Double-refrigeration-chip heat dissipation device of high-light-transmission closed light machine

Abstract

The utility model discloses a double-refrigeration chip heat dissipation device of a high-light-transmission closed ray machine, which comprises an installation shell, an installation groove is arranged in the installation shell, a display screen assembly is installed in the installation groove, a hot air channel and a cold air channel are arranged on two sides of the installation groove, and the hot air channel and the cold air channel are communicated with the installation groove. An LED light source is arranged at the bottom of the installation shell, a heat source diffusion area is arranged at the front end of the LED light source, a first refrigerating part is arranged on the end side of the LED light source, a fixing groove is further formed in the installation shell, and a second refrigerating part is installed in the fixing groove and located above the display screen assembly. According to the utility model, heat insulation is adopted to reduce a part of heat conversion, semiconductor chilling plates at the front and rear ends of the liquid crystal display screen are matched with a side air inlet turbine fan to blow cold air to the front and rear sides of the liquid crystal display screen, and hot air is discharged out of an optical machine through heat dissipation fins matched with a heat dissipation fan, so that the structure can achieve rapid cooling; meanwhile, along with continuous refrigeration of the two channels, temperature balance of the front and rear ends of the ray machine is kept.

Description

Technical Field

[0001] The present invention belongs to the technical field of double-refrigeration chip heat dissipation devices, and particularly relates to a double-refrigeration chip heat dissipation device for a high-transparency sealed optical engine. Background Art

[0002] During the operation of the optical engine module in a projection device, due to physical property limitations, the light source module will convert electrical energy into light energy and heat energy during operation. The heat energy is usually manifested as an increase in the temperature of the object. Due to the influence of the material, packaging material, and process of the current light source chip, components in the light source module, such as the PN junction in a light-emitting diode light source, usually have risks such as a decrease in the light efficiency of the light source module, color temperature drift, forward voltage (VF value) drift, and even burnout of electronic components when the temperature rises.

[0003] Currently, in order to solve the problem that the light source in a projection optical engine is prone to overheating, existing solutions usually choose to reduce the heat generation of the light source. For example, reducing the number of light sources such as light-emitting diodes in the light source, increasing the area of the light source panel, or directly using cold light sources or fluorescent light sources with lower thermal efficiency. Most of these improvements are targeted at the light source. However, such improvements will bring problems such as an unsatisfactory light-emitting effect of the light source and an increase in cost.

[0004] Chinese Patent "A Heat Dissipation Module Applied to a Projection Optical Engine" CN202110615225.8, the heat dissipation module includes: at least one heat pipe and an aluminum profile radiator. The heat generation end of at least one heat pipe is arranged on the backlight side of the light source module of the projection optical engine, and the condensation end of the at least one heat pipe is fixedly arranged in the aluminum profile radiator. The heat dissipation of the light source module in the projection optical engine is realized through the heat pipe and the aluminum profile radiator. The heat dissipation module provided by the embodiment of the present invention has simple manufacturing process, low cost, low thermal resistance, and good reliability.

[0005] Chinese Patent "A Heat Dissipation Structure for a Projection Optical Engine Liquid Crystal Screen" CN202110060175.1, includes a machine shell. Along the optical path channel in the machine shell, a first lens, a liquid crystal screen, and a second lens are sequentially arranged. The space between the first lens and the second lens forms a sealed cavity through the machine shell. An opening is arranged on the wall of the cavity in the machine shell, and a semiconductor refrigeration sheet is arranged at the opening and seals the opening. The refrigerating surface of the semiconductor refrigeration sheet faces the inside of the cavity, and the heating surface of the semiconductor refrigeration sheet faces the outside of the machine shell. The heat dissipation structure of the projection optical engine liquid crystal screen of the present invention dissipates heat from the liquid crystal screen by refrigerating the air in the cavity by accommodating the liquid crystal screen in the sealed cavity, improving the heat dissipation efficiency of the liquid crystal screen and extending the service life of the projector on the premise of ensuring the projection effect.

[0006] Chinese Patent: A heat dissipation device for a projector optical engine, CN201110375884.5, which includes a housing, a fan module, an optical engine module, and a heat dissipation module. The optical engine module is disposed within the housing, and the optical engine module is connected to the heat dissipation module such that the heat dissipation module is located outside the housing. There is a fan flow channel provided on the outside of the housing, and the fan module is disposed within the fan flow channel. The airflow generated by the fan module is guided by the fan flow channel towards the heat dissipation module. By providing the fan module on the housing of the optical engine module with the fan flow channel, the heat dissipation effect of the projector optical engine can be improved and the cost can be reduced.

[0007] However, the existing structure fails to ensure rapid heat dissipation of the optical engine. As time goes by, the temperature of the optical engine will gradually rise, and it is impossible to maintain the temperature balance between the front and back of the optical engine display screen, which affects the service life of the optical engine. Summary of the Invention

[0008] The object of the present invention is to provide a dual-cooling chip heat dissipation device for a highly transparent and sealed optical engine, which is proposed to solve the problem that the existing structure fails to ensure rapid heat dissipation of the optical engine. As time goes by, the temperature of the optical engine will gradually rise, and it is impossible to maintain the temperature balance between the front and back of the optical engine display screen, which affects the service life of the optical engine.

[0009] To achieve the above object, the present invention adopts the following technical solution: A dual-cooling chip heat dissipation device for a highly transparent and sealed optical engine, including a mounting housing. An installation groove is provided within the mounting housing, and a display screen assembly is installed within the installation groove. A hot air channel and a cold air channel are provided on both sides of the installation groove, and the hot air channel and the cold air channel communicate with the installation groove. An LED light source is provided at the bottom of the mounting housing, a heat source diffusion area is provided at the front end of the LED light source, a first cooling member is provided at the end side of the LED light source, a fixing groove is further provided on the mounting housing, and a second cooling member is installed within the fixing groove, and the second cooling member is located above the display screen assembly.

[0010] As a further description of the above technical solution:

[0011] The display screen assembly includes a liquid crystal display screen, a wind guiding groove, a connection groove, and a high-temperature heat-insulating glass. The liquid crystal display screen is connected to the wind guiding groove, the wind guiding groove is connected to the connection groove, one side of the high-temperature heat-insulating glass is connected to the connection groove, and the other side abuts against the front end of the heat source diffusion area.

[0012] As a further description of the above technical solution:

[0013] The first refrigerating element and the second refrigerating element are both semiconductor refrigerating chips. The cold ends of the semiconductor refrigerating chips are connected to the side-inlet turbo fan. The side outlet of the side-inlet turbo fan communicates with the cold air channel. The hot ends of the semiconductor refrigerating chips are connected to the heat dissipation fan, and the heat dissipation fan communicates with the hot air channel.

[0014] As a further description of the above technical solution:

[0015] A reflective glass is provided at the front end of the liquid crystal display screen, and the reflective glass and the installation housing form a triangular reflection area.

[0016] As a further description of the above technical solution:

[0017] The display screen assembly is detachably connected to the installation slot.

[0018] As a further description of the above technical solution:

[0019] Heat dissipation fins are provided at both the hot end and the cold end of the semiconductor refrigerating chip. The heat dissipation fins at the hot end are connected to the heat dissipation fan, and the heat dissipation fins at the cold end are connected to the side-inlet turbo fan.

[0020] As a further description of the above technical solution:

[0021] The hot air channel includes a first hot air channel and a second hot air channel. The cold air channel includes a first cold air channel and a second cold air channel. The first hot air channel and the first cold air channel are located on one side of the installation slot, and the second hot air channel and the second cold air channel are located on the other side of the installation slot. The cold air of the first refrigerating element passes through the first cold air channel, the connection slot and communicates with the first hot air channel. The cold air of the second refrigerating element passes through the second cold air channel, the air guide slot and communicates with the second hot air channel.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0023] 1. In the present invention, by setting a dual-channel semiconductor refrigerating chip, the dual-channel semiconductor refrigerating channels are respectively on the front and back sides of the liquid crystal display screen, and a high-temperature heat-insulating glass is used at the front end of the light source where the heat source occurs. This structure uses heat insulation to reduce a part of heat conversion. At the same time, semiconductor refrigerating chips are used at the front and back ends of the liquid crystal display screen and cooperate with the side-inlet turbo fan to blow cold air to both sides of the liquid crystal display screen, and the hot air is discharged outside the optical engine through the heat dissipation fins and the heat dissipation fan. This structure can achieve rapid cooling, and at the same time, with the continuous refrigeration of the dual channels, the temperature balance at both ends of the optical engine is always maintained, avoiding the traditional heat dissipation effect. As time goes by, the two ends of the optical engine will still slowly heat up, affecting the service life.

[0024] 2. In the present invention, the cold air of the first refrigeration structure communicates with the first hot air channel through the first cold air channel and the connection groove, and the cold air of the second refrigeration structure communicates with the second hot air channel through the second cold air channel and the air guiding groove. This structure utilizes the principles of thermodynamics and fluid mechanics. When there is a temperature difference, the hot air will rise due to its lower density (compared to cold air), forming a low-pressure area. At this time, the surrounding cold air (i.e., cold wind) will flow towards this low-pressure area under the action of the pressure difference, that is, move towards the heat source direction. Therefore, when the optical engine in the present invention dissipates heat, the cold wind generated by the semiconductor refrigeration chip can take away the heat of the heat source generated by the display screen, ensuring the rapid cooling of the display screen and improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a cross-sectional view of a double-refrigeration-chip heat dissipation device for a high-transmittance sealed optical engine.

[0027] Figure 2 It is Figure 1 The enlarged view at A in

[0028] Figure 3 It is Figure 1 The enlarged view at B in

[0029] Figure 4 It is a schematic diagram of the heat dissipation air flow direction in a double-refrigeration-chip heat dissipation device for a high-transmittance sealed optical engine.

[0030] LEGEND DESCRIPTION:

[0031] 1 - Mounting housing; 2 - Mounting groove; 3 - Display screen assembly; 31 - Liquid crystal display screen; 32 - Air guiding groove; 33 - Connection groove; 34 - High-temperature heat-insulating glass; 4 - Hot air channel (not marked); 41 - First hot air channel; 42 - Second hot air channel; 5 - Cold air channel (not marked); 51 - First cold air channel; 52 - Second cold air channel; 6 - LED light source; 7 - Heat source diffusion area; 8 - First refrigeration component; 9 - Second refrigeration component; 10 - Side air intake turbine fan; 11 - Reflective glass; 12 - Heat dissipation fins; 13 - Heat dissipation fan; 14 - Fixed groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are a part of the embodiments of the present invention, rather than all the embodiments. Generally, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "inner", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0037] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set", "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Please refer to Figures 1-4, the present invention provides a technical solution: a dual-cooling chip heat dissipation device for a high-transparency sealed optical engine, including an installation housing 1, an installation groove 2 is arranged inside the installation housing 1, a display screen assembly 3 is installed in the installation groove 2, hot air channels 4 and cold air channels 5 are arranged on both sides of the installation groove 2, the hot air channels 4 and the cold air channels 5 communicate with the installation groove 2, an LED light source 6 is arranged at the bottom of the installation housing 1, a heat source diffusion area 7 is arranged at the front end of the LED light source 6, a first cooling member 8 is arranged at the end side of the LED light source 6, a fixing groove 14 is also arranged on the installation housing 1, and a second cooling member 9 is installed in the fixing groove 14, and the second cooling member 9 is located above the display screen assembly 3.

[0039] The display screen assembly 3 includes a liquid crystal display screen 31, a wind guide groove 32, a connection groove 33 and a high-temperature heat-insulating glass 34. The liquid crystal display screen 31 is connected to the wind guide groove 32, the wind guide groove 32 is connected to the connection groove 33, one side of the high-temperature heat-insulating glass 34 is connected to the connection groove 33, and the other side abuts against the front end of the heat source diffusion area 7. This forms a ventilation duct between the liquid crystal display screen and the reflective glass, and a ventilation duct can be formed between the high-temperature heat-insulating glass and the liquid crystal display screen. While the high-temperature heat-insulating glass can reduce a part of the heat conversion, it also enables dual-channel cooling to be located on the front and back sides of the liquid crystal display screen, ensuring the heat dissipation effect and temperature balance of the liquid crystal display screen. At the same time, the two channels respectively pass through the glass of the high-temperature heat-insulating glass and the reflective glass, ensuring that the heat dissipation device dissipates heat from the components that generate heat during operation in all directions, avoiding the temperature of the components directly or indirectly connected to the liquid crystal display screen affecting the temperature of the liquid crystal display screen over time and causing it to gradually heat up. This structure can always maintain the temperature balance of the liquid crystal display screen, thereby increasing the service life of the optical engine.

[0040] Both the first cooling member 8 and the second cooling member 9 are semiconductor refrigeration chips. The cold ends of the semiconductor refrigeration chips are connected to the side air inlet turbine fans 10, the lateral air outlet of the side air inlet turbine fans 10 communicates with the cold air channels 5, and the hot ends of the semiconductor refrigeration chips are connected to the heat dissipation fans 13, and the heat dissipation fans 13 communicate with the hot air channels 4. This enables the timely transmission and dissipation of cold air and hot air, improving the heat dissipation effect.

[0041] A reflective glass 11 is arranged at the front end of the liquid crystal display screen 31, and the reflective glass 11 and the installation housing 1 form a triangular reflection area. The image of the display screen can be enlarged according to requirements.

[0042] The display screen assembly 3 is detachably connected to the installation groove 2. This facilitates its later disassembly for maintenance and replacement.

[0043] Radiating fins 12 are provided at both the hot end and the cold end of the semiconductor refrigerating sheet. The radiating fins 12 at the hot end are connected to the radiator fan 13, and the radiating fins 12 at the cold end are connected to the side air inlet turbo fan 10. This enables both cold air and hot air to be transmitted through the radiating fins.

[0044] The hot air channel 4 includes a first hot air channel 41 and a second hot air channel 42, and the cold air channel 5 includes a first cold air channel 51 and a second cold air channel 52. The first hot air channel 41 and the first cold air channel are located on one side of the installation groove 2, and the second hot air channel 42 and the second cold air channel 52 are located on the other side of the installation groove 2. The cold air of the first refrigerating member 8 passes through the first cold air channel 51, the connecting groove 33 and communicates with the first hot air channel 41, and the cold air of the second refrigerating member 9 passes through the second cold air channel 52, the air guiding groove 32 and communicates with the second hot air channel 42. This structure realizes the mutual circulation of the hot air flow channel and the cold air flow channel. Through the natural transfer of cold air to hot air and its discharge to the outside of the optical engine, not only the heat dissipation efficiency is significantly improved, but also the problem of space occupation caused by the independent setting of the hot and cold air channels in the traditional design is cleverly avoided. This change makes the internal structure of the optical engine more compact, making it possible to manufacture an optical engine with a smaller size, thus meeting the market's demand for product miniaturization and high performance.

[0045] Working principle: By setting a dual-channel semiconductor refrigerating chip, the dual-channel semiconductor refrigerating channels are respectively on the front and back sides of the liquid crystal display screen, and a high-temperature heat-insulating glass is used at the front end of the light source where the heat source occurs. This structure uses heat insulation to reduce a part of the heat conversion. At the same time, semiconductor refrigerating sheets are used in cooperation with the side air inlet turbo fan at the front and back ends of the liquid crystal display screen to blow cold air to both sides of the liquid crystal display screen, and the hot air is discharged outside the optical engine through the radiating fins in cooperation with the radiator fan. This structure can achieve rapid cooling. At the same time, as the dual channels continuously refrigerate, the temperature balance at both ends of the optical engine is always maintained, avoiding the problem that the temperature at both ends of the optical engine will slowly rise over time in the traditional heat dissipation method, which affects the service life. In addition, the cold air of the first refrigerating structure passes through the first cold air channel, the connecting groove and communicates with the first hot air channel, and the cold air of the second refrigerating structure passes through the second cold air channel, the air guiding groove and communicates with the second hot air channel. This structure utilizes the principles of thermodynamics and fluid mechanics. When there is a temperature difference, the hot air will rise due to its lower density (compared with cold air), forming a low-pressure area. At this time, the surrounding cold air (i.e., cold air) will flow towards this low-pressure area under the action of the pressure difference, that is, towards the heat source direction. Therefore, when the optical engine in the present invention dissipates heat, the cold air generated by the semiconductor refrigerating chip can take away the heat of the heat source generated by the display screen, ensuring the rapid cooling of the display screen and improving the heat dissipation effect.

[0046] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention should cover within the protection scope of the present invention by making equivalent substitutions or changes according to the technical solution and inventive concept of the present invention.

Claims

1. A double-cooling chip heat dissipation device for a high-transparency sealed optical engine, characterized in that, It includes an installation housing, an installation groove is provided inside the installation housing, a display screen assembly is installed in the installation groove, hot air channels and cold air channels are provided on both sides of the installation groove, the hot air channels and the cold air channels communicate with the installation groove, an LED light source is provided at the bottom of the installation housing, a heat source diffusion area is provided at the front end of the LED light source, a first refrigerating member is provided at the side of the LED light source, a fixing groove is further provided on the installation housing, and a second refrigerating member is installed in the fixing groove, and the second refrigerating member is located above the display screen assembly.

2. The dual-refrigeration chip heat dissipation device of a highly light-transmissive and airtight optical engine according to claim 1, wherein, The display screen assembly includes a liquid crystal display screen, a wind guide groove, a connection groove and a high-temperature heat-insulating glass. The liquid crystal display screen is connected to the wind guide groove, the wind guide groove is connected to the connection groove, one side of the high-temperature heat-insulating glass is connected to the connection groove, and the other side abuts against the front end of the heat source diffusion area.

3. The dual-cooling chip heat dissipation device of a high-transparency sealed optical engine according to claim 2, wherein, Both the first refrigerating member and the second refrigerating member are semiconductor refrigerating chips. The cold ends of the semiconductor refrigerating chips are connected to side air inlet turbine fans. The lateral air outlet of the side air inlet turbine fans communicates with the cold air channels. The hot ends of the semiconductor refrigerating chips are connected to heat dissipation fans, and the heat dissipation fans communicate with the hot air channels.

4. The dual-cooling chip heat dissipation device of a high-transparency sealed optical engine according to claim 2, wherein A reflection glass is provided at the front end of the liquid crystal display screen, and the reflection glass and the installation housing form a triangular reflection area.

5. The dual-cooling chip heat dissipation device of a high-transparency sealed optical engine according to claim 1, characterized in that, The display screen assembly is detachably connected to the installation groove.

6. The dual-refrigeration chip heat dissipation device of a high-light-transmission and airtight optical engine according to claim 3, characterized in that , heat dissipation fins are provided at both the hot end and the cold end of the semiconductor refrigerating chip. The heat dissipation fins at the hot end are connected to the heat dissipation fan, and the heat dissipation fins at the cold end are connected to the side air inlet turbine fan.

7. The dual-refrigeration chip heat dissipation device of a high-transmittance and airtight optical engine according to claim 3, characterized in that, The hot air channels include a first hot air channel and a second hot air channel. The cold air channels include a first cold air channel and a second cold air channel. The first hot air channel and the first cold air channel are located on one side of the installation groove, and the second hot air channel and the second cold air channel are located on the other side of the installation groove. The cold air of the first refrigerating member passes through the first cold air channel, the connection groove and communicates with the first hot air channel. The cold air of the second refrigerating member passes through the second cold air channel, the wind guide groove and communicates with the second hot air channel.

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