Radiator

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a radiator. Comprising a shell, two clamping assemblies and a heat dissipation assembly, and a containing space with a clamping opening is formed in the shell in the circumferential direction of the shell; the two clamping assemblies are arranged on the two opposite sides of the shell in the length direction of the shell. Each clamping assembly comprises a clamping piece and a mounting piece which are rotationally connected, the mounting piece is provided with at least one group of clamping assemblies, and the clamping assemblies are correspondingly clamped with the clamping ports; the two clamping pieces are matched with each other to clamp the electronic equipment; the heat dissipation assembly is arranged in the containing space and used for dissipating heat of the electronic equipment. And the upper clamping assembly is connected with the shell without independently arranging a mounting part on the shell, so that the structure of the shell is simplified, and the simplified design of the radiator is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a radiator. Background Art

[0002] With the upgrading of electronic devices, the main frequency is getting higher and higher, the power consumption is getting larger and larger, and the heat generation is also getting higher and higher. Serious heat generation of electronic devices will lead to a decline in their performance, reduce the service life of electronic devices, and there will also be certain potential safety hazards. Therefore, a radiator is often set up to accelerate the heat dissipation of electronic devices, ensure the service life and reduce potential safety hazards.

[0003] At present, the outer shell of the radiator needs to be set on the electronic device by cooperating with the clamping assembly. During the implementation process, an additional installation part needs to be set on the outer shell, and the clamping assembly is connected to the outer shell through the cooperation between the installation part and the clamping assembly. This setting structure is complex and not conducive to the simplification design of the radiator. Summary of the Utility Model

[0004] The technical problem to be solved in the embodiment of the utility model is to provide a radiator to solve the problem that the setting structure of the existing radiator is complex and not conducive to the simplification design of the radiator.

[0005] The utility model discloses a radiator, which includes an outer shell, two clamping assemblies and a heat dissipation assembly. The outer shell forms a receiving space with a card interface along its circumferential direction; the two clamping assemblies are arranged on opposite sides of the outer shell along the length direction of the outer shell; each clamping assembly includes a clamping part and a mounting part which are rotatably connected, and at least one set of clamping assemblies is arranged on the mounting part, and the clamping assembly is correspondingly clamped with the card interface; the two clamping parts cooperate with each other to clamp the electronic device; the heat dissipation assembly is arranged in the receiving space for dissipating heat from the electronic device.

[0006] Optionally, the outer shell includes a first shell body and a second shell body which are buckled with each other, and the first shell body and the second shell body enclose to form the receiving space; the first shell body is formed with the card interface, and the number of the card interfaces is multiple and distributed at intervals on the first shell body.

[0007] Optionally, the clamping assembly includes a first clamping arm and a second clamping arm which are oppositely arranged; the first clamping arm includes a first connecting arm and a first clamping part which are connected with each other, and the second clamping arm includes a second connecting arm and a second clamping part which are connected with each other; the first clamping part passes through the card interface and is arranged in the first shell body, and abuts against the inner wall of the first shell body, and the second clamping part passes through the card interface and is arranged in the first shell body, and abuts against the inner wall of the first shell body; wherein, the first clamping part and the second clamping part are located at opposite ends of the card interface.

[0008] Optionally, an installation inclined surface is formed on the second clamping part, and the second clamping part is clamped into the first shell through the installation inclined surface.

[0009] Optionally, two first installation parts are oppositely arranged on one side of the clamping part close to the installation part, and two second installation parts are oppositely arranged on one side of the installation part close to the clamping part. The two first installation parts are inserted into the two second installation parts; a torsion spring is further arranged between the clamping part and the installation part. An installation shaft is inserted along the length direction of the torsion spring, and the installation shaft is further connected to the first installation part and the second installation part. Two connection ends of the torsion spring respectively abut against the clamping part and the installation part.

[0010] Optionally, the heat dissipation component includes a semiconductor refrigeration sheet, a fan and heat dissipation fins. The semiconductor refrigeration sheet is arranged on the second shell, the heat dissipation fins are in an annular structure and are arranged on the second shell, and the fan is arranged inside the heat dissipation fins.

[0011] Optionally, a first installation groove and a second installation groove are formed on the second shell. The second installation groove is located inside the first installation groove. The semiconductor refrigeration sheet is arranged in the second installation groove, the heat dissipation fins are arranged on the first installation groove, and the heat dissipation fins correspond to the card interfaces.

[0012] Optionally, a plurality of avoidance grooves are formed on the outer periphery of the heat dissipation fins, and the first clamping part and the second clamping part are correspondingly located in the avoidance grooves.

[0013] Optionally, a first opening is formed on the installation part, and a second opening is formed on the clamping part. The first opening is located between two groups of the clamping assemblies, and the second opening is oppositely arranged to the first opening.

[0014] Optionally, along the circumferential direction of the second installation groove, magnets are further arranged in the second installation groove.

[0015] Compared with the prior art, the beneficial effect of the radiator provided by the embodiment of the present utility model is that: a receiving space for the card interface is formed on the outer shell along its circumferential direction. The receiving space provides an installation environment for the heat dissipation component. Clamping assemblies are respectively arranged on both sides in the length direction of the outer shell. Among them, the clamping assembly includes a clamping part and an installation part that are rotatably connected. At least one group of clamping assemblies is arranged on the installation part, and the clamping assemblies are correspondingly clamped with the card interfaces to realize the connection between the clamping assembly and the outer shell. The electronic device is clamped by the cooperation of the two clamping parts to complete the fixation of the radiator on the electronic device. The above connection between the clamping assembly and the outer shell does not require a separate installation part to be arranged on the outer shell, simplifies the structure of the outer shell, and is beneficial to the simplification design of the radiator. Description of the Drawings

[0016] The technical solution of the present utility model will be further described in detail below in conjunction with the drawings and embodiments. In the drawings:

[0017] Figure 1 is a schematic diagram of the overall structure of the radiator provided by the embodiment of the present utility model;

[0018] Figure 2 is an exploded view of the housing and the clamping assembly provided by the embodiment of the present utility model;

[0019] Figure 3 is an exploded view of the clamping assembly provided by the embodiment of the present utility model;

[0020] Figure 4 is Figure 3 a partial enlarged view of the position A in

[0021] Figure 5 is an exploded view of the radiator provided by the embodiment of the present utility model.

[0022] The reference numerals in the drawings are as follows:

[0023] 10, housing; 110, first housing; 1101, card interface; 120, second housing; 1201, first installation groove; 1202, second installation groove; 20, clamping assembly; 210, clamping member; 211, first installation part; 212, torsion spring; 213, installation shaft; 2101, second opening; 220, installation member; 2201, first opening; 221, clamping assembly; 2211, first clamping arm; 22111, first connecting arm; 22112, first clamping part; 223, second installation part; 2212, second clamping arm; 22121, second connecting arm; 22122, second clamping part; 22120, installation inclined surface; 310, semiconductor refrigeration sheet; 311, first wire; 312, second wire; 320, fan; 321, connecting plate; 330, heat dissipation fins; 331, annular installation bottom plate; 3301, avoidance groove. Detailed implementation manners

[0024] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Now, in conjunction with the drawings, the preferred embodiments of the present utility model will be described in detail.

[0025] The embodiment of the present utility model provides a radiator, as shown in Figure 1 and Figure 2As shown in the figure, it includes a housing 10, two clamping components 20 and a heat dissipation component. The housing 10 forms an accommodation space with a clamping interface 1101 along its circumferential direction; the two clamping components 20 are arranged on opposite sides of the housing 10 along the length direction of the housing 10; each clamping component 20 includes a clamping member 210 and a mounting member 220 that are rotatably connected. At least one set of clamping components 221 is provided on the mounting member 220, and the clamping components 221 are correspondingly clamped with the clamping interface 1101; the two clamping members 210 cooperate with each other to clamp the electronic device; the heat dissipation component is arranged in the accommodation space for dissipating heat from the electronic device.

[0026] Among them, an accommodation space with a clamping interface 1101 is formed on the housing 10 along its circumferential direction. The accommodation space provides an installation environment for the heat dissipation component. Clamping components 20 are respectively arranged on both sides of the housing 10 in the length direction. Among them, the clamping component 20 includes a clamping member 210 and a mounting member 220 that are rotatably connected. At least one set of clamping components 221 is provided on the mounting member 220, and the clamping components 221 are correspondingly clamped with the clamping interface 1101 to realize the connection between the clamping component 20 and the housing 10. The electronic device is clamped by the cooperation of the two clamping members 210, and the fixation of the radiator on the electronic device is completed. The above connection between the clamping component 20 and the housing 10 does not require a separate installation part on the housing 10, which simplifies the structure of the housing 10 and is beneficial to the simplified design of the radiator.

[0027] In the prior art, generally, a heat dissipation port needs to be formed on the housing 10, which cooperates with the heat dissipation component to dissipate the heat of the electronic device along the housing 10 to the outside. The clamping interface 1101 of the present application can, while fixing the clamping component 20, also cooperate with the heat dissipation component to dissipate the heat of the electronic device along the housing 10 to the outside, and reuse the clamping interface 1101 to realize the simplified design of the radiator.

[0028] As a preferred solution of this embodiment, referring to Figure 5 , the housing 10 includes a first housing 110 and a second housing 120 that are buckled with each other. The first housing 110 and the second housing 120 enclose to form an accommodation space; a clamping interface 1101 is formed on the first housing 110, and the number of the clamping interfaces 1101 is set to be multiple, and they are distributed at intervals on the first housing 110.

[0029] Among them, a structural example of the housing 10 is given here. Specifically, the housing 10 includes a first housing 110 and a second housing 120 that are buckled with each other to facilitate the installation of the radiator. The accommodation space is formed by the enclosure of the first housing 110 and the second housing 120 to provide an installation environment for the heat dissipation component. Among them, the clamping interface 1101 is located on the first housing 110.

[0030] The card interface 1101 of this embodiment may be an annular opening formed along the circumferential direction of the first housing 110, or multiple interfaces may be provided and distributed at intervals on the first housing 110. Both of the above two structures can achieve the corresponding clamping of the clamping component 221 and the card interface 1101. The setting form of the card interface 1101 is not specifically limited here.

[0031] As a preferred solution of this embodiment, referring to Figures 2 to 4 , the clamping component 221 includes a first clamping arm 2211 and a second clamping arm 2212 arranged oppositely; the first clamping arm 2211 includes a first connecting arm 22111 and a first clamping portion 22112 connected to each other, and the second clamping arm 2212 includes a second connecting arm 22121 and a second clamping portion 22122 connected to each other; the first clamping portion 22112 passes through the card interface 1101 and is arranged inside the first housing 110, and abuts against the inner wall of the first housing 110, and the second clamping portion 22122 passes through the card interface 1101 and is arranged inside the first housing 110, and abuts against the inner wall of the first housing 110; wherein, the first clamping portion 22112 and the second clamping portion 22122 are located at opposite ends of the card interface 1101.

[0032] Here, a structural example of the clamping component 221 is given. Specifically, the clamping component 221 includes a first clamping arm 2211 and a second clamping arm 2212 arranged oppositely. The first clamping arm 2211 and the second clamping arm 2212 cooperate with the card interface 1101 to fix the mounting member 220. More specifically, the first clamping arm 2211 includes a first connecting arm 22111 and a first clamping portion 22112 connected to each other, and the second clamping arm 2212 includes a second connecting arm 22121 and a second clamping portion 22122 connected to each other. The first clamping portion 22112 passes through the card interface 1101 and is arranged inside the first housing 110, and abuts against the inner wall of the first housing 110, so as to realize the clamping of the first clamping arm 2211 and the first housing 110. The second clamping portion 22122 passes through the card interface 1101 and is arranged inside the first housing 110, and abuts against the inner wall of the first housing 110, so as to realize the clamping of the second clamping arm 2212 and the first housing 110. The first clamping portion 22112 and the second clamping portion 22122 are arranged at opposite ends of the card interface 1101. The clamping component 221 is clamped on the card interface 1101 through the first clamping portion 22112 and the second clamping portion 22122 at both ends of the card interface 1101, and then the mounting member 220 is arranged on the first housing 110.

[0033] As a preferred solution of this embodiment, referring to Figure 4 , an installation inclined surface 22120 is formed on the second clamping portion 22122, and the second clamping portion 22122 is clamped into the first housing 110 through the installation inclined surface 22120.

[0034] During the process of engaging the clamping assembly 221 with the card interface 1101, first, the first clamping portion 22112 is disposed within the first housing 110 through the card interface 1101, and the first clamping portion 22112 abuts against the inner wall of the first housing 110. Then, the second engaging arm 2212 is pushed so that the second clamping portion 22122 slides into the card interface 1101 along the installation inclined surface 22120 and abuts against the inner wall of the first housing 110. The setting of the installation inclined surface 22120 is used for the cooperation between the clamping assembly 221 and the card interface 1101 to quickly fix the clamping assembly 221 to the first housing 110.

[0035] As a preferred solution of this embodiment, refer to Figure 3 , two first mounting portions 211 are oppositely arranged on one side of the clamping member 210 close to the mounting member 220, and two second mounting portions 223 are oppositely arranged on one side of the mounting member 220 close to the clamping member 210. The two first mounting portions 211 are inserted into the two second mounting portions 223; a torsion spring 212 is further arranged between the clamping member 210 and the mounting member 220. An installation shaft 213 is inserted along the length direction of the torsion spring 212, and the installation shaft 213 is also connected to the first mounting portion 211 and the second mounting portion 223. The two connecting ends of the torsion spring 212 respectively abut against the clamping member 210 and the mounting member 220.

[0036] Among them, a connection example of the clamping member 210 and the mounting member 220 is given here. Specifically, the clamping member 210 is provided with two first mounting portions 211, and two second mounting portions 223 are provided on the mounting member 220. The first mounting portions 211 are inserted into the two second mounting portions 223, and the first mounting portions 211 and the second mounting portions 223 are connected by the installation shaft 213 to realize the rotational connection between the clamping member 210 and the mounting member 220. A torsion spring 212 is arranged between the clamping member 210 and the mounting member 220, and the installation shaft 213 is inserted into the torsion spring 212 along the length direction of the torsion spring 212. The two connecting ends of the torsion spring 212 respectively abut against the clamping member 210 and the mounting member 220, so as to form an elastic clamping force between the mounting member 220 and the clamping member 210. When the radiator is fixed to the electronic device through the clamping assembly 20, hold the two clamping members 210 by hand and apply a force to open the two clamping members 210. Place the electronic device between the two clamping members 210, and cancel the force applied to the clamping members 210 to fix the electronic device.

[0037] The electronic device of this embodiment can be a mobile phone.

[0038] In this embodiment, two sets of clamping components 221 are provided, and the two sets of clamping components 221 are oppositely arranged on the mounting member 220. The clamping component 221 is used to improve the connection strength of the mounting member 220 on the first housing 110, ensure the overall stability of the clamping component 20 and the housing 10, and improve the use effect of the radiator.

[0039] As a preferred solution of this embodiment, referring to Figure 5 , the heat dissipation component includes: a semiconductor refrigeration sheet 310, a fan 320 and heat dissipation fins 330. The semiconductor refrigeration sheet 310 is arranged on the second housing 120. The heat dissipation fins 330 are in an annular structure and are arranged on the second housing 120. The fan 320 is arranged inside the heat dissipation fins 330.

[0040] Among them, a structural example of the heat dissipation component is given here. The heat dissipation component includes a semiconductor refrigeration sheet 310, a fan 320 and heat dissipation fins 330. The semiconductor refrigeration sheet 310 is arranged on the second housing 120. After the semiconductor refrigeration sheet 310 is energized through the first wire 311 and the second wire 312, one side becomes cold and the other side becomes hot. By setting the cold side close to the second housing 120, the temperature of the electronic device is reduced through the transfer of the second housing 120, achieving the purpose of dissipating heat from the electronic device. Among them, the fan 320 and the heat dissipation fins 330 are arranged on the hot side of the semiconductor refrigeration sheet 310, which can timely disperse the heat on the hot side of the semiconductor refrigeration sheet 310 and ensure the overall heat dissipation effect of the radiator.

[0041] As a preferred solution of this embodiment, referring to Figure 5 , a first installation groove 1201 and a second installation groove 1202 are formed on the second housing 120. The second installation groove 1202 is located inside the first installation groove 1201. The semiconductor refrigeration sheet 310 is arranged in the second installation groove 1202, and the heat dissipation fins 330 are arranged on the first installation groove 1201, and the heat dissipation fins 330 correspond to the card interface 1101.

[0042] Among them, a first installation groove 1201 and a second installation groove 1202 are formed on the second housing 120 to provide an installation environment for the semiconductor refrigeration sheet 310 and the heat dissipation fins 330. The second installation groove 1202 is located inside the first installation groove 1201, and the semiconductor refrigeration sheet 310 is arranged in the second installation groove 1202 to improve the integration degree of the semiconductor refrigeration sheet 310 and the heat dissipation fins 330 inside the housing 10, and then the volume of the housing 10 can be reduced to realize the miniaturized design of the radiator, which is convenient for the use and popularization of the radiator. Among them, the heat dissipation fins 330 correspond to the card interface 1101, and the heat dissipation fins 330 diffuse the heat to the outside of the housing 10 through the card interface 1101, and the card interface 1101 is reused to realize the simplified design of the radiator.

[0043] When the heat dissipation fin 330 is disposed on the first installation groove 1201, an annular installation base plate 331 is provided at the bottom of the heat dissipation fin 330, and the annular installation base plate 331 is disposed on the first installation groove 1201. At the same time, when the fan 320 is fixed, a connection plate 321 is provided at the bottom of the fan 320, and the connection plate 321 is connected to the inner ring of the annular installation base plate 331 to enable the fan 320 to be disposed inside the heat dissipation fin 330.

[0044] As a preferred solution of this embodiment, referring to Figure 5 , a plurality of avoidance grooves 3301 are formed on the outer periphery of the heat dissipation fin 330, and the first clamping portion 22112 and the second clamping portion 22122 are correspondingly located in the avoidance grooves 3301.

[0045] Among them, the formation of a plurality of avoidance grooves 3301 on the outer periphery of the heat dissipation fin 330 provides an installation environment for the setting of the first clamping portion 22112 and the second clamping portion 22122 on the first housing 110, thereby realizing the setting of the clamping assembly 20 on the first housing 110.

[0046] As a preferred solution of this embodiment, referring to Figure 3 , a first opening 2201 is formed on the mounting member 220, a second opening 2101 is formed on the clamping member 210, the first opening 2201 is located between the two sets of clamping assemblies 221, and the second opening 2101 is disposed opposite to the first opening 2201.

[0047] Among them, the first opening 2201 formed on the mounting member 220 and the second opening 2101 formed on the clamping member 210, after the fan 320 works, the heat in the accommodation space diffuses along the heat dissipation fin 330 to the outside of the housing 10, and when the heat passes through the mounting member 220 and the clamping member 210, it can continue to diffuse outward along the first opening 2201 and the second opening 2101, improving the heat dissipation efficiency of the radiator itself and further improving the working efficiency.

[0048] As a preferred solution of this embodiment, along the circumferential direction of the second installation groove 1202, a magnet is further provided in the second installation groove 1202.

[0049] Among them, the housing 10 of some electronic devices is made of a metal material, and the second housing 120 can be disposed on the electronic device through the magnet, thereby strengthening the connection strength between the housing 10 and the electronic device, ensuring the stability of the radiator during use, and improving the working effect.

[0050] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. For those skilled in the art, the technical solutions recorded in the above embodiments can be modified, or some of the technical features can be equivalently replaced; and all such modifications and replacements should fall within the protection scope of the appended claims of the present invention.

Claims

1. A radiator, characterized in that, Comprising: A housing, which forms a receiving space with a clamping interface along its circumferential direction; Two clamping components, which are arranged on opposite sides of the housing along the length direction of the housing; each clamping component includes a clamping member and a mounting member that are rotatably connected, and at least one set of clamping components is arranged on the mounting member, and the clamping components are correspondingly clamped with the clamping interfaces; the two clamping members cooperate with each other to clamp an electronic device; A heat dissipation component, which is arranged in the receiving space and is used for dissipating heat from the electronic device.

2. The radiator according to claim 1, wherein, The housing includes a first housing and a second housing that are snap-fitted to each other, and the first housing and the second housing enclose to form the receiving space; the clamping interface is formed on the first housing, and the number of the clamping interfaces is multiple and is distributed at intervals on the first housing.

3. The radiator according to claim 2, wherein The clamping component includes a first clamping arm and a second clamping arm that are oppositely arranged; The first clamping arm includes a first connecting arm and a first clamping portion that are connected to each other, and the second clamping arm includes a second connecting arm and a second clamping portion that are connected to each other; the first clamping portion passes through the clamping interface and is arranged in the first housing, and abuts against the inner wall of the first housing, and the second clamping portion passes through the clamping interface and is arranged in the first housing, and abuts against the inner wall of the first housing; Wherein, the first clamping portion and the second clamping portion are located at opposite ends of the clamping interface.

4. The radiator according to claim 3, wherein An installation inclined surface is formed on the second clamping portion, and the second clamping portion is snapped into the first housing through the installation inclined surface.

5. The radiator according to claim 3, characterized in that, Two first installation portions are oppositely arranged on one side of the clamping member close to the mounting member, and two second installation portions are oppositely arranged on one side of the mounting member close to the clamping member, and the two first installation portions are inserted into the two second installation portions; A torsion spring is further arranged between the clamping member and the mounting member, and a mounting shaft is inserted along the length direction of the torsion spring, and the mounting shaft is also connected to the first installation portion and the second installation portion, and two connection ends of the torsion spring respectively abut against the clamping member and the mounting member.

6. The radiator according to any one of claims 3 to 5, characterized in that The heat dissipation component includes: A semiconductor refrigeration sheet, a fan and heat dissipation fins, the semiconductor refrigeration sheet is arranged on the second housing, the heat dissipation fins are in an annular structure and are arranged on the second housing, and the fan is arranged inside the heat dissipation fins.

7. The radiator according to claim 6, characterized in that, A first installation groove and a second installation groove are formed on the second housing, the second installation groove is located inside the first installation groove, the semiconductor refrigeration sheet is arranged in the second installation groove, the heat dissipation fins are arranged on the first installation groove, and the heat dissipation fins correspond to the clamping interfaces.

8. The radiator according to claim 6, wherein A plurality of avoidance grooves are formed on the outer periphery of the heat dissipation fins, and the first clamping portion and the second clamping portion are correspondingly located in the avoidance grooves.

9. The radiator according to claim 6, wherein A first opening is formed on the mounting member, a second opening is formed on the clamping member, the first opening is located between two sets of the clamping components, and the second opening is oppositely arranged with the first opening.

10. The radiator according to claim 7, characterized in that, Along the circumferential direction of the second installation groove, a magnet is further arranged in the second installation groove.

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