow but also avoids oil leakage.
[0027] Further, the outer surface size of the oil-absorbing cotton 503 matches the inner surface size of the oil storage box 501, and the outer surface size of the oil storage box 501 matches the inner surface size of the protective baffle 505. Through the arrangement of the oil-absorbing cotton 503, the leaked oil is absorbed and the rotating column 2 is lubricated.
[0028] Working principle: First, when it is necessary to carry a semiconductor, the handling arm 3 above the fixed table 1 is started. The handling arm 3 rotates and moves through the rotating column 2. At this time, the telescopic cylinder 402 in the first receiving groove 401 pushes the connecting block 404 to move the fixed clamping block 406 above the item to be carried. Then, the micro cylinder 408 in the second receiving groove 405 inside the connecting block 404 drives the fixing plate 409 to push upward, so that it drives the movable clamping block 410 to clamp the item. Then, the handling arm 3 is driven by the rotating column 2 to move the item. The oil storage box 501 is installed on the outside of the rotating column 2. Then, an oil injection tool penetrates the through hole 506 on the outside of the protective baffle 505 to connect it with the oil injection groove 504, and an oil injection operation is performed on the oil storage box 501. Then, the lubricating oil starts to seep out through the oil storage hole 502 and is then absorbed by the oil-absorbing cotton 503. During the rotation of the rotating column 2, it is lubricated.
[0029] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor handling robotic arm, comprising a fixed platform (1), characterized in that: Above the upper surface of the fixed table (1), a rotating column (2) is installed. Above the upper surface of the rotating column (2), a handling arm (3) is fixedly connected. On one side surface of the handling arm (3), a clamping mechanism (4) is arranged. On the outer surface of the rotating column (2), a lubricating mechanism (5) is arranged; The clamping mechanism (4) includes a first storage groove (401), a telescopic cylinder (402), a protective shell (403), a connecting block (404), a second storage groove (405), a fixed clamping block (406), an anti-slip groove (407), a micro cylinder (408), a fixing plate (409), and a movable clamping block (410). On one side surface of the handling arm (3), a first storage groove (401) is opened. Inside the inner surface of the first storage groove (401), a telescopic cylinder (402) is installed. On one side surface of the first storage groove (401), a protective shell (403) is fixedly connected. On one side surface of the telescopic cylinder (402), a connecting block (404) is fixedly connected. On one side surface of the connecting block (404), a second storage groove (405) is opened. On one side surface of the connecting block (404), a fixed clamping block (406) is fixedly connected. On the lower surface of the fixed clamping block (406), an anti-slip groove (407) is opened. Inside the inner surface of the second storage groove (405), a micro cylinder (408) is installed. On the upper surface of the micro cylinder (408), a fixing plate (409) is fixedly connected. On one side surface of the fixing plate (409), a movable clamping block (410) is fixedly connected.
2. The semiconductor handling robotic arm according to claim 1, wherein: The outer surface dimension of the telescopic cylinder (402) matches the inner surface dimension of the first storage groove (401), and the outer surface dimension of the connecting block (404) matches the inner surface dimension of the protective shell (403).
3. A semiconductor handling robotic arm according to claim 1, characterized in that: The micro cylinders (408) are installed at equal intervals on the inner surface of the second storage groove (405), and the anti-slip grooves (407) are opened at equal intervals on the lower surface of the fixed clamping block (406).
4. A semiconductor handling robotic arm according to claim 1, wherein: The size of the fixed clamping block (406) is the same as that of the movable clamping block (410), and the outer surface dimension of the fixing plate (409) matches the inner surface dimension of the second storage groove (405).
5. A semiconductor handling robotic arm according to claim 1, characterized in that: The lubricating mechanism (5) includes an oil storage box (501), an oil outlet hole (502), an oil-absorbing cotton (503), an oil injection groove (504), a protective baffle (505), and a through hole (506). On the outer surface of the rotating column (2), an oil storage box (501) is installed. Inside the inner surface of the oil storage box (501), an oil outlet hole (502) is opened. Inside the inner surface of the oil storage box (501), an oil-absorbing cotton (503) is placed. On the outer surface of the oil storage box (501), an oil injection groove (504) is opened. On the outer surface of the oil storage box (501), a protective baffle (505) is installed. On the outer surface of the protective baffle (505), a through hole (506) is opened.
6. A semiconductor handling robotic arm according to claim 5, characterized in that: The outer surface dimensions of the rotating column (2) match the inner surface dimensions of the oil storage box (501), and the oil outlet holes (502) are equally spaced on the inner surface of the oil storage box (501).
7. A semiconductor handling robotic arm according to claim 5, characterized in that: The outer surface dimensions of the oil absorption cotton (503) match the inner surface dimensions of the oil storage box (501), and the outer surface dimensions of the oil storage box (501) match the inner surface dimensions of the protective baffle (505).