Heating disc mechanism, heating cavity mechanism thereof and thin film deposition equipment

Abstract

The utility model discloses a heating disc mechanism, a heating cavity mechanism thereof and thin film deposition equipment, the heating disc mechanism comprises a heating disc and a light intensity detection assembly embedded in the heating disc, and the light intensity detection assembly is used for receiving a light signal of a detection light source from the front side. The light intensity detection assembly comprises a light guide head, an anti-ultraviolet optical fiber connected to the light guide head and an ultraviolet light probe connected to the anti-ultraviolet optical fiber, the light guide head is embedded in the top disc surface of the heating disc, and the anti-ultraviolet optical fiber and the ultraviolet light probe are embedded in the heating disc. The light intensity detection assembly is embedded on the heating plate, and the front side receives ultraviolet light, so that the light intensity of the ultraviolet light can be accurately and conveniently obtained. According to the heating cavity mechanism and the thin film deposition equipment, the light intensity of ultraviolet light can be timely and rapidly obtained through the embedded light intensity detection assembly, and real-time adjustment is carried out according to the light intensity, so that the curing effect and quality of a semiconductor in the heating cavity are higher and more stable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor thin film deposition equipment, in particular to a heating plate mechanism, a heating cavity mechanism thereof, and a thin film deposition equipment. Background Art

[0002] UV Cure (ultraviolet light curing) equipment is widely used in the fields of printing, painting, electronic assembly, etc. Its main function is to use ultraviolet light (UV) irradiation to quickly cure materials. However, the existing UV Cure equipment generally has the following problems: inconvenient testing. For occasions where the UV light intensity needs to be measured, operators usually need to remove the lamp box from the equipment and then test it on a dedicated test platform. This is not only time-consuming and laborious, but also may cause equipment damage or contamination. It is impossible to monitor the lamp life in real time. Since the light intensity cannot be measured in real time, it is very difficult for operators to judge the service life of the lamp. When the lamp ages and the light intensity decreases, it may affect the product quality and even cause equipment failure. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a heating plate mechanism to solve the technical problem of inconvenient detection of the light intensity of the heating plate of the existing semiconductor equipment.

[0004] To achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An embodiment of the utility model provides a heating plate mechanism, which includes: a heating plate and a light intensity detection component embedded in the heating plate, and the light intensity detection component is used to receive the light signal of the detection light source from the front.

[0006] Wherein, there are multiple groups of the light intensity detection components, and the multiple groups of the light intensity detection components are evenly distributed on the plate surface of the heating plate.

[0007] Wherein, the light intensity detection component includes: a light guide head, an ultraviolet-resistant optical fiber connected to the light guide head, and an ultraviolet light probe connected to the ultraviolet-resistant optical fiber. Among them, the light guide head is embedded in the top plate surface of the heating plate, and the ultraviolet-resistant optical fiber and the ultraviolet light probe are buried inside the heating plate.

[0008] Wherein, a signal line is further connected to the ultraviolet light probe, and the other end of the signal line is connected to an irradiance meter.

[0009] Wherein, several mounting holes are further provided on the top surface of the heating plate, and the light guide head is embedded in the mounting holes.

[0010] Wherein, the heating plate is a circular heating plate, and several groups of the light intensity detection components are distributed in a cross shape on the plate surface of the circular heating plate.

[0011] Among them, the heating plate includes: a heating plate assembly and a support member supported at the bottom of the heating plate assembly; the heating plate assembly includes: an upper heating plate, a middle heating plate, and a lower heating plate, the mounting hole is opened in the upper heating plate, and the ultraviolet-resistant optical fiber is embedded in the middle heating plate.

[0012] Among them, an installation cavity is provided in the support member, and the ultraviolet light probe is arranged in the installation cavity.

[0013] The embodiment of the present invention also provides a heating cavity mechanism, which includes: a lamp box assembly, a cavity assembly, and the heating plate mechanism as described in any one of the above in the cavity assembly, and the heating plate is arranged at the bottom of the cavity of the cavity assembly.

[0014] The embodiment of the present invention also provides a thin film deposition device, which includes the heating cavity mechanism as described above.

[0015] In the heating plate mechanism of the present invention, by embedding the light intensity detection component on the heating plate and receiving ultraviolet light from the front, the light intensity of ultraviolet light can be accurately and conveniently obtained. The heating cavity mechanism and the thin film deposition device composed of it can timely and quickly obtain the light intensity of ultraviolet light through the embedded light intensity detection component, and perform real-time adjustment according to the light intensity, so that the semiconductor curing effect and quality in the heating cavity are higher and more stable.

[0016] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given and described in detail as follows. Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the overall structure of the heating cavity mechanism of the embodiment of the present invention.

[0018] Figure 2 It is a cross-sectional view of the heating cavity mechanism of the embodiment of the present invention.

[0019] Figure 3 It is Figure 2 The enlarged schematic diagram of the partial A in

[0020] Figure 4 It is a schematic diagram of the overall structure of the heating plate mechanism of the embodiment of the present invention.

[0021] Figure 5 It is Figure 4 The partial cross-sectional view shown.

[0022] Figure 6 Explosion diagram of the heating plate mechanism according to an embodiment of the present utility model.

[0023] Figure 7 Top view of the heating plate mechanism according to an embodiment of the present utility model.

[0024] Explanation of reference numerals:

[0025] Heating chamber mechanism 100, heating plate mechanism 200, light box assembly 1, cavity assembly 2, support assembly 3, heating plate 4, light intensity detection assembly 5, light box 11, ultraviolet lamp 12, upper cover unit 21, cavity unit 22, cavity 20, heating plate assembly 41, support 42, upper layer heating plate 411, middle layer heating plate 412, lower layer heating plate 413, mounting hole 4111, sapphire column 4112, mounting cavity 421, light guide head 51, ultraviolet resistant optical fiber 52, ultraviolet light probe 53, signal line 54. Detailed implementation manners

[0026] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "resin", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0030] In the present utility model, unless otherwise clearly stipulated and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] In the present utility model, unless otherwise clearly stipulated and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0032] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0033] UV Cure (ultraviolet curing) equipment is widely used in the fields of printing, painting, electronic assembly, etc. Its main function is to rapidly cure materials by irradiating with ultraviolet light (UV). However, the existing UV Cure equipment generally has the following problems: inconvenient testing. For occasions where the UV light intensity needs to be measured, operators usually need to remove the light box from the equipment and then conduct tests on a dedicated test platform. This is not only time-consuming and laborious, but may also cause equipment damage or contamination. It is impossible to monitor the lamp life in real time. Since the light intensity cannot be measured in real time, it is very difficult for operators to judge the service life of the lamp. When the lamp ages and the light intensity decreases, it may affect the quality of thin film deposition products and even cause equipment failures. Therefore, based on the above requirements, this embodiment provides a heating plate mechanism 200, its heating chamber mechanism 100, and a thin film deposition device.

[0034] Please refer to Figures 4 to 7 , this embodiment discloses a heating plate mechanism 200, which includes: a heating plate 4 and a light intensity detection component 5 embedded in the heating plate 4. The light intensity detection component 5 is used to receive the optical signal of the detection light source from the front. In a light curing device, the light source generally irradiates the surface of the workpiece to be cured from the front, so that the deposited thin film can be quickly cured. Compared with the existing method of detecting the light intensity of the light source at any position, in this embodiment, the light intensity detection component 5 is directly embedded on the heating plate 4, so that the light for curing directly irradiates the heating plate 4 and the light intensity detection component 5. Since the workpiece to be cured is placed on the heating plate 4, the light intensity detection component 5 can directly detect the light irradiation intensity at the surface position of the heating plate 4, and can accurately obtain the light intensity of the external curing light source in real time.

[0035] In this embodiment, the external curing light source is ultraviolet light. Of course, it can be understood that in other embodiments, the external light source can also be other non-ultraviolet light.

[0036] It should be noted that the embedding and assembling method of the light intensity detection component 5 and the heating plate 4 in this embodiment can be any method and structure, and is not limited to the specific embodiments described below.

[0037] Such as Figure 5 and Figure 6 shown, multiple groups of the light intensity detection components 5 are provided, and the multiple groups of the light intensity detection components 5 are evenly distributed on the disk surface of the heating plate 4. Multiple groups of light intensity detection components 5 located at different positions of the heating plate 4 are provided to obtain the light intensity values at different positions of the heating plate 4, so as to timely detect and process the abnormal light source positions, so as to keep the ultraviolet light intensity consistent at each part of the disk surface of the heating plate 4.

[0038] Specifically, the light intensity detection component 5 includes: a light guide head 51, an anti-ultraviolet optical fiber 52 connected to the light guide head 51, and an ultraviolet light probe 53 connected to the anti-ultraviolet optical fiber 52. In this embodiment, the light guide head 51 is embedded on the top of the disk surface of the heating plate 4, and the anti-ultraviolet optical fiber 52 and the ultraviolet light probe 53 are buried inside the heating plate 4. The light guide head 51 guides the external ultraviolet light signal into the anti-ultraviolet optical fiber 52, and the anti-ultraviolet optical fiber 52 transmits the optical signal to the ultraviolet light probe 53, and the ultraviolet light probe 53 converts the optical signal into an electrical signal and outputs it to the detection unit.

[0039] Furthermore, a signal line 54 is also connected to the ultraviolet light probe 53, and the other end of the signal line 54 is connected to an irradiance meter (not shown in the figure). The irradiance meter is used to receive the converted optoelectronic signal and convert the electrical signal into a light intensity value and output it to the user or the controller. The user or the controller performs corresponding processing actions according to the control strategy.

[0040] Please refer to again Figure 7 , a plurality of mounting holes 4111 are further provided on the top surface of the heating plate 4, and the light guide head 51 is embedded in the mounting holes 4111. The top of the light guide head 51 is approximately flush with the disk surface of the heating plate 4, so as to obtain more and more direct light signals as much as possible without affecting the placement of workpieces on the heating plate 4.

[0041] Among them, in this embodiment, as Figure 6 shown, the heating plate 4 is a circular heating plate, and several groups of the light intensity detection components 5 are distributed in a cross shape on the disk surface of the circular heating plate. Correspondingly, the disk surface of the heating plate 4 is provided with the same number of mounting holes 4111 as the position and quantity of the light guide head 51. According to needs, the light intensity detection components 5 on the heating plate 4 can also be arranged in other ways, such as concentric circular rings, etc. The purpose is to obtain the light irradiation intensity values at different positions on the disk surface of the heating plate 4.

[0042] Please refer to again Figure 5 and Figure 6 , the heating plate 4 includes: a heating plate assembly 41 and a support member 42 supported at the bottom of the heating plate assembly 41; the heating plate assembly 41 includes: an upper heating plate 411, a middle heating plate 412 and a lower heating plate 413. The mounting holes 4111 are opened on the upper heating plate 411, and the ultraviolet-resistant optical fiber 52 is buried in the middle heating plate 412.

[0043] It can be understood that, in this embodiment, the heating plate assembly 41 has a laminated structure of the upper heating plate 411, the middle heating plate 412 and the lower heating plate 413, and the light guide head 51 and the ultraviolet-resistant optical fiber 52 are distributed in different heating layers. In other embodiments, the heating plate assembly 41 can also be an integral structure, and the light guide head 51 and the ultraviolet-resistant optical fiber 52 are pre-buried in the heating plate assembly 41 during processing.

[0044] Furthermore, an installation cavity 421 is provided in the support member 42, and the ultraviolet light probe 53 is arranged in the installation cavity 421. That is to say, in this embodiment, the light guide head 51, the ultraviolet-resistant optical fiber 52 and the ultraviolet light probe 53 of the light intensity detection component 5 are all embedded inside the heating plate 4, so that each component of the light intensity detection component 5 is located inside the heating plate 4, avoiding interference with other components of the cavity, and at the same time isolating each component from the curing cavity to prevent other factors from affecting the detection accuracy and service life.

[0045] A plurality of sapphire columns 4112 for light curing are also embedded on the upper heating plate 411 of the heating plate 4.

[0046] The heating plate mechanism 200 of this embodiment embeds the light intensity detection component 5 in the heating plate 4, so that the ultraviolet light intensity at the surface of the heating plate 4 can be quickly and accurately obtained, thereby providing decision-making parameters for the thin film deposition process. At the same time, according to the detected light intensity value, the lifespan of the ultraviolet light source can also be predicted, so as to perform manual intervention in advance to avoid affecting the curing quality.

[0047] Please refer to Figures 1 to 3 , this embodiment of the utility model also provides a heating chamber mechanism 100, and the heating chamber mechanism 100 includes: a lamp box component 1, a cavity component 2, and the heating plate mechanism 200 as described in any one of the above disposed in the cavity component 2, and the heating plate 4 is disposed at the bottom of the cavity 20 of the cavity component 2.

[0048] The lamp box component 1 includes a lamp box 11 and an ultraviolet lamp 12 disposed in the lamp box 11, and the ultraviolet light emitted by the ultraviolet lamp 12 irradiates the surface of the heating plate 4 directly.

[0049] The cavity component 2 includes: a cavity unit 22 with an opening at the top, and an upper cover unit 21 covering the opening. The upper cover 21 and the cavity unit 22 together enclose a sealed cavity 20, and a light-transmitting window through which the ultraviolet light emitted by the ultraviolet lamp 12 can pass is provided at the top of the upper cover unit 21.

[0050] A support component 3 is further provided at the bottom of the cavity component 2 for connecting the heating chamber mechanism 100 to a semiconductor processing device.

[0051] As Figure 3 described, in this embodiment, the difference from the above heating plate mechanism 200 is that the embedding and assembling structure of the light intensity detection component 5 and the heating plate 4 is different. A plurality of longitudinally extending through holes are provided on the heating plate 4, and light guide heads 51 are embedded in the through holes. The ultraviolet-resistant optical fibers 52 connected to each light guide head 51 pass through the through holes from the bottom of the heating plate 4 and are led out from the cavity unit 22, so that the ultraviolet light probe 53 and the irradiator connected thereto are disposed outside the cavity unit 22.

[0052] This embodiment of the utility model also provides a thin film deposition device, and the thin film deposition device includes the heating chamber mechanism 100 as described above.

[0053] The heating plate mechanism 200 of the utility model can accurately and conveniently obtain the light intensity of ultraviolet light by embedding the light intensity detection component 5 on the heating plate 4 and receiving ultraviolet light directly. The heating chamber mechanism and the thin film deposition device composed of it can timely and quickly obtain the light intensity of ultraviolet light through the embedded light intensity detection component, and perform real-time adjustment according to the light intensity, so that the semiconductor curing effect and quality in the heating chamber are higher and more stable. At the same time, the lifespan of the ultraviolet lamp can also be predicted according to the light intensity value.

[0054] The above only further illustrates the technical content of the present utility model by way of examples for the convenience of readers' easier understanding, but it does not mean that the implementation modes of the present utility model are limited thereto. Any technical extension or re-creation made according to the present utility model shall be protected by the present utility model. The protection scope of the present utility model shall be subject to the claims.

Claims

1. A heating plate mechanism, characterized in that, Comprising: A heating plate and a light intensity detection component embedded in the heating plate, the light intensity detection component being used to receive the optical signal of the detection light source from the front.

2. The heating plate mechanism according to claim 1, wherein There are multiple groups of the light intensity detection components, and the multiple groups of the light intensity detection components are evenly distributed on the disk surface of the heating plate.

3. The heating plate mechanism according to claim 2, characterized in that, The light intensity detection component includes: a light guide head, an anti-ultraviolet optical fiber connected to the light guide head, and a ultraviolet light probe connected to the anti-ultraviolet optical fiber. Among them, the light guide head is embedded in the top of the disk surface of the heating plate, and the anti-ultraviolet optical fiber and the ultraviolet light probe are buried inside the heating plate.

4. The heating plate mechanism according to claim 3, characterized in that, A signal line is also connected to the ultraviolet light probe, and the other end of the signal line is connected to an irradiance meter.

5. The heating plate mechanism according to claim 4, wherein Several mounting holes are also provided on the top surface of the heating plate, and the light guide head is embedded in the mounting holes.

6. The heating plate mechanism according to claim 4, characterized in that, The heating plate is a circular heating plate, and several groups of the light intensity detection components are distributed in a cross shape on the disk surface of the circular heating plate.

7. The heating plate mechanism according to claim 5, characterized in that, The heating plate includes: a heating plate assembly and a support member supported at the bottom of the heating plate assembly; the heating plate assembly includes: an upper heating plate, a middle heating plate and a lower heating plate, the mounting holes are opened on the upper heating plate, and the anti-ultraviolet optical fiber is buried in the middle heating plate.

8. The heating plate mechanism according to claim 7, characterized in that, An installation cavity is provided inside the support member, and the ultraviolet light probe is arranged in the installation cavity.

9. A heating chamber mechanism, characterized in that, The heating cavity mechanism includes: a lamp box assembly, a cavity assembly and a heating plate mechanism as described in any one of claims 1 to 8 provided in the cavity assembly, and the heating plate is arranged at the cavity bottom of the cavity assembly.

10. A thin film deposition device, characterized in that, The thin film deposition equipment includes the heating cavity mechanism as described in claim 9.

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