Water-cooled heat dissipation module

Abstract

The utility model relates to the technical field of electronic devices, and discloses a water-cooled heat dissipation module, which comprises a water-cooled plate arranged on a high-temperature electronic device and provided with a water-cooled pipe groove, the water-cooled pipe groove is provided with a water outlet and a water inlet, and the height of the water outlet in the vertical direction is lower than that of the water inlet; the water cooling pipe is installed in the water cooling pipe groove in the water cooling plate, the water cooling pipe comprises a water inlet pipeline, the water inlet pipeline is arranged close to the upper surface of the high-temperature electronic device, the water inlet pipeline is provided with a water inlet end so that cooling liquid can flow into the water inlet pipeline, and the water inlet end is arranged at the water inlet; the connecting pipeline is communicated with the water inlet pipeline, the connecting pipeline at least comprises a top pipeline, the top pipeline is horizontally arranged close to the top of the water cooling plate, and the height of the top pipeline in the vertical direction is higher than that of the water inlet pipeline; the water outlet pipeline is communicated with the connecting pipeline, the end, communicated with the connecting pipeline, of the water outlet pipeline is higher than the water inlet pipeline, one water outlet end of the water outlet pipeline is located at the water outlet and lower than the water inlet pipeline, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a water-cooled heat dissipation module. Background Art

[0002] Electronic components generate heat during operation. In recent years, with the gradual improvement of the performance of computer systems, the heat generated by electronic components such as chips due to operation has inevitably increased. To solve the problem of their heat generation, a heat dissipation system is usually required to dissipate heat quickly to prevent the electronic components from reducing their lifespan or being damaged due to overheating. The existing heat dissipation systems mainly include air-cooled heat dissipation systems and liquid-cooled heat dissipation systems. Among them, the liquid-cooled heat dissipation system has been widely used in the heat dissipation treatment of chips due to its remarkable heat dissipation performance and low noise, and has become one of the important development trends of computer cooling systems.

[0003] However, at present, the structures of most liquid-cooled radiators are relatively simple, especially the layout design of the water-cooled pipes in the water-cooled plate, which greatly affects the overall heat dissipation effect. For example, some water-cooled pipes are designed to have the same diameter as the thickness of the water-cooled plate, which results in uneven temperature distribution on the planes directly in contact with and not directly in contact with the heat source of the water-cooled plate. The areas with lower temperature cannot be effectively utilized. Even though its overall area is large, the heat dissipation efficiency is limited by the thermal diffusion coefficient of the solid. There are also some water-cooled pipes designed to have the same diameter as the thickness of the water-cooled plate. When the water-cooled plate contacts the chip surface, heat is transferred from the outside of the pipeline and the water-cooled plate through heat conduction, then into the pipeline and through heat convection to exchange heat with the flowing liquid, and finally the heat is taken away from the chip to achieve the heat dissipation effect. The larger the contact area between the chip and the water-cooled plate, the more heat can be taken away from the chip. However, to achieve the above heat dissipation method, there are many bends in the water-cooled pipes to increase their contact area with the chip. When the water-cooled liquid flows into the bent water-cooled path, the flow rate will be reduced and the pressure drop of the water-cooled plate will be increased, thereby affecting the overall heat dissipation performance of the water-cooled plate. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a water-cooled heat dissipation module to solve the deficiencies in the background art and have good heat dissipation effect.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A water-cooled heat dissipation module, comprising: a water-cooling plate disposed on a high-temperature electronic device, provided with a water-cooling pipe groove, the water-cooling pipe groove being provided with a water outlet and a water inlet, the height of the water outlet in the vertical direction being lower than that of the water inlet; and a water-cooling pipe installed in the water-cooling pipe groove in the water-cooling plate, the water-cooling pipe comprising: an inlet water pipe path disposed close to the upper surface of the high-temperature electronic device, the inlet water pipe path being provided with an inlet end for allowing a coolant to flow into the inlet water pipe path, and the inlet end being disposed at the water inlet; a connection pipe path communicating with the inlet water pipe path, the connection pipe path at least comprising a top pipe path disposed horizontally close to the top of the water-cooling plate, and the height of the top pipe path in the vertical direction being higher than that of the inlet water pipe path; and an outlet water pipe path communicating with the connection pipe path, and the end communicating with the connection pipe path being higher than the inlet water pipe path, the outlet water pipe path being provided with an outlet end for allowing the coolant to flow out of the outlet water pipe path, the outlet end being disposed at the water outlet and lower than the inlet water pipe path.

[0007] Preferably, the outlet water pipe path is inclined in the direction from the end of the connection pipe path to the water outlet, and the coolant gradually approaches the bottom of the water-cooling plate during the flow in the outlet water pipe path.

[0008] Preferably, a bump is symmetrically disposed at the bottom of the water-cooling plate, and the two bumps cooperate to form the water outlet, and the height of the bump in the vertical direction is lower than the height of the water inlet in the vertical direction.

[0009] Preferably, the connection pipe path further comprises: a connection pipe communicating with the inlet water pipe path; a first pipe path disposed in an inclined direction from top to bottom and communicating with the connection pipe; a first hook-shaped pipe path, one end of which communicates with the first pipe path and the other end of which communicates with the top pipe path; and a second hook-shaped pipe path, one end of which communicates with the top pipe path and the other end of which communicates with the outlet water pipe path.

[0010] Preferably, the connection pipe is U-shaped and is provided with a third hook-shaped pipe path and a fourth hook-shaped pipe path at both ends, and is communicated with the inlet water pipe path through the third hook-shaped pipe path and communicated with the first pipe path through the fourth hook-shaped pipe path.

[0011] Preferably, the water-cooling pipe groove comprises: an inlet water pipe groove disposed horizontally and having the water inlet at one end, the inlet water pipe groove being for the installation of the inlet water pipe path; a connection pipe groove communicating with the inlet water pipe groove and being for the installation of the connection pipe path; and an outlet water pipe groove communicating with the connection pipe groove and having the water outlet at one end, the outlet water pipe groove being for the installation of the outlet water pipe path.

[0012] Preferably, both the inlet water pipe groove and the inlet water pipe path are U-shaped.

[0013] Preferably, the water outlet groove is inclined and the inclination direction is the same as that of the water outlet pipeline.

[0014] Preferably, both the water outlet and the water inlet are arranged on the same side of the water cooling plate.

[0015] Preferably, the water cooling pipe is flat.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: By arranging the water inlet pipeline close to the upper surface of the high-temperature electronic device, the coolant inside can directly contact the high-temperature electronic device first, thereby shortening the time for the coolant to flow to the high-temperature electronic device and improving the heat dissipation efficiency; In addition, the overall water cooling pipe has a three-dimensional structure, and the heat of the entire water cooling plate is conducted from bottom to top, making the heat in most positions inside tend to be the same, reducing the occurrence of uneven heat distribution, and also improving the overall heat dissipation efficiency; Finally, the water outlet end of the water pipeline is located at the water outlet and is lower than the water inlet pipeline, so that the coolant flows from a high place to a low place in the water outlet pipeline, so that the coolant with heat can flow out quickly, reducing the time in the water cooling pipe and further improving the heat dissipation efficiency. Description of the Drawings

[0017] Figure 1 A three-dimensional view of the water-cooled heat dissipation module according to an embodiment of the present utility model;

[0018] Figure 2 A front view of the water-cooled heat dissipation module according to an embodiment of the present utility model;

[0019] Figure 3 An internal structure diagram of the water-cooled heat dissipation module according to an embodiment of the present utility model;

[0020] Figure 4 A structure diagram of the water cooling plate according to an embodiment of the present utility model. Detailed Embodiments

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0022] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0023] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0024] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0025] Figures 1 - 4 is a schematic diagram of a water-cooled heat dissipation module according to an embodiment of the present invention. First, refer to Figure 1 、 Figure 2 and Figure 3, the water-cooled heat dissipation module includes a water-cooled plate 1 and a water-cooled pipe 2 disposed within the water-cooled plate 1. The water-cooled plate 1 can be arranged on a high-temperature electronic device 3 to dissipate heat from the high-temperature electronic device 3. Among them, the high-temperature electronic device 3 can be an electronic device such as a chip or a processor. And a water-cooled pipe groove is provided on the water-cooled plate 1, and the water-cooled pipe groove is provided with a water outlet 101 and a water inlet 102. Further, the water-cooled pipe groove can start from the water inlet 102 and end at the water outlet 101, and the water-cooled pipe groove is used to install the water-cooled pipe 2. Then, the water-cooled pipe 2 includes an inlet pipe 201, a connecting pipe 202, and an outlet pipe 203. The inlet end 2011 of the inlet pipe 201 is arranged on the water inlet 102 to facilitate the inflow of the coolant into the inlet pipe 201; one end of the connecting pipe 202 is communicated with the inlet pipe 201, and the other end is communicated with the outlet pipe 203. The outlet end on the outlet pipe 203 is arranged on the water outlet 101 to facilitate the outflow of the coolant from the outlet pipe 203. Among them, the inlet pipe 201 is arranged close to the upper surface of the high-temperature electronic device 3, that is to say, the inlet pipe 201 is arranged close to the bottom of the water-cooled plate 1 so that the coolant inside it can directly contact the high-temperature electronic device 3 first, thereby shortening the time for the coolant to flow to the high-temperature electronic device 3 and improving the heat dissipation efficiency; and in order to increase the contact area between the inlet pipe 201 and the high-temperature electronic device 3, the inlet pipe 201 can be arranged in a U shape to improve the heat exchange efficiency between the two. Further, the connecting pipe 202 at least includes a top pipe 202a. The top pipe 202a is arranged horizontally close to the top of the water-cooled plate 1, and the height of the top pipe 202a in the vertical direction is higher than that of the inlet pipe 201. That is to say, the whole water-cooled pipe 2 has a three-dimensional structure. After the coolant exchanges heat with the high-temperature electronic device 3 through the inlet pipe 201, the coolant with heat will flow upward into the top pipe 202a in the connecting pipe 202. At this time, since the area of the water-cooled plate 1 near the top pipe 202a does not directly contact the high-temperature electronic device 3, the temperature of this area is relatively low. Therefore, the coolant with heat can quickly cool down in this area. The heat of the whole water-cooled plate 1 is conducted from bottom to top, making the heat in most positions inside tend to be the same, reducing the occurrence of uneven heat distribution, and also improving the overall heat dissipation efficiency and quickly dissipating heat. Still further, the end of the outlet pipe 203 communicated with the connecting pipe 202 is higher than the inlet pipe 201, and the outlet end of the outlet pipe 203 is located at the water outlet 101 and lower than the inlet pipe 201, so that the coolant flows from a high place to a low place in the outlet pipe 203. In this process, the kinetic energy of the coolant includes the kinetic energy when flowing in from the connecting pipe 202 and the kinetic energy converted from the gravitational potential energy of the coolant, so that the coolant with heat can quickly flow out, reducing the time in the water-cooled pipe 2 and improving the heat dissipation efficiency.In addition, the height of the water outlet 101 in the vertical direction is lower than that of the water inlet 102, which can further increase the total amount of kinetic energy converted from gravitational potential energy when the coolant flows down, so as to further increase the outflow speed of the coolant and is conducive to improving the overall cooling efficiency. Then, in order to achieve that the set height of the water outlet 101 in the vertical direction is lower than that of the water inlet 102, refer to. Figure 2 Convex blocks 103 are symmetrically arranged at the bottom of the water-cooling plate 1, and a water outlet 101 is formed by the cooperation between the two convex blocks 103. The set height of the convex block 103 in the vertical direction is lower than the set height of the water inlet 102 in the vertical direction, so as to ensure that the set height of the water outlet 101 in the vertical direction is lower than that of the water inlet 102. Moreover, both the water outlet 101 and the water inlet 102 are arranged on the same side of the water-cooling plate 1, which is convenient for the overall installation and layout. Secondly, the overall water-cooling pipe 2 can be flat-shaped to increase the contact area between the coolant and the heat source, thereby improving the heat exchange efficiency. Moreover, the flat-shaped water-cooling pipe 2 can better adapt to the complex space layout and is convenient for realizing effective cooling in a limited space.

[0026] Then, refer to Figure 3 , the water outlet pipe 203 is inclined along the direction from the end of the connecting pipe 202 to the water outlet 101, and the coolant gradually approaches the bottom of the water-cooling plate 1 during the flow in the water outlet pipe 203. In this way, a state where the coolant flows from a high place to a low place in the water outlet pipe 203 is formed, so as to accelerate the outflow of the coolant and improve the heat dissipation efficiency.

[0027] Furthermore, continue to refer to Figure 3, the connecting pipeline 202 further includes a connecting pipeline 202b communicating with the water inlet pipeline 201, a first pipeline 202c communicating with the connecting pipeline 202b, a first hook-shaped pipeline 202d, and a second hook-shaped pipeline 202e. First, the first pipeline 202c is arranged in an inclined direction from top to bottom, so as to ensure that the coolant can flow from the lower water inlet pipeline 201 to the upper top pipeline 202a, enabling the heat of the entire water-cooling plate 1 to be conducted from bottom to top and improving the overall heat dissipation efficiency. Then, one end of the first hook-shaped pipeline 202d communicates with the first pipeline 202c, and the other end communicates with the top pipeline 202a. The function of the first hook-shaped pipeline 202d is to connect the first pipeline 202c and the top pipeline 202a. Next, one end of the second hook-shaped pipeline 202e communicates with the top pipeline 202a, and the other end communicates with the water outlet pipeline 203. The function of the second hook-shaped pipeline 202e is to connect the top pipeline 202a and the water outlet pipeline 203. Among them, the connecting pipeline 202b is U-shaped and is provided with a third hook-shaped pipeline 202b1 and a fourth hook-shaped pipeline 202b2 at both ends. It communicates with the water inlet pipeline 201 through the third hook-shaped pipeline 202b1 and communicates with the first pipeline 202c through the fourth hook-shaped pipeline 202b2. That is to say, the function of the connecting pipeline 202b is to connect the water inlet pipeline 201 and the first pipeline 202c, that is, to realize the connection between the connecting pipeline 202 and the water inlet pipeline. In addition, in some embodiments, the shape and structure of the first hook-shaped pipeline 202d are the same as those of the second hook-shaped pipeline 202e. Similarly, in some other embodiments, the shape and structure of the third hook-shaped pipeline 202b1 are the same as those of the fourth hook-shaped pipeline 202b2.

[0028] Finally, referring to Figure 4 , the water-cooling pipe groove includes a water inlet pipe groove 301, a connecting pipe groove 302 communicating with the water inlet pipe groove 301, and a water outlet pipe groove 303 communicating with the connecting pipe groove 302. First, the water inlet pipe groove 301 is horizontal and has a water inlet 102 at one end. The water inlet pipe groove 301 is used for the installation of the water inlet pipeline 201. Among them, in some embodiments, both the water inlet pipe groove 301 and the water inlet pipeline 201 are U-shaped to realize the matching installation of the water inlet pipeline 201 in the water inlet pipe groove 301. Then, the function of the connecting pipe groove 302 is to install the connecting pipeline 202, and its shape and structure are also the same as those of the connecting pipeline 202. Next, the water outlet pipe groove 303 has a water outlet 101 at one end. The water outlet pipe groove 303 is used for the installation of the water outlet pipeline 203. Among them, in some embodiments, the water outlet pipe groove 303 is inclined and the inclined direction is the same as that of the water outlet pipeline 203 to realize the matching installation of the water outlet pipeline 203 in the water outlet pipe groove 303.

[0029] Based on the disclosure and teachings of the above specification, those skilled in the art to which the present utility model pertains can also make changes and modifications to the above embodiments. Therefore, the present utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present utility model should also fall within the protection scope of the claims of the present utility model. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present utility model.

Claims

1. A water-cooled heat dissipation module, characterized in that Comprising: A water-cooling plate (1) is disposed on a high-temperature electronic device (3). The water-cooling plate is provided with a water-cooling pipe groove, and the water-cooling pipe groove is provided with a water outlet (101) and a water inlet (102). The height of the water outlet (101) in the vertical direction is lower than that of the water inlet (102); and A water-cooling pipe (2) is installed in the water-cooling pipe groove in the water-cooling plate (1). The water-cooling pipe (2) includes: An inlet water pipe (201) is disposed close to the upper surface of the high-temperature electronic device (3). The inlet water pipe (201) is provided with an inlet end (2011) for allowing a coolant to flow into the inlet water pipe (201), and the inlet end (2011) is disposed at the water inlet (102); A connecting pipe (202) is communicated with the inlet water pipe (201). The connecting pipe (202) at least includes a top pipe (202a). The top pipe (202a) is disposed horizontally close to the top of the water-cooling plate (1), and the height of the top pipe (202a) in the vertical direction is higher than that of the inlet water pipe (201); and An outlet water pipe (203) is communicated with the connecting pipe (202), and one end communicated with the connecting pipe (202) is higher than the inlet water pipe (201). The outlet water pipe (203) is provided with an outlet end (2031) for allowing the coolant to flow out of the outlet water pipe (203). The outlet end (2031) is disposed at the water outlet (101) and is lower than the inlet water pipe (201).

2. The water-cooled heat dissipation module according to claim 1, wherein The outlet water pipe (203) is disposed obliquely from the end of the connecting pipe (202) to the water outlet (101), and the coolant gradually approaches the bottom of the water-cooling plate (1) during the flowing process in the outlet water pipe (203).

3. The water-cooled heat dissipation module according to claim 1, wherein A convex block (103) is symmetrically disposed at the bottom of the water-cooling plate (1), and the water outlet (101) is formed by the cooperation between the two convex blocks (103). The height of the convex block (103) in the vertical direction is lower than the height of the water inlet (102) in the vertical direction.

4. The water-cooled heat dissipation module according to claim 1, wherein The connecting pipe (202) further includes: A connecting pipe (202b) is communicated with the inlet water pipe (201); A first pipe (202c) is disposed in an inclined direction from top to bottom and is communicated with the connecting pipe (202b), A first hook-shaped pipe (202d) has one end communicated with the first pipe (202c) and the other end communicated with the top pipe (202a); and A second hook-shaped pipe (202e) has one end communicated with the top pipe (202a) and the other end communicated with the outlet water pipe (203).

5. The water-cooled heat dissipation module according to claim 4, wherein, The connecting pipe (202b) is in a U shape and is provided with a third hook-shaped pipe (202b1) and a fourth hook-shaped pipe (202b2) at both ends. The connecting pipe (202b) is communicated with the inlet water pipe (201) through the third hook-shaped pipe (202b1) and is communicated with the first pipe (202c) through the fourth hook-shaped pipe (202b2).

6. The water-cooled heat dissipation module according to claim 1, wherein The water-cooling pipe groove includes: An inlet water pipe groove (301), which is horizontal and has the water inlet (102) provided at one end, and the inlet water pipe groove (301) is used for the installation of the inlet water pipe (201); A connecting pipe groove (302), which is communicated with the inlet water pipe groove (301) and is used for the installation of the connecting pipe (202); and An outlet water pipe groove (303), which is communicated with the connecting pipe groove (302) and has the water outlet (101) provided at one end, and the outlet water pipe groove (303) is used for the installation of the outlet water pipe (203).

7. The water-cooled heat dissipation module according to claim 6, wherein, Both the inlet water pipe groove (301) and the inlet water pipe (201) are U-shaped.

8. The water-cooled heat dissipation module according to claim 6, wherein The outlet water pipe groove (303) is inclined and the inclined direction is the same as that of the outlet water pipe (203).

9. The water-cooled heat dissipation module according to claim 1, characterized in that, Both the water outlet (101) and the water inlet (102) are provided on the same side of the water cooling plate (1).

10. The water-cooled heat dissipation module according to claim 1, characterized in that, The water cooling pipe (2) is flat.

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