Heat dissipation mechanism for gilding press

Abstract

The utility model relates to the technical field of gilding presses, and discloses a heat dissipation mechanism for a gilding press, the heat dissipation mechanism comprises a machining table, a gilding press body, a heat dissipation box and a heat dissipation assembly, the gilding press body is arranged at the top of the machining table and is used for gilding a workpiece, the heat dissipation box is arranged at the bottom of the machining table, and the heat dissipation assembly is arranged on the machining table. A cooling cavity is formed in the upper surface of the heat dissipation box, and the heat dissipation box is provided with a plurality of fixing assemblies used for installing the heat dissipation box on a machining table. High temperature generated by the machining table can be conducted to the two cooling fin sets through the heat conduction copper pipe, air in the cooling cavity can be cooled through the semiconductor chilling plate, heat on the cooling fin sets can be taken away through the air inlet fan and the two exhaust fans, and then the machining table can be rapidly cooled; and the heat dissipation effect is good, the situation that gold stamping process treatment can be conducted after the machining table is cooled is avoided, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of hot stamping machines, and in particular to a heat dissipation mechanism for hot stamping machines. Background Art

[0002] Hot stamping is a special printing process that does not use ink. Hot stamping refers to the process of hot stamping electrochemical aluminum foil onto the surface of the substrate under a certain temperature and pressure. The hot stamping machine is the equipment that completes the hot stamping process.

[0003] The current hot stamping machine needs to use a workbench to carry the substrate, but the heat dissipation performance of the workbench of the existing hot stamping machine is poor. For some workpieces with good thermal conductivity, during the hot stamping process, the heat is transferred to the workbench after a long time of operation, causing the workbench to heat up. When processing workpieces of other materials, it is necessary to wait for the work platform to cool down before the hot stamping process can be carried out, which affects the work progress and thus reduces the work efficiency. Utility Model Content

[0004] In order to solve the problems raised by the above background technology, the present application provides a heat dissipation mechanism for a hot stamping machine.

[0005] The heat dissipation mechanism for a hot stamping machine provided in this application adopts the following technical solution:

[0006] A heat dissipation mechanism for a hot stamping machine, comprising a processing table, a hot stamping machine body, a heat dissipation box and a heat dissipation component;

[0007] The processing table is used to support the workpiece;

[0008] The hot stamping machine body is arranged on the top of the processing table and is used for hot stamping the workpiece;

[0009] The heat dissipation box is arranged at the bottom of the processing table, a cooling cavity is opened on the upper surface of the heat dissipation box, a plurality of fixing components for mounting it on the processing table are arranged on the heat dissipation box, and an inlet fan is fixedly installed on the bottom side of the heat dissipation box;

[0010] The heat dissipation component is arranged inside the heat dissipation box, and the heat dissipation component includes two exhaust fans and two heat sink groups. The two exhaust fans are symmetrically fixedly installed inside the heat dissipation box, and the two heat sink groups are symmetrically fixedly installed on the bottom side of the heat dissipation box. A plurality of heat-conducting copper tubes in contact with the lower surface of the processing table are fixedly installed at equal intervals on the bottom side of the heat dissipation box. One end of the heat-conducting copper tube passes through the heat sink group and the heat dissipation box and extends to the outside of the heat dissipation box. A semiconductor refrigeration sheet is symmetrically passed through and fixedly connected to one side of the heat dissipation box, and the hot end of the semiconductor refrigeration sheet is placed on the outside of the heat dissipation box.

[0011] Preferably, the fixing component includes a bolt and a mounting plate. The mounting plate is fixedly connected to one side of the heat dissipation box, and the bolt is threadedly mounted on the mounting plate and used to fix the heat dissipation box on the processing table.

[0012] Preferably, a knob is fixedly connected to the bottom end of the bolt.

[0013] Preferably, support legs are fixedly connected to the four corners of the lower surface of the processing table.

[0014] Preferably, a plurality of through holes are evenly spaced inside the two heat sink groups.

[0015] In summary, the present application includes the following beneficial technical effects:

[0016] Compared with the prior art, the high temperature generated by the processing table can be conducted to the two heat sink groups through the heat conduction copper tube, the air in the cooling cavity can be cooled by the semiconductor refrigeration sheet, and the heat on the heat sink group can be taken away by the intake fan and the two exhaust fans, so as to quickly cool the processing table, and the heat dissipation effect is good, avoiding the need to wait for the processing table to cool down before the hot stamping process can be carried out, and improving the working efficiency. Description of the Drawings

[0017] Figure 1 is a three-dimensional structure diagram of an embodiment of the application;

[0018] Figure 2 is a structural diagram of the fixing component of an embodiment of the application;

[0019] Figure 3 is a structural diagram of the semiconductor refrigeration sheet of an embodiment of the application;

[0020] Figure 4 is a structural diagram of the intake fan and the exhaust fan of an embodiment of the application;

[0021] Figure 5 is a structural diagram of the heat conduction copper tube and the heat sink group of an embodiment of the application.

[0022] Description of the reference numerals: 1, processing table; 2, hot stamping machine body; 3, support leg; 4, exhaust fan; 5, heat dissipation box; 6, semiconductor refrigeration sheet; 7, bolt; 8, mounting plate; 9, heat conduction copper tube; 10, heat sink group; 11, through hole; 12, intake fan; 13, cooling cavity; 14, knob. Detailed Description of the Invention

[0023] The following will further describe the present application in detail Figures 1-5 with reference to the attached

[0024] This application embodiment discloses a heat dissipation mechanism for a hot stamping machine. Refer toFigures 1-5 , a heat dissipation mechanism for a hot stamping machine, comprising a processing table 1, a hot stamping machine body 2, a heat dissipation box 5 and a heat dissipation component;

[0025] The processing table 1 is used to support the workpiece;

[0026] The hot stamping machine body 2 is arranged on the top of the processing table 1 and is used for hot stamping the workpiece;

[0027] The heat sink 5 is arranged at the bottom of the processing table 1, and a cooling cavity 13 is opened on the upper surface of the heat sink 5. The heat sink 5 is provided with a plurality of fixing components for mounting it on the processing table 1, and the fixing components include bolts 7 and a mounting plate 8. The mounting plate 8 is fixedly connected to one side of the heat sink 5. The bolts 7 are threadedly mounted on the mounting plate 8 and are used to fix the heat sink 5 on the processing table 1. The bottom end of the bolts 7 is fixedly connected with a knob 14.

[0028] The heat dissipation component is arranged inside the heat dissipation box 5, and the heat dissipation component includes two exhaust fans 4 and two heat sink groups 10. The two exhaust fans 4 are symmetrically fixedly installed inside the heat dissipation box 5, and the two heat sink groups 10 are symmetrically fixedly installed on the bottom side of the heat dissipation box 5. A plurality of heat-conducting copper tubes 9 in contact with the lower surface of the processing table 1 are fixedly installed at equal intervals on the bottom side of the heat dissipation box 5. One end of the heat-conducting copper tube 9 passes through the heat sink group 10 and the heat dissipation box 5 and extends to the outside of the heat dissipation box 5. A semiconductor cooling sheet 6 is symmetrically passed through and fixedly connected on one side of the heat dissipation box 5. The hot end of the semiconductor cooling sheet 6 is placed on the outside of the heat dissipation box 5. An inlet fan 12 is fixedly installed on the bottom side of the heat dissipation box 5.

[0029] When in use, the electrical components appearing in the present application are all externally connected to the power supply and the control switch, and the heat sink 5 is moved from one side of the processing table 1 to its bottom. When the heat sink 5 is located directly below the processing table 1, the bolts 7 are driven to rotate by a plurality of knobs 14 to fix the heat sink 5 and the mounting plate 8 to the bottom of the processing table 1, and the top of the heat-conducting copper tube 9 can also fit tightly to the bottom of the processing table 1. Then the workpiece to be processed can be placed on the processing table 1, and the workpiece can be hot-stamped by the hot stamping machine body 2. After the processing table 1 has been used for a period of time, the temperature of its surface will increase. The high temperature generated by the processing table 1 can be conveniently conducted through a plurality of heat-conducting copper tubes 9. The heat-conducting copper tubes 9 can conveniently export the heat to the two heat sink groups 10. By starting the inlet fan 12, air can be transported to the cooling chamber 13. By controlling the operation of the semiconductor refrigeration plate 6, the air in the cooling chamber 13 can be cooled. By starting the exhaust fan 4, the heat in the cold heat sink group 10 can be taken away, thereby accelerating the cooling of the two heat sink groups 10.

[0030] In this process, the high temperature generated by the processing table 1 can be conducted to the two heat sink groups 10 through the heat-conducting copper tube 9. The air in the cooling cavity 13 can be cooled by the semiconductor refrigeration sheet 6, and the heat on the heat sink groups 10 can be taken away through the intake fan 12 and the two exhaust fans 4. Thus, the processing table 1 can be quickly cooled, and the heat dissipation effect is good, avoiding the need to wait for the processing table 1 to cool down before the hot stamping process can be carried out, improving work efficiency.

[0031] Referring to Figure 1 and Figure 2 , support legs 3 are fixedly connected to the four corners of the lower surface of the processing table 1, and the processing table 1 can be supported by the support legs 3.

[0032] Referring to Figure 3 and Figure 5 , a plurality of through holes 11 are equally spaced inside the two heat sink groups 10, and the through holes 11 can accelerate the air flow to cool the two heat sink groups 10.

[0033] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, and can also be the communication inside two components. It can be directly connected. "Up", "down", "left", "right", etc. are only used to represent the relative position relationship. When the absolute position of the described object changes, the relative position relationship may change;

[0034] Second: In the attached drawings of the disclosed embodiments of the present utility model, only the structures related to the disclosed embodiments are involved. Other structures can refer to the general design. Without conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0035] Finally: The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

[0036] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A heat dissipation mechanism for a hot stamping machine, characterized in that: It includes a processing table (1), a hot stamping machine body (2), a heat dissipation box (5) and a heat dissipation component; The processing table (1) is used to support the workpiece; The hot stamping machine body (2) is arranged on the top of the processing table (1) and is used for hot stamping the workpiece; The heat dissipation box (5) is arranged at the bottom of the processing table (1). A cooling cavity (13) is opened on the upper surface of the heat dissipation box (5). Multiple fixing components for installing it on the processing table (1) are arranged on the heat dissipation box (5). An intake fan (12) is fixedly installed on the bottom side inside the heat dissipation box (5); The heat dissipation component is arranged inside the heat dissipation box (5). The heat dissipation component includes two exhaust fans (4) and two heat sink groups (10). The two exhaust fans (4) are symmetrically and fixedly installed inside the heat dissipation box (5). The two heat sink groups (10) are symmetrically and fixedly installed on the bottom side inside the heat dissipation box (5). A plurality of heat conduction copper tubes (9) that are in contact with the lower surface of the processing table (1) are equidistantly and fixedly installed on the bottom side inside the heat dissipation box (5). One end of the heat conduction copper tube (9) penetrates through the heat sink group (10) and the heat dissipation box (5) and then extends to the outside of the heat dissipation box (5). A semiconductor refrigeration sheet (6) is symmetrically and fixedly connected through one side of the heat dissipation box (5). The hot end of the semiconductor refrigeration sheet (6) is placed outside the heat dissipation box (5).

2. The heat dissipation mechanism for a gilding machine according to claim 1, characterized in that: The fixing component includes a bolt (7) and a mounting plate (8). The mounting plate (8) is fixedly connected to one side of the heat dissipation box (5). The bolt (7) is threadedly installed on the mounting plate (8) and is used to fix the heat dissipation box (5) on the processing table (1).

3. The heat dissipation mechanism for a gilding machine according to claim 2, characterized in that: The bottom end of the bolt (7) is fixedly connected with a knob (14).

4. The heat dissipation mechanism for a gilding machine according to claim 1, characterized in that: Support legs (3) are fixedly connected to the four corners of the lower surface of the processing table (1).

5. A heat dissipation mechanism for a gilding machine according to claim 1, characterized in that: A plurality of through holes (11) are equidistantly opened inside the two heat sink groups (10).

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