Round light-emitting LED packaging structure

Abstract

The utility model discloses a round light-emitting LED packaging structure, which relates to the technical field of LED chips and comprises a substrate, a chip arranged on the substrate, a fluorescent diaphragm and a white wall glue layer, the LED chip is electrically connected with a circuit layer on the substrate through a connecting wire, the round light-emitting LED packaging structure further comprises a supporting medium arranged at the top of the LED chip, the fluorescent diaphragm is arranged at the top of the supporting medium, and the white wall glue layer is arranged at the bottom of the supporting medium. Therefore, when the white wall glue layer surrounds the LED chip and the fluorescent diaphragm, the connecting line can be completely wrapped in the white wall glue layer. According to the utility model, through the arrangement of the supporting medium, the position of the fluorescent diaphragm can be raised and is higher than the trend height of the connecting line, and when the white wall glue is used for surrounding the LED chip and the fluorescent diaphragm subsequently, the formed white wall glue layer can wrap the connecting line therein, so that the connecting line is prevented from being exposed to the outside; therefore, the position of the connecting line after connection is kept stable enough, and the packaging structure has a good effect.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chips, and particularly relates to a circular light-emitting LED packaging structure. Background Art

[0002] In recent years, under the global trend of energy conservation and emission reduction, LED light sources have developed rapidly. Compared with traditional light sources, LED light sources have the advantages of long life, small size, high efficiency, fast response speed, earthquake resistance, energy saving, and no pollution, and are a kind of "green light source". In the production process of LED light sources, packaging is a crucial link connecting the upstream and downstream. The function of packaging is to provide sufficient protection for the light-emitting chips to prevent the chips from aging due to long-term exposure in the air or being damaged mechanically and becoming ineffective.

[0003] In the prior art, generally, LED chips are used as LED light sources. During packaging, first, the LED chips are placed on a substrate by die bonding, then a fluorescent film is pasted on the top of the LED chips, and finally, white wall glue is surrounded around the LED chips and the whole body of the fluorescent film. After curing for a period of time, the packaging is completed. In the current packaging process, there are three types of LED chips available for selection, namely, front-mounted chips, flip chips, and vertical chips. When using flip chips, the electrodes of the flip chips will be directly bonded to the circuit layer on the substrate for electrical connection; when using front-mounted chips or vertical chips, the electrodes on the front-mounted chips or vertical chips need to be electrically connected to the circuit layer on the substrate through connecting wires before subsequent operations can be carried out.

[0004] In the case of selecting front-mounted chips or vertical chips, the function of the connecting wire is to electrically conduct the LED chips and the substrate. However, the routing height of the connecting wire may be greater than the thickness of the LED chips, that is, some positions of the connecting wire may be located above the LED chips. Subsequently, when surrounding the LED chips and the fluorescent film with white wall glue, the white wall glue will not be able to uniformly cover the connecting wire, resulting in inconvenient use. Summary of the Utility Model

[0005] The purpose of the utility model is to propose a circular light-emitting LED packaging structure to solve the problems in the prior art. Through the setting of a supporting medium, the position of the fluorescent film can be elevated, so that when the subsequent white wall glue layer surrounds the LED chips and the fluorescent film, the connecting wires will be completely wrapped and protected, making the circuit connection stable and the packaging effect good.

[0006] To solve the above problems, the utility model provides the following technical solutions:

[0007] A circular light-emitting LED packaging structure includes a substrate, an LED chip disposed on the substrate, a fluorescent film, and a white wall adhesive layer. The LED chip is electrically connected to a circuit layer on the substrate through a connecting wire. It further includes a supporting medium disposed on top of the LED chip, and the fluorescent film is disposed on top of the supporting medium. When the white wall adhesive layer surrounds the LED chip and the fluorescent film, the connecting wire will be completely covered inside the white wall adhesive layer.

[0008] As a further solution of the present utility model: The supporting medium is a glass sheet.

[0009] As a further solution of the present utility model: The white wall adhesive layer is provided with a circular through hole at the position on top of the fluorescent film, so that the top of the fluorescent film is circularly exposed.

[0010] As a further solution of the present utility model: The LED chip is a vertical chip.

[0011] As a further solution of the present utility model: The LED chip is a front-mounted chip.

[0012] As a further solution of the present utility model: The substrate is provided as a ceramic circuit board.

[0013] As a further solution of the present utility model: The substrate is provided as an aluminum-based circuit board.

[0014] As a further solution of the present utility model: The substrate is provided as a bowl-shaped bracket.

[0015] As a further solution of the present utility model: The white wall adhesive layer is a silicone layer.

[0016] Compared with the prior art, the present utility model has the following beneficial effects:

[0017] Through the setting of the supporting medium, the position of the fluorescent film can be raised and higher than the height of the connecting wire. When the white wall adhesive is used to surround the LED chip and the fluorescent film subsequently, the formed white wall adhesive layer can evenly wrap the connecting wire therein, avoiding the exposure of the connecting wire to the outside, making the position after the connection of the connecting wire maintain sufficient stability, that is, making the packaging structure of the present utility model have a good effect and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following further describes the present utility model with reference to the drawings.

[0019] Figure 1 is the schematic assembly structure of the present utility model Figure 1 ;

[0020] Figure 2 is the schematic assembly structure of the present utility model Figure 2 ;

[0021] Figure 3 is a schematic diagram of the assembly structure of the present utility model Figure 3 ;

[0022] Figure 4 is a schematic diagram of the assembly structure of the present utility model Figure 4 ;

[0023] Figure 5 is a schematic diagram of the structure when the present utility model is applied to a flashlight.

[0024] In the figure: 1, substrate; 2, LED chip; 3, fluorescent film; 4, white wall adhesive layer; 5, connecting wire; 6, supporting medium; a, LED chip under this encapsulation structure; b, flashlight housing; c, convex lens at the flashlight lens; d, wall. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0026] As Figures 1-4 shown, a circular light-emitting LED encapsulation structure includes a substrate 1, an LED chip 2, a supporting medium 6, a fluorescent film 3, and a white wall adhesive layer 4, wherein: the substrate 1, the LED chip 2, the supporting medium 6, and the fluorescent film 3 are arranged in sequence from bottom to top, and the LED chip 2 is electrically connected to the circuit layer on the substrate 1 through a connecting wire 5. The white wall adhesive layer 4 is disposed on the substrate 1 and is used to surround the LED chip 2 and the fluorescent film 3. On the basis of providing the supporting medium 6, the position of the fluorescent film 3 will be lifted upward and located above the connecting wire 5. Further, the connecting wire 5 will be completely covered inside the white wall adhesive layer 4, that is, the white wall adhesive layer 4 can stably set the LED chip 2, the fluorescent film 3, and the connecting wire 5 on the substrate 1 as a whole, ensuring the connection stability of the connecting wire 5.

[0027] Preferably, the above-mentioned supporting medium 6 can be set as a glass sheet with uniform thickness everywhere, which completely covers the top of the LED chip 2. It should be noted that the LED chip 2 used in the present utility model can be a flip-chip or a vertical chip.

[0028] In order to enable the LED chip 2 under the encapsulation structure of the present utility model to be suitable for places such as stage lights and flashlights that require circular light spots, a circular through-hole can be opened at the position where the white wall adhesive layer 4 is located on top of the fluorescent film 3, so that the top of the fluorescent film 3 is circularly exposed. Furthermore, the light emitted by the LED chip 2 will pass through the circular through-hole at the top of the fluorescent film 3 and be emitted. Figure 5 The figure shows a schematic diagram of the light emission of a flashlight applying the LED chip 2. Under the action of the convex lens at the flashlight lens, the emitted light spot appears as a circle on the wall. Figure 5 In the figure, a is the LED chip under this encapsulation structure, b is the flashlight housing, c is the convex lens at the flashlight lens, and d is the wall.

[0029] It should be noted that for the setting of the substrate 1 in the present utility model, the substrate 1 can be any one of a ceramic circuit board, an aluminum-based circuit board, an LED special PCT bowl cup bracket, and an LED special EMC bowl cup type bracket. The present utility model attaches Figures 1-4 Taking the bowl cup type bracket as an example for illustration. At the same time, for the setting of the above-mentioned fluorescent film 3, generally, silicone, fluorescent powder, and silica powder are mixed in a certain proportion to obtain a mixed solution, and then the mixed solution is formed by coating and molding, and finally cut into the corresponding size by laser or die cutting. Similarly, for the setting of the white wall adhesive layer 4 in the present utility model, the white wall adhesive layer 4 is generally silicone, and silicone has good light-shielding and reflectivity.

[0030] The specific encapsulation process steps for the present utility model are as follows:

[0031] 1) Select the corresponding type of substrate 1;

[0032] 2) Before the substrate 1 is put into welding, it is generally subjected to a dehumidification baking, and the baking conditions are 100 - 150 °C and the baking time is 0.5 - 4 hours;

[0033] 3) After the substrate 1 is completed with dehumidification baking, a plurality of LED chips 2 are placed in the corresponding areas on the substrate 1, and then using an automatic wire bonding machine, the electrodes of the LED chips 2 are welded to the circuit layer on the substrate 1 through the connecting wires 5, so that the LED chips 2 are connected to the substrate 1. This state can be Figure 1 represented by

[0034] 4) After welding, the substrate 1 and the LED chips 2 as a whole are put into a plasma cleaner, nitrogen or argon is injected for plasma cleaning, and after cleaning, wait for the next process to proceed;

[0035] 5) After cleaning, a glass sheet with a uniform thickness is pasted on the top of the LED chip 2. The thickness of the glass sheet is generally 100um - 250um. This state can be Figure 2 represented by

[0036] 6) Then, attach the fluorescent film 3 to the glass slide. This state can be represented by Figure 3 for display;

[0037] 7) Next, put the substrate 1, the glass slide, and the fluorescent film 3 as a whole into a plasma cleaner, inject nitrogen or argon, and perform plasma cleaning. After cleaning, wait for the next process to proceed;

[0038] 8) After the cleaning is completed, perform the operation of applying the white wall adhesive. The operation of applying the white wall adhesive is generally carried out by a dispensing machine. Surround the LED chip 2 and the fluorescent film 3 with the white wall adhesive. The top of the fluorescent film 3 is not treated, so that the top of the fluorescent film 3 is circularly exposed, and then cure it. The curing conditions generally adopt 150 °C for 1 - 8 hours to cure the liquid white wall adhesive into the white wall adhesive layer 4. This state can be represented by Figure 4 for display;

[0039] 9) After the curing is completed, perform the splitting work of the LED chip 2. The splitting form generally adopts the methods of water jet cutting, wire cutting, laser cutting, or die cutting and blanking;

[0040] 10) After the splitting is completed, use a spectrometer to test and grade the packaged LED chips 2, and select the qualified products.

[0041] The above has described in detail an embodiment of the present invention, but the content described is only a preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention shall still fall within the scope covered by the patent of the present invention.

Claims

1. A circular light-emitting LED packaging structure, characterized in that, It includes a substrate (1), an LED chip (2) disposed on the substrate (1), a fluorescent film (3), and a white wall adhesive layer (4). The LED chip (2) is electrically connected to the circuit layer on the substrate (1) through a connecting wire (5). It further includes a supporting medium (6) disposed on the top of the LED chip (2). The fluorescent film (3) is disposed on the top of the supporting medium (6), so that when the white wall adhesive layer (4) surrounds the LED chip (2) and the fluorescent film (3), the connecting wire (5) will be completely covered inside the white wall adhesive layer (4).

2. The circular light-emitting LED packaging structure according to claim 1, characterized in that, The supporting medium (6) is a glass sheet.

3. A circular light-emitting LED packaging structure according to claim 1, characterized in that, The white wall adhesive layer (4) is provided with a circular through hole at the position on the top of the fluorescent film (3), so that the top of the fluorescent film (3) is circularly exposed.

4. A circular light-emitting LED packaging structure according to claim 1, characterized in that The LED chip (2) is a vertical chip.

5. A circular light-emitting LED package structure according to claim 1, wherein, The LED chip (2) is a front-mounted chip.

6. A circular light-emitting LED packaging structure according to claim 1, characterized in that, The substrate (1) is set as a ceramic circuit board.

7. A circular light-emitting LED package structure according to claim 1, characterized in that, The substrate (1) is set as an aluminum-based circuit board.

8. A circular light-emitting LED packaging structure according to claim 1, characterized in that, The substrate (1) is set as a bowl-shaped bracket.

9. A circular light-emitting LED packaging structure according to claim 1, wherein, The white wall adhesive layer (4) is a silicone layer.

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