Shaping equipment for diamond semiconductor production

Abstract

The utility model belongs to the technical field of semiconductor production equipment, and particularly relates to shaping equipment for diamond semiconductor production, which comprises an operation table, a voltage machine main body arranged on the rear side of the top of the operation table, a heat shaping plate arranged on the voltage machine main body, a placement table arranged on the top of the operation table, and a placement groove formed in the placement table, a diamond semiconductor is placed in the placing groove, and a piston mechanism is arranged in the placing table; two supporting plates are fixedly installed on the top of the operation table, the containing table is located between the two supporting plates, and the electric press body is located on the rear sides of the supporting plates. The dustproof film cutting device is reasonable in design, by arranging the piston mechanism, the dustproof film can be adsorbed through a left vent hole and can be adsorbed to the left side of the placement table to be limited, by arranging the cutting mechanism, the dustproof film can be cut through a cutter, time and labor can be saved during operation, and the dustproof film cutting efficiency is improved. And the working efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor production equipment, and particularly relates to a shaping device for diamond semiconductor production. Background Art

[0002] With the continuous development of technology, various high-tech products have also been popularized in people's daily lives. Semiconductors are installed in the main boards of various high-tech products. In the manufacturing process of semiconductors, a heat setting voltage machine is required for processing.

[0003] Currently, a heat setting voltage machine for semiconductor production disclosed in a Chinese patent with the publication number CN215578466U includes a processing table, a voltage machine main body, a heat setting plate, a placement table, a placement groove, a sliding plate, a sliding groove, a sliding block, a pulling block, a driving rod, a paper tube, a dust-proof film, a replacement device, and a limiting device. The voltage machine main body is installed on the upper surface of the processing table through bolts, and the heat setting plate is installed outside the voltage machine main body. By setting the replacement device, the dust-proof film can be quickly replaced after use. In cooperation with the dust-proof film, it can prevent the outer surface of the semiconductor from being contaminated by external oil or dust during the centralized placement process. Furthermore, after foreign objects are adsorbed on the outer surface of the semiconductor, workers need to clean it before further deep processing of the semiconductor, thus avoiding increasing the unnecessary workload of the workers.

[0004] In actual use, it is found that the existing equipment is rather cumbersome in film covering for semiconductors, resulting in time-consuming and laborious film covering, which in turn affects the working efficiency. Therefore, we propose a shaping device for diamond semiconductor production to solve the above problems. Summary of the Utility Model

[0005] The purpose of this application is to solve the drawbacks existing in the prior art, namely, time-consuming and laborious film covering, which in turn affects the working efficiency, and to propose a shaping device for diamond semiconductor production.

[0006] To achieve the above purpose, this application adopts the following technical solutions:

[0007] A shaping device for diamond semiconductor production includes an operating table. A voltage machine main body is arranged at the rear side of the top of the operating table. A heat setting plate is arranged on the voltage machine main body. A placement table is arranged at the top of the operating table. A placement groove is arranged on the placement table. A diamond semiconductor is placed in the placement groove. A piston mechanism is arranged in the placement table. Two support plates are fixedly installed at the top of the operating table. The placement table is located between the two support plates. The voltage machine main body is located behind the support plates. A film covering mechanism is arranged between the two support plates. A driving mechanism is arranged at the top of the operating table. The same mounting plate is fixedly installed at the tops of the two support plates. A cutting mechanism is arranged on the mounting plate.

[0008] Preferably, the piston mechanism includes a piston chamber, a piston rod, a piston plate, and a ventilation hole. A piston chamber is formed in the placement table. The piston chamber is located below the placement groove. A piston rod is slidably installed in the piston chamber. A piston plate is fixedly installed at the left end of the piston rod. The piston plate is slidably connected to the inner wall of the piston chamber. Ventilation holes are formed in both inner walls of the piston chamber.

[0009] Preferably, the film covering mechanism includes a paper tube and a dust-proof film. The same paper tube is arranged between the two support plates. A dust-proof film is sleeved on the paper tube. A sliding mechanism is arranged between the paper tube and the support plates.

[0010] Preferably, the sliding mechanism includes two sliding seats, two sliders, and two sliding grooves. The sliding seats are slidably installed on the adjacent sides of the two support plates respectively. Sliders are arranged on the mutually remote sides of the two sliding seats respectively. Sliding grooves are formed in the adjacent sides of the two support plates respectively. The sliders are slidably connected to the corresponding sliding grooves. The paper tube is rotatably connected to the two sliding seats. A connecting mechanism is arranged between the sliding seats and the piston rod.

[0011] Preferably, the connecting mechanism includes a first connecting plate and a second connecting plate. The first connecting plate is fixedly installed on the right side of the sliding seat. The second connecting plate is fixedly installed on the right side of the first connecting plate. The left side of the second connecting plate is fixedly connected to the right end of the piston rod.

[0012] Preferably, the driving mechanism includes a fixing plate and an electric telescopic rod. The fixing plate is fixedly installed on the left side of the top of the operating table. The electric telescopic rod is fixedly installed on the right side of the fixing plate. The output end of the electric telescopic rod is fixedly connected to the left side of the corresponding sliding seat.

[0013] Preferably, the cutting mechanism includes a hydraulic cylinder, a tool holder, and a cutting tool. The hydraulic cylinder is fixedly installed on the top of the mounting plate. The output end of the hydraulic cylinder extends below the mounting plate. The tool holder is fixedly installed at the output end of the hydraulic cylinder. The cutting tool is arranged at the bottom of the tool holder.

[0014] Preferably, a button is arranged on the inner wall of the right side of the sliding groove. The slider is adapted to the button. The button is electrically connected to the hydraulic cylinder.

[0015] Advantages of the present application:

[0016] 1. Through the cooperation of the electric telescopic rod, the sliding seat, the first connecting plate, the second connecting plate, the piston rod, and the piston plate, it can be realized that the electric telescopic rod drives the piston plate to move to the right, it can be realized that negative pressure is generated in the piston chamber by the piston plate, it can be realized that the dust-proof film is adsorbed through the left ventilation hole, and it can be realized that the dust-proof film is adsorbed to the left side of the placement table for limiting purposes;

[0017] 2. Through the cooperation of the sliding seat, the paper tube and the dust-proof film, it is possible to drive the dust-proof film to move to the right by the sliding seat, achieve the purpose of covering the diamond semiconductor with the dust-proof film, and achieve the purpose of dust-proof for the diamond semiconductor.

[0018] 3. Through the cooperation of the sliding seat, the slider and the button, and through the cooperation of the hydraulic cylinder, the tool holder and the cutting knife, it is possible to press the button by the slider on the sliding seat, start the hydraulic cylinder through the button, drive the cutting knife to move downward by the hydraulic cylinder, and achieve the purpose of cutting the dust-proof film by the cutting knife. Furthermore, it is possible to achieve the purpose of saving time and effort in operation and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional structural schematic diagram of a shaping device for diamond semiconductor production proposed by the present application;

[0020] Figure 2 is a front view sectional structural schematic diagram of a shaping device for diamond semiconductor production proposed by the present application;

[0021] Figure 3 is a partial structural schematic diagram A of a shaping device for diamond semiconductor production proposed by the present application;

[0022] Figure 4 is a partial structural schematic diagram B of a shaping device for diamond semiconductor production proposed by the present application;

[0023] Figure 5 is a three-dimensional structural schematic diagram of the sliding seat of a shaping device for diamond semiconductor production proposed by the present application.

[0024] In the figure: 1, operating table; 2, main body of the voltage machine; 3, heat setting plate; 4, placing table; 5, placing groove; 6, piston chamber; 7, piston rod; 8, piston plate; 9, ventilation hole; 10, support plate; 11, sliding seat; 12, paper tube; 13, dust-proof film; 14, first connecting plate; 15, second connecting plate; 16, fixing plate; 17, electric telescopic rod; 18, mounting plate; 19, hydraulic cylinder; 20, button; 21, slider; 22, chute; 23, tool holder; 24, cutting knife. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0026] Refer to Figures 1-5, A sizing device for diamond semiconductor production, including an operating table 1. A voltage machine main body 2 is arranged at the rear side of the top of the operating table 1. A heat sizing plate 3 is arranged on the voltage machine main body 2. A placing table 4 is arranged at the top of the operating table 1. A placing groove 5 is arranged on the placing table 4. A diamond semiconductor is placed in the placing groove 5. A piston mechanism is arranged in the placing table 4. Two support plates 10 are fixedly installed at the top of the operating table 1. The placing table 4 is located between the two support plates 10. The voltage machine main body 2 is located at the rear side of the support plates 10. A film covering mechanism is arranged between the two support plates 10. A driving mechanism is arranged at the top of the operating table 1. The same mounting plate 18 is fixedly installed at the top of the two support plates 10. A cutting mechanism is arranged on the mounting plate 18.

[0027] In this embodiment, the piston mechanism includes a piston chamber 6, a piston rod 7, a piston plate 8 and a vent hole 9. A piston chamber 6 is opened in the placing table 4. The piston chamber 6 is located below the placing groove 5. The piston rod 7 is slidably installed in the piston chamber 6. The left end of the piston rod 7 is fixedly installed with a piston plate 8. The piston plate 8 is slidably connected with the inner wall of the piston chamber 6. Vent holes 9 are opened on both inner walls of the piston chamber 6. By providing the piston mechanism, the piston rod 7 can drive the piston plate 8 to move to the right, the purpose of generating negative pressure in the piston chamber 6 through the piston plate 8 can be achieved, and the purpose of adsorbing the dust-proof film 13 through the left vent hole 9 can be achieved.

[0028] In this embodiment, the film covering mechanism includes a paper tube 12 and a dust-proof film 13. The same paper tube 12 is arranged between the two support plates 10. The dust-proof film 13 is sleeved on the paper tube 12. A sliding mechanism is arranged between the paper tube 12 and the support plates 10. By providing the film covering mechanism, the diamond semiconductor can be covered by the dust-proof film 13, and the purpose of dust-proofing the diamond semiconductor can be achieved.

[0029] In this embodiment, the sliding mechanism includes two sliding seats 11, two sliders 21 and two sliding grooves 22. The sliding seats 11 are slidably installed on the adjacent sides of the two support plates 10. The sliders 21 are arranged on the mutually remote sides of the two sliding seats 11. The sliding grooves 22 are opened on the adjacent sides of the two support plates 10. The sliders 21 are slidably connected with the corresponding sliding grooves 22. The paper tube 12 is rotatably connected with the two sliding seats 11. A connecting mechanism is arranged between the sliding seats 11 and the piston rod 7. By providing the sliding mechanism, the sliding seats 11 can drive the sliders 21 to slide in the sliding grooves 22, and the purpose of making the sliding seats 11 move more smoothly when moving left and right can be achieved.

[0030] In this embodiment, the connecting mechanism includes a first connecting plate 14 and a second connecting plate 15. The first connecting plate 14 is fixedly installed on the right side of the sliding seat 11. The second connecting plate 15 is fixedly installed on the right side of the first connecting plate 14. The left side of the second connecting plate 15 is fixedly connected to the right end of the piston rod 7. By providing the connecting mechanism, the sliding seat 11 can drive the piston rod 7 to move left and right through the first connecting plate 14 and the second connecting plate 15.

[0031] In this embodiment, the driving mechanism includes a fixing plate 16 and an electric telescopic rod 17. The fixing plate 16 is fixedly installed on the left side of the top of the operating table 1. The electric telescopic rod 17 is fixedly installed on the right side of the fixing plate 16. The output end of the electric telescopic rod 17 is fixedly connected to the left side of the corresponding sliding seat 11. By providing the driving mechanism, the electric telescopic rod 17 can drive the sliding seat 11 to move left and right.

[0032] In this embodiment, the cutting mechanism includes a hydraulic cylinder 19, a tool holder 23 and a cutting tool 24. The hydraulic cylinder 19 is fixedly installed on the top of the mounting plate 18. The output end of the hydraulic cylinder 19 extends below the mounting plate 18. The output end of the hydraulic cylinder 19 is fixedly installed with the tool holder 23. The cutting tool 24 is arranged at the bottom of the tool holder 23. By providing the cutting mechanism, the hydraulic cylinder 19 can drive the cutting tool 24 to move downward, and the purpose of cutting the dust-proof film 13 with the cutting tool 24 can be achieved.

[0033] In this embodiment, a button 20 is arranged on the inner wall of the right side of the chute 22. The slider 21 is adapted to the button 20. The button 20 is electrically connected to the hydraulic cylinder 19. By providing the button 20, when the slider 21 abuts against the button 20, the purpose of starting the hydraulic cylinder 19 through the button 20 can be achieved.

[0034] In this application, during operation, first place the diamond semiconductor into the placement groove 5, then start the main body 2 of the voltage machine, and perform shaping processing on the diamond semiconductor by moving the heat setting plate 3 downward. (This technology is a mature existing solution, and reference can be made to the comparative document with the authorization announcement number: CN215578466U). After the processing is completed, by starting the electric telescopic rod 17, it can drive the sliding seat 11 to move to the right, drive the paper tube 12 and the dust-proof film 13 to move to the right, move to the right through the first connecting plate 14 and the second connecting plate 15, drive the piston rod 7 and the piston plate 8 to move to the right, generate negative pressure in the piston chamber 6 through the piston plate 8, adsorb the dust-proof film 13 through the left ventilation hole 9 (a small number of ventilation holes 9 will not be covered by the dust-proof film 13), and achieve the purpose of adsorbing the dust-proof film 13 to the left side of the placement table 4 for limiting. At this time, the electric telescopic rod 17 continues to push the sliding seat 11, the paper tube 12 and the dust-proof film 13 to move to the right, achieve the purpose of covering the diamond semiconductor with the dust-proof film 13, and achieve the purpose of dust-proofing the diamond semiconductor. When the sliding seat 11 drives the slider 21 to continue moving to the right, the slider 21 can abut against the button 20, start the hydraulic cylinder 19 through the button 20, drive the tool holder 23 and the cutting tool 24 to move downward, and achieve the purpose of cutting the dust-proof film 13 with the cutting tool 24, thereby achieving the purpose of saving time and effort in operation and improving work efficiency.

Claims

1. A sizing device for diamond semiconductor production, characterized in that, It includes an operating table (1), a voltage machine main body (2) is arranged at the rear side of the top of the operating table (1), a heat setting plate (3) is arranged on the voltage machine main body (2), a placing table (4) is arranged at the top of the operating table (1), a placing groove (5) is arranged on the placing table (4), a diamond semiconductor is placed in the placing groove (5), and a piston mechanism is arranged in the placing table (4); Two support plates (10) are fixedly installed at the top of the operating table (1), the placing table (4) is located between the two support plates (10), the voltage machine main body (2) is located at the rear side of the support plates (10), a film covering mechanism is arranged between the two support plates (10), a driving mechanism is arranged at the top of the operating table (1), and the two support plates (10) are fixedly installed with the same mounting plate (18) at the top, and a cutting mechanism is arranged on the mounting plate (18).

2. The sizing device for diamond semiconductor production according to claim 1, wherein The piston mechanism includes a piston chamber (6), a piston rod (7), a piston plate (8) and a ventilation hole (9). A piston chamber (6) is opened in the placing table (4), the piston chamber (6) is located below the placing groove (5), a piston rod (7) is slidably installed in the piston chamber (6), a piston plate (8) is fixedly installed at the left end of the piston rod (7), the piston plate (8) is slidably connected with the inner wall of the piston chamber (6), and ventilation holes (9) are opened on both inner walls of the piston chamber (6).

3. A sizing device for diamond semiconductor production according to claim 1, characterized in that, The film covering mechanism includes a paper tube (12) and a dust-proof film (13). The same paper tube (12) is arranged between the two support plates (10), a dust-proof film (13) is sleeved on the paper tube (12), and a sliding mechanism is arranged between the paper tube (12) and the support plates (10).

4. A shaping device for diamond semiconductor production according to claim 3, characterized in that, The sliding mechanism includes two sliding seats (11), two sliders (21) and two sliding grooves (22). The adjacent sides of the two support plates (10) are both slidably installed with sliding seats (11), sliders (21) are arranged on the sides of the two sliding seats (11) away from each other, sliding grooves (22) are opened on the adjacent sides of the two support plates (10), the sliders (21) are slidably connected with the corresponding sliding grooves (22), the paper tube (12) is rotatably connected with the two sliding seats (11), and a connecting mechanism is arranged between the sliding seat (11) and the piston rod (7).

5. The shaping device for diamond semiconductor production according to claim 4, wherein The connecting mechanism includes a first connecting plate (14) and a second connecting plate (15). The right side of the sliding seat (11) is fixedly installed with the first connecting plate (14), the right side of the first connecting plate (14) is fixedly installed with the second connecting plate (15), and the left side of the second connecting plate (15) is fixedly connected with the right end of the piston rod (7).

6. The shaping device for diamond semiconductor production according to claim 1, characterized in that, The driving mechanism includes a fixing plate (16) and an electric telescopic rod (17). The fixing plate (16) is fixedly installed on the left side of the top of the operating table (1), the electric telescopic rod (17) is fixedly installed on the right side of the fixing plate (16), and the output end of the electric telescopic rod (17) is fixedly connected with the left side of the corresponding sliding seat (11).

7. A shaping device for diamond semiconductor production according to claim 1, characterized in that, The cutting mechanism includes a hydraulic cylinder (19), a tool holder (23) and a cutting tool (24). A hydraulic cylinder (19) is fixedly installed at the top of the mounting plate (18). The output end of the hydraulic cylinder (19) extends below the mounting plate (18). A tool holder (23) is fixedly installed at the output end of the hydraulic cylinder (19). A cutting tool (24) is arranged at the bottom of the tool holder (23).

8. A shaping device for diamond semiconductor production according to claim 4, characterized in that, A button (20) is arranged on the right inner wall of the chute (22). The slider (21) is adapted to the button (20). The button (20) is electrically connected to the hydraulic cylinder (19).

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