Semiconductor transportation clamping mechanism

Abstract

The utility model relates to the related technical field of semiconductors, in particular to a semiconductor transportation clamping mechanism which comprises a transportation device, a clamping mechanism is arranged on the inner side surface of the transportation device, and a clamping mechanism is arranged on the surface of one side of the transportation device. According to the semiconductor transportation clamping mechanism, through the arrangement of the containing groove, the air cylinder, the push rod, the clamping plate and the anti-skid pad, when a semiconductor needs to be carried, the transportation device is moved to the position of the semiconductor, then the air cylinder in the containing groove in the inner side of the transportation device is started, and the air cylinder pushes the push rod to clamp the carried semiconductor through the clamping plate; and the friction force between the semiconductors is increased through the anti-skid pads, so that the semiconductors are clamped more firmly, the carrying efficiency is improved, and the risk that the semiconductors are damaged due to improper carrying is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor, in particular to a semiconductor transportation clamping mechanism. Background Technique

[0002] However, during the transportation of existing semiconductors, great care must be taken to ensure that they are not damaged. Currently, most rely on mechanical handling to avoid damaging the semiconductors. However, during the handling process, the semiconductors may fall due to unstable handling, which will cause certain damage to the use of the semiconductors. Content of the Utility Model

[0003] The purpose of the utility model is to provide a semiconductor transportation clamping mechanism to solve the problem that during the transportation of existing semiconductors, great care must be taken to ensure that they are not damaged. Currently, most rely on mechanical handling to avoid damaging the semiconductors. However, during the handling process, the semiconductors may fall due to unstable handling, which will cause certain damage to the use of the semiconductors as mentioned in the above background technique.

[0004] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor transportation clamping mechanism includes a transportation device, a clamping mechanism is arranged on the inner surface of the transportation device, and a clamping mechanism is arranged on one surface of the transportation device;

[0005] Preferably, the storage grooves are symmetrically opened along the width central axis of the transportation device, and the air cylinders are equidistantly installed on the inner surface of the storage grooves.

[0006] Preferably, the clamping plates are connected to the air cylinders through push rods, and the anti-slip pads are equidistantly installed on the inner surface of the clamping plates.

[0007] Preferably, the outer surface size of the sliding block matches the inner surface size of the second placement groove, and the outer surface size of the lead screw matches the inner surface size of the through hole.

[0008] Preferably, the outer surface size of the support plate matches the inner surface size of the first placement groove, and the outer surface size of the support plate matches the inner surface size of the sliding groove.

[0009] Preferably, the sliding block is slidably connected to the lead screw, and the sliding groove has the same size as the first placement groove.

[0010] Preferably, the clamping mechanism includes a storage groove, a cylinder, a push rod, a clamping plate and an anti-slip pad. A storage groove is formed on the inner surface of the transportation device. A cylinder is fixedly installed on the inner surface of the storage groove. A push rod is fixedly connected to one side surface of the cylinder. A clamping plate is fixedly connected to one side surface of the push rod. An anti-slip pad is fixedly connected to one side surface of the clamping plate.

[0011] Preferably, the clamping mechanism includes a first placement groove, a sliding groove, a baffle, a fixed block, a second placement groove, a lead screw, a sliding block, a through hole and a support plate. A first placement groove is formed on the inner surface of the transportation device. A sliding groove is formed on the inner surface of the transportation device. A baffle is fixedly connected to one side surface of the transportation device. A fixed block is installed on one side surface of the transportation device. A second placement groove is formed on one side surface of the fixed block. A lead screw is installed on the inner surface of the second placement groove. A sliding block is installed on the outer surface of the lead screw. A through hole is formed on one side surface of the sliding block. A support plate is fixedly connected to one side surface of the sliding block.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows: for this semiconductor transportation clamping mechanism, through the settings of the storage groove, the cylinder, the push rod, the clamping plate and the anti-slip pad, when it is necessary to transport a semiconductor, the transportation device is moved to the position of the semiconductor. Then, the cylinder in the storage groove inside the transportation device is started, which makes it push the push rod to clamp the transported semiconductor with the clamping plate. The anti-slip pad increases the friction between semiconductors, making the clamping more firm, thereby improving the transportation efficiency and greatly reducing the risk of semiconductor damage caused by improper transportation. Description of the Drawings

[0013] Figure 1 is a schematic diagram of the overall external structure of the present utility model;

[0014] Figure 2 is a schematic diagram of the structure of the clamping mechanism of the present utility model;

[0015] Figure 3 is a schematic diagram of the structure of the first placement groove and the sliding groove of the present utility model in cooperation;

[0016] Figure 4 is the present utility model Figure 3 is an enlarged schematic diagram of part A.

[0017] In the figure: 1, transportation device; 2, clamping mechanism; 201, storage groove; 202, cylinder; 203, push rod; 204, clamping plate; 205, anti-slip pad; 3, clamping mechanism; 301, first placement groove; 302, sliding groove; 303, baffle; 304, fixed block; 305, second placement groove; 306, lead screw; 307, sliding block; 308, through hole; 309, support plate. Detailed implementation mode

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative work shall fall within the protection scope of the present invention.

[0019] Please refer to Figures 1-4 , the present invention provides a technical solution: a semiconductor transportation and clamping mechanism, including a transportation device 1, a clamping mechanism 2 is arranged on the inner surface of the transportation device 1, and a clamping mechanism 3 is arranged on one surface of the transportation device 1;

[0020] The clamping mechanism 2 includes a storage groove 201, a cylinder 202, a push rod 203, a clamping plate 204 and an anti-slip pad 205. A storage groove 201 is opened on the inner surface of the transportation device 1. A cylinder 202 is fixedly installed on the inner surface of the storage groove 201. A push rod 203 is fixedly connected to one surface of the cylinder 202. A clamping plate 204 is fixedly connected to one surface of the push rod 203. An anti-slip pad 205 is fixedly connected to one surface of the clamping plate 204. Through the settings of the storage groove 201, the cylinder 202, the push rod 203, the clamping plate 204 and the anti-slip pad 205, when a semiconductor needs to be transported, the transportation device 1 is moved to the position of the semiconductor, and then the cylinder 202 in the storage groove 201 on the inner side of the transportation device 1 is started, so that it pushes the push rod 203 to clamp the transported semiconductor with the clamping plate 204, and the anti-slip pad 205 increases the friction between the semiconductors, making the clamping more firm.

[0021] Further, the clamping mechanism 3 includes a first placement groove 301, a sliding groove 302, a baffle 303, a fixing block 304, a second placement groove 305, a lead screw 306, a sliding block 307, a through hole 308, and a support plate 309. A first placement groove 301 is formed on the inner surface of the transport device 1, a sliding groove 302 is formed on the inner surface of the transport device 1, a baffle 303 is fixedly connected to one side surface of the transport device 1, a fixing block 304 is installed on one side surface of the transport device 1, a second placement groove 305 is formed on one side surface of the fixing block 304, a lead screw 306 is installed on the inner surface of the second placement groove 305, a sliding block 307 is installed on the outer surface of the lead screw 306, a through hole 308 is formed on one side surface of the sliding block 307, and a support plate 309 is fixedly connected to one side surface of the sliding block 307. Through the settings of the first placement groove 301, the sliding groove 302, the baffle 303, the fixing block 304, the second placement groove 305, the lead screw 306, the sliding block 307, the through hole 308, and the support plate 309, after the semiconductor is clamped, the transport device 1 rises. At this time, the lead screw 306 in the second placement groove 305 inside the fixing block 304 rotates, causing the sliding block 307 to move horizontally on the lead screw 306 through the through hole 308, thereby driving the support plate 309 to move in the sliding groove 302 until the support plate 309 slides into the first placement groove 301. At this time, the semiconductor is supported.

[0022] Further, the storage grooves 201 are symmetrically formed with respect to the width central axis of the transport device 1, and the air cylinders 202 are installed at equal intervals on the inner surface of the storage grooves 201. Through the setting of the storage grooves 201, the air cylinders 202 can be placed, thereby pushing the clamping plates 204.

[0023] Further, the clamping plate 204 is connected to the air cylinder 202 through a push rod 203, and anti-slip pads 205 are installed at equal intervals on the inner surface of the clamping plate 204. Through the setting of the clamping plate 204, it is ensured that it will not be displaced during the processing, and at the same time, the semiconductor is firmly clamped.

[0024] Further, the outer surface size of the sliding block 307 matches the inner surface size of the second placement groove 305, and the outer surface size of the lead screw 306 matches the inner surface size of the through hole 308. Through the setting of the sliding block 307, it can move the support plate 309, thereby supporting the semiconductor.

[0025] Further, the outer surface size of the support plate 309 matches the inner surface size of the first placement groove 301, and the outer surface size of the support plate 309 matches the inner surface size of the sliding groove 302. Through the setting of the support plate 309, the transported semiconductor is further supported, thereby preventing it from falling.

[0026] Furthermore, the sliding block 307 is slidably connected to the lead screw 306, and the sizes of the sliding groove 302 and the first placement groove 301 are the same. Through the arrangement of the sliding block 307, precise movement on the lead screw 306 can be achieved, ensuring its stability and reliability during long-term use.

[0027] Working principle: First, when it is necessary to carry semiconductors, the transportation device 1 is moved to the position of the semiconductors. Then, the cylinder 202 in the storage groove 201 inside the transportation device 1 is started, which pushes the push rod 203 to clamp the semiconductor to be carried with the clamping plate 204. The anti-slip pad 205 increases the friction between the semiconductors, making the clamping more firm. After the semiconductor is clamped, the transportation device 1 rises. At this time, the lead screw 306 in the second placement groove 305 inside the fixed block 304 rotates, causing the sliding block 307 to move horizontally on the lead screw 306 through the through hole 308, thereby driving the support plate 309 to move in the sliding groove 302 until the support plate 309 slides into the first placement groove 301, at which point the semiconductor is supported.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor transportation clamping mechanism, comprising a transportation device (1), characterized in that: The inner surface of the transport device (1) is provided with a clamping mechanism (2), and one side surface of the transport device (1) is provided with a clamping and connecting mechanism (3); The clamping mechanism (2) includes a storage groove (201), a cylinder (202), a push rod (203), a clamping plate (204) and an anti-slip pad (205). A storage groove (201) is formed on the inner surface of the transport device (1). A cylinder (202) is fixedly installed on the inner surface of the storage groove (201). A push rod (203) is fixedly connected to one side surface of the cylinder (202). A clamping plate (204) is fixedly connected to one side surface of the push rod (203). An anti-slip pad (205) is fixedly connected to one side surface of the clamping plate (204).

2. The semiconductor transportation clamping mechanism according to claim 1, wherein: The storage grooves (201) are symmetrically arranged along the width central axis of the transport device (1), and the cylinders (202) are equidistantly installed on the inner surface of the storage grooves (201).

3. The semiconductor transportation clamping mechanism according to claim 1, characterized in that: The clamping plate (204) is connected to the cylinder (202) through the push rod (203), and the anti-slip pads (205) are equidistantly installed on the inner surface of the clamping plate (204).

4. A semiconductor transportation clamping mechanism according to claim 1, characterized in that: The clamping and connecting mechanism (3) includes a first placement groove (301), a sliding groove (302), a baffle (303), a fixed block (304), a second placement groove (305), a lead screw (306), a sliding block (307), a through hole (308) and a support plate (309). A first placement groove (301) is formed on the inner surface of the transport device (1). A sliding groove (302) is formed on the inner surface of the transport device (1). A baffle (303) is fixedly connected to one side surface of the transport device (1). A fixed block (304) is installed on one side surface of the transport device (1). A second placement groove (305) is formed on one side surface of the fixed block (304). A lead screw (306) is installed on the inner surface of the second placement groove (305). A sliding block (307) is installed on the outer surface of the lead screw (306). A through hole (308) is formed on one side surface of the sliding block (307). A support plate (309) is fixedly connected to one side surface of the sliding block (307).

5. The semiconductor transportation clamping mechanism according to claim 4, characterized in that: The outer surface dimension of the sliding block (307) matches the inner surface dimension of the second placement groove (305), and the outer surface dimension of the lead screw (306) matches the inner surface dimension of the through hole (308).

6. The semiconductor transportation and clamping mechanism according to claim 4, characterized in that: The outer surface dimension of the support plate (309) matches the inner surface dimension of the first placement groove (301), and the outer surface dimension of the support plate (309) matches the inner surface dimension of the sliding groove (302).

7. The semiconductor transportation clamping mechanism according to claim 4, characterized in that: The sliding block (307) is slidably connected to the lead screw (306), and the sliding groove (302) has the same size as the first placement groove (301).

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